JPH0548295A - Method and apparatus for mounting electronic component - Google Patents

Abstract

(57) [Summary] [Structure] The first imaging camera 1 for imaging the position data and the rotation angle of the electronic component 1 sucked by the suction nozzle 10.
7 and the rotation angle θ of the electronic component 1 obtained by the first imaging camera 17, the suction nozzle 10 is rotated to correct the rotation angle of the electronic component 1, and an image is taken before the correction. Second position data of the electronic component 1 after correction calculated from the position data of the electronic component 1 and the rotation angle
Comparing with the position data of the electronic component 1 after correction actually imaged by the image pickup camera 25, if they are different from each other, the arithmetic control unit newly calculates the position data of the suction nozzle 10. And 20. [Effect] With such a configuration, the electronic component can be positioned and mounted on the circuit board with high accuracy, and a suction error may occur when the suction nozzle again sucks the electronic component. Since it can be prevented, the product yield is improved.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic component mounting method and apparatus for mounting a chip-shaped electronic component at a predetermined position on an electronic circuit board.

[0002]

2. Description of the Related Art When a chip-shaped electronic component is mounted on an electronic circuit board to manufacture a mounted circuit board, a large number and many types of electronic components must be mounted on a single circuit board. .. For this purpose, a suction head having a plurality of electronic component suction nozzles (hereinafter referred to as “suction nozzles”) is used. This suction head is the rotary of the electronic component mounting device.
-It is attached to the index table and can be driven intermittently at high speed.

The electronic component mounting apparatus first moves the suction head onto a component tray in which electronic components are stored. When a predetermined component is sucked from the component tray, the suction head is intermittently driven by the rotary index table and moved onto the circuit board. Then, the electronic component mounting apparatus mounts the electronic component at a predetermined position on the circuit board.

By the way, when an electronic component is sucked and taken out from the component tray by the tip of the suction nozzle, the suction nozzle does not always suck the center of the electronic component. In addition, the electronic component may rotate in the XY plane during suction. When mounted on the circuit board in this state,
This means that the electronic component is not mounted on the circuit board at a predetermined position or in a predetermined posture.

Therefore, an image pickup camera is usually arranged between the component tray and the circuit board. The suction nozzle that suction-holds the electronic component on the component tray always passes in the vicinity of the image pickup camera, and the suction state of the electronic component is imaged. The rotation angle of the electronic component is corrected based on the image pickup signal, and the relationship between the electronic component and the suction nozzle is detected.

When the electronic component is rotating, the suction nozzle is rotated to correct the rotation angle of the component.
For that purpose, first, how many times the electronic component should be rotated around the position of the suction nozzle is calculated from the position of the suction nozzle which has been inputted in advance with the image pickup signal.

Then, the suction nozzle is rotated based on the calculation result. That is, FIG. 3 is an image of the electronic component taken by the image pickup camera. In the figure, 1 is an electronic component. Here, the electronic component 1 shown by the solid line is the electronic component 1 before correction, and the electronic component 1 shown by the alternate long and short dash line is the electronic component 1 after correction.
Is shown. Further, in the figure, α is the position data (rotation center) of the suction nozzle, which is input in advance, and G is a reference point indicating the position data of the electronic component 1 before correction (solid line).

When it is desired to correct the electronic component 1 to the posture shown by the alternate long and short dash line, the suction nozzle may be rotated by the angle θ shown in FIG. At this time, the point G is line segment (G−α) = line segment (G ₁ −α), angle (G, α,
G ₁ ) = Go to a point G ₁ having the relationship of angle (θ).

This makes it possible to know the suction position α of the suction nozzle and the position data (reference point) G ₁ of the electronic component 1 with respect to the suction position α, and if the circuit board is shifted to XY based on this value. The electronic component 1 can be mounted at the correct position on the circuit board.

By the way, when the suction nozzle is driven at a high speed and used many times, the actual position of the suction nozzle deviates from the position data α initially input due to vibration, thermal deformation and the like. It is possible to come. For example, as shown in FIG. 3, the position of the suction nozzle is changed from the first input point α to the point α.
Suppose that it shifts to ₁ . At this time, when the suction nozzle is rotated by the angle θ obtained by the calculation, the position of the electronic component 1 becomes as shown by the solid line in FIG. At this time, the point G moves to the point G ₂ which is different from the point G ₁ . In the case of numerical control, such a state cannot be dealt with and the operation is performed based on the input coordinates α, G ₁ . That is, although the electronic component 1 is actually located at the position shown by the solid line in FIG. 4, it is mounted on the circuit board assuming that it is at the position shown by the alternate long and short dash line. In such a case, since the relationship between the suction nozzle and the electronic component 1 is erroneously recognized, it cannot be mounted at an accurate position.

Further, if the suction nozzle is mounted while the position data of the suction nozzle is displaced from the actual position, the displacement is further increased. Further, if the nozzle position data is greatly different from the actual nozzle position, it may not be possible to pick up the electronic component 1 from the component tray.

[0012]

As described above, in the conventional numerically controlled electronic component mounting apparatus, when the position of the suction nozzle deviates from the position data initially input due to changes in the environment over time. However, since this cannot be dealt with, there is a risk that electronic components may be mounted in the wrong positions.

It is an object of the present invention to provide an electronic component mounting method and an electronic component mounting apparatus capable of responding to a displacement of a suction nozzle in real time and always mounting an electronic component at an accurate position. Is.

[0014]

According to a first means of the present invention, an electronic component suction nozzle for which position data has been obtained in advance is used to adsorb the electronic component, and this electronic component is obtained in advance for the position data. In the electronic component mounting method to be mounted on the circuit board,

The first step of obtaining the position data and the rotation angle of the electronic component by imaging the electronic component sucked by the electronic component suction nozzle, and the electronic component of the electronic component obtained in the first step. A second step of correcting the rotation angle of the electronic component by rotating the electronic component suction nozzle based on the rotation angle, a third step of calculating the corrected position data of the electronic component, and the electronic component A fourth step of obtaining the position data of the electronic component after correction by picking up an image of the electronic component sucked by the suction nozzle, and the position data of the electronic component after correction calculated in the third step. And the position data of the electronic component after the correction obtained in the fourth step are compared, and if they are different, from the position data of the electronic component obtained in the fourth step, Fifth process for calculating position data of new electronic component suction nozzle When the position data of the electronic component suction nozzles previously obtained - and having a sixth step of correcting the data - the data position de obtained in the fifth step.

The second means of the present invention is to move the electronic component suction nozzle for which the position data has been obtained in advance and the electronic component suction nozzle above the circuit board for which the position data has been obtained in advance. In an electronic component mounting apparatus having a moving means and an electronic component mounting means for mounting an electronic component sucked by the electronic component suction nozzle on the circuit board,

An electronic component sucked by an electronic component suction nozzle is imaged and its position data and rotation angle are obtained.
Image processing means and the first component for correcting the rotation angle of the electronic component by rotating the electronic component suction nozzle based on the rotation angle of the electronic component obtained by the first image processing means.
And a second image processing means for calculating the position data of the electronic component after correction, and a second image processing means for obtaining the position data of the electronic component after correction. , The position data of the electronic component after correction obtained by the second arithmetic control unit and the position data of the electronic component after correction obtained by the second image processing unit are compared, and both are compared. In the case of a difference, a third calculation control means for calculating the position data of a new electronic component suction nozzle is provided.

[0018]

According to this structure, when the position data of the suction nozzle is deviated from the initially input position, the position data of the suction nozzle is calculated and corrected so that the electronic data can be obtained. The parts can be mounted accurately.

[0019]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to the drawings.

FIG. 1 is a schematic configuration diagram of an electronic component mounting apparatus 3 showing an embodiment of the present invention. This component mounting device has a rotary index table 4. The rotary index table 4 is composed of an index shaft 5 whose upper end is connected to an intermittent drive device (not shown), and a plate-shaped table body 6 fixed to the lower end of the index shaft 5.

The table body 6 is provided with arm portions 6a which are horizontally projected outwardly in the radial direction at intervals of, for example, 45 degrees in the circumferential direction. A column-shaped turn holder 8 is rotatably provided on the projecting end of the arm portion 6a with the axis line vertical. That is, the rotary index table 4 is intermittently rotated by the intermittent driving device, so that the turn holder 8 is positioned above the first to eighth stages.

Inside the turn holder 8, the turn holder 8 is provided.
Retaining holes 8a opened on the upper and lower surfaces of the holder 8 are circumferentially arranged on a concentric circle centered on the rotation center of the holder 8.
The holes are drilled at 0 degree intervals. Also, this turn holder 8
A driven gear portion 8b is provided at the upper end of the outer peripheral surface of the.

A nozzle holder 9 is vertically slidably inserted into the holding hole 8a. A suction nozzle 10 is attached to the lower end of the nozzle holder 9 with its axis aligned with the nozzle holder 9. The suction nozzle 10 is connected to a vacuum means (not shown) via the nozzle holder 9.

The nozzle holder 9 is biased upward with respect to the turn holder 8 by a spring (not shown). That is, the nozzle holder 9 is driven downward by pressing the upper end surface downward with the pressing member 11 shown in FIG.

On the first stage, on which the turn holder 8 is positioned, a component tray 15 in which a large number of electronic components 1 are stored is arranged. The component tray 15 is fixed on the first XY table 16 and is positioned and driven in the XY directions so that the suction nozzle 10 and the electronic component 1 sucked by the suction nozzle 10 face each other.

Further, a first image pickup camera 17 as a first image processing means is arranged in the second stage.
The first image pickup camera 17 is provided so that the image pickup surface 17a faces a first position where the suction nozzle 10 is positioned by the rotation of the turn holder 8. The first image pickup camera 17 can pick up an image of the electronic component 1 sucked by the suction nozzle 10.

The image pickup signal from the first image pickup camera 17 is sent to the first image processing section 18. The position data of the electronic component 1 obtained by the image processing by the first image processing unit 18 and the suction posture angle (rotation angle) thereof are sent to the arithmetic control unit 20. At this time, the position data of the electronic component 1 is input as G to the arithmetic control unit 20.

The third stage is provided with a rotation driving means 21 for correcting the rotation angle of the electronic component 1 by rotationally driving the suction nozzle 10 that has sucked the electronic component 1. The rotary driving means 21 engages with the upper end surface of the nozzle holder 9 to rotate and drive the rotary holder 22.
And a driving motor 24 connected to the jig 22 by a belt 23 and rotationally driving the jig 22. The rotation driving means 21 operates according to a command from the arithmetic control section 20.

In the fourth stage, the second image pickup camera 25 as the second image processing means for picking up the position data of the electronic component 1 of which the rotation angle is corrected is taken as the first image pickup. Like the camera 17, it is provided so as to face the first position of the suction nozzle 10. This second imaging camera 2
The corrected position data of the electronic component 1 captured in step 5 is G
₂ is input to the arithmetic control unit 20 via the second image processing unit 26.

A third image pickup camera 30 for picking up the position data of the circuit board 29 is arranged above the fifth stage with its image pickup surface 30a facing the circuit board 29. It is arranged. The third imaging camera 30 reads a positioning mark (not shown) provided at the corner of the circuit board 29. Then, the position control data of the circuit board 29 imaged by the third imaging camera 30 is set to β, and the arithmetic control unit 20 is operated via the third image processing unit 31.
To enter.

Further, the electronic component 1 is provided in the fifth stage.
A second XY table 32 for holding a circuit board 29 on which is mounted is arranged. This second XY table 32
Operates on the basis of a command from the arithmetic and control unit 20, and the circuit board 29 is moved so that the suction nozzle 10 sucking the electronic component 1 and the position on the circuit board 29 where the electronic component 1 is mounted face each other. Positioning drive in the -Y direction.

The seventh stage is a selector which meshes with the driven gear portion 8b of the turn holder 8 to drive the turn holder 8 intermittently with respect to the arm portion 6a every 90 degrees. 33 is provided. By this selector 33, the suction nozzle 10 is positioned at the second to fourth positions at 90 degree intervals in the circumferential direction of the turn holder 8 with the position farthest from the index shaft 5 as the first position.

The arithmetic and control unit 20 is picked up by the first image pickup camera 17 and the position data .alpha. Of the suction nozzle position inputted in advance, the storage position data of the electronic parts stored in the parts tray 15. angle correction before the position data of the electronic component 1 - data G, the second position data of the electronic component 1 after the angle correction obtained by the image obtaining camera 25 - is captured by the data G _2, the third imaging camera 31 The positioning calculation is performed based on the position data β of the circuit board 29.

Then, the arithmetic control unit 20 makes the rotary index table 4 based on the result of the arithmetic operation.
(Intermittent drive device), first XY table 16, second X
A control signal is sent to the Y-table 32, the rotation driving means 21, the selector 33 and the like to control the electronic component mounting apparatus 3 to mount a large number of electronic components 1 ... On the circuit board 29 at high speed.

That is, the arithmetic control unit 20 selects an arbitrary electronic component 1 from the selected position data α of the suction nozzle 10 and the storage position data of the electronic component 1 placed on the component tray 15. Means for sending a command to position the suction nozzle 10 below the suction nozzle 10 to the first XY table 16 and the electronic component 1 sucked by the suction nozzle 10 based on a signal from the first imaging camera 17. A means for calculating a reference position (for example, a center position) G as position data, a means for calculating a rotation angle θ of the electronic component 1 at that time, and a rotation driving means 21 for causing the suction nozzle 10 to rotate the rotation angle θ. Means for sending a command for rotating (correcting) only (first calculation control means) and a position G that can be newly taken as the center position G of the electronic component 1 after the electronic component 1 is rotated by the angle θ (after correction). Means to calculate ₁ ( The second operation control means) and the image signal from the third image pickup camera 30 after the electronic part 1 is actually rotated by the angle θ, and the position data of the electronic part 1 is detected.
Means for calculating a reference position G ₂ as data, the position data of the electronic component 1 after the correction obtained by the calculation - data G ₁ and position de was determined by the imaging - means for comparing the data G _2, the G
_{When 1} and G ₂ are different, a means (third arithmetic control means) for calculating the rotation center (actual position data of the suction nozzle 10) α ₁ from G ₂ , θ and G, and the suction nozzle 10
Position data of - correcting the data alpha to alpha ₁ (replaced) means and said alpha ₁ and G ₂ Metropolitan circuit the electronic component 1 from the substrate 2
And a means for issuing a command to drive the second XY table 32 so that the second XY table 32 can be mounted at an accurate position on the table 9.

A monitor-34 is connected to the arithmetic control section, and the first to third image pickup cameras 17 and 2 are connected.
The images picked up at 5 and 30 can be appropriately displayed on the monitor-34. Next, the operation of the electronic component mounting device 3 will be described.

First, in the electronic component mounting apparatus 3, before the electronic component 1 is mounted on the circuit board 29, the position data α of all the suction nozzles 10 are set in advance in the arithmetic control unit 20.
To enter. That is, the rotary index table
The bull 4 and the rotation driving means 21 are operated so that all the suction nozzles 10 are sequentially opposed to above the first imaging camera 17. The position data of the suction nozzle 10 imaged by the first image pickup camera 17 is input to the arithmetic control unit 20 as α.

Next, the electronic component mounting apparatus 3 picks up an image of the circuit board 29 by the third image pickup camera 30 and inputs its position data as β into the arithmetic control unit 20. Further, the position data of the electronic components 1 ... Stored in the component tray 15 is input to the arithmetic control unit 20 in advance.

The arithmetic control unit 20 loads the data based on the above data.
The tally index table 4 and the first and second XY tables 16 and 32 are controlled. That is, first, in the seventh stage, the selector 33 is actuated, and among the four suction nozzles 10 held by the turn holder 8, the suction nozzle having a diameter most suitable for the electronic component to be sucked next. 10 is selected, and this is positioned at the first position of the turn holder 8.

Next, the arithmetic control section 20 intermittently drives the turn holder 8 by the rotary index table 4 to position it on the first stage. Next, the arithmetic control unit 20 performs the first operation based on the input position data α of the selected suction nozzle 10.
The XY table 16 is operated to position the electronic component 1 sucked by the suction nozzle 10 so as to face the suction nozzle 10.

When the suction nozzle 10 and the electronic component 1 face each other, the arithmetic processing unit 20 causes the pressing rod 1 to operate.
1, the suction nozzle 10 and the nozzle holder 9 are pressed and moved downward. At this time, a suction force is generated at the tip of the suction nozzle 10 by a vacuum means (not shown), and the electronic component 1 can be suction-held.

The arithmetic and control unit 20 is arranged so that the suction nozzle 1
When the predetermined electronic component 1 is attracted by 0, the turn holder 8 is intermittently driven to the second stage. In this second stage 14, the posture of the electronic component 1 sucked by the suction nozzle 10 is imaged by the first image pickup camera 17, and the position data (reference position) of the electronic component 1 is picked up by the arithmetic control unit 20. ) G and the rotation angle θ are calculated (first step).

That is, as shown in FIG. 2 (a), the electronic component 1 shown by the solid line by the first imaging camera 17 is used.
Is imaged. The arithmetic and control unit 20 obtains a center position (reference position) G as position data of the electronic component 1 from this image, and further obtains a rotation angle θ of the electronic component 1 on the XY plane (α in the figure). Is the position data of the suction nozzle).

Next, the arithmetic control unit 20 causes the target
The holder 8 is intermittently driven to the third stage. In response to a command from the arithmetic processing unit 20, the rotation driving means 21 rotationally drives the suction nozzle 10 around its axis (centered on α) by an angle θ to correct the attitude of the electronic component 1 (second).
Process).

Then, the calculation control section 20 calculates the corrected position data of the electronic component 1 by calculation. That is, the center position G as the position data of the electronic component 10 by the rotation driving means 21 is, as shown in FIG. 2A, angle (G, α, G ₁ ) = angle (θ), line Minute (G-
It should move to the point G ₁ having the relationship of α) = segment (G ₁ −α) (third step).

In order to confirm this, the arithmetic control unit 20 intermittently drives the turn holder 8 to the fourth stage. The second image pickup camera 25 actually picks up the image of the electronic component 1 after correction, as shown in FIG. The arithmetic processing unit 20 obtains the center position G ₂ as position data of the electronic component 1 based on this image signal (fourth position).
Process).

Next, the arithmetic control unit 20 corrects the position data G ₁ of the electronic component 1 after the correction and the electronic component after the correction obtained by actually taking an image with the second image pickup camera 25. 1 and position data G _{2 of} 1.

As a result, if the points G ₁ and G ₂ are coincident with each other, then the G ₁ is correct, and thus the arithmetic control section 20 intermittently drives the turn holder 8 to the fifth stage and sucks it. The electronic component 1 is mounted at a predetermined position on the circuit board 29, where α is the position data of the nozzle 10 and G ₁ is the position data of the electronic component 1.

However, as shown in FIG.
₁ and G ₂ may be different. At this time, since the position data α of the suction nozzle 10 is different from the actual rotation center, the position data of the suction nozzle 10 is different.
We have to change α.

The arithmetic and control unit 20 described above calculates the position data G of the electronic component 1 before correction and the actual position data of the electronic component after correction.
The actual position data α ₁ of the suction nozzle 10 is obtained from the data G ₂ and the rotation angle θ. That is, α ₁ is, as shown in FIG. 2D, angle (G, α ₁ , G ₂ ) = angle (θ), line segment (G−α ₁ ) = line segment (G ₂ −α ₁ ). Have a relationship.
Since G, G ₂ and θ are known, the above point α
You can ask for _one . When the point α ₁ is obtained,
This point α ₁ is input as the position data of the suction nozzle 10 (α is replaced by α ₁ ), and the center position of the electronic component ₁ is not the point G ₁ but the actually imaged point G ₂ (replacement) ) (Fifth step).

In this way, the position data of the suction nozzle 10 is changed.
Once corrected data alpha to the correct value alpha _1, the above-mentioned operation control unit 20 the data - Nhoruda 8 a fifth stearyl - intermittently driven di. Then, the position data of the suction nozzle 10 - ₁ other alpha, position data of the suction nozzle 10 - the position data of electronic components for motor alpha ₁ - circuit board 29 the electronic component 1 the data as G ₂
It is attached to a predetermined position above (sixth step).

That is, in the fifth stage, the arithmetic control section 20 causes the position data β of the circuit board 29 imaged by the third imaging camera 27 and the already input circuit board 29 on the circuit board 29. Parts mounting position data, the suction nozzle 10
Of the second XY table 3 based on the position data α or α _{1 of} the electronic component 1 and the position data G ₁ or G ₂ of the electronic component 1.
2 is driven to position the electronic component 1 so that the component mounting positions on the circuit board 29 face each other.

Then, the arithmetic control unit 20 lowers the pressing rod 11 to press and lower the suction nozzle 10 and the nozzle holder 9. As a result, the electronic component 1 is mounted at a predetermined position on the circuit board 29 in a predetermined posture.

The electronic component mounting apparatus 3 has all the electronic components 1 for mounting such an operation on the circuit board 29.
Do about ... This work is continuously performed by intermittently driving the rotary table 4 at high speed.

According to this structure, when the position of each suction nozzle 10 is deviated from the initially input position data α due to a change in environment over time, the rotation angle of the electronic component 1 is corrected. By re-imaging the position data G ₂ of the subsequent electronic component 1, the accurate position data of the suction nozzle 10 can be obtained.
You can know the data α ₁ . As a result, the actual position data α _{1 of} the suction nozzle and the actual position data of the suction nozzle 10 are obtained.
Since the position data G ₂ of the electronic component 1 with respect to the data α ₁ is known, the electronic component 1 can be positioned and mounted at a predetermined position on the circuit board 29 in a predetermined posture based on these values.

Further, the position data α of the suction nozzle 10 is set.
Is corrected to the accurate position data α ₁ so that the electronic component 1 cannot be adsorbed from the component tray 15 in the first stage when the same adsorption nozzle 10 is used again for mounting. Is less. It should be noted that the present invention is not limited to the above-described embodiment, but can be variously modified without changing the gist of the invention.

For example, in the above embodiment, the suction nozzle 10 and the nozzle holder 9 are the rotary index table.
Although it is attached to the table 4, it may be arranged in a linear index table linearly at regular intervals. In this case, the parts trays 15 are respectively attached to the stages corresponding to both ends of the linear index table.
And a second XY table 32 holding the circuit board 29 are provided, and a first XY table 16 holding the
The second imaging cameras 17 and 25 are provided.

Further, in the above-described embodiment, the electronic component 1
Are stored in the component tray 22, but the electronic components 1 may be placed on a feed tape and sequentially fed. That is, the above tape has 1
Various types of parts are arranged at regular intervals in the groove formed in the tape. The tape is rolled up to form a reel. A plurality of reels having different types of parts accommodated therein are provided, and an arbitrary reel is called as needed. Then, a predetermined electronic component is supplied from an arbitrary tape so as to face the tip of the suction nozzle 10.

[0059]

As described above, according to the present invention, when the position of the suction nozzle deviates from the initially input position due to changes in the environment over time, the position data of the suction nozzle is calculated and corrected. did.

According to this structure, the electronic component can be positioned and mounted on the circuit board with high accuracy, and a suction error may occur when the suction nozzle again sucks the electronic component. Since it can be prevented, the product yield is improved.

[Brief description of drawings]

FIG. 1 is a schematic perspective view showing an embodiment of the present invention.

FIGS. 2A to 2D are process diagrams showing steps of correcting the rotation angle of an electronic component that is also sucked by a suction nozzle and correcting the position data of the suction nozzle.

FIG. 3 is an explanatory diagram showing correction of a rotation angle of a conventional electronic component.

FIG. 4 is an explanatory diagram showing erroneous recognition of position data of an electronic component that occurs due to displacement of the position data of a suction nozzle.

[Explanation of symbols] 1 ... Electronic parts, 4 ... Rotary index table, 1
Reference numeral 0 ... Electronic component suction nozzle, 17 ... First imaging camera (first image processing means), 20 ... Arithmetic control unit, 25 ... Second imaging camera (second image processing means), 29 ... Circuit board.

Claims (2)

[Claims] 1. An electronic component mounting method for sucking an electronic component by an electronic component suction nozzle, the position data of which is previously obtained, and mounting the electronic component on a circuit board, the position data of which is previously obtained. A first step of obtaining position data and a rotation angle of the electronic component by imaging the electronic component sucked by the electronic component suction nozzle; and a rotation angle of the electronic component obtained in the first step. A second step of correcting the rotation angle of the electronic component by rotating the electronic component suction nozzle based on the above, a third step of calculating the corrected position data of the electronic component, and the electronic component suction nozzle A fourth step of obtaining the position data of the electronic component after correction by picking up an image of the electronic component adsorbed on the substrate, and the position data of the electronic component after correction calculated in the third step and the above Supplement obtained in the fourth step From data, - the position data of electronic components found in the fourth step when compared with the motor, both are different - the position data of electronic components after
Fifth for calculating position data of new electronic component suction nozzle
And a sixth step of correcting the position data of the electronic component suction nozzle obtained in advance to the position data obtained in the fifth step. .. 2. An electronic component suction nozzle whose position data is obtained in advance, a moving means for moving the electronic component suction nozzle onto a circuit board whose position data is obtained in advance, and the electronic component suction nozzle. In an electronic component mounting apparatus having electronic component mounting means for mounting the electronic component sucked onto the circuit board, the electronic component sucked by the electronic component suction nozzle is imaged, and its position data and rotation angle are obtained. First image processing means, and first arithmetic control for correcting the rotation angle of the electronic component by rotating the electronic component suction nozzle based on the rotation angle of the electronic component obtained by the first image processing means. Means, second calculation control means for calculating the position data of the electronic component after correction, second image processing means for imaging the corrected electronic component, and obtaining the position data thereof, second Position data of electronic components after correction obtained by the arithmetic control unit - motor and the second
Comparing with the corrected position data of the electronic component obtained by the image processing means, if the two are different, the third calculation control for calculating the position data of the new electronic component suction nozzle An electronic component mounting apparatus comprising: