JPH054596U - Electronic component mounting work device - Google Patents

Abstract

(57) [Abstract] [Purpose] The bending of the suction nozzle can be prevented without lowering the image recognition accuracy of the electronic component suction state, and regardless of the type and size of the electronic component, the electronic component is always reliably sucked and sucked. It accurately recognizes the state of the image and stably mounts electronic components with high accuracy. A light diffusing member 15 made of a light diffusing material is externally attached and fixed to the nozzle portion 10b of the suction nozzle 10. The light diffusion member 15 has a substantially piece shape in which a flange 15b is extended around the shaft 15a, and the shaft 15a covers substantially the entire side surface of the nozzle 10b to prevent the nozzle 10b from bending. To be installed. An illuminator 16 is provided diagonally above the light diffusion member 15.
Is installed and the chip component Cp is irradiated through the light diffusion member 15.

Description

[Detailed description of the device]

[0001]

[Technical field of invention]

 The present invention relates to a mounting work head device that mounts electronic components while repeating picking up of electronic components and placing on a board.

[0002]

[Prior art and its problems]

 Conventionally, when a large number of chip components such as ICs, resistors and capacitors are automatically mounted on a printed circuit board, a mounting work head provided with a suction nozzle that detachably sucks the chip components is used. When mounting a chip component, the mounting work head is freely moved between the pick-up position and the place position, and the chip component is automatically mounted on the printed circuit board while repeating the pick-up and place of the chip component. In this mounting operation, when picking up a chip component, the suction position of the suction nozzle with respect to the chip component may shift. Conventionally, a mechanical method using a chuck claw has been adopted as a method for correcting the displacement of the suction position. In this method, chuck claws are arranged around the suction nozzle, and the suction position is corrected by evenly grasping the electronic component by these four chuck claws, and there is a problem in correction accuracy.

Therefore, in recent years, in order to correct the suction position of the chip component with high accuracy, an optical method based on image recognition is often adopted. In this method, the state in which a component is picked up by a suction nozzle is captured by a camera, and the image is processed by a computer to detect a shift in the suction position, and the mounting position is corrected based on this.

When the mounting position correction method based on the image recognition described above is used, an illuminator 51 is installed below the mounting work head 50 as shown in FIG. The illuminator 51 is fixed around the ascending / descending mounting shaft 52, and illuminates the chip component Cp sucked by the suction nozzle 53 mounted on the tip of the mounting shaft 52 from an obliquely upper periphery. Below the suction nozzle 53, a camera 54 for picking up the suction state of the chip component Cp is arranged.

When the suction state of the chip component Cp is imaged, in order to improve the mounting accuracy, the chip component Cp is lowered to a height at which it is actually placed on the printed circuit board B, and the image is picked up. Therefore, the projection light from the illuminator 51 is also radiated to the attachment / detachment mechanism D for attaching the suction nozzle 53 to the mounting shaft 52. As a result, the attachment / detachment mechanism D and the like also become a background and are imaged together with the chip component Cp. When an object other than the chip component Cp is imaged, it is difficult to distinguish it from the image of the chip component Cp in image processing, which causes a recognition miss. Further, the position of the chip component Cp with respect to the illuminator 51 at the time of imaging differs depending on the height of the chip component Cp. However, since the illuminator 51 is fixedly installed, depending on the chip component, the entire component may not be uniformly irradiated with light, which may hinder image recognition.

The nozzle portion 53a of the suction nozzle 53 for sucking the chip component Cp is usually formed in a small diameter pipe shape such that the tip is hidden by the chip component Cp so as not to become the background of the chip component Cp. There is. Therefore, in the case of a suction nozzle for sucking a very small chip component, the diameter of the nozzle portion 53a becomes extremely small. The nozzle portion 53a having such a small diameter is easily bent by a slight impact due to contact with the chip component Cp or the like. The bending of the nozzle portion 53a of the suction nozzle 53 causes a suction error of the chip component Cp.

[0007]

[The purpose of the device]

 The present invention has been made in view of the above-mentioned problems of the conventional technology, and regardless of the type and size of the electronic component, the electronic component is always reliably adsorbed, and the adsorption state is accurately image-recognized. An object of the present invention is to provide an electronic component mounting work device capable of stably mounting components with high accuracy.

[0008]

[Key points of the device]

 In order to achieve the above-mentioned object, this invention picks up an electronic component at a component supply position, makes an image recognition of the picked-up state, and then mounts it at a predetermined position on a substrate. A suction nozzle that detachably adsorbs an electronic component at the tip of the nozzle, an illumination unit that irradiates the held electronic component with light, and a light diffusion material that transmits and diffuses the light projected from the illumination unit. The light diffusing member is formed, and the light diffusing member is attached to at least substantially the entire side surface of the nozzle portion.

[0009]

[Example of device]

 The present invention will be described in detail below with reference to the embodiments shown in FIGS. FIG. 1 is an elevational view showing a mounting work head H as an embodiment of the present invention, and FIG. 2 is a partial cross-sectional view of the tip end thereof, showing a state in which a chip component Cp is held and conveyed. There is. In FIG. 1, a head base 1 rotatably supports a rotary base 2, and the rotary base 2 supports a mounting shaft 3 integrally rotatable and slidable in the vertical direction. The turntable 2 is connected to a head rotation drive motor 5 via a toothed belt 4. The mounting shaft 3 is connected to a moving base 7 which is slidable vertically along a head mounting plate 6. The movable table 7 is connected to a head lifting drive motor 9 via a toothed belt 8.

An attachment / detachment mechanism D for detachably attaching the suction nozzle 10 is provided at the lower end of the mounting shaft 3. In the attachment / detachment mechanism D, as shown in the sectional view of FIG. 2, two pairs of chuck claws 11 and 11 (one pair is not shown) are provided on four sides around the tip of the tapered mounting shaft 3. ) Are rotatably and evenly arranged. Each chuck claw 11 is rotatably supported at one end thereof by a retainer 12 fixed to the mounting shaft 3 via shafts 13, 13. The chuck claws 11 are in contact with the free ends of the pair of leaf springs 14, 14 each having one end fixed to the retainer 12 from the outside. Therefore, each chuck claw 11 is rotationally biased in the closing direction by the elastic force of each leaf spring 14.

The suction nozzle 10 is composed of a held portion 10a and a nozzle portion 10b, and an intake hole 10c is formed so as to penetrate along the central axis thereof. Engagement grooves 10d are provided on the peripheral surface of the held portion 10a. The tip ends of the chuck claws 11, 11 described above are engaged with the engagement groove 10d, and hold the suction nozzle 10 therebetween.

Thus, the nozzle portion 10b of the suction nozzle 10 is provided with a light diffusion member 15 that diffuses and transmits light. The light diffusing member 15 has a piece shape in which a collar portion 15b is extended around the shaft portion 15a. A mounting hole 15c is formed through the shaft portion 15a. The mounting hole 15c is externally inserted into the nozzle portion 10a, and the light diffusing member 15 is fixed to the suction nozzle 10. In this way, by covering substantially the entire side surface of the elongated nozzle portion 10a with the shaft portion 15a of the light diffusing member 15, the light diffusing member 15 serves as a reinforcing material, and the tip of the nozzle portion 10a becomes a substrate or the like during the mounting operation. It is possible to prevent the nozzle portion 10a from being bent when it comes into contact with the nozzle. This reduces the occurrence of suction errors and greatly contributes to stable and highly accurate mounting of electronic components. As the material of the light diffusing member 15, translucent vinyl chloride resin, acrylic resin, or ground glass can be preferably used. In this example, vinyl chloride resin is used to improve moldability and reduce the weight of the mounting work head.

An illuminator 16 is installed around a path along which the suction nozzle 10 at the tip of the mounting shaft 3 and the attachment / detachment mechanism D move up and down. The illuminator 16 is attached to the lower surface of the head base 1 by a stay 17. The illuminator 16 is an illuminator for imaging when the suction state of the chip component Cp by the suction nozzle 10 is image-recognized, and irradiates the chip component Cp with light via the light diffusion member 15 described above. The light projected from the illuminator 16 is diffused when passing through the light diffusion member 15 and emitted, and the diffused light is illuminated on the chip component Cp.

Next, a chip component mounting operation by the mounting work head H will be described. First, the mounting work head H moves to the chip component supply position, lowers the suction nozzle 10 together with the mounting shaft 3, and sucks the chip component Cp at its tip. After the suction of the chip component Cp is completed, as shown in FIG. 2, the suction nozzle 10 is raised and moved to the image recognition position.

As shown in FIG. 3, a camera 17 is installed at the image recognition position, and the mounting work head H is accurately positioned above the camera 17. Next, the suction nozzle 10 and the chip component Cp are lowered to the height at which the chip component Cp is actually mounted on the printed board B.

Under the above conditions, the illuminator 16 irradiates the chip component Cp, and image recognition of the chip component Cp suction state is started. As indicated by the broken line A, the light projected from the illuminator 16 is transmitted and diffused through the collar portion 15b of the light diffusion member 15, and the diffused light uniformly irradiates the chip component Cp. However, as shown by the broken line B, for example, the light emitted to the attachment / detachment mechanism D located in the background portion of the chip component Cp cannot enter the camera 17 directly because the light diffusion member 15 exists, and the light diffusion member After passing through 15, it diffuses. Therefore, the image of the object above the light diffusion member 15 such as the attachment / detachment mechanism D is not formed, and only the chip component Cp is imaged. As a result, the image processing is facilitated, and it becomes possible to accurately detect the deviation of the suction position of the chip component Cp.

Further, as shown in FIGS. 4A and 4B, when the shape of the chip component Cp is changed, the illuminator 16 can be imaged at the same position as when the chip component Cp is mounted. The component suction position (lowering position of the tip of the suction nozzle 10) Pp corresponding to the above changes. In FIG. 4A, since the height h of the chip component Cp is low, the distance between the component suction position Pp and the illuminator 16 becomes large. On the other hand, in FIG. 4B, since the height h of the chip component Cp is high, the distance between the component suction position Pp and the illuminator 16 is small. As a result, in the past, there were cases where the suction state could not be accurately imaged depending on the shape of the electronic component. In the mounting work head H of this invention, since the light diffusing member 15 is fixed to the suction nozzle 10, the distance between the light diffusing member 15 and the component suction position Pp is always constant, and the light diffusing member 1 An image is formed by uniformly irradiating the entire chip component Cp with diffused light passing through 5. Therefore, irrespective of the shape of the chip component Cp, it is possible to always secure an image quality of a required level or higher, and it is possible to perform accurate image recognition.

Further, as shown in FIG. 4B, when the suction surface (upper surface) of the chip component Cp is small, the light diffusion member shaft portion 15a is not completely hidden by the chip component Cp. In such a case, if the shaft portion 15a is not formed of the light diffusion material, the shaft portion 15a is imaged as the background of the chip component Cp. In this invention, since the entire light diffusing member 15 including the shaft portion 15a is formed of the light diffusing material, it is possible to avoid the inconvenience that the light diffusing member shaft portion 15a is imaged as the background when the small chip component Cp is imaged. can do.

When the image recognition of the chip component Cp suction state is completed, the suction nozzle 10 is raised and the mounting work head H is moved onto the printed circuit board B. At this time, the mounting position is corrected based on the amount of displacement of the suction state of the chip component Cp obtained by the above image recognition, and the mounting work head H is stopped at the corrected mounting position. Next, the suction nozzle 10 is lowered to place the chip component Cp at the target position on the printed board B.

It should be noted that the present invention should not be limited to the above specific embodiment, and various modifications can be made within the technical scope of the present invention.

[0021]

[Effect of the device]

 As described above in detail, according to the electronic component mounting work device of the present invention, the light diffusing member made of the light diffusing material is attached to the suction nozzle that detachably adsorbs the electronic component, and the light diffusing member is used to interpose the light diffusing member. By irradiating the sucked electronic component with an image and recognizing the sucked state with an image, only the electronic component is clearly imaged, and the sucked state of the electronic component can be accurately recognized with an image. Further, since the above-mentioned light diffusing member is provided on substantially the entire side surface of the nozzle portion of the suction nozzle, the light diffusing member serves as a reinforcing material to prevent bending of the nozzle portion. As a result, it is possible to reliably prevent an electronic component suction error due to the bending of the nozzle portion. In this case, even if the electronic component to be adsorbed is small, the light diffusion member around the nozzle portion does not form a background image, so that only the electronic component can be clearly imaged. Even if the shape of the electronic component changes, the diffused light is evenly radiated through the light diffusing means provided at a fixed position on the electronic component, and the image quality above the required level is always ensured to keep the electronic component in a holding state. The image can be accurately recognized. Therefore, irrespective of the shape of the electronic component, the electronic component can always be reliably attracted, and the attracted state can be accurately image-recognized, and the electronic component can be stably mounted with high accuracy.

[Brief description of drawings]

FIG. 1 is an elevational view showing an electronic component mounting work head according to an embodiment of the present invention.

FIG. 2 is an enlarged partial sectional view showing the electronic component mounting work head.

FIG. 3 is an enlarged elevational view showing the operation of the electronic component mounting work head.

FIG. 4 is an explanatory diagram showing, in comparison, place states of electronic components having different shapes.

FIG. 5 is an elevational view showing a conventional electronic component mounting work head.

[Explanation of symbols]

 1 Head base 3,52 Mounting shaft 10,53 Adsorption nozzle 10b, 53a Nozzle part 15 Light diffusion member 15a Shaft part 15b Collar part 16,51 Illuminator B Printed circuit board Cp Chip part D Attachment mechanism H Mounting work head Pp Part adsorption position

Claims (1)

[Claims for utility model registration] 1. A mounting work device for picking up an electronic component at a component supply position, recognizing an image of the picked-up state, and then mounting the electronic component at a predetermined position on a substrate, provided with a tubular nozzle portion. A suction nozzle that detachably adsorbs an electronic component on the tip of the nozzle portion, an illumination unit that irradiates the held electronic component with light, and a light diffusion material that transmits and diffuses the light projected from the illumination unit. And a light diffusing member, wherein the light diffusing member is attached to at least substantially the entire side surface of the nozzle portion.