JPH0545246B2 - - Google Patents

Description

[Detailed Description of the Invention] Industrial Application Field This invention provides a carpet with a built-in electronic circuit,
Related to floor interior materials such as carpet tiles.

BACKGROUND TECHNOLOGY In view of the advent of a highly information-oriented society, many information and communication devices such as personal computers and facsimile machines have recently been installed in offices as data terminals for information processing networks or as so-called OA equipment. I'm getting used to it. As a result, the problem has become how to handle the large number of complicated wirings connected to each piece of equipment within the office.

One such in-office wiring processing method is an undercarpet wiring method, but it has drawbacks such as requiring installation work on the floor and making changes to the layout troublesome.

Therefore, as a solution to this drawback, a concept has been proposed in which the cables are built into the floor interior material itself, such as carpet, and the wiring is performed using a combination of the cables. (For example, JP-A-61-233146, JP-A-62-
No. 74317).

Problems to be Solved by the Invention However, when connecting a terminal such as a personal computer to a host computer inside or outside the office and transmitting information, the conventional floor interior materials described above often have problems with the terminal. For example, it is necessary to interpose electronic circuits such as interfaces, but conventional floor interior materials simply have built-in cables, so the wiring around terminals remains complicated. It was hot. Another drawback was that the space occupied by electronic circuits such as interfaces itself was wasted, leading to a reduction in work space. These shortcomings are caused by terminals and
As the number of office automation equipment increases and information processing networks are expanded, this problem is becoming increasingly noticeable.

This invention eliminates these drawbacks, comprehensively simplifies the wiring system including the wiring around devices such as terminals, and provides new carpets and tiles to expand the work space in the office. It provides floor interior materials such as carpets.

Means for Solving the Problems The present invention provides floor interior materials for electronic circuits constituting devices necessary for information transmission and communication, such as terminal interfaces, or devices necessary for the operation of various devices. This was the result of further intensive research with a focus on incorporating it into the system.

That is, the floor interior material with a built-in electronic circuit according to the present invention has a surface layer 3 integrally coated on a base layer 2 made of synthetic resin, as shown in FIGS. 1 and 2, for example. A circuit board 5 on which an electronic component 4 is mounted on a base layer and an electronic circuit is formed by the electronic component is embedded integrally with the mounting surface of the electronic component facing downward. Here, as the synthetic resin forming the base layer 2, preferably a non-foamed urethane elastomer is used.

Function If a floor interior material containing a built-in electronic circuit that constitutes the terminal interface is installed, in order to connect the terminal device to a host computer, the built-in electronic circuit must be extended to the outside of the floor interior material. Connector 6
Alternatively, it is sufficient to simply connect the connection terminal of the terminal to the jack (not shown), simplifying the wiring around the terminal. At the same time, the installation space for the interface is no longer required, and the work space in the office is expanded. Further, the circuit board 5 is integrally embedded in the base layer 2, and the synthetic resin is completely filled up to the smallest spaces around each electronic component 4. Therefore, the load of pedestrians and the like applied to the floor interior material after installation will not be locally concentrated on the electronic component 4. Furthermore, since the circuit board 5 is buried with its mounting surface facing downward, the circuit board 5 acts to suppress this load, further reducing the load on the electronic components 4. be done.

Embodiment FIGS. 1 and 2 show a square tile carpet, which is one of the floor interior materials. This tile carpet 1 has a base layer 2 made of transparent synthetic resin having a predetermined thickness and a surface layer 3 integrally coated in a laminated manner. Here, the surface layer 3 consists of a base fabric 32 on which piles 31 are planted and a backing layer 33 integrally coated on the back surface thereof. Here, the base layer 2 is provided to provide stability to the surface layer 3 and to incorporate an electronic circuit.

Almost in the center of the base layer 2, an epoxy glass cloth circuit board 5 on which various electronic components 4 such as ICs and micro-relays are mounted is buried horizontally with its mounting surface facing downward. . The electronic circuit constituted by the electronic component 4 is an electronic circuit such as an interface for connecting a terminal such as a personal computer to a predetermined information processing network, or an interface for connecting with a telephone. Electronic circuits, etc. And terminal A (shown in Figure 5) to electronic circuits such as these interfaces.
a plug-in connector 6 with a lid electrically connected to the electronic circuit via a cord (not shown) also embedded in the base layer 2 for connection with a phone or a telephone;
is provided with the upper surface exposed by excluding a part of the surface layer 3. Furthermore, on both sides of the circuit board 5, there are two flexible printed wiring boards each extending in electrical continuity from the electronic circuit such as an interface to connect the electronic circuit to a host computer or other equipment. (hereinafter referred to as "FPC")
7 is similarly embedded in the base layer 2 in a state that crosses the middle part in the thickness direction. The tips of these FPCs 7 extend to a slightly protruding position from both side edges of the tile carpet 1, but both side edges of the base layer 2 are notched in a concave shape, and the tip portions of the FPCs 7 are exposed at these notches 8. The state has been made.
The cutout portion 8 is formed as a connection point between the FPCs 7 of the tile carpets laid adjacent to each other.

The above-mentioned circuit board 5 and FPC 7 are manufactured by setting these at a predetermined position in a mold, and then pouring synthetic resin into the mold to quickly fill the detailed space around each electronic component 4 with the synthetic resin. It is embedded integrally in the base layer 2 by hardening. Here, the synthetic resin forming the base layer 2 is not particularly limited, and a synthetic resin used as a backing material for ordinary carpet tiles may be used, but it is preferable to use a non-foamed urethane elastomer. preferable. The reason for this is
Appropriate cushioning properties can be provided to improve the feeling of walking after installation, excellent electrical insulation and water resistance for electronic components, and no need to worry about heat damage to electronic components that may be destroyed at high temperatures. However, it is possible to embed the material in one piece at room temperature or a low temperature region close to this, there is little shrinkage during molding, the coefficient of thermal expansion is extremely small, and the dimensional stability is excellent. A non-foamed urethane elastomer that satisfies these conditions can be obtained by mixing and reacting an active hydrogen-containing compound and a polyisocyanate compound in a normal ratio,
JIS A hardness is 60 or higher. Incidentally, the base layer 2 of this example is made of polyether polyol with a hydroxyl value of 160 mgKOH/g and modified 4,4'-diphenylmethane diisocyanate (hereinafter referred to as modified) with an isocyanate content of 23% by weight as raw materials for the non-foamed urethane elastomer. After each raw material was degassed under reduced pressure to 5 mmHg or less using MDI, a mixture of 100 parts by weight of this polyether polyol and 157.5 parts by weight of modified MD was poured into a mold coated with a mold release agent. It was manufactured by curing at ℃ for 3 to 4 hours. In addition, the non-foamed urethane elastomer is
JIS A hardness was 90. Of course, the raw materials for the synthetic resin and the molding process are not limited to these. Further, it is not always necessary to use a mold, and a molding process may be used in which the circuit board 5 and the like are set in a predetermined position on the upper surface of the surface layer 3, which is turned upside down, and then the synthetic resin is poured onto the surface.

When the tile carpet 1 having the above configuration is laid on the floor, the connector 6 is placed in a predetermined position.
Lay it so that it is placed. Then, sandwich the carpet tile 1 and place a circuit board on both sides.
After arranging the FPC or another tile carpet 1 or 11 in which only the FPC is buried, as shown in FIGS. 3 and 4, so that the notches 8 match each other, the two FPCs 7 and 7 are connected. Connect the ends electrically. This connection can be made by turning over the surface layer 3 above the notch 8, and making a connection between both sides, for example, as shown in the same figure.
Both FPCs 7,
This can be done by overlapping the parts 7 and fixing them with insulating fixing members 9, 9 with screws from both upper and lower sides of this overlapping part. By sequentially making such connections between adjacent tile carpets, predetermined wiring as shown in FIG. 5 is achieved. Note that 10 shown in Figures 3 and 4 is an FPC.
This is a protection plate fitted into the notch 8 after the connection.

Above, tile carpet has been shown as a floor interior material, but as shown in FIG. As the base layer, a base layer in which a circuit board 5' having an electronic component 4' mounted thereon and an FPC 7' may be embedded may be used. Furthermore, the surface layer 3 may be made of a wood-based decorative board, a vinyl chloride board, a foamed vinyl chloride flooring material, etc. instead of a carpet. Further, the built-in electronic circuits are not limited in function or form, and desired ones may be embedded as necessary.

Effects of the Invention Since the present invention has an electronic circuit built into the base layer, for example, when this electronic circuit is an electronic circuit such as an interface for connecting a terminal,
It is no longer necessary to connect the terminal device and the interface in the work space in the office, and it is now only necessary to connect the terminal device to the electronic circuit such as the interface inside the floor interior material. Wiring around various devices can be simplified. In addition, the work space in the office is expanded by the built-in electronic circuit device, which improves the work environment and work efficiency. Of course, unlike the undercarpet wiring method, there is no need for installation work on the floor, and it is convenient because layout changes can be easily handled by simply relocating or replacing floor interior materials. Furthermore, since the circuit board is embedded integrally in the base layer, the synthetic resin can be quickly filled up to the smallest spaces around each electronic component. Therefore, the load of pedestrians and the like applied to the floor interior material after installation will not be locally concentrated on the electronic components, and circuit failures due to damage to the electronic components can be reliably prevented. Moreover, since the circuit board is buried with its mounting surface facing downward, the board acts to suppress the above-mentioned load, further reducing the load on the electronic components, and The electronic circuit can operate stably for a long period of time. In addition, when the base layer is made of non-foamed urethane elastomer, it is possible to improve the feeling of walking due to moderate cushioning properties, and it has excellent electrical insulation and water resistance against electronic components, which may be destroyed at high temperatures. It is now possible to bury electronic components in one piece at room temperature or a low temperature region close to this without worrying about heat.
It has low shrinkage during molding, has an extremely low coefficient of thermal expansion, and has excellent dimensional stability.

[Brief explanation of the drawing]

FIG. 1 is a perspective view showing a tile carpet with a part thereof cut away, FIG. 2 is a sectional view taken along the line -- in FIG. FIG. 4 is a sectional view taken along the line -- in FIG. 3, FIG. 5 is a plan view schematically showing a part of the wiring using the tile carpet of FIG. 1, and FIG. 6 is a sectional view of the carpet. 1...Tile carpet, 2...Base layer, 3...
...Surface layer, 4...Electronic component, 5...Circuit board.

Claims (1)

[Scope of Claims] 1. A circuit board comprising a base layer made of a synthetic resin and a surface layer integrally coated thereon, electronic components mounted on the base layer, and an electronic circuit formed by the electronic components. A floor interior material with a built-in electronic circuit, characterized in that the components are buried integrally with the mounting surface facing downward. 2. The floor interior material with a built-in electronic circuit according to claim 1, wherein the synthetic resin is made of a non-foamed urethane elastomer.