JPH0219480A - Mechanical plating method - Google Patents

Abstract

PURPOSE:To prevent a plating layer formed by mechanical plating from being made ununiform in thickness by moving a metal block so that the surface of the block brought into contact with a metal brush is kept fresh. CONSTITUTION:A metal brush 1 is turned at a high speed and brought into contact with a round metal bar or a metal strip as a metal block 2 to tear fine metal chips from the block 2. At the same time, the brush 1 is brought into contact with a material 3 to be plated to mechanically plate the surface of the material 3 with the metal torn from the block 2 through the brush 1. At this time, the block 2 is moved so that the surface of the block 2 brought into contact with the brush 1 is kept fresh. Meanwhile, an intensely worked layer formed in the surface of the block 2 is removed by bringing a grindstone 4 or a cutting tool into contact with the block 2. The remaining metal chips sticking to the surface of the brush 1 are removed by bringing the grindstone 4 or the cutting tool into contact with the brush 1.

Description

Detailed Description of the Invention (Field of Industrial Application) The present invention is applied to mechanical plates used in fields that require corrosion resistance, heat resistance, abrasion resistance, solderability, conductivity, plating properties, and decorative properties. The present invention relates to a mechanical plating method, in particular, to a mechanical plating method in which the metal surface of a metal block, which is plated metal, is continuously plated as a new metal surface.

(Conventional technology) Surface treatment techniques that have been commonly used to plate metals on materials, parts, etc. include electroplating, chemical plating, hot-dip plating, and thermal spray plating. A thin film of metal or alloy is plated on the surface of the material and used for various purposes.

Electroplating is a method of forming a thin metal film on the surface of a material by using a material to be plated as a cathode in a solution containing metal and passing a direct current between the anode and the opposing anode.

Chemical plating is a method of plating on nonconducting materials such as glass and synthetic resin without using electricity. The hot-dip plating method is a method of plating by dipping into molten metal. Thermal spray plating is a method of spraying metal melted by gas or arc onto the surface of a material using high-pressure gas or air. Each of these various plating methods has its own drawbacks or problems.

(Problems to be solved by the invention) Namely, with electroplating, alloy plating is difficult, with chemical plating, the plating layer cannot be thick and the cost of chemicals is high, and with hot-dip plating, it is difficult to form a pipe by simply dipping it. Although it has the advantage of being able to thicken the plating layer on the inner surface, etc., it has the disadvantages that it is difficult to adjust the thickness, that thermal spray plating tends to be porous, and that the metal particles are oxidized. The most common problem is that the adhesion between the plating layer and the material is not necessarily sufficient.

Additionally, there are other problems such as the equipment being expensive and the need for waste liquid treatment.

The present inventors previously discovered a mechanical plating method (Japanese Patent Application No. 62-299714) as a means of solving these problems, and eliminated and improved the problems or drawbacks of conventional methods of plating metal surfaces. In other words, the mechanical plating method involves bringing a metal brush into contact with a metal block and stripping off the metal from the metal block with the metal brush, and then bringing the material to be plated into contact with the metal brush and stripping it off with the metal brush. This is a method of mechanically plating metal onto the surface of a material to be plated via a metal brush.

However, there are other problems with this method.

While brating is being performed, the metal from the metal block that was previously stripped off by the brush does not adhere to the material to be plated, but instead adheres to the surface of the metal block and forms a hard-working layer (re-deposition). This layer is very hard and difficult to scrape off, so the amount of metal that can be removed by a metal brush is small.For this reason, if plating is performed for a long time, the plating film thickness will decrease over time. It will be done.

An object of the present invention is to provide a mechanical plating method that eliminates and improves the problems or drawbacks of the above-mentioned mechanical plating methods and prevents non-uniformity in plating thickness.

(Means for Solving the Problems) The present invention brings a metal brush into frictional contact with a metal block made of pure metal or an alloy, and peels off minute portions of metal from the metal block with the metal brush, and at the same time removes the metal brush from the metal block. In a mechanical plating method, the metal of the stripped metal block is mechanically plated onto the surface of the material to be plated via a metal brush by bringing it into frictional contact with the material to be plated, in which the metal block is moved and brought into contact with the metal brush. This is a mechanical plating method that is characterized by continuously plating the surface of a metal block that is coated with a new metal surface.

That is, the present invention is a mechanical plating method characterized by continuously plating by moving a metal block and constantly supplying a new metal surface,
Furthermore, the highly processed layer (re-deposition layer) generated on the surface of the metal block after contact with the metal brush is removed using a grindstone or cutting tool, and when it comes into contact with the metal brush again, it is continuously supplied with a new surface. This is a mechanical plating method characterized by plating.

As described above, in the method of the present invention, the metal block that comes into contact with the metal brush is moved by moving the metal block, or removing the strongly processed layer (redeposition layer) generated on the surface of the metal block using a grindstone or a cutting tool. To make the plating film thickness uniform by constantly creating a new surface.

In these methods, a grindstone or a cutting tool is brought into contact with the metal brush to remove metal particles that have adhered to the surface of the metal brush and have not been formed into a plating layer, thereby making the process even more continuous. can be plated.

In the combination of the metal block, metal brush, and material to be plated used in the present invention, the metal block must be softer than the metal brush, or must have an equivalent hardness in principle.

A few examples of combinations of metal blocks and metal brushes include using the same metal for the metal block and metal brush, or using a stainless steel wire brush for the AQ metal block and a stainless wire brush for the Cu metal block. Combinations such as hard steel wire brushes can be used.

The material to be plated is not particularly limited, and examples include 42% Ni alloy, stainless steel, and ordinary steel.

Further, the grindstone and cutting tool used in the present invention only need to be able to sharpen the surface of the metal block and the surface of the metal brush.
It is not specified in particular. Furthermore, the metal block only needs to have a surface that comes into contact with the metal brush, and its shape is not particularly specified.

Next, one aspect of the present invention will be explained with reference to the drawings.

FIG. 1 is an explanatory diagram of the method according to the present invention. In Figure 1, ■ is a metal brush, 2 is a metal round bar (Figure 1 (a))
or a metal coil (Fig. 1 (b)), 3 is the material to be plated, 4 is a grinding wheel (Fig. 1 (a)) or a grinding belt (Fig. 1 (b)), and 5 is the formed plating layer. show.

Rotate the metal brush 1 at high speed (circumferential speed of about 2000 m/ll)
The plated layer 5 can be obtained by bringing the tip of the 1 inch brush into contact with the metal block 2 and the material to be plated 3. Further, by bringing the metal block 2 into contact with the grinding wheel 4, the metal block can be continuously regenerated.

(Function) As in the present invention, when plating is performed without moving the metal block or without bringing the grindstone into contact with the metal brush, a highly processed layer (redeposition layer) is generated on the surface of the metal block, and this The hard-working layer is very hard and difficult to scrape, so if plating is carried out for a long time, the plating film thickness will decrease over time.

However, as in the present invention, when plating is performed while moving the metal block or while removing a highly processed layer formed on the surface of the metal block.

Since the contact between the metal brush and the metal block is always with a new metal surface of the metal block, that is, a surface without the hard working layer, the problem of reduction in plating thickness due to the influence of the hard working layer is eliminated. In addition, when this metal brush is further brought into contact with a grindstone and plated, the metal of the metal block that could not form a plating layer is removed from the surface of the metal brush.
A highly processed layer becomes more difficult to form, and a uniform plating layer can be obtained continuously for a long period of time.

Next, the present invention will be specifically explained with reference to Examples.
The present invention is not to be construed as being limited by this.

(Example 1) Outer diameter 250n+ with many 0.2mmφ hard steel wires implanted
mφ, length 100mm Q foil-shaped metal brush 25
Rotate at 0 rpm, outer diameter 100 mmφ, length 100
An AQ round piece of mm Q was rotated at a circumferential speed of 0.5 m/min, brought into contact with the metal brush, and further rotated at a speed of 2.0 m/min.
5I of thickness 1.0 control x width 100mm moving at the speed of
Figure 2 shows the plating thickness distribution in the longitudinal direction of the JS 304 strip when a metal brush is applied to the strip by force plating. Here, the grinding wheel and the AQ wheel are always in contact (this embodiment corresponds to FIG. 1(a)).

The * mark in FIG. 2 is based on the method of the present invention. ○
The mark is a comparative example, and the lt-marusoku was not rotated.

(Example 2) Outer diameter 3 with many 0.1mmφ SO5304 wires implanted
A foil metal brush with a diameter of 00φ and a length of 500+a+++Q is rotated at 200Orpm and moved at a speed of 2m/min with a thickness of 2. Push the Cu band of 0 mm x width 500 nn into a metal brush, and then push the metal brush at 1.0 m/min.
Figure 3 shows the plating thickness distribution in the longitudinal direction of a 42% Ni alloy strip of 1.5 mm thick x 500 n+m width moving at a speed by pressing a metal brush against it. The grinding belt and the Cu band are always in contact (this embodiment corresponds to FIG. 1(b)). The marks in FIG. 3 are based on the method of the present invention.

The O mark is a comparative example, and the Cu band has not moved.

(Effects of the Invention) The mechanical plating method according to the present invention is a method of mechanically brating metal by simultaneously making frictional contact between a metal brush, a material to be plated, and a moving metal block, so it is a method for mechanically brating metal. This is an inexpensive method that does not require various baths or solutions unlike chemical plating methods, and it is possible to obtain a plated material with strong adhesion. Furthermore, problems such as non-uniform plating thickness and reduction in plating thickness are eliminated.

In addition, the mechanical plating method according to the present invention can firmly plate various types of pure metals and alloys on the material surface at a much lower cost than conventional methods. It is possible to obtain a plated material that has the properties of metal and has excellent plating properties, solderability, conductivity, corrosion resistance, heat resistance, abrasion resistance, and decorative properties.

[Brief explanation of the drawing]

FIG. 1(a) and FIG. 1(b) are explanatory diagrams of the method according to the present invention. FIG. 2 shows the change in the plating film thickness in the longitudinal direction of the coil in the case of AQ plating.・marks are data related to the present invention, and O marks are data related to the comparative example. Figure 3 shows an example of Cu plating. The O mark is the same as in FIG. 1 Metal 4 Grinding wheel or grinding belt 2 Metal round bar or band 5 Plating layer 3 Material to be plated

Claims (1)

[Claims] 1 A metal brush is brought into frictional contact with a metal block made of a pure metal or an alloy, and a minute part of the metal of the metal block is removed by the metal brush, and the metal brush is brought into frictional contact with a material to be plated. In the mechanical plating method, the metal from the stripped metal block is mechanically plated onto the surface of the material to be plated using a metal brush.
A mechanical plating method characterized in that the metal block is moved so that the surface of the metal block that comes into contact with the metal brush is always made into a new metal surface and plating is performed continuously. 2. A metal brush is brought into frictional contact with a metal block made of pure metal or an alloy, and the metal brush is used to strip off minute portions of metal from the metal block, and the metal brush is brought into frictional contact with a material to be plated to remove the stripped metal. In the mechanical plating method, the metal of the block is mechanically plated onto the surface of the material to be plated via a metal brush.
Mechanical plating characterized in that the hard working layer generated on the surface of the metal block after contact with the metal brush is removed by a grindstone or a cutting tool, and the surface of the metal block is made into a new metal surface for continuous plating. Method. 3. Plating is carried out by further bringing a grindstone or a cutting tool into contact with the metal brush to remove metal particles that have adhered to the surface of the metal brush and have not formed a plating layer. Mechanical plating method according to item 2.