JPH0543331A - Production of highly tough silicon nitride sintered compact - Google Patents

Production of highly tough silicon nitride sintered compact

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Publication number
JPH0543331A
JPH0543331A JP3218057A JP21805791A JPH0543331A JP H0543331 A JPH0543331 A JP H0543331A JP 3218057 A JP3218057 A JP 3218057A JP 21805791 A JP21805791 A JP 21805791A JP H0543331 A JPH0543331 A JP H0543331A
Authority
JP
Japan
Prior art keywords
powder
silicon nitride
sintered body
temperature
oxide
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP3218057A
Other languages
Japanese (ja)
Inventor
Akio Yoshida
昭夫 吉田
Hiroshi Isozaki
啓 磯崎
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Denka Co Ltd
Original Assignee
Denki Kagaku Kogyo KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Denki Kagaku Kogyo KK filed Critical Denki Kagaku Kogyo KK
Priority to JP3218057A priority Critical patent/JPH0543331A/en
Publication of JPH0543331A publication Critical patent/JPH0543331A/en
Pending legal-status Critical Current

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Abstract

PURPOSE:To prevent micro-cracks from forming in a silicon nitride sintered compact and remarkably improve the toughness value. CONSTITUTION:Si3N4 powder containing oxide-based sintering assistant powder or Si3N4 powder containing the oxide-based superconducting sintering assistant powder and Cr3C2 powder is formed and the resultant compact is then pressed and sintered to provide a sintered compact. In the process, the compact is cooled within the temperature region from the maximum sintering temperature to 1200 deg.C at <=10 deg.C/min rate.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】本発明はエンジニアリングセラミ
ックスとして各種機械部品、自動車部品等に適用される
高靱性窒化ケイ素焼結体の製造方法に関するものであ
る。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for producing a high toughness silicon nitride sintered body which is applied as engineering ceramics to various machine parts, automobile parts and the like.

【0002】[0002]

【従来の技術】窒化ケイ素焼結体の有効な高靱性化手段
としてウィスカー繊維による強化が挙げられるが、分散
性、成形性等の技術的問題があるため、ウィスカーの代
わりに、マトリックスの窒化ケイ素柱状粒子自身を成長
させ、高靱性化する方法も試みられている。この方法
は、加圧条件下に高温焼成することによってマトリック
ス窒化ケイ素粒子を通常の数倍にまで成長させ、粒径効
果により高靱性化する方法であり、例えば特開昭62- 10
5958号公報、特開昭63-310771 号公報、「組織制御によ
るSi3N4 セラミックスの多様化:窒化ケイ素セラミック
ス2」、内田老鶴圃、135-146(1990) 等に開示されてい
る。
2. Description of the Related Art Reinforcement by whisker fibers can be cited as an effective means of increasing the toughness of a silicon nitride sintered body. However, there are technical problems such as dispersibility and formability. Attempts have also been made to grow the columnar particles themselves to increase the toughness. This method is a method in which matrix silicon nitride particles are grown up to several times the usual size by firing at high temperature under a pressure condition to increase the toughness by the particle size effect.
5958, JP-A-63-310771, "Diversification of Si 3 N 4 ceramics by controlling the structure: Silicon nitride ceramics 2", Uchida Otsukaku, 135-146 (1990) and the like.

【0003】[0003]

【発明が解決しようとする課題】しかし従来方法で得ら
れた焼結体の破壊靱性値KICは高々9〜 10MPa・m1/2
程度であり、これを大幅に向上させる方法は知られてい
ない。そこで本発明者等は、その原因を明らかにすべく
鋭意研究を行った結果、上記焼結体の窒化ケイ素粒子が
異常成長した状態で冷却されるので、焼結体中にマイク
ロクラックが発生し、それが原因で靱性値の低下を引き
起こすことを見い出した。本発明は、かかる知見に基づ
き、靱性に優れた窒化ケイ素焼結体を提供することを目
的とするものである。
However, the fracture toughness value K IC of the sintered body obtained by the conventional method is at most 9 to 10 MPa · m 1/2.
There is no known way to improve this significantly. Therefore, the inventors of the present invention have conducted extensive studies to clarify the cause, and as a result, the silicon nitride particles of the sintered body are cooled in an abnormally grown state, so that microcracks occur in the sintered body. , It was found that it causes a decrease in toughness value. An object of the present invention is to provide a silicon nitride sintered body having excellent toughness based on such findings.

【0004】[0004]

【課題を解決するための手段】本発明の特徴は、マイク
ロクラックの発生を防止するために焼成工程における冷
却速度を制御したことにある。本発明は、酸化物系焼結
助剤粉末を含む Si3N4粉末を成形した後、その成形体を
加圧焼成して焼結体を製造するにあたり、焼成最高温度
から1200℃までの温度域を10℃/分以下の速度で冷却す
ることを特徴とする高靱性窒化ケイ素焼結体の製造方法
を提供する。また、本発明は、酸化物系焼結助剤粉末お
よび Cr3C2粉末を含む Si3N4粉末を成形した後、その成
形体を加圧焼成して焼結体を製造するにあたり、焼成最
高温度から1200℃までの温度域を10℃/分以下の速度で
冷却することを特徴とする高靱性窒化ケイ素焼結体の製
造方法を提供する。
The feature of the present invention resides in that the cooling rate in the firing step is controlled in order to prevent the generation of microcracks. The present invention, after the Si 3 N 4 powder containing the oxide-based sintering aid powder is molded, the molded body is pressure-fired to produce a sintered body. Provided is a method for producing a high toughness silicon nitride sintered body, which comprises cooling the zone at a rate of 10 ° C./minute or less. Further, the present invention, after the Si 3 N 4 powder containing the oxide-based sintering aid powder and Cr 3 C 2 powder is molded, the molded body is pressure-fired to produce a sintered body. Provided is a method for producing a high toughness silicon nitride sintered body, which comprises cooling a temperature range from the maximum temperature to 1200 ° C at a rate of 10 ° C / minute or less.

【0005】以下に、本発明をさらに詳しく説明する。
使用する窒化ケイ素粉末としては特に制限はないが、窒
化ケイ素粉末のα分率は90%以上、特に95%以上である
のが好ましい。その理由は、α分率が低いと焼結体にお
ける窒化ケイ素粒子のアスペクト比が小さくなり、靱性
値が差程向上しないためである。また、平均粒径は3μ
m 以下、特に1μm 以下であるのが好ましい。その理由
は、粒径が大きすぎると緻密化が阻害されて強度低下が
起こり易くなり、材料として重要な機械的特性が損なわ
れるためである。
The present invention will be described in more detail below.
The silicon nitride powder used is not particularly limited, but the α fraction of the silicon nitride powder is preferably 90% or more, particularly preferably 95% or more. The reason is that if the α fraction is low, the aspect ratio of the silicon nitride particles in the sintered body will be small, and the toughness value will not be improved so much. The average particle size is 3μ
It is preferably m or less, and particularly preferably 1 μm or less. The reason is that if the particle size is too large, the densification is hindered and the strength is apt to decrease, and the mechanical properties important as a material are impaired.

【0006】酸化物系焼結助剤としては、イットリア等
の希土類酸化物単独、或いは希土類酸化物とアルミナ系
或いは更にマグネシア、スピネル等のマグネシア系酸化
物を含む系が挙げられる。窒化ケイ素粉末と酸化物系焼
結助剤とを所望の割合で混合し、適当な成形方法で成形
する。使用する成形方法としてはプレス成形、CIP成
形、鋳込み成形、射出成形、押し出し成形等が挙げられ
る。
Examples of the oxide-based sintering aid include rare earth oxides such as yttria alone, or rare earth oxides and alumina-based materials, or systems containing magnesia-based oxides such as magnesia and spinel. The silicon nitride powder and the oxide-based sintering aid are mixed in a desired ratio and molded by an appropriate molding method. Examples of the molding method used include press molding, CIP molding, cast molding, injection molding and extrusion molding.

【0007】得られた成形体を1〜2000の圧力下に1800
〜2000℃まで加熱し、数時間保持する。この場合、緻密
な焼結体を得るために低温或いは低圧状態で加熱し、適
度に緻密化してから徐々に加圧する必要がある。保持時
間はマトリックス窒化ケイ素粒子が充分に成長するのに
必要な時間であり、大略、1800℃で5〜10時間、2000℃
で1〜2時間である。
The obtained molded body is subjected to a pressure of 1 to 2000 under a pressure of 1800
Heat to ~ 2000 ° C and hold for several hours. In this case, in order to obtain a dense sintered body, it is necessary to heat at a low temperature or a low pressure to appropriately densify and then gradually pressurize. The holding time is the time required for the matrix silicon nitride particles to grow sufficiently, and is generally at 1800 ° C for 5 to 10 hours and 2000 ° C.
It takes 1-2 hours.

【0008】焼成最高温度に保持した後に、1200℃まで
10℃/分以下の速度で冷却し、1200℃以下からは自然冷
却して焼結体を得る。この際に、冷却速度が10℃/分以
上では、得られる焼結体はマイクロクラックが発生しや
すく、靱性が向上しないので、好ましくない。また、冷
却温度を1200℃に限定する理由は、1200℃を越えると、
やはりマイクロクラックが発生しやすく、靱性が向上し
ないためである。冷却速度を制御する手段としては、例
えば焼結炉の温度を制御している温度プログラムコント
ローラーで行う。
After maintaining the maximum firing temperature, up to 1200 ° C
It is cooled at a rate of 10 ° C / min or less, and is naturally cooled from 1200 ° C or less to obtain a sintered body. At this time, if the cooling rate is 10 ° C./minute or more, microcracks are likely to occur in the obtained sintered body and toughness is not improved, which is not preferable. The reason for limiting the cooling temperature to 1200 ° C is that if it exceeds 1200 ° C,
This is also because microcracks are likely to occur and the toughness is not improved. As a means for controlling the cooling rate, for example, a temperature program controller controlling the temperature of the sintering furnace is used.

【0009】本発明は上述の酸化物系焼結助剤粉末を含
む Si3N4粉末であるモノリシック系粉末を使用する場合
でも充分に効果があるが、これに分散粒子として更に C
r3C2粉末を加えると、靱性値の向上はモノリシック系粉
末の場合より更に顕著である。その原因は定かではない
が、窒化ケイ素粒子がモノリシック系粉末の場合より更
に成長するために生じる粒径効果が一つの要因と考えら
れる。この場合の Cr3C2添加量は、原料粉末に対して外
割りで1〜10wt%、特に2〜5wt%であるのが好まし
い。1wt%未満では、窒化ケイ素の粒成長の効果が小さ
く、靱性値はモノリシック系粉末の場合と大差なく、10
wt%を越えると、Cr3C2 と窒化ケイ素との反応が激しく
なり、製造される焼結体が局部的に変形するため、所望
の形状が得られない。
The present invention is sufficiently effective even when using a monolithic powder which is a Si 3 N 4 powder containing the above-mentioned oxide-based sintering aid powder.
When r 3 C 2 powder is added, the improvement in toughness value is more remarkable than in the case of monolithic powder. The cause of this is not clear, but it is considered that one factor is the particle size effect caused by the further growth of the silicon nitride particles as compared with the case of monolithic powder. In this case, the amount of Cr 3 C 2 added is preferably 1 to 10% by weight, particularly 2 to 5% by weight, based on the raw material powder. If it is less than 1 wt%, the effect of grain growth of silicon nitride is small, and the toughness value is not much different from that of monolithic powder,
When it exceeds wt%, the reaction between Cr 3 C 2 and silicon nitride becomes vigorous, and the produced sintered body is locally deformed, so that the desired shape cannot be obtained.

【0010】[0010]

【実施例】以下に、本発明を実施例について具体的に説
明する。実施例1〜7および比較例1〜4 93wt%の Si3N4粉末 (平均粒径 0.4μm 、α分率97%)
、酸化物系焼結助剤として5wt%のY2O3および2wt%
のAl2O3 を Si3N4製ポット内に入れ、 1,1,1−トリクロ
ロエタン中で Si3N4製ボールを用いて20時間混合後乾燥
した。得られた粉末を金型で所定形状に成形し、次いで
CIP成形した後、表1に示す条件で焼成し、焼結体を
得た、尚、焼成条件において、1000℃からの昇温速度は
10℃/分、加圧パターンは1400℃までは15MPa にし、さ
らに焼成最高温度まで徐々に加圧し、最終的に40MPa に
した。得られた焼結体について密度、JIS R1601 に準拠
した3点曲げ強度、JIS R1607 に準拠した SEPB 法によ
る破壊靱性の測定を行った。
EXAMPLES The present invention will be specifically described below with reference to examples. Examples 1 to 7 and Comparative Examples 1 to 4 93 wt% Si 3 N 4 powder (average particle size 0.4 μm, α fraction 97%)
, 5 wt% Y 2 O 3 and 2 wt% as oxide-based sintering aids
Al 2 O 3 was placed in a Si 3 N 4 pot, mixed in 1,1,1-trichloroethane using Si 3 N 4 balls for 20 hours, and then dried. The obtained powder was molded into a predetermined shape with a mold, then CIP molded, and then fired under the conditions shown in Table 1 to obtain a sintered body. In the firing conditions, the temperature rising rate from 1000 ° C was
The pressure pattern was 10 ° C./minute, the pressure pattern was 15 MPa up to 1400 ° C., the pressure was gradually increased to the maximum firing temperature, and finally 40 MPa. The density, the three-point bending strength according to JIS R1601, and the fracture toughness according to the SEPB method according to JIS R1607 of the obtained sintered body were measured.

【0011】結果を表1に示す。表1の結果より、 Si3
N4の粒成長に効果のある1800℃以上の温度で焼成した場
合には、自然冷却或いは冷却温度を1400℃にした比較例
1〜4に対し、10℃/分以下の冷却速度で1200℃まで冷
却した実施例1〜7の焼結体では、高い靱性値が得られ
ることを確認した。
The results are shown in Table 1. From the results in Table 1, Si 3
When fired at a temperature of 1800 ° C or higher, which is effective for grain growth of N 4 , compared to Comparative Examples 1 to 4 in which natural cooling or cooling temperature was 1400 ° C, 1200 ° C at a cooling rate of 10 ° C / min or less. It was confirmed that high toughness values were obtained in the sintered bodies of Examples 1 to 7 that had been cooled to.

【0012】[0012]

【表1】 [Table 1]

【0013】実施例8〜14および比較例5〜8 表2に示す焼成条件を使用し、平均粒径 4.3μm の Cr3
C2粉末を2wt%添加する以外は実施例1〜7と同様な方
法で焼結体を製造し、測定を行った。結果を表2に示
す。表2の結果より、 Cr3C2を添加した系においても、
Si3N4の粒成長に効果のある1800℃以上の焼結温度で焼
成した場合には、自然冷却或いは10℃/分の冷却速度で
1400℃まで又は20℃/分の冷却速度で1200℃まで冷却し
た比較例5〜8に対し、10℃/分以下の冷却速度で1200
℃まで冷却した実施例8〜14の焼結体では、高い靱性値
が得られ、表1に示したモノリシック系よりも更に高い
靱性値であることを確認した。
Examples 8-14 and Comparative Examples 5-8 Cr 3 having an average particle size of 4.3 μm was used under the firing conditions shown in Table 2.
Sintered bodies were manufactured and measured in the same manner as in Examples 1 to 7 except that 2 wt% of C 2 powder was added. The results are shown in Table 2. From the results shown in Table 2, even in the system containing Cr 3 C 2 ,
When firing at a sintering temperature of 1800 ° C or higher, which is effective for grain growth of Si 3 N 4 , it is possible to cool naturally or at a cooling rate of 10 ° C / min.
Compared to Comparative Examples 5 to 8 cooled to 1400 ° C. or 1200 ° C. at a cooling rate of 20 ° C./min, 1200 at a cooling rate of 10 ° C./min or less
It was confirmed that in the sintered bodies of Examples 8 to 14 that were cooled to 0 ° C, a high toughness value was obtained, and the toughness value was higher than that of the monolithic system shown in Table 1.

【0014】尚、この実施例9で得た焼結体および比較
例5で得た焼結体の研磨面の結晶構造を示す倍率2000の
走査型電子顕微鏡写真を図1および図2に示す。図2に
示す自然冷却した比較例5の焼結体にはマイクロクラッ
クが観察されたが、図1に示す実施例9の焼結体にはマ
イクロクラックは観察されず良好な状態であることを確
認した。
1 and 2 are scanning electron micrographs showing the crystal structures of the polished surfaces of the sintered body obtained in Example 9 and the sintered body obtained in Comparative Example 5 at a magnification of 2000. Microcracks were observed in the naturally cooled sintered body of Comparative Example 5 shown in FIG. 2, but microcracks were not observed in the sintered body of Example 9 shown in FIG. confirmed.

【0015】[0015]

【表2】 [Table 2]

【0016】実施例15〜17 最終最高圧力を40MPa から表3に示す条件に変えた点を
除き、実施例9と同様な方法で焼結体を製造し、測定を
行った。結果を表3に示す。表3の結果より、最終最高
圧力を変えても靱性値に大きな相違はなく、高い靱性値
が得られることを確認した。但し、最終最高圧力が中間
圧力と大差ない30MPa の場合には、緻密化しずらかっ
た。
Examples 15 to 17 Sinters were manufactured and measured in the same manner as in Example 9 except that the final maximum pressure was changed from 40 MPa to the conditions shown in Table 3. The results are shown in Table 3. From the results of Table 3, it was confirmed that even if the final maximum pressure was changed, there was no great difference in the toughness values, and high toughness values were obtained. However, when the final maximum pressure was 30 MPa, which was not much different from the intermediate pressure, it was difficult to densify.

【0017】 [0017]

【0018】実施例18〜21 Si3N4粉末を表4に示す粉末特性の粉末に変えた点を除
き、実施例9と同様な方法で焼結体を製造し、測定を行
った。結果を表4に示す。表4の結果より、Si3N4 粉末
のα分率が90%以上、平均粒径が 2.8μm 以下の条件に
おいて高い靱性値が得られることを確認した。
Examples 18 to 21 Sintered bodies were manufactured and measured in the same manner as in Example 9 except that the powder having the powder characteristics shown in Table 4 was used instead of the Si 3 N 4 powder. The results are shown in Table 4. From the results of Table 4, it was confirmed that a high toughness value was obtained under the condition that the α fraction of the Si 3 N 4 powder was 90% or more and the average particle size was 2.8 μm or less.

【0019】 [0019]

【0020】実施例22〜25 酸化物系焼結助剤を5wt%のY2O3および2wt%のAl2O3
から表5に示す助剤に変えた点を除き、実施例19と同様
な方法で焼結体を製造し、測定を行った。結果を表5に
示す。表5の結果より、他の酸化物系助剤系でも高い靱
性値が得られることを確認した。
Examples 22-25 Oxide-based sintering aids 5 wt% Y 2 O 3 and 2 wt% Al 2 O 3
A sintered body was manufactured in the same manner as in Example 19 except that the auxiliaries shown in Table 5 were used, and the measurements were performed. The results are shown in Table 5. From the results in Table 5, it was confirmed that a high toughness value can be obtained with other oxide-based auxiliary agents.

【0021】 [0021]

【0022】実施例26〜29 Cr3C2 添加量を2wt%から表6に示す添加量に変えた点
を除き、実施例9と同様な方法で焼結体を製造し、測定
を行った。結果を表6に示す。表6の結果より、Cr3C2
添加量が1〜10wt%の範囲の場合には高い靱性値が得ら
れることを確認した。
Examples 26 to 29 Sintered bodies were manufactured and measured in the same manner as in Example 9 except that the Cr 3 C 2 addition amount was changed from 2 wt% to the addition amount shown in Table 6. .. The results are shown in Table 6. From the results in Table 6, Cr 3 C 2
It was confirmed that a high toughness value was obtained when the addition amount was in the range of 1 to 10 wt%.

【0023】 [0023]

【0024】[0024]

【発明の効果】本発明の方法により、強度を損なうこと
なく、高い破壊靱性を有する窒化ケイ素焼結体を得るこ
とができる。
According to the method of the present invention, a silicon nitride sintered body having high fracture toughness can be obtained without impairing the strength.

【図面の簡単な説明】[Brief description of drawings]

【図1】本発明の方法によって得た実施例9の焼結体の
研磨面の結晶構造を示す倍率2000の走査型電子顕微鏡写
真である。
FIG. 1 is a scanning electron micrograph (magnification: 2000) showing a crystal structure of a polished surface of a sintered body of Example 9 obtained by the method of the present invention.

【図2】従来の方法によって得た比較例5の焼結体の研
磨面の結晶構造を示す倍率2000の走査型電子顕微鏡写真
である。
FIG. 2 is a scanning electron micrograph at a magnification of 2000 showing a crystal structure of a polished surface of a sintered body of Comparative Example 5 obtained by a conventional method.

Claims (2)

【特許請求の範囲】[Claims] 【請求項1】 酸化物系焼結助剤粉末を含む Si3N4粉末
を成形した後、その成形体を加圧焼成して焼結体を製造
するにあたり、 焼成最高温度から1200℃までの温度域を10℃/分以下の
速度で冷却することを特徴とする高靱性窒化ケイ素焼結
体の製造方法。
1. When a Si 3 N 4 powder containing an oxide-based sintering aid powder is molded and then the molded body is pressure-fired to produce a sintered body, the maximum firing temperature up to 1200 ° C. A method for producing a high toughness silicon nitride sintered body, which comprises cooling the temperature range at a rate of 10 ° C / minute or less.
【請求項2】 酸化物系焼結助剤粉末および Cr3C2粉末
を含む Si3N4粉末を成形した後、その成形体を加圧焼成
して焼結体を製造するにあたり、 焼成最高温度から1200℃までの温度域を10℃/分以下の
速度で冷却することを特徴とする高靱性窒化ケイ素焼結
体の製造方法。
2. A sintered body is manufactured by molding a Si 3 N 4 powder containing an oxide-based sintering aid powder and a Cr 3 C 2 powder, and then sintering the molded body under pressure to produce a sintered body. A method for producing a high toughness silicon nitride sintered body, which comprises cooling a temperature range from temperature to 1200 ° C at a rate of 10 ° C / minute or less.
JP3218057A 1991-08-05 1991-08-05 Production of highly tough silicon nitride sintered compact Pending JPH0543331A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3218057A JPH0543331A (en) 1991-08-05 1991-08-05 Production of highly tough silicon nitride sintered compact

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3218057A JPH0543331A (en) 1991-08-05 1991-08-05 Production of highly tough silicon nitride sintered compact

Publications (1)

Publication Number Publication Date
JPH0543331A true JPH0543331A (en) 1993-02-23

Family

ID=16713973

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3218057A Pending JPH0543331A (en) 1991-08-05 1991-08-05 Production of highly tough silicon nitride sintered compact

Country Status (1)

Country Link
JP (1) JPH0543331A (en)

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