JPH0543188B2 - - Google Patents

Info

Publication number
JPH0543188B2
JPH0543188B2 JP59099182A JP9918284A JPH0543188B2 JP H0543188 B2 JPH0543188 B2 JP H0543188B2 JP 59099182 A JP59099182 A JP 59099182A JP 9918284 A JP9918284 A JP 9918284A JP H0543188 B2 JPH0543188 B2 JP H0543188B2
Authority
JP
Japan
Prior art keywords
metal foil
insulating layer
hybrid integrated
resin
integrated circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP59099182A
Other languages
English (en)
Japanese (ja)
Other versions
JPS60241237A (ja
Inventor
Takashi Takahama
Kunihito Sakai
Yoichi Kitamura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP59099182A priority Critical patent/JPS60241237A/ja
Publication of JPS60241237A publication Critical patent/JPS60241237A/ja
Publication of JPH0543188B2 publication Critical patent/JPH0543188B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/131—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being only partially enclosed
    • H10W74/144—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being only partially enclosed the encapsulations comprising foils
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations

Landscapes

  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
JP59099182A 1984-05-15 1984-05-15 混成集積回路装置 Granted JPS60241237A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP59099182A JPS60241237A (ja) 1984-05-15 1984-05-15 混成集積回路装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP59099182A JPS60241237A (ja) 1984-05-15 1984-05-15 混成集積回路装置

Publications (2)

Publication Number Publication Date
JPS60241237A JPS60241237A (ja) 1985-11-30
JPH0543188B2 true JPH0543188B2 (de) 1993-06-30

Family

ID=14240509

Family Applications (1)

Application Number Title Priority Date Filing Date
JP59099182A Granted JPS60241237A (ja) 1984-05-15 1984-05-15 混成集積回路装置

Country Status (1)

Country Link
JP (1) JPS60241237A (de)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2560355Y2 (ja) * 1987-12-23 1998-01-21 松下電工株式会社 放電灯点灯装置
FR2685159B1 (fr) * 1991-12-17 1996-11-22 Matra Sep Imagerie Inf Procede de fabrication de circuits electroniques a micro-composants nus et circuit encapsule realisable par ce procede.
JP2525896Y2 (ja) * 1993-08-23 1997-02-12 阪神エレクトリック株式会社 内燃機関の点火コイル
FR2799883B1 (fr) * 1999-10-15 2003-05-30 Thomson Csf Procede d'encapsulation de composants electroniques
JP2003273571A (ja) * 2002-03-18 2003-09-26 Fujitsu Ltd 素子間干渉電波シールド型高周波モジュール
KR20040098070A (ko) * 2002-04-11 2004-11-18 코닌클리즈케 필립스 일렉트로닉스 엔.브이. 전자 디바이스 및 그 제조 방법
JP4096605B2 (ja) * 2002-04-23 2008-06-04 日本電気株式会社 半導体装置および半導体装置のシールド形成方法
JPWO2008026247A1 (ja) * 2006-08-29 2010-01-14 日本包材株式会社 電磁波シールド構造とその形成方法
WO2008026257A1 (en) * 2006-08-29 2008-03-06 Pioneer Corporation Electronic device and method for manufacturing shielding material for same
JP2010182995A (ja) * 2009-02-09 2010-08-19 Kuichi Ose 信号増幅器のシールド装置
WO2014045671A1 (ja) * 2012-09-21 2014-03-27 株式会社村田製作所 電子機器
JP6402421B2 (ja) * 2014-03-25 2018-10-10 北川工業株式会社 電磁波シールド部材、及び電磁波シールド構造
JP2020088206A (ja) * 2018-11-27 2020-06-04 三菱電機株式会社 回路基板用バリア構造

Also Published As

Publication number Publication date
JPS60241237A (ja) 1985-11-30

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