JPH04181793A - Burn-in printed board - Google Patents

Burn-in printed board

Info

Publication number
JPH04181793A
JPH04181793A JP2310573A JP31057390A JPH04181793A JP H04181793 A JPH04181793 A JP H04181793A JP 2310573 A JP2310573 A JP 2310573A JP 31057390 A JP31057390 A JP 31057390A JP H04181793 A JPH04181793 A JP H04181793A
Authority
JP
Japan
Prior art keywords
burn
sockets
board
socket
printed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2310573A
Other languages
Japanese (ja)
Inventor
Kazunori Takahashi
高橋　寿徳
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Miyagi Electronics Ltd
Original Assignee
Fujitsu Miyagi Electronics Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Miyagi Electronics Ltd filed Critical Fujitsu Miyagi Electronics Ltd
Priority to JP2310573A priority Critical patent/JPH04181793A/en
Publication of JPH04181793A publication Critical patent/JPH04181793A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components

Landscapes

  • Testing Of Individual Semiconductor Devices (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)

Abstract

PURPOSE:To mount many ICs on one printed board by surfacemounting a plurality of IC sockets and a plurality of electronic components on both front and rear surfaces of the board. CONSTITUTION:A plurality of IC sockets 1A, 1B and a plurality of electronic components 3 are surface-mounted on front and rear surfaces. Thus, the leads of lead insertion type IC sockets, surface mounting type IC sockets and electronic components such as resistors, capacitors, etc., to be used for different types of ICs are bent in an L shape and mounted so as to be mounted on both side surfaces of a printed board 5. Accordingly, the IC sockets 1A, 1B, the components 3 in which the leads are bent, are used thereby to be mounted on both side surfaces of the board 5 used for burn-in, etc. Thus, since both the front and rear surfaces of one printed board can be mounted, two types of the ICs can be used, for general use, and a manufacturing cost can be reduced.

Description

【発明の詳細な説明】 〔概要〕 本発明は、主として半導体装置（ＩＣ）の最終試験にお
いて行われる熱負荷処理（バーンイン）に於いて使用さ
れるバーンイン用プリント板（Ｄｅｖｉｃｅ　１Ｊｎｄ
ｅｒ　Ｔｅ５ｔ　Ｐｒ１ｎｔ　Ｂｏａｒｄ：ＤＵＴ　−
Ｐ　を板）に関し。Detailed Description of the Invention [Summary] The present invention relates to a burn-in printed board (Device 1Jnd) used in heat load treatment (burn-in) performed mainly in the final test of semiconductor devices (IC).
er Te5t Pr1nt Board: DUT −
Regarding P board).

プリント基板にＩＣソケット、電子部品を両面実装出来
るようにして、１枚のプリント板で多数のＩＣの実装に
対応できる事を目的とし。The purpose is to allow IC sockets and electronic components to be mounted on both sides of a printed circuit board, so that a single printed circuit board can support the mounting of a large number of ICs.

複数のＩＣソケット、並びに複数の電子部品か表裏両面
上に表面実装されてなるように構成する。A plurality of IC sockets and a plurality of electronic components are surface mounted on both the front and back surfaces.

〔産業上の利用分野〕[Industrial application field]

本発明は、主としてＩＣの最終試験において行われるバ
ーンインに於いて使用されるバーンイン用プリント板に
関する。TECHNICAL FIELD The present invention relates to a burn-in printed board used primarily in burn-in performed during final testing of ICs.

近年、ＩＣの長寿命等の品質保証においては。In recent years, in terms of quality assurance such as long life of IC.

益々ユーザーの要望に応える為に、電圧、電流。In order to meet the increasing demands of users, voltage and current.

温度、湿度等の負荷条件でエージング処理を行うバーン
イン処理の工程か増加している。The use of burn-in processing, which performs aging processing under load conditions such as temperature and humidity, is increasing.

そのバーンイン工程で必要な治具としてプリント板か使
用されるが、ＩＣの種類や数量の増大に対処するために
は、多品種のＩＣを同時にセットするプリント板か要望
されている。A printed board is used as a necessary jig in the burn-in process, but in order to deal with an increase in the types and quantities of ICs, there is a demand for a printed board on which a wide variety of ICs can be set at the same time.

〔従来の技術〕[Conventional technology]

第３図は従来例の説明図である。 FIG. 3 is an explanatory diagram of a conventional example.

図において、　１７はプリント基板、１８はＩｃソケッ
ト、１９はリード、　２０は電子部品、２１はリート。In the figure, 17 is a printed circuit board, 18 is an IC socket, 19 is a lead, 20 is an electronic component, and 21 is a lead.

２２は半田、２３はＩＣである。22 is solder, and 23 is an IC.

従来、バーンイン用プリント板は、１枚のブＩｉント基
板１７の表面に数十個のＩＣソケソ１月８と。Conventionally, burn-in printed boards have several dozen IC sockets on the surface of a single printed circuit board 17.

それに付随する抵抗、コンデンサ等のバーンインの回路
構成用の電子部品２０を実装し、そのＩＣソケット１８
にＩＣ２３をセットして、バーンイン装置の高温雰囲気
の炉に入れて試験を行っていた。Electronic components 20 for burn-in circuit configuration, such as resistors and capacitors, are mounted thereon, and the IC socket 18 is mounted thereon.
The IC23 was set in a burn-in device and placed in a high-temperature furnace for testing.

しかし、ＩＣの種類は益々増大し、また、　　ＩＣのパ
ッケージか異なると、ＩＣのリードの数、リードの方向
、パッケージの外形寸法も異なるために、１種類のバー
ンイン用プリント板で１品種。However, the number of IC types is increasing, and the number of IC leads, direction of leads, and external dimensions of the package are also different depending on the type of IC package, so one type of burn-in printed board is required.

或いは２品種のＩＣにしか対応することかできなかった
。Alternatively, it could only support two types of ICs.

また、このバーンイン用プリント板は高価であり、ＩＣ
の生産数量に比例して、その分のプリント板か必要とさ
れるので、コスト的にも大きな負担増となる。In addition, this printed board for burn-in is expensive, and the IC
Since the number of printed boards required is proportional to the production quantity, the cost also increases significantly.

そのために、１枚のプリント板に、数種類のＩＣを出来
るだけ多く実装することかできるプリシト板か必要とさ
れる。For this purpose, a printed circuit board is required that can mount as many different types of ICs as possible on a single printed circuit board.

従来のプリント板は片面たけにＩＣソケソｌ−。Conventional printed circuit boards only have an IC socket on one side.

抵抗、コンデンサ等の電子部品を実装している。Electronic components such as resistors and capacitors are mounted.

即ち、第３図に示すように、プリント基板Ｉ７に孔を開
けて、その孔にＩＣソケット１８のり−１〜１９と、コ
ンデンサ、抵抗等の電子部品２０のリートをさし込み、
プリント基板１７の裏面迄貫通させて。That is, as shown in FIG. 3, holes are made in the printed circuit board I7, and IC sockets 18 glues 1 to 19 and electronic parts 20 such as capacitors and resistors are inserted into the holes.
Penetrate it to the back side of the printed circuit board 17.

裏面に突出したリード１９．２１を半田２２により固定
していた。Leads 19 and 21 protruding from the back surface were fixed with solder 22.

そのため、裏面に、ＩＣソケットや電子部品のリードか
一杯突き出る構造となるので、裏面にもＩＣソケット等
を設けて、ＩＣを実装することか困難であった。As a result, the IC socket and electronic component leads protrude fully from the back surface, making it difficult to provide an IC socket or the like on the back surface and mount an IC.

〔発明か解決しようとする課題〕[Invention or problem to be solved]

従って、プリント板の片面だけに実装すれば。 Therefore, if it is mounted only on one side of the printed board.

１種類のＩＣソケットを用いる為、１品種のＩＣにしか
対応することかできず、また、ＩＣソケットのリードは
垂直であるために、そのまま表面に半田付は等の方法で
実装することはできなかった。Since one type of IC socket is used, it can only support one type of IC, and since the leads of the IC socket are vertical, it cannot be mounted directly on the surface by methods such as soldering. There wasn't.

本発明はプリント基板にＩＣソケットや、電子部品を両
面実装出来るようにして、１枚のプリント板で多数のＩ
Ｃが実装できる事を目的として提供されるものである。The present invention makes it possible to mount IC sockets and electronic components on both sides of a printed circuit board, so that a large number of I/Os can be mounted on a single printed circuit board.
It is provided for the purpose of being able to be implemented in C.

〔課題を解決するための手段〕[Means to solve the problem]

第１図は本発明の原理説明図である。 FIG. 1 is a diagram explaining the principle of the present invention.

図において、ｌはＩＣソケット２はリード。In the figure, l indicates the lead of the IC socket 2.

３は電子部品、４はリード、５はプリント基板である。3 is an electronic component, 4 is a lead, and 5 is a printed circuit board.

上記の問題点は、プリント基板５に孔を開けるよってこ
とをしないで、実装するＩＣソケット１や電子部品３の
リード２，４の先端を曲げて、プリント基板に半田等に
より表面実装することで解決される。これにより、プリ
ント基板５の両面にＩＣソケット１等の実装か可能とな
る。The above problem can be solved by bending the tips of the leads 2 and 4 of the IC socket 1 and electronic component 3 to be mounted and surface mounting them on the printed circuit board by soldering, etc., instead of drilling holes in the printed circuit board 5. resolved. This makes it possible to mount the IC socket 1 and the like on both sides of the printed circuit board 5.

即ち１本発明の目的は、第１図に示すように。That is, one object of the present invention is as shown in FIG.

複数のＩＣソケット１．並びに複数の電子部品３か表裏
両面上に表面実装されてなることにより達成される。Multiple IC sockets1. This is also achieved by surface mounting a plurality of electronic components 3 on both the front and back surfaces.

〔作用〕[Effect]

このように２本発明は、プリント基板の両面に表面実装
出来る様に、各々品種の異なるＩＣに対応できるリード
挿入型ＩＣ用ソケット１表面実装型ＩＣ用ソケット、及
び抵抗、コンデンサ等の電子部品のり一トをＬ字型に曲
げて取り付けている。In this way, the present invention provides a socket for a lead insertion type IC that can accommodate different types of ICs so that it can be surface mounted on both sides of a printed circuit board, a socket for a surface mount type IC, and a socket for electronic components such as resistors and capacitors. It is attached by bending one end into an L shape.

従って、これらのり−トを曲げたＩｃソケット。Therefore, these boards are bent into Ic sockets.

電子部品を使う事により、バーンイン等に使用するプリ
ント板への両面実装が可能となる。By using electronic components, double-sided mounting on printed boards used for burn-in etc. is possible.

〔実施例〕〔Example〕

第２図は本発明の一実施例の説明図である。 FIG. 2 is an explanatory diagram of one embodiment of the present invention.

図において、６はプリント基板、７はＩＣソケットＡ、
８はＩＣソケットＢ、９は９はリード１１０はコンデン
サ、１１はリード、　　１２はリード挿入型ＩＣ，１３
は表面実装型ｒｃ、　１４ハＩＣ，１５は抵抗。In the figure, 6 is a printed circuit board, 7 is an IC socket A,
8 is IC socket B, 9 is lead 110 is capacitor, 11 is lead, 12 is lead insertion type IC, 13
is a surface-mounted RC, 14 is an IC, and 15 is a resistor.

１６はガイドレールである。16 is a guide rail.

第２図（ａ）に平面図、第２図（ｂ）に側面図で示す本
発明の一実施例としてのバーンイン用プリント板はバー
ンイン装置の炉の構造に合わせているので、従来と同一
の寸法である。The printed board for burn-in as an embodiment of the present invention shown in FIG. 2(a) as a plan view and in FIG. 2(b) as a side view is matched to the structure of the furnace of the burn-in equipment, so it is the same as the conventional one. Dimensions.

ガイドレール１６はバーンイン装置にプリント板をセッ
トする際のガイドであり、プリント板の運搬の際に重ね
るか、ＩＣソケット電子部品を保護するために設けであ
る。The guide rail 16 is a guide when setting the printed boards in the burn-in device, and is provided to stack the printed boards when transporting them or to protect the IC socket electronic components.

第２図（Ｃ）にプリント板の一部を拡大して示すように
、ＩＣソケット７．８のり一部９と電子部品であるコン
デンサＩＯのリード１１の先端をＬ字型に曲げて、プリ
ント基板６に対してフラットのものを、半田付は等によ
りプリント基板６の両面に表面実装する。As shown in an enlarged view of a part of the printed board in Fig. 2 (C), the IC socket 7, 8 glue part 9 and the tip of the lead 11 of the capacitor IO, which is an electronic component, are bent into an L shape and printed. Those that are flat to the board 6 are surface mounted on both sides of the printed board 6 by soldering or the like.

実施例では、プリント基板６の表側に、リード第２図（
ｄ）に示すＤＩＰ型パッケージ等のリード挿入型ＩＣ１
２をセットするためのＩＣソケットＡ７を実装し、プリ
ント基板６の裏側に、第２図（ｅ）に示すＱＦＰ型パッ
ケージ等の表面実装型ＴＣ１３をセットするためのＩＣ
ソケットＢ８　　Ａ実装しである。In this embodiment, a lead shown in FIG. 2 (
Lead insertion type IC1 such as DIP type package shown in d)
An IC socket A7 is mounted on the back side of the printed circuit board 6 for setting a surface mount type TC13 such as a QFP type package shown in FIG. 2(e).
Socket B8 A is mounted.

このように、プリント基板６の両面に２種類のＩＣに対
応できるＩＣソケットを実装することかできるため１枚
のプリント板で２種類のＩＣを同時に従来より数多くバ
ーンイン処理をする事つ＼てきる。In this way, since IC sockets that can accommodate two types of ICs can be mounted on both sides of the printed circuit board 6, it is possible to perform burn-in processing for two types of ICs simultaneously on one printed circuit board in greater numbers than before. .

〔発明の効果〕〔Effect of the invention〕

以上説明した様に９本発明によれば、１枚のプリント板
で１表裏両面に実装するので、２種以上のＩＣにも対応
することか出来、汎用化か図れ。As explained above, according to the present invention, since one printed board is mounted on both the front and back sides, it is possible to support two or more types of ICs, and to achieve general versatility.

また製作コストの低減か可能となる。It also becomes possible to reduce manufacturing costs.

プリント板の所要数量も多くなる中で、プリント板の維
持管理も半減出来るので２本発明のプリント板は、今後
、益々ＩＣのバーンイン化の増加傾向の中で極めて有用
なものとなる。As the required quantity of printed boards increases, the maintenance and management of printed boards can be halved, so the printed board of the present invention will become extremely useful in the future as the burn-in of ICs increases.

【図面の簡単な説明】[Brief explanation of drawings]

第１図は本発明の原理説明図。 第２図は本発明の一実施例の説明図。 第３図は従来例の説明図 である。 図において。 ｌはＩＣソケット、　　２はリード。 ３は電子部品、　　　　４はリード。 ５はプリント基板、　　６はプリント基板。 ７はＩＣソケットＡ、８はＩＣソケットＢ。 ９はリード、　　　　　　１０はコンデンサ。 １１はリート、１２はリート挿入型ＩＣ。 １３は表面実装型ＩＣ，１４はＩＣ。 １５は抵抗、１６はガイドレール ３電子昭 不発Ｂ目の原工ＴＡ欝月口 て１０ イ子来イク＋ｒｎｔ斤日目口 物〉　　３　Ｆ］ 不４ト日月ｎ−寅六で介＋ｌ／）説ｓ月斤コ宴２０情！
Ｑ１） 杢発明ｎ−実売例ｎ説明同 第２０（行ｆ）２）FIG. 1 is a diagram explaining the principle of the present invention. FIG. 2 is an explanatory diagram of one embodiment of the present invention. FIG. 3 is an explanatory diagram of a conventional example. In fig. l is IC socket, 2 is lead. 3 is an electronic component, 4 is a lead. 5 is a printed circuit board, 6 is a printed circuit board. 7 is IC socket A, 8 is IC socket B. 9 is a lead, 10 is a capacitor. 11 is a REET, and 12 is a REET insertion type IC. 13 is a surface-mounted IC, and 14 is an IC. 15 is the resistance, 16 is the guide rail 3 electronics No-explosion B-th original engineer TA Tsuzukiguchi 10 Iko comes + rnt 斤日目口〉 3 F] No 4 To Sun Moon n- Tora Roku de suke + l/ ) theory s moon cake party 20 emotions!
Q1) Heather invention n - actual sales example n explanation same No. 20 (row f) 2)

Claims (1)

【特許請求の範囲】[Claims] 複数のＩＣソケット（１），並びに複数の電子部品（３
）が表裏両面上に表面実装されてなることを特徴とする
バーンイン用プリント板。Multiple IC sockets (1) and multiple electronic components (3
) is surface-mounted on both the front and back sides.
JP2310573A 1990-11-16 1990-11-16 Burn-in printed board Pending JPH04181793A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2310573A JPH04181793A (en) 1990-11-16 1990-11-16 Burn-in printed board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2310573A JPH04181793A (en) 1990-11-16 1990-11-16 Burn-in printed board

Publications (1)

Publication Number Publication Date
JPH04181793A true JPH04181793A (en) 1992-06-29

Family

ID=18006864

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2310573A Pending JPH04181793A (en) 1990-11-16 1990-11-16 Burn-in printed board

Country Status (1)

Country Link
JP (1) JPH04181793A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112379191A (en) * 2020-10-13 2021-02-19 航天科工防御技术研究试验中心 Burn-in test device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112379191A (en) * 2020-10-13 2021-02-19 航天科工防御技术研究试验中心 Burn-in test device

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