JPH0546701B2 - - Google Patents

Description

[Detailed Description of the Invention] [Field of Application of the Invention] The present invention relates to a device for transferring wafers from a storage cassette in which the wafers are stored to another storage cassette in a semiconductor wafer processing process, and in particular to a device for transferring wafers from a storage cassette in which the wafers are stored to another storage cassette. The present invention relates to a semiconductor wafer transfer device suitable for transferring wafers stored in a short storage cassette to another storage cassette.

[Background of the invention]

A conventional semiconductor wafer transfer apparatus, as disclosed in, for example, Japanese Patent Application Laid-Open No. 182846/1984, takes out wafers one by one from a storage cassette containing wafers and transfers them one by one to another storage cassette. However, since this method processes each sheet one by one,
The drawbacks are that it is time consuming and requires a large scale device.

To solve this problem, there is known an apparatus in which a storage cassette is set horizontally and all the wafers in the storage cassette are transferred to another storage cassette at once. However, when this device is transferred from a short storage cassette such as a quartz cassette to another storage cassette, the following problems occur.

This will be explained with reference to FIG. A space is formed in the center of the short storage cassette 1, guide block 2, and buffer cassette 3, through which a wafer pusher plate 4 can pass. A large number of wafers 5 are arranged and stored in the cut groove of the storage cassette 1.

Therefore, in order to transfer the wafers, the wafer push plate 4 passes through the storage cassette 1 and lifts each wafer 5 from the state shown in FIG. While carefully inserting it into the groove, lift it up to buffer cassette 3. When the wafer 5 enters the buffer cassette 3, two
The stopper 6 protrudes to prevent the wafer 5 from falling even when the wafer pusher plate 4 is lowered.
hold.

Incidentally, the notched groove into which the wafer 5 is inserted into the short storage cassette 1 has poor processing accuracy. In addition, the groove dimensions are not accurate because the cut grooves are worn away during the cleaning process. Therefore, when the storage cassette 1 is placed horizontally, the wafers 5 are tilted randomly and the pitches near the top of the wafers 5 are uneven. Therefore,
Even if the wafer pushing plate 4 moves upward and lifts the wafer 5, the wafer 5 cannot enter the guide groove of the guide block 2. in this way,
It was not possible to safely transfer the wafers 5 from the short storage cassette 1.

[Purpose of the invention]

SUMMARY OF THE INVENTION An object of the present invention is to provide a semiconductor wafer transfer device that allows easy transfer from a short storage cassette.

[Summary of the invention]

In order to achieve the above object, the present invention includes a first storage cassette that is arranged to be inclined so that the wafers can be tilted in one direction, and a second storage cassette that is the same as the first storage cassette above the first storage cassette. A buffer cassette is arranged at an inclined angle, and is movable up and down below the first storage cassette in the same direction as the wafer storage notch of the first storage cassette, and corresponds to the wafer storage notch. It is characterized by consisting of a comb-tooth-shaped alignment plate with grooves formed in the portion where it is aligned.

[Embodiments of the invention]

An embodiment of the present invention will be described below with reference to FIGS. 2 and 3. A short first storage cassette 11 in which the wafers 10 are arranged and stored is
is tilted and fixed to the base 12 so that it is tilted in one direction. Above the first storage cassette 11, a buffer cassette 13 is fixed to the base 12 at the same angle of inclination as the first storage cassette 11. Two stoppers 14, 14 are disposed in the wafer passing section at the bottom of the buffer cassette 13 so as to be able to reciprocate laterally. An alignment plate 15 is disposed below the first storage cassette 11 and is movable up and down in the same direction as the wafer storage cut groove of the first storage cassette 11. Alignment board 1
5 has a groove 15a formed in a part corresponding to the notched groove for wafer storage of the first storage cassette 11 in a comb-like shape, so that the wafer 10 can be lifted up by slipping through the first storage cassette 11. can. Further, the tips of the comb tooth portions 15b of the alignment plate 15 are formed at acute angles.

Next, the operation of transferring the wafer 10 will be explained with reference to FIG. As shown in FIG. 1A, since the first storage cassette 11 is set at an angle, the wafers 10 are all tilted backward (to one side) although they are not aligned. Therefore, when the alignment plate 15 moves upward as shown in FIG. Accordingly, wafer 10
can enter the groove 15a of the alignment plate 15 correctly. When the alignment plate 15 further rises, the wafers 10 are forcibly aligned while making light contact with the back side of the wafers 10, and the wafers 10 are lifted up in an aligned state in contact with one side of the comb teeth portion 15b of the alignment plate 15. It is made to enter the buffer account 13. In this state, the stoppers 14 move forward and hold the wafer 10. Next, as shown in FIG. 3c, when the alignment plate 15 is returned to its original lower origin position, the wafer 10 is held by the stoppers 14 and left behind in the buffer cassette 13. As a result, the wafer 10 is moved from the first storage cassette 11 to the buffer cassette 13.

Therefore, as shown in Figure d, the wafers 10 in the buffer cassette 13 are transferred to the second storage cassette 16.
In order to transfer the wafers 1 in the buffer cassette 13, the first storage cassette 11 is replaced with the second storage cassette 16, the alignment plate 15 is raised, and the wafers 1 in the buffer cassette 13 are
0 is held on the alignment plate 15. Next stoppa 1
The wafers 10 can be transferred to the second storage cassette 16 by retracting the wafers 4 and 14 and then lowering the alignment plate 15 to its original position.

In this way, the first storage cassette 11 is arranged to be inclined so that the wafers 10 are inclined in one direction, and the wafers 10 are held and lifted by the grooves 15a of the comb-shaped alignment plate 15, so that the wafers 10 are They are forcibly aligned and inserted into the buffer cassette 13 safely and reliably. In addition, the wafer 10 is arranged on the alignment plate 1.
Since the wafer 10 is held in the groove 15a of the wafer 10
scratches to the surface are prevented.

〔Effect of the invention〕

As is clear from the above description, according to the present invention, it is possible to easily and reliably transfer wafers stored in a short first storage cassette to a second storage cassette using a simple mechanism. , damage to the wafer surface is prevented.

[Brief explanation of drawings]

Figures 1a and b are explanatory diagrams of the operation of the conventional example, Figure 2 is a front view showing an embodiment of the present invention, Figure 3 is a view taken in the direction of arrow A in Figure 1, and Figures 4a to 4. d is an explanatory diagram of the operation. DESCRIPTION OF SYMBOLS 10... Wafer, 11... First storage cassette, 13... Buffer cassette, 15... Aligning plate, 15a... Groove, 15b... Comb tooth portion, 16...
...Second storage cassette.

Claims (1)

[Scope of Claims] 1. A first storage cassette that supports the lower portion of the wafer and is arranged to be inclined so that the wafer can be tilted in one direction; a buffer cassette disposed at the same angle of inclination as the storage cassette; and a buffer cassette that is movable up and down below the first storage cassette in the same direction as the wafer storage groove of the first storage cassette, and and a comb-tooth-shaped alignment plate with grooves formed in portions corresponding to the storage notch grooves, and the inclination is
The wafer is provided with the back surface facing downward, the tip of the comb-shaped alignment plate is formed at an acute angle, and the comb-shaped alignment plate is inserted from near the bottom of the wafer, and the wafer is A semiconductor wafer transfer apparatus characterized in that the wafers are forcibly aligned while coming into contact with the back surface of the semiconductor wafer.