JPH0545986Y2 - - Google Patents

Description

[Detailed explanation of the idea] Industrial applications This invention relates to a measurement board for electronic components.

BACKGROUND TECHNOLOGY A measurement board used for general characteristic tests and life tests of electronic components such as ICs is made of electrically insulating material, and has a socket on its surface into which the electronic component to be measured is removably inserted. , A predetermined conductive pattern to be connected to the socket is printed on the back or front surface, and current-limiting resistors and other electronic components are attached to key points of the conductive pattern by soldering, etc. ing. On the surface of the measurement board, as many sockets as there are electronic components are arranged in a grid pattern in order to mount a large number of electronic components at once. and,
The lead terminals of this socket pass through the board and are soldered to conductive pattern lands on the back side of the board.Normally, the ends of the lead terminals are left uncut, so the ends of the lead terminals are is somewhat exposed from the back of the board.

Problems that the invention aims to solve By the way, in production sites for ICs and the like, it is common for measurement boards to be stacked one on top of the other and handled during storage and transportation. When handled in this way, conventional measurement boards suffer from damage due to the fact that the ends of the socket lead terminals are exposed below the back surface of the board, as described above.
Due to board stacking, exposed portions of lead terminals may bend laterally. Such bending of the exposed portion may cause an electrical short between adjacent wires that should be in an insulated state, which may lead to a serious situation where the electronic component is erroneously measured. Especially when the electronic component is a small component such as an IC, the conductive pattern provided on the board is formed at a very high density, so even if the length of the exposed part of the lead terminal is small,
The possibility of the electrical shot occurring is high.

Another problem is that high temperature accelerated testing, which is one of the life tests for electronic components, is sometimes performed.
In this case, after the electronic components are mounted in the sockets of the measurement board, they are exposed to a high temperature atmosphere. Conventional measurement boards themselves do not have any reinforcement measures, so in high-temperature atmospheres,
Warpage may occur on the measurement board.

This idea was devised in view of the above circumstances, and the work of cutting the lead terminals can be omitted.
Moreover, it is an object of the present invention to provide a measurement board for electronic components that can prevent the occurrence of shoots between adjacent conductive patterns.

Another object is to provide a measurement board for electronic components that does not warp in the above-mentioned high-temperature atmosphere.

Means for Solving the Problems A measuring board for electronic components according to this invention includes a board body on which electronic components are mounted, and a cover member attached to the back surface of the board body via a stay. The main body includes a board with a predetermined conductive pattern, a plurality of sockets attached to the surface of the board, and a stay attached to the back side, and the cover member has a notch that allows manual insertion. .

Operation Attach the cover member to the stay attached to the back of the board body using an appropriate method. When performing high temperature accelerated tests or normal characteristic tests, electronic components are mounted in sockets.

Embodiment FIG. 2 shows a partially omitted perspective view of the front side and a partially omitted perspective view of the back side of a board main body 10, which is a component of an embodiment of the present invention.

Reference numeral 11 denotes a board made of an insulating material, on which a plurality of sockets 12 for mounting electronic components (not shown) to be measured are arranged in a grid pattern. Reference numeral 13 denotes a conductive pattern that connects the connector 14 and the socket 12 in a predetermined pattern, and the main part of this conductive pattern 13 includes, for example, a current limiting resistor and other electronic components 1.
5 are arranged. Note that 18 is a screw that fixes the stay 16 to the board body 10.

In FIG. 3, reference numeral 16 denotes a long stay made of aluminum or the like, which is attached to three sides of the back surface of the board 11.
Female threads 17 for attaching the cover member 20 are provided at key points of the cover member 6 . 19 is board 1
1 shows an exposed portion of a lead terminal of a socket 12 having its proximal end soldered to a conductive pattern 13 (not shown). Here, the height of the stay 16 is set slightly higher than that of the exposed portion 19 of the lead terminal. That is, the board body 1
0 includes a board 11, a socket 12, a conductive pattern 13, and a stay 16.

FIG. 1 is a perspective view of an embodiment of the present invention seen from the back side.

In the figure, a cover member 20 is made of an insulating material such as epoxy resin, has a predetermined thickness, and covers the entire surface of the board 11. It is attached to the board 11 with screws 21. In addition, 20 connectors 1 of the cover member
4 has a notch 22 large enough to fit a finger.
is formed. The electronic component measurement board configured as described above is used as follows.

The electronic component to be measured is attached to the socket 12.

A connector of a predetermined measuring device is fitted into the connector 14, and a predetermined voltage is applied to the electronic component via the socket 12 to perform necessary characteristic measurements.

When conducting a high temperature accelerated test, measurement boards equipped with electronic components are stacked in a rack installed in an atmospheric furnace (not shown) and heated for a predetermined period of time.
Alternatively, measurement may be performed at the same time as heating.

Effects of the Invention Unlike conventional boards, the measuring board of the present invention is configured such that a cover member is attached to the back side of the board body via a stay, so that the exposed portion of the lead terminal of the socket is hidden from the outside. Therefore, no external force is applied to the exposed portions when the measurement boards are stacked or handled during transportation, and shorts between wiring lines due to bending of the exposed portions can be prevented. Furthermore, even if this measurement board is installed in a high-temperature atmosphere, since the board body is reinforced by the cover member, deformation or warping of the board body due to heat will not occur. As described above, the cover member is formed with a notch that can be manually inserted, so it is very convenient to insert and remove the measurement board from a measurement device or the like. Furthermore, the measurement board of the present invention has the advantage that cutting the ends of the lead terminals on the back side of the board body can be omitted.

[Brief explanation of drawings]

Fig. 1 is a perspective view of an embodiment of the present invention as seen from the back side, Fig. 2 is a partially omitted perspective view of the board body, which is a component of an embodiment of the present invention, as seen from the front side;
FIG. 3 is a partially omitted perspective view similarly seen from the back side. 10...Board body, 11...Board, 12...
...Socket, 13... Conductive pattern, 16...
Stay, 20...cover member, 22...notch portion.

Claims (1)

[Scope of utility model registration request] It is equipped with a board body on which electronic parts are mounted, and a cover member attached to the back side of the board body via a stay, and the board body has a board with a predetermined conductive pattern and a plurality of parts attached to the surface of the board. What is claimed is: 1. A measuring board for electronic components, comprising a socket and a stay attached to the back surface thereof, and a cutout portion for manual insertion is formed in the cover member.