JPH0542791A - IC card - Google Patents
IC cardInfo
- Publication number
- JPH0542791A JPH0542791A JP3224699A JP22469991A JPH0542791A JP H0542791 A JPH0542791 A JP H0542791A JP 3224699 A JP3224699 A JP 3224699A JP 22469991 A JP22469991 A JP 22469991A JP H0542791 A JPH0542791 A JP H0542791A
- Authority
- JP
- Japan
- Prior art keywords
- card
- wire
- chip
- substrate
- tape
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Classifications
-
- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/0772—Physical layout of the record carrier
- G06K19/07728—Physical layout of the record carrier the record carrier comprising means for protection against impact or bending, e.g. protective shells or stress-absorbing layers around the integrated circuit
Landscapes
- Credit Cards Or The Like (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Abstract
(57)【要約】
【目的】 曲げ応力に強く、かつ薄型化を図ることので
きるＩＣカードを提供する。
【構成】 基板４上には、チップ状部品１がＴＡＢテー
プと呼ばれる回路パターンが形成されたテープ２とワイ
ヤ３を介してマウントされている。さらにチップ状部品
１、テープ２、ワイヤ３が樹脂モールド部５により封入
されている。上記構成のＩＣカードに曲げ応力が加わる
と、比較的剛性の高い樹脂モールド部５は変形せず、樹
脂モールド部５が形成されていない基板４の部分のみが
変形することになるので、樹脂モールド部５内に封入さ
れたワイヤ４が断線する恐れがない。またワイヤ４にア
ールを施すことがないので、ＩＣカードとしての厚みを
最小限に抑えることができる。
(57) [Abstract] [Purpose] To provide an IC card that is resistant to bending stress and can be made thin. [Structure] A chip-shaped component 1 is mounted on a substrate 4 via a tape 2 on which a circuit pattern called a TAB tape is formed and a wire 3. Further, the chip-shaped component 1, the tape 2 and the wire 3 are enclosed by the resin mold portion 5. When a bending stress is applied to the IC card having the above structure, the resin mold portion 5 having a relatively high rigidity is not deformed, and only the portion of the substrate 4 where the resin mold portion 5 is not formed is deformed. There is no fear that the wire 4 enclosed in the portion 5 will break. Further, since the wire 4 is not rounded, the thickness of the IC card can be minimized.
Description
【０００１】[0001]
【産業上の利用分野】本発明は、柔軟性を有するカード
状基板にチップ状部品をマウントしたＩＣカードに関す
る。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an IC card in which a chip-shaped component is mounted on a flexible card-shaped substrate.
【０００２】[0002]
【従来の技術】従来、カード状基板にチップ状のマイク
ロコンピュータやその他のチップ状集積回路をマウント
したＩＣカードが知られている。図３はかかるＩＣカー
ドの一例を示す断面図であり、チップ状部品１は回路面
６が基板４と対向するように配置され、ＴＡＢテープと
呼ばれる回路パターンを形成したテープ２と、ワイヤ３
とによって基板４に固着されている。2. Description of the Related Art Conventionally, an IC card in which a chip-shaped microcomputer or other chip-shaped integrated circuit is mounted on a card-shaped substrate is known. FIG. 3 is a cross-sectional view showing an example of such an IC card. The chip-shaped component 1 is arranged so that the circuit surface 6 faces the substrate 4, and a tape 2 having a circuit pattern called a TAB tape and a wire 3 are formed.
It is fixed to the substrate 4 by.
【０００３】また、図４は他のＩＣカードの一例を示す
断面図であり、チップ状部品１はその回路面６が上に向
き、回路面６とは反対側の面７が基板４と対向するよう
にように接着固定されており、チップ状部品１のパッド
と基板４のランドとがワイヤ３によって電気的に接続さ
れている。そして、これらチップ状部品１とワイヤ３が
樹脂モールド部５によって封入されている。FIG. 4 is a sectional view showing an example of another IC card. The chip-shaped component 1 has a circuit surface 6 facing upward, and a surface 7 opposite to the circuit surface 6 faces the substrate 4. Thus, the pads of the chip-shaped component 1 and the lands of the substrate 4 are electrically connected by the wires 3 as described above. Then, the chip-shaped component 1 and the wire 3 are encapsulated by the resin mold portion 5.
【０００４】[0004]
【発明が解決しようとする課題】しかしながら図３の例
の場合、基板４に曲げ応力が加わるとワイヤ３がこの曲
げを吸収するように作用するものの、吸収できる曲げの
量を越えるとワイヤ３が断線する恐れがある。また図４
の例の場合、樹脂モールド部５の剛性が比較的高いため
曲げ応力には強いものの、ワイヤ３のアール部分がＩＣ
カードの厚みを増してしまう欠点がある。However, in the case of the example of FIG. 3, when the bending stress is applied to the substrate 4, the wire 3 acts so as to absorb the bending, but when the amount of bending that can be absorbed is exceeded, the wire 3 is absorbed. There is a risk of breaking the wire. See also FIG.
In the case of the example, although the resin mold portion 5 has a relatively high rigidity, it is strong against bending stress, but the rounded portion of the wire 3 has an IC.
It has the drawback of increasing the thickness of the card.
【０００５】本発明はかかる従来の技術の欠点を克服す
るためになされたもので、曲げ応力に強く、かつ薄型化
を図ることの可能なＩＣカードを提供することを目的と
する。The present invention has been made in order to overcome the drawbacks of the conventional techniques, and an object thereof is to provide an IC card which is resistant to bending stress and can be made thin.
【０００６】[0006]
【課題を解決するための手段】本発明のＩＣカードは、
カード状基板と、基板上にマウントされるチップ状部品
と、チップ状部品に貼着して電気的接続をなすテープ
と、テープとカード基板との電気的接続をなすワイヤ
と、チップ部品及びテープ及びワイヤを封入する樹脂モ
ールド部とを備えることを特徴とする。The IC card of the present invention comprises:
Card-shaped substrate, chip-shaped component mounted on the substrate, tape attached to the chip-shaped component for electrical connection, wire for electrical connection between tape and card substrate, chip component and tape And a resin mold part for enclosing the wire.
【０００７】[0007]
【作用】上記構成のＩＣカードにおいては、樹脂モール
ド部がチップ状部品、テープ、ワイヤを封入する。樹脂
モールド部により封入された部分は剛性が高く、曲げ応
力が加わってもワイヤが断線することがなく、またワイ
ヤにアールを施すことがないので、厚みを最小限にとど
めることができる。In the IC card having the above structure, the resin mold portion encloses the chip-shaped component, tape and wire. The portion enclosed by the resin mold portion has high rigidity, the wire is not broken even when bending stress is applied, and the wire is not rounded, so that the thickness can be minimized.
【０００８】[0008]
【実施例】以下、本発明の実施例を図面に従って説明す
る。なお、従来の技術と同じ部分には同一の符号を付与
し、その説明は適宜省略する。図１は本発明のＩＣカー
ドの一実施例の構成を示す断面図であり、チップ状部品
１は図３の例の場合と同様にテープ２、ワイヤ３を介し
て基板４と電気的に接続されている。本発明においては
図３の例とは異なり、チップ状部品１、テープ２および
ワイヤ３を樹脂モールド部５で封入する構成となってい
る。Embodiments of the present invention will be described below with reference to the drawings. The same parts as those of the conventional technique are designated by the same reference numerals, and the description thereof will be omitted as appropriate. FIG. 1 is a cross-sectional view showing the configuration of an embodiment of an IC card of the present invention. A chip-shaped component 1 is electrically connected to a substrate 4 via a tape 2 and a wire 3 as in the case of the example of FIG. Has been done. In the present invention, unlike the example of FIG. 3, the chip-shaped component 1, the tape 2 and the wire 3 are encapsulated by the resin mold portion 5.
【０００９】かかる構成のＩＣカードにおいては、チッ
プ状部品１の回路面６が基板４と対向しているので、ワ
イヤ３にアールを施す必要がないため、図４の例に比べ
て、厚みを少なくすることができる。In the IC card having such a configuration, since the circuit surface 6 of the chip-shaped component 1 faces the substrate 4, it is not necessary to round the wire 3, so that the thickness is smaller than that of the example of FIG. Can be reduced.
【００１０】また、基板４に曲げ応力が加わった場合に
は、図２に示すように比較的剛性の高い樹脂モールド部
５はほとんど曲がることがなく、基板４の樹脂モールド
部５の施されていない部分のみが変形する。従って、樹
脂モールド部５内に封入されたワイヤ３が断線する恐れ
がない。When a bending stress is applied to the substrate 4, the resin mold portion 5 having a relatively high rigidity hardly bends as shown in FIG. 2, and the resin mold portion 5 of the substrate 4 is applied. Only the non-existing parts are deformed. Therefore, there is no possibility that the wire 3 enclosed in the resin mold portion 5 will break.
【００１１】[0011]
【発明の効果】以上のように本発明のＩＣカードによれ
ば、樹脂モールド部によってチップ状部品、テープ、ワ
イヤを封入するようにしたので、曲げ応力が加わっても
樹脂モールド部に封入されたワイヤには曲げ応力が伝わ
らず、断線の恐れがなくなる。また、ワイヤにアールを
施す必要がないので、厚みを最小限に抑えることが可能
となる。As described above, according to the IC card of the present invention, since the chip-shaped component, the tape and the wire are encapsulated by the resin mold portion, they are encapsulated in the resin mold portion even if bending stress is applied. No bending stress is transmitted to the wire, and there is no risk of disconnection. Further, since it is not necessary to round the wire, the thickness can be minimized.
【図１】本発明のＩＣカードの一実施例の構成を示す断
面図である。FIG. 1 is a sectional view showing the configuration of an embodiment of an IC card of the present invention.
【図２】図１のＩＣカードに曲げ応力が加わったときの
変形の様子を示す断面図である。FIG. 2 is a cross-sectional view showing a state of deformation when bending stress is applied to the IC card of FIG.
【図３】従来のＩＣカードの一例の構成を示す断面図で
ある。FIG. 3 is a sectional view showing a configuration of an example of a conventional IC card.
【図４】従来のＩＣカードの他の一例の構成を示す断面
図である。FIG. 4 is a sectional view showing the configuration of another example of a conventional IC card.
１ チップ状部品 ２ テープ ３ ワイヤ ４ 基板 ５ 樹脂モールド部 1 Chip-shaped component 2 Tape 3 Wire 4 Substrate 5 Resin mold part
Claims (1)
されるチップ状部品と、前記チップ状部品に貼着して電
気的接続をなすテープと、前記テープと前記カード基板
との電気的接続をなすワイヤと、前記チップ部品及び前
記テープ及び前記ワイヤを封入する樹脂モールド部とを
備えることを特徴とするＩＣカード。1. A card-shaped substrate, a chip-shaped component mounted on the substrate, a tape attached to the chip-shaped component for electrical connection, and an electrical connection between the tape and the card substrate. And a resin mold portion encapsulating the chip component, the tape, and the wire.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3224699A JPH0542791A (en) | 1991-08-09 | 1991-08-09 | IC card |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3224699A JPH0542791A (en) | 1991-08-09 | 1991-08-09 | IC card |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0542791A true JPH0542791A (en) | 1993-02-23 |
Family
ID=16817860
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3224699A Withdrawn JPH0542791A (en) | 1991-08-09 | 1991-08-09 | IC card |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0542791A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1996032696A1 (en) * | 1995-04-13 | 1996-10-17 | Dai Nippon Printing Co., Ltd. | Ic card and ic module |
| JP2001102897A (en) * | 1999-09-30 | 2001-04-13 | Kinseki Ltd | Piezoelectric container |
-
1991
- 1991-08-09 JP JP3224699A patent/JPH0542791A/en not_active Withdrawn
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1996032696A1 (en) * | 1995-04-13 | 1996-10-17 | Dai Nippon Printing Co., Ltd. | Ic card and ic module |
| US5975420A (en) * | 1995-04-13 | 1999-11-02 | Dai Nippon Printing Co., Ltd. | Apparatus and method of manufacturing an integrated circuit (IC) card with a protective IC module |
| US6076737A (en) * | 1995-04-13 | 2000-06-20 | Dai Nippon Printing Co., Ltd. | Apparatus and method of manufacturing an integrated circuit (IC) card with a protective IC module |
| JP2001102897A (en) * | 1999-09-30 | 2001-04-13 | Kinseki Ltd | Piezoelectric container |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A300 | Application deemed to be withdrawn because no request for examination was validly filed |
Free format text: JAPANESE INTERMEDIATE CODE: A300 Effective date: 19981112 |