JPH0543556U - Hybrid integrated circuit board - Google Patents

Abstract

(57) [Summary] (Correction) [Purpose] Prevents thermal interference between semiconductor components via a metal substrate and enables reliable heat dissipation from a heat sink. [Structure] The semiconductor components 2a and 2b are other electronic components 4,
4 and the like are mounted on the metal substrates 9a and 9b via the insulating layer 1 and connected to the circuit wiring 5 formed on the surface of the insulating layer 1. The metal substrates 9a and 9b are separated from each other with the divided portion 6 as a boundary, and the two semiconductor components 2a and 2b are mounted on different metal substrates 9a and 9b, respectively. Therefore, the heat generated from the one semiconductor component 2a is generated by the metal substrate 9
It does not reach the other semiconductor component 2b via a and 9b.

Description

[Detailed description of the device]

[0001]

[Industrial applications]

 The present invention relates to a circuit device using a semiconductor component such as a power transistor or an FET, and to a hybrid integrated circuit substrate using a metal substrate having a heat radiation property for cooling the semiconductor component.

[0002]

[Prior Art]

 Conventionally, a hybrid integrated circuit board on which a semiconductor component with a large amount of heat radiation is mounted uses a metal substrate with good heat dissipation as a circuit board on which the semiconductor component is mounted so that heat generation does not hinder the circuit function. Heat is radiated from semiconductor components through the metal substrate. For example, in a semiconductor component that generates a large amount of heat such as a power transistor, the outer casing of the semiconductor component is directly or indirectly bonded to the metal substrate.

As the hybrid integrated circuit board on which these semiconductor components that easily generate heat are mounted, for example, those shown in FIGS. 3 and 4 showing a conventional example are known. That is, the hybrid integrated circuit board shown in FIGS. 3 and 4 uses two semiconductor components 2, 2 such as power transistors that generate a large amount of heat. An insulating layer 1 is formed on a metal substrate 9, and the semiconductor components 2, 2 and other electronic components 4, 4, ... Are mounted on the insulating layer 1. The conductive lands 8, 8 ... Are formed on one side of the insulating layer 1, and one ends of the lead terminals 7, 7 are soldered to the respective electrode lands 8, 8 ... And led out to the side of the insulating layer 1. ing.

[0004]

[Problems to be solved by the device]

 The high frequency power amplifier using such a metal substrate 9 corresponds to the recent miniaturization of mobile phones and the like, and thus the demand for further miniaturization is increasing, and as shown in FIGS. 2 are often mounted close to each other.

However, when the semiconductor components 2 and 2 are mounted close to each other in this manner, the heat generated from one semiconductor component 2 is transmitted to the other semiconductor component 2 via the metal substrate 9 having good thermal conductivity. In some cases, the heat generated from the semiconductor components 2 and 2 of both of them may be concentrated in the meantime, and the heat may not be radiated smoothly from the metal substrate 9. In this way, the heat generated from the semiconductor components 2 and 2 reaches the other semiconductors 2 and 2 via the metal substrate 9 and, so to speak, thermal interference occurs. As a result, there was a problem that the heat was not released exactly as originally designed due to rises and the like. It is an object of the present invention to provide a hybrid integrated circuit board that solves the above-mentioned problems of the prior art, prevents thermal interference between semiconductor components, and enables reliable heat dissipation from a metal board. .

[0006]

[Means for solving the problem]

 That is, according to the present invention, in order to achieve the above object, the metal substrates 9a and 9b, the insulating layer 1 formed on the metal substrates 9a and 9b and having the circuit wiring 5 formed on the surface thereof, and the insulating layer 1 are formed. In a hybrid integrated circuit board having a plurality of semiconductor components 2a, 2b mounted on the metal substrates 9a, 9b via the above and connected to the circuit wiring 5, the metal substrates 9a, 9b are the semiconductor components 2a, Provided is a hybrid integrated circuit board, characterized in that the semiconductor parts 2a and 2b are each divided into 2b and are mounted on the different metal boards 9a and 9b via the insulating layer 1 respectively.

[0007]

[Work]

 In the hybrid integrated circuit board according to the present invention, the metal substrates 9a and 9b are divided for each of the semiconductor components 2a and 2b, and one semiconductor component is provided on each of the metal substrates 9a and 9b via the insulating layer 1. Since 2a and 2b are mounted, the heat generated from one semiconductor component 2a does not reach the other semiconductor component 2b via the metal substrates 9a and 9b. Therefore, thermal interference between the semiconductor components 2a and 2b does not occur, and the heat generated from the individual semiconductor components 2a and 2b is radiated from the respective metal substrates 9a and 9b. Therefore, unexpected heat conduction does not occur, and the heat radiation originally expected in the design is almost certainly achieved.

[0008]

【Example】

 Next, an embodiment of the present invention will be specifically described with reference to the drawings. The hybrid integrated circuit boards shown in FIGS. 1 and 2 have basically the same structure as the hybrid integrated circuit boards shown in FIGS. 3 and 4 described above. That is, the insulating layer 1 is formed on the metal substrates 9a and 9b, and the two semiconductor components 2a and 2b, as well as the other electronic components 4, 4, ... Are provided on the metal substrates 9a and 9b via the insulating layer 1. It is mounted on. A circuit wiring 5 including a conductor pattern, a resistance pattern, an insulation pattern, etc. is formed on the surface of the insulating layer 1 on the side on which the semiconductor components 2a and 2b are mounted.

The metal substrates 9a and 9b are divided into left and right sides in FIG. 2, and the two metal substrates 9a and 9b are separate from each other. These metal substrates 9a and 9b are joined by an adhesive or the like on the principal surface of the insulating layer 1 on the component mounting side and the opposite side so as to be divided into the functions in FIG.

The conductive lands 8, 8 ... Are formed on one side of the insulating layer 1, and one ends of the lead terminals 7, 7 ... Are soldered to the respective electrode lands 8, 8 ,. Is derived to the side of. In the above embodiments, the case where the number of the semiconductor components 2a and 2b mounted on the insulating layer 1 is two has been described, but the present invention can be applied even when the number of the semiconductor components 2a and 2b is three or more. It's clear. In this case, the metal substrates 9a and 9b are basically divided into three or more for each semiconductor component 2a and 2b, which is basically the same as the above-mentioned embodiment.

[0011]

[Effect of the device]

 As described above, according to the present invention, it is possible to prevent the plurality of semiconductor components 2a and 2b mounted on the insulating layer 1 from interfering with each other through the metal substrates 9a and 9b, and to prevent a local unexpected occurrence. It is possible to obtain the effect that the originally designed heat dissipation is possible without the temperature rising.

[Brief description of drawings]

FIG. 1 is a perspective view of a hybrid integrated circuit board showing an embodiment of the present invention.

FIG. 2 is a side view of the hybrid integrated circuit board.

FIG. 3 is a perspective view of a hybrid integrated circuit board showing a conventional example.

FIG. 4 is a side view of the hybrid integrated circuit board.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Insulating substrate 2a Exothermic semiconductor component 2b Exothermic semiconductor component 4 General electronic component 5 Circuit wiring 9a Heat sink 9b Heat sink

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Claims (1)

[Reference number] 0030214-01 [Claims for utility model registration] 1. Metal substrates 9a, 9b and the metal substrate 9
an insulating layer 1 formed on a and 9b and having a circuit wiring 5 formed on the surface, and metal substrates 9a and 9b via the insulating layer 1.
In a hybrid integrated circuit board having a plurality of semiconductor components 2a, 2b mounted thereon and connected to the circuit wiring 5, the metal substrates 9a, 9b are divided for each semiconductor component 2a, 2b, 2. A hybrid integrated circuit board, wherein 2a and 2b are mounted on different metal boards 9a and 9b via the insulating layer 1 respectively.