JPH0547638B2 - - Google Patents

Description

Detailed Description of the Invention (Field of Industrial Application) The present invention is applied to mechanical plating used in fields that require corrosion resistance, heat resistance, abrasion resistance, solderability, electrical conductivity, plating performance, and decorativeness. In particular, the present invention relates to a mechanical plating method in which the metal surface of a metal block, which is plated metal, is continuously plated as a new metal surface.

(Prior art) Surface treatment techniques that have been commonly used to plate metal on materials, parts, etc. include electroplating, chemical plating, hot-dip plating, and thermal spray plating. A thin film of metal or alloy is plated on the surface of the material and is used for various purposes.

The electroplating method is a method of forming a thin metal film on the surface of a material by using a material to be plated as a cathode in a solution containing a metal and passing a direct current between the anode and the opposing anode. The chemical plating method is a method of plating on nonconducting materials such as glass and synthetic resins without using electricity. The molten plating method is a method of plating by immersing the material in molten metal. The thermal spray plating method is a method of plating the surface of a material by spraying metal melted by gas or arc onto the surface of the material using high-pressure gas or air. Each of these various plating methods has its own drawbacks or problems.

(Problems to be solved by the invention) Namely, with electroplating, alloy plating is difficult, with chemical plating, the plating layer cannot be thick and the cost of chemicals is high, and with hot-melt plating, it is difficult to form a pipe by just dipping it. Although it has the advantage of being able to thicken the plating layer on the inner surface, etc., it is difficult to adjust the thickness, thermal spray plating tends to become porous, and the metal particles are oxidized. The most common problems are that the adhesion between the plating layer and the material is not necessarily sufficient, that the equipment is expensive, and that waste liquid treatment is necessary.

The present inventors previously proposed a mechanical plating method (Japanese Patent Application No. 1983-1999) as a means of solving these problems.
No. 321345) was discovered, and the problems and drawbacks of conventional methods of plating metal surfaces were eliminated and improved. In other words, the mechanical plating method involves bringing a metal brush into contact with a metal block and stripping off the metal from the metal block with the metal brush.
Subsequently, the material to be plated is brought into contact with a metal brush, and the metal that has been removed by the metal brush is mechanically plated onto the surface of the material to be plated via the metal brush.

However, another problem with this method is that during plating, the metal from the metal block that has been stripped off by the brush does not adhere to the material to be plated and is re-attached to the surface of the metal block. A hard-working layer (also called a re-deposition layer) is formed by adhering to the surface of the metal block. This layer is very hard and difficult to scrape off, so the amount of metal that can be removed by the metal brush is small, and for this reason it takes a long time to remove. When plating is performed, the plating film thickness decreases over time.

The present invention eliminates and improves the problems or drawbacks of the above mechanical plating method,
The object of the present invention is to provide a mechanical plating method that prevents nonuniform plating thickness.

(Means for Solving the Problems) The present invention brings a metal brush into frictional contact with a metal block made of pure metal or an alloy, and strips off minute portions of metal from the metal block with the metal brush, and at the same time removes the metal brush from the metal block. In a mechanical plating method, the metal of the stripped metal block is mechanically plated onto the surface of the material to be plated through a metal brush by bringing it into frictional contact with the material to be plated, in which the metal block is moved and brought into contact with the metal brush. This is a mechanical plating method characterized by continuously plating the surface of a metal block, which is always made into a new metal surface.

That is, the present invention is a mechanical plating method characterized by continuously plating by moving the metal block and constantly supplying a new metal surface, and further, by plating the metal block after it has come into contact with the metal brush. The highly processed layer (redeposition layer) generated on the surface is removed using a grindstone or a cutting tool, and when it comes into contact with the metal brush again, plating is performed continuously while supplying a new surface. This is a mechanical plating method.

As described above, in the method of the present invention, the metal block is brought into contact with the metal brush by moving the metal block or by removing the highly processed layer (redeposition layer) formed on the surface of the metal block using a grindstone or a cutting tool. To make the plating film thickness uniform by always making the surface of the metal block a new surface.

In these methods, a grindstone or a cutting tool is brought into contact with the metal brush to remove metal particles that have adhered to the surface of the metal brush and cannot form a plating layer, thereby making the process even more continuous. It is possible to perform a metsuki.

In principle, the combination of the metal block, metal brush, and material to be plated used in the present invention requires that the metal block be softer than the metal brush, or have a hardness equivalent to that of the metal brush.

2 and 3 combinations of metal blocks and metal brushes
For example, the metal block and metal brush may be made of the same metal, or a stainless steel wire brush may be used for an Al metal block, a hard steel wire brush may be used for a Cu metal block, etc. can.

The material to be plated is not particularly limited, and examples include 42% Ni alloy, stainless steel, and ordinary steel.

Further, the grindstone and cutting tool used in the present invention are not particularly specified as long as they can sharpen the surface of the metal block and the surface of the metal brush. Furthermore, the metal block only needs to have a surface that comes into contact with the metal brush, and its shape is not particularly specified.

Next, the present invention will be explained with reference to the drawings.
FIG. 1 is an explanatory diagram of the method according to the present invention. 1st
In the figure, 1 is a metal brush, 2 is a metal round bar (Figure 1a) or a metal coil (Figure 1b), 3 is the material to be plated, and 4 is a grinding wheel (Figure 1a) or a grinding belt (Figure 1a). 1b) and 5 show the formed plating layer.

Rotate the metal brush 1 at high speed (peripheral speed approximately 2000 m/
min) The plating layer 5 can be obtained by bringing the tip of the brush into contact with the metal block 2 and the material to be plated 3. Further, by bringing the metal block 2 into contact with the grinding wheel 4, the metal block can be continuously regenerated.

(Function) As in the present invention, when plating is performed without moving the metal block or without bringing the grindstone into contact with the metal brush, a highly processed layer (reattachment layer) is generated on the surface of the metal block, This hard-working layer is very hard and difficult to scrape, so if plating is performed for a long time, the plating film thickness will decrease over time.

However, as in the present invention, when plating is carried out while moving the metal block or while removing a hard-working layer formed on the surface of the metal block, the contact between the metal brush and the metal block always occurs on the new surface of the metal block. Since contact is made with a metal surface, that is, a surface without a hard working layer, the problem of reduction in plating thickness due to the influence of the hard working layer is eliminated. In addition, when this metal brush is further brought into contact with a grindstone, etc. to perform plating, the metal of the metal block that could not form a plating layer is removed from the surface of the metal brush, making it even more difficult to form a hard-working layer, and making it possible to continue plating for a longer period of time. A uniform plating layer can be obtained.

Next, the present invention will be specifically explained with reference to Examples, but the present invention is not to be construed as limited by these.

Example 1 Outer diameter 250mm with many 0.2mmφ hard steel wires implanted
φ, 100mm length foil metal brush
Rotates at 2500rpm, outer diameter 100mmφ, length 100mm
The Al round bar was rotated at a circumferential speed of 0.5 m/min, brought into contact with the metal brush, and then the metal brush was pressed onto the SUS304 strip with a thickness of 1.0 mm and a width of 100 mm moving at a speed of 2.0 m/min for plating. Figure 2 shows the plating thickness distribution in the longitudinal direction of the strip in this case. Here, the grinding wheel and the Al round bar are always in contact (this embodiment corresponds to FIG. 1a). The ● marks in Figure 2 are
This is based on the method of the present invention. The circle mark is a comparative example, and the Al round bar was not rotated.

Example 2 Outer diameter with many 0.1mmφ SUS304 wires implanted
A foil metal brush with a diameter of 300 mm and a length of 500 mm.
Rotating at 2000 rpm and moving at a speed of 2 m/min, a 2.0 mm thick x 500 mm Cu band is pressed against a metal brush, and the metal brush is further moved at a speed of 1.0 m/min, 42% of a thickness of 1.5 mm x 500 mm wide. Figure 3 shows the plating thickness distribution in the longitudinal direction of the Ni alloy strip when it was plated by pressing a metal brush against it. Grinding belt and Cu
The bands are always in contact (this embodiment corresponds to FIG. 1b). In FIG. 3, the ● marks are those obtained by the method of the present invention, and the O marks are comparative examples, in which the Cu band has not moved.

(Effects of the Invention) The mechanical plating method according to the present invention simultaneously brings the metal brush into frictional contact with the material to be plated and the moving metal block.
Since this is a method of mechanically plating metal, it does not require various baths or solutions like electroplating or chemical plating, and is an inexpensive method. A material that becomes Furthermore, the plating thickness is uneven,
Problems such as reduction in plating thickness are eliminated.

In addition, the mechanical plating method according to the present invention makes it possible to firmly plate a wide variety of pure metals and alloys onto the material surface at a much lower cost than conventional methods. It is possible to obtain a plated material that can be attached with the properties of metal and has excellent plating properties, solderability, conductivity, corrosion resistance, heat resistance, abrasion resistance, and decorative properties.

[Brief explanation of drawings]

1a and 1b are illustrations of the method according to the invention. FIG. 2 shows the change in the plating film thickness in the longitudinal direction of the coil when Al plating is applied. The ● mark is data related to the present invention, and the ○ mark is data related to the comparative example. Figure 3 shows an example of Cu plating, and the ● and ○ marks are the same as in Figure 2. 1... Metal, 2... Metal round bar or band, 3... Material to be plated, 4... Grindstone or grinding belt, 5...
Metsuki layer.

Claims (1)

[Scope of Claims] 1 A metal brush is brought into frictional contact with a metal block made of pure metal or an alloy, and a minute portion of metal from the metal block is removed by the metal brush, and the metal brush is brought into frictional contact with a material to be plated. In the mechanical plating method, in which the metal of the stripped metal block is mechanically plated onto the surface of the material to be plated via a metal brush, the metal block is moved and the surface of the metal block in contact with the metal brush is constantly polished A mechanical plating method characterized by continuously plating a new metal surface. 2. A metal brush is brought into frictional contact with a metal block made of pure metal or an alloy, and the metal brush is used to peel off minute portions of metal from the metal block, and the metal brush is brought into frictional contact with the material to be plated to remove the stripped metal. In the mechanical plating method, in which the metal of the block is mechanically plated on the surface of the material to be plated through a metal brush, the hard working layer generated on the surface of the metal block after contact with the metal brush is applied to a grindstone or a cutting tool. Twist and remove;
A mechanical plating method characterized by continuously plating the surface of a metal block as a new metal surface. 3. Plating is carried out by further bringing a grindstone or a cutting tool into contact with the metal brush to remove metal particles that have adhered to the surface of the metal brush and cannot form a plating layer. 2
Mechanical plating method described in section.