JPH0548104Y2 - - Google Patents
Info
- Publication number
- JPH0548104Y2 JPH0548104Y2 JP3963687U JP3963687U JPH0548104Y2 JP H0548104 Y2 JPH0548104 Y2 JP H0548104Y2 JP 3963687 U JP3963687 U JP 3963687U JP 3963687 U JP3963687 U JP 3963687U JP H0548104 Y2 JPH0548104 Y2 JP H0548104Y2
- Authority
- JP
- Japan
- Prior art keywords
- temperature
- temperature sensor
- insulating tube
- ntc thermistor
- heat
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 229920005989 resin Polymers 0.000 claims description 11
- 239000011347 resin Substances 0.000 claims description 11
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 5
- 229910052782 aluminium Inorganic materials 0.000 claims description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 3
- 239000007769 metal material Substances 0.000 claims description 3
- 229910000859 α-Fe Inorganic materials 0.000 description 2
- 239000004809 Teflon Substances 0.000 description 1
- 229920006362 Teflon® Polymers 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 235000008446 instant noodles Nutrition 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000008267 milk Substances 0.000 description 1
- 210000004080 milk Anatomy 0.000 description 1
- 235000013336 milk Nutrition 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 230000006903 response to temperature Effects 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 229920006337 unsaturated polyester resin Polymers 0.000 description 1
Landscapes
- Measuring Temperature Or Quantity Of Heat (AREA)
Description
【考案の詳細な説明】
産業上の利用分野
本考案は、電子ポツト、コーヒーメーカー等の
如きヒーター回路を内蔵した各種機器に組付け可
能な温度センサーに関するものである。[Detailed Description of the Invention] Industrial Field of Use The present invention relates to a temperature sensor that can be installed in various types of equipment having built-in heater circuits, such as electronic pots, coffee makers, and the like.
従来の技術
従来、この種の温度センサーとしては所定温度
で磁力を急激に低下するに応じてヒーター回路の
スイツチを開成制御する感温フエライト等を組込
んだものが用いられているのが通常である。Conventional technology Conventionally, this type of temperature sensor has usually incorporated a temperature-sensitive ferrite, etc., which controls the opening of a heater circuit switch in response to a sudden decrease in magnetic force at a predetermined temperature. be.
考案が解決しようとする問題点
然し、その感温フエライト等を組込んだ温度セ
ンサーでは或る一点の温度管理しか行うことがで
きず、例えばミルクを温めるに適した温度65℃程
度に設定したり或いは即席ラーメンを作るに適し
た温度95℃程度に設定したりする如き必要に応じ
た数点の温度制御を行うには用いることができな
い。Problems that the invention aims to solve However, the temperature sensor incorporating temperature-sensitive ferrite can only control the temperature at one point, for example, setting the temperature to about 65 degrees Celsius, which is suitable for heating milk. Alternatively, it cannot be used to control the temperature at several points as necessary, such as setting the temperature to about 95° C., which is suitable for making instant noodles.
考案の目的
本考案は、数点の温度設定を行うことの可能な
NTCサーミスタを用いて構成する温度センサー
を提供することを目的とする。Purpose of the invention This invention is a device that can set the temperature at several points.
The purpose of the present invention is to provide a temperature sensor configured using an NTC thermistor.
目的を達成するための手段
本考案に係る温度センサーにおいては、アルミ
等の金属材料で形成した感熱ヘツドの凸部に絶縁
チユーブで収容したNTCサーミスタを挿置し、
そのNTCサーミスタのリード線と接続した電線
を感熱ヘツドの凸部と嵌合する樹脂ケースから引
き出すことにより構成されている。Means for Achieving the Object In the temperature sensor according to the present invention, an NTC thermistor housed in an insulating tube is inserted into a convex portion of a heat-sensitive head made of a metal material such as aluminum.
It is constructed by pulling out the electric wire connected to the lead wire of the NTC thermistor from the resin case that fits into the convex part of the heat-sensitive head.
作 用
この温度センサーでは感熱ヘツドの温度変化に
応じて抵抗値変化するNTCサーミスタの負特性
を用いるものであり、そのサーミスタと直列に抵
抗を接続することにより温度変化を電位変化に置
き換えて取り出すことができるから、この電位変
化をマイコンで読取つて常時一定温度でヒーター
回路の開閉制御を行うようにすることができるば
かりでなく、任意の温度毎に応じた電位値をマイ
コンに記憶させて置けば数点の温度でヒーター回
路を開閉制御するに用いるセンサーとして組込む
ことができるようになる。Function This temperature sensor uses the negative characteristic of an NTC thermistor whose resistance value changes in response to temperature changes in the heat-sensitive head. By connecting a resistor in series with the thermistor, temperature changes can be replaced with potential changes and extracted. Not only can this change in potential be read by a microcomputer to control the opening and closing of the heater circuit at a constant temperature, but it can also be used to store potential values corresponding to arbitrary temperatures in the microcomputer. It becomes possible to incorporate it as a sensor used to control the opening and closing of a heater circuit at several temperatures.
実施例
以下、添付図面を参照して説明すれば、次の通
りである。Embodiments The following description will be made with reference to the accompanying drawings.
この温度センサーはNTCサーミスタ１０を用
いて構成するものであり、そのサーミスタ１０と
しては第１図で示すようにダイオード型ガラス封
止サーミスタを用いることができる。また、この
サーミスタ１０はテフロン等の絶縁チユーブ１１
の径内に収容して感熱ヘツド１２の凸部１２ａに
挿置されている。その感熱ヘツド１２はアルミ等
の如き熱伝導性の良好な金属材料を用いて形成さ
れており、凸部１２ａには第２図で示すように絶
縁チユーブ１１を挿置する貫通孔１２ｂが直径方
向に設けられている。この貫通孔１２ｂを通して
配置する絶縁チユーブ１１はサーミスタ１０のリ
ード線１０ａ，１０ｂを挿入したシリコン等の絶
縁チユーブ１３ａ，１３ｂと共に直角方向に折曲
することにより下方に位置され、その絶縁チユー
ブ１１を当てがい配置するべく凸部１２ｂの側面
には扁平な面取り部１２ｃが形成されている。ま
た、絶縁チユーブ１１の径内でリード線１０ａ，
１０ｂの端末にはスプラインバンド等のカシメ金
具１４を用いてシリコン含浸ガラス編組の電線１
５ａ，１５ｂが接続され、その電線１５ａ，１５
ｂと共に絶縁チユーブ１１は樹脂ケース１６を通
して下方に引き出されている。この樹脂ケース１
６としては不飽和ポリエステル樹脂等の熱硬化性
樹脂で形成したものを用いることができ、それに
は第３図で示すように感熱ヘツド１２の凸部１２
ａを嵌合する凹部１６ａと電線１５ａ，１５ｂ並
びに絶縁チユーブ１１を挿通する貫通孔１６ｂ，
１６ｃとが設けられている。また、周側面には樹
脂ケース１６を各種の機器に組付け固定するに用
いられる止め鍔１６ｄと切欠凹部１６ｅ，１６ｆ
とが設けられている。 This temperature sensor is constructed using an NTC thermistor 10, and as the thermistor 10, a diode-type glass-sealed thermistor can be used as shown in FIG. Moreover, this thermistor 10 is made of an insulating tube 11 made of Teflon or the like.
The heat-sensitive head 12 is inserted into the convex portion 12a of the heat-sensitive head 12. The heat-sensitive head 12 is made of a metal material with good thermal conductivity such as aluminum, and the convex portion 12a has a through hole 12b in the diametrical direction into which the insulating tube 11 is inserted, as shown in FIG. It is set in. The insulating tube 11 disposed through the through hole 12b is bent at right angles with the insulating tubes 13a, 13b made of silicon or the like into which the lead wires 10a, 10b of the thermistor 10 are inserted, and the insulating tube 11 is positioned below. A flat chamfered portion 12c is formed on the side surface of the convex portion 12b for arranging the housing. Further, within the diameter of the insulating tube 11, the lead wire 10a,
At the terminal of 10b, a silicon-impregnated glass braided electric wire 1 is attached using a caulking metal fitting 14 such as a spline band.
5a, 15b are connected, and the electric wires 15a, 15
The insulating tube 11 and b are pulled out downward through the resin case 16. This resin case 1
6 may be made of a thermosetting resin such as unsaturated polyester resin, and as shown in FIG.
a through-hole 16b through which the electric wires 15a, 15b and the insulating tube 11 are inserted;
16c is provided. Also, on the circumferential side, a stopper 16d and cutout recesses 16e and 16f are used for assembling and fixing the resin case 16 to various devices.
and is provided.
この温度センサーを組立てるにあたつては、ま
ず、NTCサーミスタ１０のリード線１０ａ，１
０ｂに絶縁チユーブ１３ａ，１３ｂを被せ、その
全体を相対的に太い径の絶縁チユーブ１１に挿入
する。次に、リード線１０ａ，１０ｂの端末にカ
シメ金具１４で電線１５ａ，１５ｂを接続した
後、絶縁チユーブ１１のNTCサーミスタ１０を
収容した部分を感熱ヘツド１２の凸部１２ａに形
成した貫通孔１２ｂに挿入してリード線１２ａ，
１２ｂの絶縁チユーブ１３ａ，１３ｂで被覆した
部分を絶縁チユーブ１１と共に直角に曲げる。こ
の絶縁チユーブ１１を樹脂ケース１６の貫通孔１
６ｂ，１６ｃに挿通し、また、感熱ヘツド１２の
凸部１２ａを樹脂ケース１６の凹部１６ａに嵌込
めばよい。最後に、樹脂ケース１６から引き出さ
れる電線１５ａ，１５ｂの端末に第４図で示すよ
うにコネクタ１７を取付ければ温度センサーとし
て完成することができる。 When assembling this temperature sensor, first, the lead wires 10a and 1 of the NTC thermistor 10 are assembled.
0b is covered with insulating tubes 13a and 13b, and the whole is inserted into insulating tube 11 having a relatively large diameter. Next, after connecting the electric wires 15a and 15b to the ends of the lead wires 10a and 10b with the caulking fittings 14, the portion of the insulating tube 11 that accommodates the NTC thermistor 10 is inserted into the through hole 12b formed in the convex portion 12a of the thermal head 12. Insert the lead wire 12a,
The portion of 12b covered with insulating tubes 13a and 13b is bent at right angles together with insulating tube 11. This insulating tube 11 is connected to the through hole 1 of the resin case 16.
6b and 16c, and the convex portion 12a of the heat-sensitive head 12 is fitted into the concave portion 16a of the resin case 16. Finally, by attaching connectors 17 to the ends of the electric wires 15a and 15b drawn out from the resin case 16 as shown in FIG. 4, the temperature sensor can be completed.
このように構成する温度センサーはマイコン制
御用電子ポツトに組付けることができ、或いはコ
ーヒーメーカーやその他のヒーターを内蔵する各
種の機器に温度センサーとして組込むことができ
る。この温度センサーではNTCサーミスタ１０
を用いるため、任意の温度設定ができて好みの温
度でヒーター回路を制御する機器を構成できる。
また、マイコン制御用電子ポツトに組込む場合に
はサーミスタ１０と直列に抵抗を接続することに
より温度変化を電位変化に置き換えて取出すこと
ができるから、この電位変化をマイコンで読取つ
て常時一定温度でヒーター回路の開閉制御を行な
えると共に任意の温度毎に応じた電位値をマイコ
ンに記憶させて置けば数点の温度でヒーター回路
を開閉制御するようにすることができる。 The temperature sensor configured in this manner can be installed in an electronic pot for microcomputer control, or can be installed as a temperature sensor in a coffee maker or other various devices having a built-in heater. In this temperature sensor, NTC thermistor 10
By using , it is possible to set any temperature and configure a device that controls the heater circuit at the desired temperature.
In addition, when incorporating it into an electronic pot for microcomputer control, by connecting a resistor in series with the thermistor 10, temperature changes can be replaced with potential changes. It is possible to control the opening and closing of the circuit, and by storing potential values corresponding to arbitrary temperatures in the microcomputer, it is possible to control the opening and closing of the heater circuit at several temperatures.
考案の効果
以上の如く、本考案に係る温度センサーに依れ
ば、NTCサーミスタを用いて任意の温度に応じ
た各種機器のヒーター回路を開閉制御可能なセン
サーを簡単に構成することができる。Effects of the Invention As described above, according to the temperature sensor according to the present invention, it is possible to easily construct a sensor that can control the opening and closing of heater circuits of various devices according to any temperature using an NTC thermistor.
第１図は本考案に係る温度センサーの部分拡大
断面図、第２図ａ，ｂは同センサーを構成する感
熱ヘツドの側面並びに平面図、第３図ａ〜ｃは同
センサーを構成する樹脂ケースの平面、側面並び
に底面図、第３図ｄは第３図ａで示すＡ−Ｂ線断
面図、第４図は同センサーの全体を示す説明図で
ある。
１０……NTCサーミスタ、１０ａ，１０ｂ…
…リード線、１１……絶縁チユーブ、１２……感
熱ヘツド、１２ａ……凸部、１５ａ，１５ｂ……
電線、１６……樹脂ケース。
Figure 1 is a partially enlarged sectional view of the temperature sensor according to the present invention, Figures 2a and b are side and plan views of the thermal head that constitutes the sensor, and Figures 3a to c are resin cases that constitute the sensor. FIG. 3d is a sectional view taken along the line AB shown in FIG. 3a, and FIG. 4 is an explanatory diagram showing the entire sensor. 10...NTC thermistor, 10a, 10b...
...Lead wire, 11...Insulating tube, 12...Thermal head, 12a...Protrusion, 15a, 15b...
Electric wire, 16...resin case.
Claims (1)
部に絶縁チユーブで収容したNTCサーミスタを
挿置し、そのNTCサーミスタのリード線と接続
した電線を感熱ヘツドの凸部と嵌合する樹脂ケー
スから引き出してなることを特徴とする温度セン
サー。 An NTC thermistor housed in an insulating tube is inserted into the convex part of the heat-sensitive head made of metal material such as aluminum, and the electric wire connected to the lead wire of the NTC thermistor is pulled out from the resin case that fits into the convex part of the heat-sensitive head. A temperature sensor characterized by:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3963687U JPH0548104Y2 (en) | 1987-03-17 | 1987-03-17 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3963687U JPH0548104Y2 (en) | 1987-03-17 | 1987-03-17 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS63146733U JPS63146733U (en) | 1988-09-28 |
| JPH0548104Y2 true JPH0548104Y2 (en) | 1993-12-20 |
Family
ID=30852992
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3963687U Expired - Lifetime JPH0548104Y2 (en) | 1987-03-17 | 1987-03-17 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0548104Y2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7588994B2 (en) | 2002-06-07 | 2009-09-15 | Amberwave Systems Corporation | Methods for forming strained-semiconductor-on-insulator device structures by mechanically inducing strain |
-
1987
- 1987-03-17 JP JP3963687U patent/JPH0548104Y2/ja not_active Expired - Lifetime
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7588994B2 (en) | 2002-06-07 | 2009-09-15 | Amberwave Systems Corporation | Methods for forming strained-semiconductor-on-insulator device structures by mechanically inducing strain |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS63146733U (en) | 1988-09-28 |
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