JPH05486A - Preparation of laminated sheet - Google Patents
Preparation of laminated sheetInfo
- Publication number
- JPH05486A JPH05486A JP15280991A JP15280991A JPH05486A JP H05486 A JPH05486 A JP H05486A JP 15280991 A JP15280991 A JP 15280991A JP 15280991 A JP15280991 A JP 15280991A JP H05486 A JPH05486 A JP H05486A
- Authority
- JP
- Japan
- Prior art keywords
- epoxy resin
- resin
- diphenyl ether
- type epoxy
- prepreg
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Laminated Bodies (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、プリント配線板などに
用いられるエポキシ樹脂系の積層板の製造方法に関する
ものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for producing an epoxy resin-based laminate used for printed wiring boards and the like.
【０００２】[0002]
【従来の技術】多層プリント配線板などに用いられるエ
ポキシ樹脂系の積層板は、ガラス基材にエポキシ樹脂ワ
ニスを含浸して加熱・乾燥することによってプリプレグ
を作成し、このプリプレグを複数枚重ねると共に必要に
応じて銅箔等の金属箔を重ね、これを加熱加圧して積層
成形することによって、製造されている。そしてこのよ
うなエポキシ樹脂系積層板の耐熱性を高めるために、従
来からエポキシ樹脂としてノボラック型エポキシ樹脂を
配合することがおこなわれており、例えばＦＲ−４レベ
ルのブロム化エポキシ樹脂にノボラック型エポキシ樹脂
を配合して調製したエポキシ樹脂ワニスを用いてプリプ
レグを作成すると共に積層板を製造するようにしてい
る。2. Description of the Related Art Epoxy resin-based laminates used for multilayer printed wiring boards and the like are made by impregnating a glass base material with epoxy resin varnish and heating and drying to prepare a prepreg. It is manufactured by stacking metal foils such as copper foils as necessary, and heating and pressing the foils to form a laminate. In order to improve the heat resistance of such an epoxy resin-based laminate, it has been conventionally practiced to blend a novolac type epoxy resin as an epoxy resin. For example, a FR-4 level brominated epoxy resin is mixed with a novolac type epoxy resin. An epoxy resin varnish prepared by blending a resin is used to prepare a prepreg and a laminated plate is manufactured.
【０００３】[0003]
【発明が解決しようとする課題】ノボラック型エポキシ
樹脂を配合することによってガラス転移温度（Ｔｇ）を
高めることができるために、常態での積層板の耐熱性を
高めることはできるが、吸湿後の耐熱性を高めることは
できないものであった。すなわち、吸湿後に熱衝撃が積
層板に作用すると、樹脂とガラス基材、樹脂と銅箔との
間の熱膨脹係数の差による歪みや、高温による樹脂強度
や接着力の低下、吸湿した水分の膨脹等が発生し、樹脂
とガラス基材との界面や樹脂と銅箔との界面で剥離が発
生するおそれがあるという問題があった。Since the glass transition temperature (Tg) can be increased by blending a novolac type epoxy resin, it is possible to increase the heat resistance of the laminate in a normal state, but The heat resistance could not be increased. That is, when a thermal shock acts on the laminated plate after absorbing moisture, distortion due to a difference in thermal expansion coefficient between the resin and the glass substrate, or between the resin and the copper foil, deterioration of resin strength and adhesive force due to high temperature, and expansion of moisture absorbed However, there is a problem that peeling may occur at the interface between the resin and the glass base material or the interface between the resin and the copper foil.
【０００４】本発明は上記の点に鑑みてなされたもので
あり、吸湿耐熱性に優れた積層板の製造方法を提供する
ことを目的とするものである。The present invention has been made in view of the above points, and it is an object of the present invention to provide a method for manufacturing a laminated board having excellent heat resistance to moisture absorption.
【０００５】[0005]
【課題を解決するための手段】本発明に係る積層板の製
造方法は、エポキシ樹脂としてジフェニルエーテル系エ
ポキシ樹脂を配合して調製した樹脂ワニスをガラス基材
に含浸させ、これを乾燥してプレプレグを作成すると共
にプレプリグを積層成形することを特徴とするものであ
る。A method for manufacturing a laminated board according to the present invention comprises: impregnating a glass base material with a resin varnish prepared by blending a diphenyl ether type epoxy resin as an epoxy resin, and drying the resin varnish to form a prepreg. It is characterized in that the prepreg is formed and laminated at the same time.
【０００６】以下、本発明を詳細に説明する。ジフェニ
ルエーテル系エポキシ樹脂は、ジフェニルエーテル基を
有するエポキシ樹脂であり、日本チバガイギー社から商
品名「ＸＪ−８００４」として提供されているものを用
いることができる。本発明ではエポキシ樹脂成分として
このジフェニルエーテル系エポキシ樹脂を用いてエポキ
シ樹脂ワニスを調製するものであり、エポキシ樹脂成分
の総てとしてこのジフェニルエーテル系エポキシ樹脂を
用いるようにする他、ブロム化ビスフェノールＡ型エポ
キシ樹脂など積層板用の任意のエポキシ樹脂にこのジフ
ェニルエーテル系エポキシ樹脂を併用するようにしても
よい。他のエポキシ樹脂と併用してジフェニルエーテル
系エポキシ樹脂を用いる場合、ジフェニルエーテル系エ
ポキシ樹脂はエポキシ樹脂成分の２０重量％以上を占め
るように配合するのが好ましい。The present invention will be described in detail below. The diphenyl ether-based epoxy resin is an epoxy resin having a diphenyl ether group, and the one provided by Nippon Ciba Geigy under the trade name "XJ-8004" can be used. In the present invention, an epoxy resin varnish is prepared using this diphenyl ether type epoxy resin as an epoxy resin component. In addition to using this diphenyl ether type epoxy resin as all epoxy resin components, a brominated bisphenol A type epoxy resin is used. This diphenyl ether type epoxy resin may be used in combination with any epoxy resin such as a resin for a laminated plate. When the diphenyl ether epoxy resin is used in combination with another epoxy resin, the diphenyl ether epoxy resin is preferably blended so as to account for 20% by weight or more of the epoxy resin component.
【０００７】上記のようにエポキシ樹脂としてジフェニ
ルエーテル系エポキシ樹脂を用い、これに硬化剤として
ジシアンジアミドなどを配合し、さらに硬化促進剤など
の配合資材や溶剤を配合することによって、エポキシ樹
脂ワニスを調製することができる。そしてガラス織布や
ガラス不織布などで形成されるガラス基材にこのエポキ
シ樹脂ワニスを含浸させ、加熱乾燥することによってプ
リプレグを調製し、次にこのプリプレグを複数枚重ねる
と共に必要に応じてさらに片側もしくは両側に銅箔等の
金属箔を重ね、これを加熱加圧して積層成形することに
よって、エポキシ樹脂系積層板を得ることができるもの
である。このようにして製造される積層板にあって、エ
ポキシ樹脂としてジフェニルエーテル系エポキシ樹脂を
用いることによって樹脂の強靱性を高めることができる
と共に高温時の接着力を高めることができる。従って吸
湿時に熱衝撃が積層板に作用しても、この熱衝撃に耐え
て樹脂とガラス基材との界面や樹脂と銅箔との界面で剥
離が発生することを防ぐことができるものである。As described above, an epoxy resin varnish is prepared by using a diphenyl ether type epoxy resin as an epoxy resin, adding dicyandiamide as a curing agent to the epoxy resin, and further adding a compounding material such as a curing accelerator and a solvent. be able to. Then, a glass base material formed of glass woven cloth or glass non-woven cloth is impregnated with this epoxy resin varnish, and a prepreg is prepared by heating and drying, and then a plurality of prepregs are stacked and one side or more as necessary. By stacking metal foils such as copper foils on both sides and heating and pressurizing the foils to form a laminate, an epoxy resin-based laminate can be obtained. In the laminated board thus manufactured, the toughness of the resin can be enhanced and the adhesive strength at high temperature can be enhanced by using the diphenyl ether type epoxy resin as the epoxy resin. Therefore, even if a thermal shock acts on the laminate during moisture absorption, it is possible to withstand the thermal shock and prevent peeling from occurring at the interface between the resin and the glass substrate or the interface between the resin and the copper foil. .
【０００８】[0008]
【実施例】次に、本発明を実施例によって例証する。実施例１ エポキシ樹脂成分として、ジフェニルエーテル系エポキ
シ樹脂（日本チバガイギー社製「ＸＪ−８００４」）１
００ｐｈｒに、硬化剤としてジシアンジアミド２．０ｐ
ｈｒ、溶剤としてジメチルホルムアミド１５ｐｈｒとプ
ロピレングリコールモノメチルエチルエーテル１５ｐｈ
ｒ、硬化促進剤として２−エチル−４−メチルイミダゾ
ール０．１ｐｈｒを配合してエポキシ樹脂ワニスを調製
した。次にガラス織布基材にこのエポキシ樹脂ワニスを
樹脂含量が５０重量％になるように含浸させ、１６０℃
の熱風乾燥機で５分間加熱乾燥することによって、プリ
プレグを作成した。そしてこのプリプレグを６枚重ねる
と共にさらに両側に銅箔を重ね、これを１７５℃、３０
ｋｇ／ｃｍ2 の加熱加圧条件で６０分間積層成形するこ
とによって、厚み０．７ｍｍのエポキシ樹脂系積層板を
得た。The invention will now be illustrated by the examples. Example 1 As an epoxy resin component, a diphenyl ether type epoxy resin (“XJ-8004” manufactured by Ciba-Geigy Japan) 1
00 phr, dicyandiamide 2.0p as a curing agent
hr, dimethylformamide 15 phr as solvent and propylene glycol monomethyl ethyl ether 15 ph
r and 0.1 phr of 2-ethyl-4-methylimidazole as a curing accelerator were added to prepare an epoxy resin varnish. Next, a glass woven fabric substrate was impregnated with this epoxy resin varnish so that the resin content became 50% by weight, and the temperature was increased to 160 ° C.
A prepreg was prepared by heat-drying with a hot air dryer for 5 minutes. And 6 sheets of this prepreg are piled up and copper foils are piled up on both sides.
An epoxy resin-based laminate having a thickness of 0.7 mm was obtained by performing lamination molding under heating / pressurizing conditions of kg / cm 2 for 60 minutes.
【０００９】実施例２ エポキシ樹脂成分として、ジフェニルエーテル系エポキ
シ樹脂（日本チバガイギー社製「ＸＪ−８００４」）５
０ｐｈｒとブロム化ビスフェノールＡ型エポキシ樹脂５
０ｐｈｒを用いてエポキシ樹脂ワニスを調製するように
した他は、実施例１と同様にしてエポキシ樹脂系積層板
を得た。 Example 2 As an epoxy resin component, a diphenyl ether type epoxy resin (“XJ-8004” manufactured by Nippon Ciba Geigy) was used.
0 phr and brominated bisphenol A type epoxy resin 5
An epoxy resin-based laminate was obtained in the same manner as in Example 1 except that 0 phr was used to prepare the epoxy resin varnish.
【００１０】実施例３ エポキシ樹脂成分として、ジフェニルエーテル系エポキ
シ樹脂（日本チバガイギー社製「ＸＪ−８００４」）２
５ｐｈｒとブロム化ビスフェノールＡ型エポキシ樹脂７
５ｐｈｒを用いてエポキシ樹脂ワニスを調製するように
した他は、実施例１と同様にしてエポキシ樹脂系積層板
を得た。 Example 3 As an epoxy resin component, a diphenyl ether type epoxy resin (“XJ-8004” manufactured by Nippon Ciba Geigy) 2
5 phr and brominated bisphenol A type epoxy resin 7
An epoxy resin-based laminate was obtained in the same manner as in Example 1 except that the epoxy resin varnish was prepared using 5 phr.
【００１１】比較例 エポキシ樹脂成分として、ブロム化ビスフェノールＡ型
エポキシ樹脂８０ｐｈｒとノボラック型エポキシ樹脂２
０ｐｈｒを用いてエポキシ樹脂ワニスを調製するように
した他は、実施例１と同様にしてエポキシ樹脂系積層板
を得た。上記のようにして得た積層板について、耐熱性
を測定した。耐熱性の試験は、常態の積層板、ＭＩＬ−
ＳＴＤ−２０２Ｆ １０６Ｅに基づいて図１に示す条件
の加湿を２サイクルおこなって処理した２サイクル吸湿
積層板、この加湿を４サイクルおこなって処理した４サ
イクル吸湿積層板、この加湿を６サイクルおこなって処
理した６サイクル吸湿積層板を用い、積層板の表面温度
が図２に示すようになるようにしたリフロー条件で加熱
し、積層板の表面積に対するフクレの発生によって生じ
る剥離の面積の割合を測定することによって評価した。
結果を次表に示す。 Comparative Examples As the epoxy resin components, 80 phr of brominated bisphenol A type epoxy resin and novolac type epoxy resin 2
An epoxy resin-based laminate was obtained in the same manner as in Example 1 except that 0 phr was used to prepare the epoxy resin varnish. The heat resistance of the laminated plate obtained as described above was measured. The heat resistance test is performed using a normal laminated board, MIL-
Based on STD-202F 106E, two cycles of humidification under the conditions shown in FIG. 1 were processed, two cycles of moisture absorption laminated plate, four cycles of this humidification were processed, and four cycles of moisture absorption were processed. Using the above-mentioned 6-cycle hygroscopic laminate, the laminate is heated under the reflow condition so that the surface temperature of the laminate is as shown in FIG. 2, and the ratio of the area of peeling caused by blistering to the surface area of the laminate is measured. Evaluated by
The results are shown in the table below.
【００１２】[0012]
【表１】 [Table 1]
【００１３】表の結果にみられるように、エポキシ樹脂
としてジフェニルエーテル系エポキシ樹脂を用いるよう
にした各実施例のものでは、常態の耐熱性が向上すると
共に、吸湿させた後の耐熱性も向上することが確認され
る。As can be seen from the results in the table, in each of the examples in which the diphenyl ether type epoxy resin is used as the epoxy resin, the heat resistance in the normal state is improved and the heat resistance after absorbing moisture is also improved. Is confirmed.
【００１４】[0014]
【発明の効果】上記のように本発明は、エポキシ樹脂と
してジフェニルエーテル系エポキシ樹脂を配合して調製
した樹脂ワニスを用いるようにしたので、エポキシ樹脂
としてジフェニルエーテル系エポキシ樹脂を用いること
によって樹脂の強靱性を高めることができると共に高温
時の接着力を高めることができ、吸湿時に熱衝撃が積層
板に作用してもこの熱衝撃に耐えて樹脂とガラス基材や
銅箔との界面で剥離が発生することを防いで、吸湿耐熱
性を高めることができるものである。As described above, according to the present invention, since the resin varnish prepared by blending the diphenyl ether type epoxy resin as the epoxy resin is used, the toughness of the resin can be improved by using the diphenyl ether type epoxy resin as the epoxy resin. The adhesive strength at high temperature can be increased, and even if a thermal shock acts on the laminate during moisture absorption, it withstands this thermal shock and peeling occurs at the interface between the resin and the glass substrate or copper foil. It is possible to prevent this from happening and to improve the moisture absorption heat resistance.
【図１】耐熱試験の加湿条件を示すグラフである。FIG. 1 is a graph showing humidification conditions in a heat resistance test.
【図２】耐熱試験の加熱条件を示すグラフである。FIG. 2 is a graph showing heating conditions of a heat resistance test.
Claims (1)
系エポキシ樹脂を配合して調製した樹脂ワニスをガラス
基材に含浸させ、これを乾燥してプレプレグを作成する
と共にプレプリグを積層成形することを特徴とする積層
板の製造方法。Claim: What is claimed is: 1. A glass base material is impregnated with a resin varnish prepared by mixing a diphenyl ether epoxy resin as an epoxy resin, and this is dried to form a prepreg and laminate molding of the prepreg. A method for manufacturing a laminated board, comprising:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15280991A JPH05486A (en) | 1991-06-25 | 1991-06-25 | Preparation of laminated sheet |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15280991A JPH05486A (en) | 1991-06-25 | 1991-06-25 | Preparation of laminated sheet |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH05486A true JPH05486A (en) | 1993-01-08 |
Family
ID=15548632
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15280991A Pending JPH05486A (en) | 1991-06-25 | 1991-06-25 | Preparation of laminated sheet |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH05486A (en) |
-
1991
- 1991-06-25 JP JP15280991A patent/JPH05486A/en active Pending
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A02 | Decision of refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A02 Effective date: 20000208 |