JPH0545510A - Color filter manufacturing method - Google Patents

Abstract

(57) [Abstract] [Purpose] An object of the present invention is to provide a method for manufacturing a color filter that does not generate a sudden step between a light-shielding portion and a pixel. [Structure] Light-shielding portion 2 formed on a substrate 1 such as glass
Then, after applying a colored resist on the substrate 1 including the light-shielding portion 2, exposure is performed using an area below an opening for forming pixels formed by the light-shielding portion 2 on the substrate 1 as an exposure region. After that, the substrate is rotated, and thereafter, exposure is performed with an area equal to or larger than an opening for forming a pixel formed by the light shielding portion 2 on the substrate 1 as an exposure region. [Effect] It is possible to prevent the disconnection of the transparent conductive film due to the sudden step between the pixel and the light-shielding portion, the thinning of the film, and the increase in the resistance of the transparent conductive film caused by the generation of cracks. Can be realized.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing a color filter used for a liquid crystal display or the like.

[0002]

2. Description of the Related Art In recent years, a liquid crystal display has been actively developed as a main force of a flat display, and a color filter used for the liquid crystal display is also actively developed.

Conventionally, as a color filter for a flat display such as a liquid crystal display, it has been disclosed in JP-A-62-136.
No. 2 etc. have been filed. As an example, FIG. 4 shows a process chart of a method for manufacturing a color filter. An example of the conventional method for manufacturing the above-described color filter will be described below with reference to the drawings.

A color filter has conventionally been manufactured through the following manufacturing process shown in FIG. (A) First, a chrome film or the like is formed on the glass substrate 1 by a sputtering method or the like, and patterned by a photolithography method to form the light shielding portion 2. (B) Next, as shown in FIG. 4B, red, green, and blue pixels 3 made of a colored resist are sequentially formed by a photolithography method. (C) After that, in FIG. 4C, a protective film 4 made of a polymer resin is applied on the light-shielding portion 2 and the pixel 3 and cured by heat treatment to be formed. (D) Then, as shown in FIG. 4D, the transparent conductive film 5 is formed by using a sputtering method or the like.

[0005]

However, the method of manufacturing the above color filter has the following problems.

The protective film 4 is formed to smooth the step between the light shielding portion 2 and the pixel 3. However, due to the abrupt step between the light shielding portion 2 and the pixel 3, in the color filter obtained by the above process, As shown in FIG. 5, the protective film 4 also has a large step portion. Therefore, the transparent conductive film 5 formed on the protective film 4 has a poor step coverage, and has a broken portion as shown in A portion of FIG. 5 or a thin film portion as shown in B portion of FIG. Occurs. Further, there is a problem in that a crack as shown in the C portion of FIG. 5 occurs.

Therefore, the resistance of the transparent conductive film 5 increases, and the voltage drop increases as the distance from the input terminal for applying a voltage to the transparent conductive film 5 increases. That is, the voltage that can be applied to the transparent conductive film 5 at a position corresponding to the pixel 3 is greatly different depending on the distance from the input terminal, which causes a problem such as uneven brightness, and a high-quality large-area display is manufactured. Was difficult.

In view of the above problems, the present invention provides a method of manufacturing a color filter for preventing a sharp step between the light-shielding portion 2 and the pixel 3 and realizing a high-quality large-area flat display. With the goal.

[0009]

In order to solve the above-mentioned problems, a method of manufacturing a color filter according to the present invention comprises a light-shielding portion formed on a substrate such as glass, and a substrate including the light-shielding portion. After applying the colored resist, exposure is performed with an area below the opening for forming the pixel formed by the light-shielding portion on the substrate as an exposure region, and then the substrate is rotated, and then the light-shielding portion on the substrate The exposure is performed with an area equal to or larger than the opening for forming the pixel formed by the above as an exposure region.

Alternatively, a light shielding portion formed on a substrate such as glass and a substrate including the light shielding portion is coated with a colored resist, and then an opening for forming a pixel formed by the light shielding portion on the substrate is formed. Is exposed to light and developed, and then a new colored resist is applied on the substrate including pixels formed by the light-shielding portion and the colored resist, and the light-shielding portion on the substrate forms The exposure is performed using an area larger than the opening for forming the formed pixels as an exposure region.

[0011]

According to the first means, a pixel having an area equal to or smaller than the opening is formed in the opening for forming the pixel by the first exposure. The colored resist remains where it is not exposed. When this substrate is rotated,
The colored resist that has not been exposed by the centrifugal force and the surface tension remains slightly adhered to the periphery of the colored resist that has been cured by the exposure. Next, a second exposure is performed on a region having an area equal to or larger than an opening for forming a pixel formed by the light-shielding portion, so that the reaction caused by the first exposure and the reaction attached to the periphery of the cured colored resist The uncolored resist reacts and becomes a cured colored resist.
By developing this substrate, the pixels formed on the substrate and the light shielding portion have a trapezoidal shape, and a sharp step between the pixel and the light shielding portion does not occur.

Alternatively, according to the above-mentioned second means, a pixel having an area equal to or smaller than the opening is formed in the opening for forming the pixel by performing the first exposure and developing the substrate. Next, after applying a colored resist on this substrate, a second exposure is applied to a region having an area larger than an opening for forming a pixel formed by the light-shielding portion, so that the first exposure causes a reaction. Then, the unreacted colored resist attached around the cured colored resist reacts to become a cured colored resist. By developing this substrate, the pixels formed on the substrate and the light shielding portion have a trapezoidal shape, and a sharp step between the pixel and the light shielding portion does not occur.

As described above, in any of the means, a sharp step between the pixel and the light-shielding portion is not generated, and the disconnection and the film thickness of the transparent conductive film due to the sharp step between the pixel and the light-shielding portion are reduced. The generation of cracks can be prevented.

[0014]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the color filter manufacturing method of the present invention will be described below with reference to the drawings.

The manufacturing process of the embodiment of the present invention is divided into FIGS. 1 and 2 for convenience of drawing paper size. That is, one set of FIGS. 1 and 2 shows the manufacturing process of this embodiment. Note that, in this embodiment as well, elements having the same functions as the constituent elements of the color filter formed on the substrate in each step of the conventional example described with reference to FIG. The steps of this example will be described below. (A) First, as shown in FIG. 1 (a), a chromium film or the like is formed on a glass substrate 1 by a sputtering method or the like, and patterned by a photolithography method to form a light shielding portion 2. To do. (B) Next, as shown in FIG. 1B, the colored resist 6 is applied to the glass substrate 1 on which the light shielding portion 2 is formed, and the area below the opening formed by the light shielding portion 2 for pixel formation. Exposure is performed using a mask 7 having an exposure area of.

Then, as shown in FIG. 1 (c), only the exposed region reacts to become a cured colored resist 8. (C) Thereafter, when the glass substrate 1 is rotated by a spinner or the like, the unreacted colored resist 6 remaining between the cured and cured colored resists 8 is formed as shown in FIG. 1D. .. (D) Next, as shown in FIG. 2A, using a mask 9 having an exposure area that is larger than the opening formed by the light-shielding portion 2 for forming pixels formed on the glass substrate 1. , Perform exposure. (E) The exposed portion becomes a colored resist 8 which is reacted and hardened. By developing and post-baking the glass substrate 1, as shown in FIG. 2B, the reacted and hardened colored A sharp step between the pixel of the resist 8 and the light shielding portion 2 does not occur.

Therefore, according to the above steps, FIG.
As shown in FIG. 3, the protective film 4 formed thereon has no sharp step, and the transparent conductive film 5 formed on the protective film 4 disappears.
Since it is possible to prevent wire breakage, thin film thickness, and generation of cracks, it is possible to realize a high-quality large-area flat display.

A method of manufacturing a color filter according to a second embodiment of the present invention will be described below with reference to the drawings.

FIG. 3 shows a manufacturing process chart of this embodiment. Note that, in this embodiment as well, elements having the same functions as the constituent elements of the color filter formed on the substrate in each step of the conventional example described with reference to FIG. The steps of this example will be described below. (A) First, as shown in FIG. 3A, a chrome film or the like is formed on the glass substrate 1 by a sputtering method or the like, and patterned by a photolithography method to form a light shielding portion 2.
To form. (B) After that, as shown in FIG. 3B, a colored resist is applied to the glass substrate 1 on which the light shielding portion 2 is formed, and the area below the opening formed by the light shielding portion 2 for pixel formation is exposed. As a region, after exposure and development and post-baking, a reacted and hardened colored resist 10 having an area equal to or smaller than the opening formed by the light shielding portion 2 for pixel formation is formed.
A pixel is formed. (C) Next, a new colored resist 11 is applied on the glass substrate 1 and rotated by a spinner or the like to obtain the structure shown in FIG.
A new colored resist 11 is formed as shown in (c). (D) Next, as shown in FIG. 3D, exposure is performed by the mask 12 so that an area larger than the opening formed by the light shielding portion 2 for forming pixels formed on the glass substrate 1 becomes an exposure region. .. (E) The exposed portion becomes a cured and cured colored resist 10. By developing and post-baking the glass substrate 1, as shown in FIG. 3 (e), the reacted and cured coloring is obtained. A sharp step between the pixel of the resist 10 and the light shielding portion 2 does not occur.

Therefore, according to the above steps, the protective film formed on the protective film does not have a sharp step, and the transparent conductive film formed on the protective film has a disconnection and a thin film thickness and a crack. Since it can be prevented from occurring, a high-quality large-area flat display can be realized.

[0021]

According to the method of manufacturing a color filter of the present invention, since a sharp step between the pixel and the light-shielding portion does not occur, a steep step does not occur in the protective film formed on the pixel. It is possible to prevent disconnection of the transparent conductive film formed above, thinning of the film, and increase in resistance of the transparent conductive film caused by generation of cracks. Therefore, it is possible to manufacture a high-quality large-area display having good display performance without unevenness in brightness and the like, and to provide a great effect in practical use.

[Brief description of drawings]

FIG. 1A is a patterning process diagram of a light shielding part in an embodiment of a method for manufacturing a color filter of the present invention, FIG. 1B is an exposure process diagram of the embodiment, and FIG. 1C is a coloring process of the embodiment. Process diagram of forming resist (d) is a process diagram of completing the colored resist of the embodiment

2A and 2B show the manufacturing process of the same embodiment as one set in FIG. 1, in which FIG. 2A is an exposure process drawing performed subsequently to FIG. 1D, and FIG. The post-baking process diagram (c) in the example is a cross-sectional state diagram of the main part of the color filter obtained in the final stage of the example.

3A is a patterning process diagram of a light shielding part in another embodiment of the present invention, FIG. 3B is a process diagram of forming a colored resist in the same embodiment, and FIG. 3C is a new coloring process in the same embodiment. A resist forming process diagram (d) is an exposure process diagram in the same embodiment, and (e) is a cross-sectional state view of a main part of a color filter obtained at the final stage of the same embodiment.

4A is a process diagram of forming a light-shielding portion in a conventional color filter manufacturing method, FIG. 4B is a process diagram of forming pixels in the conventional example, and FIG. 4C is a protective film forming process in the conventional example. FIG. 3D is a process diagram of forming a transparent conductive film in the conventional example.

FIG. 5 is a sectional view of a color filter obtained by a method for manufacturing a color filter of the same conventional example.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Glass substrate 2 Light-shielding part 3 Pixel 4 Protective film 5 Transparent conductive film 6 Colored resist 7 Mask 8 Reactive and hardened colored resist 9 Mask 10 Reacted and hardened colored resist 11 Colored resist 12 Mask

 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Ryutaro Akutagawa 1006 Kadoma, Kadoma City, Osaka Prefecture Matsushita Electric Industrial Co., Ltd.

Claims (2)

[Claims] 1. A light shielding portion formed on a substrate such as glass, and a colored resist is applied on the substrate including the light shielding portion, and then a pixel formed by the light shielding portion on the substrate is formed. Exposure is performed with an area equal to or smaller than the opening for exposure as an exposure area, then the substrate is rotated, and then an area equal to or larger than the opening for forming the pixel formed by the light shielding portion on the substrate is set. A method of manufacturing a color filter, which comprises exposing as an exposure region. 2. A light shielding portion formed on a substrate such as glass, and a colored resist is applied on the substrate including the light shielding portion, and then a pixel formed by the light shielding portion on the substrate is formed. The area below the opening for exposure is used as an exposure area, exposure is performed, and then development is performed, and then, a new colored resist is applied onto the previous period substrate including pixels formed by the light shielding portion and the colored resist, A method for manufacturing a color filter, wherein exposure is performed with an exposure region having an area equal to or larger than an opening for forming a pixel formed by the light shielding portion on the substrate.