JPH0550465B2 - - Google Patents
Info
- Publication number
- JPH0550465B2 JPH0550465B2 JP61103523A JP10352386A JPH0550465B2 JP H0550465 B2 JPH0550465 B2 JP H0550465B2 JP 61103523 A JP61103523 A JP 61103523A JP 10352386 A JP10352386 A JP 10352386A JP H0550465 B2 JPH0550465 B2 JP H0550465B2
- Authority
- JP
- Japan
- Prior art keywords
- alcohol
- temperature
- degreasing
- injection molded
- ceramic powder
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000000919 ceramic Substances 0.000 claims description 37
- 239000000843 powder Substances 0.000 claims description 35
- 239000007924 injection Substances 0.000 claims description 34
- 238000002347 injection Methods 0.000 claims description 34
- 238000005238 degreasing Methods 0.000 claims description 25
- -1 phthalate ester Chemical class 0.000 claims description 24
- 239000011342 resin composition Substances 0.000 claims description 23
- 238000001746 injection moulding Methods 0.000 claims description 14
- 239000000113 methacrylic resin Substances 0.000 claims description 13
- WOZVHXUHUFLZGK-UHFFFAOYSA-N dimethyl terephthalate Chemical group COC(=O)C1=CC=C(C(=O)OC)C=C1 WOZVHXUHUFLZGK-UHFFFAOYSA-N 0.000 claims description 11
- 239000011347 resin Substances 0.000 claims description 8
- 229920005989 resin Polymers 0.000 claims description 8
- 238000005245 sintering Methods 0.000 claims description 8
- 238000000034 method Methods 0.000 claims description 7
- 238000002156 mixing Methods 0.000 claims description 7
- VOWAEIGWURALJQ-UHFFFAOYSA-N Dicyclohexyl phthalate Chemical group C=1C=CC=C(C(=O)OC2CCCCC2)C=1C(=O)OC1CCCCC1 VOWAEIGWURALJQ-UHFFFAOYSA-N 0.000 claims description 6
- 238000004519 manufacturing process Methods 0.000 claims description 6
- 238000006116 polymerization reaction Methods 0.000 claims description 4
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 7
- KKEYFWRCBNTPAC-UHFFFAOYSA-N benzene-dicarboxylic acid Natural products OC(=O)C1=CC=C(C(O)=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-N 0.000 description 7
- 235000019441 ethanol Nutrition 0.000 description 7
- 238000010438 heat treatment Methods 0.000 description 7
- XNGIFLGASWRNHJ-UHFFFAOYSA-N o-dicarboxybenzene Natural products OC(=O)C1=CC=CC=C1C(O)=O XNGIFLGASWRNHJ-UHFFFAOYSA-N 0.000 description 6
- 229910052799 carbon Inorganic materials 0.000 description 5
- 238000007796 conventional method Methods 0.000 description 5
- 230000007547 defect Effects 0.000 description 5
- 239000000203 mixture Substances 0.000 description 5
- 229920003229 poly(methyl methacrylate) Polymers 0.000 description 5
- 239000004926 polymethyl methacrylate Substances 0.000 description 5
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 4
- VVQNEPGJFQJSBK-UHFFFAOYSA-N Methyl methacrylate Chemical compound COC(=O)C(C)=C VVQNEPGJFQJSBK-UHFFFAOYSA-N 0.000 description 4
- 238000013329 compounding Methods 0.000 description 4
- ZSIAUFGUXNUGDI-UHFFFAOYSA-N hexan-1-ol Chemical group CCCCCCO ZSIAUFGUXNUGDI-UHFFFAOYSA-N 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 229920000642 polymer Polymers 0.000 description 4
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 3
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 3
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 3
- LRHPLDYGYMQRHN-UHFFFAOYSA-N N-Butanol Chemical compound CCCCO LRHPLDYGYMQRHN-UHFFFAOYSA-N 0.000 description 3
- AMQJEAYHLZJPGS-UHFFFAOYSA-N N-Pentanol Chemical compound CCCCCO AMQJEAYHLZJPGS-UHFFFAOYSA-N 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 150000002148 esters Chemical class 0.000 description 3
- 239000007789 gas Substances 0.000 description 3
- 230000003647 oxidation Effects 0.000 description 3
- 238000007254 oxidation reaction Methods 0.000 description 3
- 239000004014 plasticizer Substances 0.000 description 3
- 238000013001 point bending Methods 0.000 description 3
- 239000002994 raw material Substances 0.000 description 3
- 239000007787 solid Substances 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- KBPLFHHGFOOTCA-UHFFFAOYSA-N 1-Octanol Chemical group CCCCCCCCO KBPLFHHGFOOTCA-UHFFFAOYSA-N 0.000 description 2
- BBMCTIGTTCKYKF-UHFFFAOYSA-N 1-heptanol Chemical group CCCCCCCO BBMCTIGTTCKYKF-UHFFFAOYSA-N 0.000 description 2
- MSXVEPNJUHWQHW-UHFFFAOYSA-N 2-methylbutan-2-ol Chemical group CCC(C)(C)O MSXVEPNJUHWQHW-UHFFFAOYSA-N 0.000 description 2
- 229910018072 Al 2 O 3 Inorganic materials 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- CPLXHLVBOLITMK-UHFFFAOYSA-N Magnesium oxide Chemical compound [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 description 2
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical group OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 2
- 239000004743 Polypropylene Substances 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- MCMNRKCIXSYSNV-UHFFFAOYSA-N Zirconium dioxide Chemical compound O=[Zr]=O MCMNRKCIXSYSNV-UHFFFAOYSA-N 0.000 description 2
- 239000012298 atmosphere Substances 0.000 description 2
- 238000005452 bending Methods 0.000 description 2
- BTANRVKWQNVYAZ-UHFFFAOYSA-N butan-2-ol Chemical compound CCC(C)O BTANRVKWQNVYAZ-UHFFFAOYSA-N 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- MWKFXSUHUHTGQN-UHFFFAOYSA-N decan-1-ol Chemical group CCCCCCCCCCO MWKFXSUHUHTGQN-UHFFFAOYSA-N 0.000 description 2
- SWXVUIWOUIDPGS-UHFFFAOYSA-N diacetone alcohol Chemical group CC(=O)CC(C)(C)O SWXVUIWOUIDPGS-UHFFFAOYSA-N 0.000 description 2
- DOIRQSBPFJWKBE-UHFFFAOYSA-N dibutyl phthalate Chemical compound CCCCOC(=O)C1=CC=CC=C1C(=O)OCCCC DOIRQSBPFJWKBE-UHFFFAOYSA-N 0.000 description 2
- FLKPEMZONWLCSK-UHFFFAOYSA-N diethyl phthalate Chemical compound CCOC(=O)C1=CC=CC=C1C(=O)OCC FLKPEMZONWLCSK-UHFFFAOYSA-N 0.000 description 2
- PHTQWCKDNZKARW-UHFFFAOYSA-N isoamylol Chemical compound CC(C)CCO PHTQWCKDNZKARW-UHFFFAOYSA-N 0.000 description 2
- ZXEKIIBDNHEJCQ-UHFFFAOYSA-N isobutanol Chemical compound CC(C)CO ZXEKIIBDNHEJCQ-UHFFFAOYSA-N 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- ZWRUINPWMLAQRD-UHFFFAOYSA-N nonan-1-ol Chemical group CCCCCCCCCO ZWRUINPWMLAQRD-UHFFFAOYSA-N 0.000 description 2
- 239000004033 plastic Substances 0.000 description 2
- 229920003023 plastic Polymers 0.000 description 2
- 229920001225 polyester resin Polymers 0.000 description 2
- 239000004645 polyester resin Substances 0.000 description 2
- 229920001155 polypropylene Polymers 0.000 description 2
- BDERNNFJNOPAEC-UHFFFAOYSA-N propan-1-ol Chemical compound CCCO BDERNNFJNOPAEC-UHFFFAOYSA-N 0.000 description 2
- 239000000243 solution Substances 0.000 description 2
- HLZKNKRTKFSKGZ-UHFFFAOYSA-N tetradecan-1-ol Chemical group CCCCCCCCCCCCCCO HLZKNKRTKFSKGZ-UHFFFAOYSA-N 0.000 description 2
- KJIOQYGWTQBHNH-UHFFFAOYSA-N undecanol Chemical group CCCCCCCCCCCO KJIOQYGWTQBHNH-UHFFFAOYSA-N 0.000 description 2
- HMUNWXXNJPVALC-UHFFFAOYSA-N 1-[4-[2-(2,3-dihydro-1H-inden-2-ylamino)pyrimidin-5-yl]piperazin-1-yl]-2-(2,4,6,7-tetrahydrotriazolo[4,5-c]pyridin-5-yl)ethanone Chemical group C1C(CC2=CC=CC=C12)NC1=NC=C(C=N1)N1CCN(CC1)C(CN1CC2=C(CC1)NN=N2)=O HMUNWXXNJPVALC-UHFFFAOYSA-N 0.000 description 1
- OAYXUHPQHDHDDZ-UHFFFAOYSA-N 2-(2-butoxyethoxy)ethanol Chemical group CCCCOCCOCCO OAYXUHPQHDHDDZ-UHFFFAOYSA-N 0.000 description 1
- SBASXUCJHJRPEV-UHFFFAOYSA-N 2-(2-methoxyethoxy)ethanol Chemical group COCCOCCO SBASXUCJHJRPEV-UHFFFAOYSA-N 0.000 description 1
- XNWFRZJHXBZDAG-UHFFFAOYSA-N 2-METHOXYETHANOL Chemical group COCCO XNWFRZJHXBZDAG-UHFFFAOYSA-N 0.000 description 1
- POAOYUHQDCAZBD-UHFFFAOYSA-N 2-butoxyethanol Chemical group CCCCOCCO POAOYUHQDCAZBD-UHFFFAOYSA-N 0.000 description 1
- ZNQVEEAIQZEUHB-UHFFFAOYSA-N 2-ethoxyethanol Chemical group CCOCCO ZNQVEEAIQZEUHB-UHFFFAOYSA-N 0.000 description 1
- TZYRSLHNPKPEFV-UHFFFAOYSA-N 2-ethyl-1-butanol Chemical group CCC(CC)CO TZYRSLHNPKPEFV-UHFFFAOYSA-N 0.000 description 1
- YIWUKEYIRIRTPP-UHFFFAOYSA-N 2-ethylhexan-1-ol Chemical group CCCCC(CC)CO YIWUKEYIRIRTPP-UHFFFAOYSA-N 0.000 description 1
- UPGSWASWQBLSKZ-UHFFFAOYSA-N 2-hexoxyethanol Chemical group CCCCCCOCCO UPGSWASWQBLSKZ-UHFFFAOYSA-N 0.000 description 1
- PFNHSEQQEPMLNI-UHFFFAOYSA-N 2-methyl-1-pentanol Chemical group CCCC(C)CO PFNHSEQQEPMLNI-UHFFFAOYSA-N 0.000 description 1
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical group CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 1
- CUZKCNWZBXLAJX-UHFFFAOYSA-N 2-phenylmethoxyethanol Chemical compound OCCOCC1=CC=CC=C1 CUZKCNWZBXLAJX-UHFFFAOYSA-N 0.000 description 1
- HCGFUIQPSOCUHI-UHFFFAOYSA-N 2-propan-2-yloxyethanol Chemical group CC(C)OCCO HCGFUIQPSOCUHI-UHFFFAOYSA-N 0.000 description 1
- BRRVXFOKWJKTGG-UHFFFAOYSA-N 3,3,5-trimethylcyclohexanol Chemical group CC1CC(O)CC(C)(C)C1 BRRVXFOKWJKTGG-UHFFFAOYSA-N 0.000 description 1
- JSGVZVOGOQILFM-UHFFFAOYSA-N 3-methoxy-1-butanol Chemical group COC(C)CCO JSGVZVOGOQILFM-UHFFFAOYSA-N 0.000 description 1
- MQWCXKGKQLNYQG-UHFFFAOYSA-N 4-methylcyclohexan-1-ol Chemical group CC1CCC(O)CC1 MQWCXKGKQLNYQG-UHFFFAOYSA-N 0.000 description 1
- 239000004925 Acrylic resin Substances 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 1
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 1
- MQIUGAXCHLFZKX-UHFFFAOYSA-N Di-n-octyl phthalate Natural products CCCCCCCCOC(=O)C1=CC=CC=C1C(=O)OCCCCCCCC MQIUGAXCHLFZKX-UHFFFAOYSA-N 0.000 description 1
- HXQPUEQDBSPXTE-UHFFFAOYSA-N Diisobutylcarbinol Chemical group CC(C)CC(O)CC(C)C HXQPUEQDBSPXTE-UHFFFAOYSA-N 0.000 description 1
- RZKSECIXORKHQS-UHFFFAOYSA-N Heptan-3-ol Chemical group CCCCC(O)CC RZKSECIXORKHQS-UHFFFAOYSA-N 0.000 description 1
- 229930182556 Polyacetal Natural products 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- 239000004793 Polystyrene Substances 0.000 description 1
- 239000004372 Polyvinyl alcohol Substances 0.000 description 1
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- 229910004298 SiO 2 Inorganic materials 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- DKGAVHZHDRPRBM-UHFFFAOYSA-N Tert-Butanol Chemical compound CC(C)(C)O DKGAVHZHDRPRBM-UHFFFAOYSA-N 0.000 description 1
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 1
- QCWXUUIWCKQGHC-UHFFFAOYSA-N Zirconium Chemical compound [Zr] QCWXUUIWCKQGHC-UHFFFAOYSA-N 0.000 description 1
- HMDDXIMCDZRSNE-UHFFFAOYSA-N [C].[Si] Chemical compound [C].[Si] HMDDXIMCDZRSNE-UHFFFAOYSA-N 0.000 description 1
- 230000005856 abnormality Effects 0.000 description 1
- 239000006061 abrasive grain Substances 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 150000001298 alcohols Chemical class 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 239000003963 antioxidant agent Substances 0.000 description 1
- 230000003078 antioxidant effect Effects 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 229910002113 barium titanate Inorganic materials 0.000 description 1
- JRPBQTZRNDNNOP-UHFFFAOYSA-N barium titanate Chemical compound [Ba+2].[Ba+2].[O-][Ti]([O-])([O-])[O-] JRPBQTZRNDNNOP-UHFFFAOYSA-N 0.000 description 1
- 125000001797 benzyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])([H])* 0.000 description 1
- 229910052790 beryllium Inorganic materials 0.000 description 1
- ATBAMAFKBVZNFJ-UHFFFAOYSA-N beryllium atom Chemical compound [Be] ATBAMAFKBVZNFJ-UHFFFAOYSA-N 0.000 description 1
- BJQHLKABXJIVAM-UHFFFAOYSA-N bis(2-ethylhexyl) phthalate Chemical compound CCCCC(CC)COC(=O)C1=CC=CC=C1C(=O)OCC(CC)CCCC BJQHLKABXJIVAM-UHFFFAOYSA-N 0.000 description 1
- 239000006229 carbon black Substances 0.000 description 1
- 229920002301 cellulose acetate Polymers 0.000 description 1
- 229910001597 celsian Inorganic materials 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 1
- 229910052878 cordierite Inorganic materials 0.000 description 1
- 229930003836 cresol Chemical group 0.000 description 1
- HPXRVTGHNJAIIH-UHFFFAOYSA-N cyclohexanol Chemical group OC1CCCCC1 HPXRVTGHNJAIIH-UHFFFAOYSA-N 0.000 description 1
- 230000001066 destructive effect Effects 0.000 description 1
- GUJOJGAPFQRJSV-UHFFFAOYSA-N dialuminum;dioxosilane;oxygen(2-);hydrate Chemical group O.[O-2].[O-2].[O-2].[Al+3].[Al+3].O=[Si]=O.O=[Si]=O.O=[Si]=O.O=[Si]=O GUJOJGAPFQRJSV-UHFFFAOYSA-N 0.000 description 1
- 239000010432 diamond Substances 0.000 description 1
- 229910003460 diamond Inorganic materials 0.000 description 1
- XXJWXESWEXIICW-UHFFFAOYSA-N diethylene glycol monoethyl ether Chemical group CCOCCOCCO XXJWXESWEXIICW-UHFFFAOYSA-N 0.000 description 1
- JSKIRARMQDRGJZ-UHFFFAOYSA-N dimagnesium dioxido-bis[(1-oxido-3-oxo-2,4,6,8,9-pentaoxa-1,3-disila-5,7-dialuminabicyclo[3.3.1]nonan-7-yl)oxy]silane Chemical compound [Mg++].[Mg++].[O-][Si]([O-])(O[Al]1O[Al]2O[Si](=O)O[Si]([O-])(O1)O2)O[Al]1O[Al]2O[Si](=O)O[Si]([O-])(O1)O2 JSKIRARMQDRGJZ-UHFFFAOYSA-N 0.000 description 1
- 229910001873 dinitrogen Inorganic materials 0.000 description 1
- 239000003995 emulsifying agent Substances 0.000 description 1
- 230000001804 emulsifying effect Effects 0.000 description 1
- 239000000839 emulsion Substances 0.000 description 1
- 230000032050 esterification Effects 0.000 description 1
- 238000005886 esterification reaction Methods 0.000 description 1
- 230000008014 freezing Effects 0.000 description 1
- 238000007710 freezing Methods 0.000 description 1
- 239000001760 fusel oil Chemical group 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000012770 industrial material Substances 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 229940035429 isobutyl alcohol Drugs 0.000 description 1
- NLYAJNPCOHFWQQ-UHFFFAOYSA-N kaolin Chemical group O.O.O=[Al]O[Si](=O)O[Si](=O)O[Al]=O NLYAJNPCOHFWQQ-UHFFFAOYSA-N 0.000 description 1
- 229910001947 lithium oxide Inorganic materials 0.000 description 1
- 239000000314 lubricant Substances 0.000 description 1
- 239000000395 magnesium oxide Substances 0.000 description 1
- 239000002075 main ingredient Substances 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 229910052618 mica group Inorganic materials 0.000 description 1
- 239000006082 mold release agent Substances 0.000 description 1
- 239000012299 nitrogen atmosphere Substances 0.000 description 1
- 229910052575 non-oxide ceramic Inorganic materials 0.000 description 1
- 239000011225 non-oxide ceramic Substances 0.000 description 1
- SJWFXCIHNDVPSH-UHFFFAOYSA-N octan-2-ol Chemical group CCCCCCC(C)O SJWFXCIHNDVPSH-UHFFFAOYSA-N 0.000 description 1
- 229910052609 olivine Inorganic materials 0.000 description 1
- 239000010450 olivine Substances 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000008188 pellet Substances 0.000 description 1
- 230000035699 permeability Effects 0.000 description 1
- XNGIFLGASWRNHJ-UHFFFAOYSA-L phthalate(2-) Chemical compound [O-]C(=O)C1=CC=CC=C1C([O-])=O XNGIFLGASWRNHJ-UHFFFAOYSA-L 0.000 description 1
- 150000003021 phthalic acid derivatives Chemical class 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 229920006324 polyoxymethylene Polymers 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- 229920002451 polyvinyl alcohol Polymers 0.000 description 1
- 238000000197 pyrolysis Methods 0.000 description 1
- 238000006722 reduction reaction Methods 0.000 description 1
- 238000004904 shortening Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 229910052596 spinel Inorganic materials 0.000 description 1
- 239000011029 spinel Substances 0.000 description 1
- 150000005846 sugar alcohols Polymers 0.000 description 1
- 239000002344 surface layer Substances 0.000 description 1
- 230000008961 swelling Effects 0.000 description 1
- 239000000454 talc Substances 0.000 description 1
- 229910052623 talc Inorganic materials 0.000 description 1
- KKEYFWRCBNTPAC-UHFFFAOYSA-L terephthalate(2-) Chemical compound [O-]C(=O)C1=CC=C(C([O-])=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-L 0.000 description 1
- 150000003503 terephthalic acid derivatives Chemical class 0.000 description 1
- ZCUFMDLYAMJYST-UHFFFAOYSA-N thorium dioxide Chemical compound O=[Th]=O ZCUFMDLYAMJYST-UHFFFAOYSA-N 0.000 description 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
- 229940057402 undecyl alcohol Drugs 0.000 description 1
- 239000001993 wax Substances 0.000 description 1
- 229910052726 zirconium Inorganic materials 0.000 description 1
- 229910000859 α-Fe Inorganic materials 0.000 description 1
Landscapes
- Compositions Of Oxide Ceramics (AREA)
Description
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ãæ¹æ³ã«é¢ãããã®ã§ããã[Detailed Description of the Invention] (Technical Field) The present invention relates to a method for manufacturing ceramic products,
In particular, ceramic products with excellent characteristics,
The present invention relates to a method that allows production with good degreasing properties at low temperatures.
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ãããŠãçŒçµæäœãæœãããããã«ãªã€ãŠããã(Prior art and its problems) Conventionally, one method for manufacturing ceramic products of desired shapes such as various structural parts and functional parts is to injection mold a predetermined ceramic powder and then mold the resulting injection molded product. A method of degreasing and then sintering is used, but when injection molding such ceramic powder, for example, "Industrial Materials" Vol. 33, No. 14, pp. 22-32 (1985)
As disclosed in the following, the main ingredients are polystyrene, polyethylene, polypropylene, cellulose acetate, atactic polypropylene, polyvinyl alcohol, polyacetal, acrylic resins, waxes, etc., which are solid at room temperature, and as needed. Using a resin composition for injection molding obtained by blending a plasticizer that is liquid at room temperature such as diethyl phthalate, dibutyl phthalate, dioctyl phthalate, etc., this resin composition and ceramic powder are uniformly blended to obtain the desired product. This is used as a kneaded material for injection molding, and this is injection molded to form an injection molded product in the desired shape.The resulting injection molded product is heated at a degreasing temperature of about 450 to 550°C. After that, a sintering operation is performed at a sintering temperature depending on each ceramic powder.
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床ãäœäžãããåé¡ããã€ãã However, in such conventional methods, since the degreasing temperature is high as mentioned above, the temperature increase rate is about 1â to 10â/Hr, so it takes a long time to reach the maximum temperature. It takes too much time and has inherent problems that are economically disadvantageous, and it is also difficult to use non-oxide ceramics, such as SiC,
Ceramic powders such as Si 3 N 4 and AlN have the problem of being oxidized by oxygen in the atmosphere, reducing the high-temperature strength of their sintered bodies.
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äœåŒ·åºŠãäœäžãããçã®åé¡ãæ¹èµ·ããŠããã Furthermore, even if the injection molded body is degreased, compounding agents such as resins and plasticizers in the molded body cannot be completely removed, and as a result, about 2 to 5% of carbon due to these compounding agents is removed by degreasing. This residual carbon may cause swelling (cavities) in the sintered body due to the CO gas generated by the reduction reaction of (oxide + C) during the sintering of the degreased body. Furthermore, the positions where carbon exists form holes, causing problems such as lowering the strength of the sintered body.
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ããŠè¡ãªãããã«ããããšã«ããã(Means for Solving the Problems) The present invention has been made to solve the problems of the conventional method as described above, and its gist is to injection mold ceramic powder. Then, the injection molded product is degreased and then sintered to produce a desired ceramic product.
The present invention uses a kneaded product obtained by blending a resin composition consisting of a methacrylic resin, a phthalic acid ester, and a terephthalic acid ester with the ceramic powder.
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ãã¹ãã§ããã(Specific structure of the solution) By the way, the ceramic powder used in the present invention includes clays such as kaolin group, montmorillonite group, mica group, talc, pyrofluorite, diamonite, and daite group, silica, In addition to general ceramic base powder such as non-plastic raw materials such as waxite, iron,
Metal powders such as aluminum, silicon, zirconium and their oxides, glass frit, alumina, magnesia, zirconia, beryllium,
Special ceramic base powders such as thoria, spinel, cordierite, lithia, olivine, steatite, titanium oxide, barium titanate, celsian, ferrite, and engineering such as carbon silicon, silicon nitride, aluminum nitride, and sialon. Examples include ceramic powder. However, it should be understood that these examples do not limit the present invention in any way, and that any of the various conventionally known ceramic powders, especially powders for producing injection molded bodies, can be used. It is.
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枩床ã350âãããäžæããããã«ãªãã®ã§ããã Furthermore, the methacrylic resin constituting the resin composition used in the present invention and blended with the above-mentioned ceramic powder is an essential component in order to impart resin properties to the mixture with the ceramic powder. This combination allows the ceramic powder to be injection molded in the same way as general plastics. As this methacrylic resin, any known resin used in injection molding operations of ceramic powder can be used, but in particular, in the present invention, a polymer of methyl methacrylate, especially a polymer of methyl methacrylate, can be used. It is effective to use methyl methacrylate polymers having a degree of polymerization in the range of 10 to 150, particularly preferably 15 to 110. Incidentally, if the degree of polymerization of this methyl methacrylate polymer becomes too low, the shape of the injection molded product obtained will easily deform.
Furthermore, if the degree of polymerization is greater than 150, the degreasing temperature will rise above 350°C.
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ãã圹å²ãå¥ãããã®ã§ããã Furthermore, the phthalate ester that constitutes the resin composition together with the methacrylic resin has the role of lowering the viscosity of the prepared injection molding kneaded product, improving its fluidity, and reducing heat generated during degreasing. Terephthalic acid ester is sublimable and is added to create holes by sublimating at low temperatures during degreasing, and by creating the holes, This serves to improve the air permeability of subsequent liquid components, evaporated gas, or pyrolysis gas, and to prevent cracks in the molded product.
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奚ãããã These phthalic acid esters and terephthalic acid esters are obtained by esterifying phthalic acid and terephthalic acid with a specified monohydric alcohol using a conventional method, but in particular, esters with a freezing point of 10°C or higher are used. Recommended to use.
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ã¬ãã¿ã¬ãŒãçãããç¥ãããŠããã The monohydric alcohol used in the above esterification includes methyl alcohol, ethyl alcohol, n-propyl alcohol, isopropyl alcohol, n-butyl alcohol, isobutyl alcohol, sec-butyl alcohol, tertiary-butyl alcohol, and n-amyl alcohol. , isoamyl alcohol, secondary amyl alcohol, tertiary amyl alcohol, fusel oil, 3-methoxybutyl alcohol, n-hexyl alcohol, 2-methylpentanol-1, secondary hexyl alcohol, 2
-Ethylbutyl alcohol, secondary heptyl alcohol, heptanol-3, n-octyl alcohol, 2-ethylhexyl alcohol, secondary octyl alcohol, nonyl alcohol, 2,6-dimethyl-4-heptanol, n-decanol, secondary undecyl Alcohol, trimethylnonyl alcohol, secondary tetradecyl alcohol, phenol, cresol, cyclohexanol, methylcyclohexanol, 3,3,5-trimethylcyclohexanol, dibenzyl alcohol, diacetone alcohol, methyl cellosolve, ethyl cellosolve, isopropyl cellosolve, Butyl cellosolve, hexyl cellosolve, methyl carbitol, ethyl carbitol, butyl carbitol,
There are benzyl cellosolve, phenylmethyl carbitol, etc., and it goes without saying that other monohydric alcohols other than these can also be used in the same way. Also,
These phthalic esters and terephthalic esters used in the present invention may be those modified with polyhydric alcohols, and their specific compounds may be commercially available as solid plasticizers. Dicyclohexyl phthalate, which is used as a raw material for polyester resin, and dimethyl terephthalate, which is a raw material for polyester resin, are well known.
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ãããšãšãªãã®ã§ããã The methacrylic resin, phthalate ester, and terephthalate ester constituting the resin composition according to the present invention are added to a predetermined ceramic powder in accordance with a conventional method, either alone or after being mixed in advance. , added in the form of a solid powder or pellets, heated and mixed, or added and mixed as a solution in an organic solvent, or added in the form of an emulsion obtained by emulsifying in the presence of a suitable emulsifier. The mixture is uniformly blended and the desired kneaded material for injection molding is obtained.
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ãã In addition, in this compounding, the compounding ratio of the three components of methacrylic resin, phthalic acid ester, and terephthalic acid ester is determined as appropriate depending on the subsequent degreasing conditions and the shape of the intended injection molded product. When a resin composition containing a relatively large proportion of methacrylic resin is used, the shape of the injection molded product is difficult to deform, making it suitable for complex-shaped products; When using a resin composition with a small blending ratio of resin, such a resin composition may be
However, in general, methacrylic resin is about 20 to 75% by weight, phthalate is about 5 to 75% by weight, and terephthalate is about 3% by weight. It will be used in a resin composition composition in which the total amount is 100% by weight at a ratio of about 40% by weight.
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ãããããšãšãªãã In addition, the blending ratio of such resin composition to ceramic powder is generally about 17 to 33 parts by weight per 100 parts by weight of ceramic powder.
Preferably, a value within the range of about 19 to 22 parts by weight will be adopted.
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ããããããããšãšãªãã Furthermore, as in the past, a mold release agent is added as a third substance to a kneaded product obtained by blending a resin composition consisting of a methacrylic resin, a phthalate ester, and a terephthalate ester with ceramic powder. , a lubricant, an antioxidant, a coloring agent, etc., are added and blended as necessary within known usage ranges.
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ã®ã§ããã The thus obtained kneaded ceramic powder obtained by blending the resin composition of the methacrylic resin, phthalic acid ester, and terephthalic acid ester according to the present invention is then molded by conventional injection molding. The operation is performed to form an injection molded body corresponding to the desired product shape, and then such injection molded body is subjected to a degreasing operation, but the degreasing temperature at that time is ,
Therefore, a temperature of 350°C or lower is preferably used. Such low-temperature degreasing operations effectively shorten the degreasing time and eliminate the effects of oxidation.
Moreover, the defatted body obtained in this way is
Each ceramic powder is sintered in accordance with a conventional method under sintering conditions appropriate for the powder, and is thereby made into a specified ceramic product (sintered body) and used as the intended structural component, functional component, etc. It becomes.
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ã¯ãèšããŸã§ããªããšããã§ããã(Examples) Some examples of the present invention are shown below, but it should be understood that the present invention is not to be interpreted in any way limited by these illustrative examples. It goes without saying that the present invention includes many other embodiments in addition to these illustrative embodiments.
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ããã Note that all percentages and parts in the following examples are based on weight unless otherwise specified.
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ãããŠïŒæéçŒçµãè¡ãªã€ããExample 1 98% β-SiC (product name: Beta Random Ultra Fine, manufactured by IBIDEN Corporation), 1% of carbon black (Diablack I, manufactured by Mitsubishi Chemical Industries, Ltd.) as a sintering aid, and amorphous 1% boron powder (manufactured by HC SchÃŒttarch) was uniformly mixed in benzene and dried to obtain a powder containing 6 parts of polymethyl methacrylate, 1 part of dicyclohexyl phthalate, and 2.5 parts of dimethyl terephthalate. Add and blend the resin composition at a ratio of 17.4% (ceramic powder 82.6%),
The mixture was kneaded using a pressure kneader at a temperature of 140°C until the torque became stable. Next, the obtained kneaded product was heated to an injection temperature of 130°C, a diameter of 30 mm, and a length of 30 mm.
It was injection molded into a mm round bar. Thereafter, this injection molded body (round bar) was degreased by heating it in air at a temperature increase rate of 6 °C/Hr to 285 °C, and the obtained degreased body was further heated with Ar at a temperature of 2050 °C. Sintering was carried out in an atmosphere for 1 hour.
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ã®å¹³åå€ãšããŠ63KgïŒmm2ãåŸãããã The density of the sintered body thus obtained is 3.06 g/cm 3
It was hot. Also, regarding the 3 x 4 x 30 mm 3 test piece cut out from this sintered round bar sample,
The top, bottom, and side surfaces were polished to a final mirror finish using 1/4 ÎŒm diamond abrasive grains, and a three-point bending test (span: 20 mm) was performed. As a result, the average value of 5 samples was 63 kg/mm 2 . Obtained.
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äœçã®ææå·®ãèªããããªãã€ãã In addition, when the above injection molded round bar was degreased in nitrogen gas and similar tests were conducted, the performance of both density and strength was compared to the above degreasing in air. No significant difference was observed between the two.
宿œäŸ ïŒ
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ãªãã€ããExample 2 Si 3 N 4 (manufactured by Denki Kagaku Kogyo Co., Ltd.: product name SN-
9S) 96%, Al 2 O 3 (manufactured by Iwatani Chemical Co., Ltd.: trade name B type) 2% and Y 2 O 3 (manufactured by Mitsubishi Chemical Corporation: ceramic grade) 2% were uniformly mixed in ethanol with a ball mill. 16.2% of a resin composition consisting of 6 parts of polymethyl methacrylate, 3 parts of dicyclohexyl phthalate and 1.5 parts of dimethyl terephthalate was added to the mixed and dried powder.
(ceramic powder: 83.8%) and kneaded at a temperature of 130°C using a pressure kneader. Then, using this obtained kneaded material, injection molding was performed at an injection temperature of 120°C, and the maximum outer diameter was:
An injection molded body having the shape of a turbocharger impeller having a portion of 68 mm and a maximum wall thickness of 35 mm was manufactured. Incidentally, in the obtained injection molded article, no shape abnormality was observed in normal dimensional measurements.
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ãã Next, the thus obtained impeller-shaped injection molded product was heated in air to 90°C at a rate of 20°C/Hr, then at a temperature increase rate of 4°C/Hr to 280°C, and then heated for 10 minutes. The product was fired by heating at 1760° C. for 2 hours in a nitrogen atmosphere at atmospheric pressure to produce 55 desired sintered bodies (turbine wheels). No surface or internal defects were detected in any of the obtained sintered bodies. In addition, after assembling a metal shaft to each sintered body, a spin test was conducted, and the results showed that the product had durability at an average speed of 184,000 rpm at a temperature of 900°C. Further, when a test piece of 3Ã4Ã30 mm 3 cut out from the sintered body was subjected to a three-point bending test (span: 20 mm), it showed a bending strength of 72 Kg/mm 2 at a temperature of 900°C.
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ã«äºè£ãèªããããã On the other hand, a similar impeller-shaped model was manufactured by using a commercially available acrylic injection molding resin in place of the above resin composition and injection molding the above ceramic powder at an injection temperature of 170°C. For injection molded products, the degreasing operation is carried out at 4°C/Hr.
At the heating rate of , the degreasing temperature required 580°C, and the degreasing took a long time. Moreover, cracks were observed on the surface of the degreased body.
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38KgïŒmm2ãšäœããã®ã§ãã€ãã Among these degreased bodies, an impeller-shaped degreased body with relatively small cracks was sintered in the same manner as above, and as a result, Si 3 N 4 was converted to SiO 2 by oxidation.
The amount of linear shrinkage was about 0.3%, which was larger than in the above case, probably because of the generation of . In addition, when a test piece of 3 x 4 x 30 mm 3 cut out from the obtained sintered body was subjected to a similar three-point bending test, it was found that the bending temperature was 900â.
It was low at 38Kg/ mm2 .
宿œäŸ ïŒ
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ã§ãã€ããExample 3 1 part polymethyl methacrylate, 3 parts dicyclohexyl phthalate, and dimethyl terephthalate
Al 2 O 3 was prepared in the same manner as in Example 1 using resin composition A consisting of 0.2 parts of polymethyl methacrylate, or resin composition B consisting of 9 parts of polymethyl methacrylate, 1 part of dicyclohexyl phthalate, and 2.5 parts of dimethyl terephthalate . Injection molding was performed to obtain a round bar-shaped injection molded article. The amount of added resin is 16.8%.
It was hot.
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ããããªã€ãã Next, when the injection molded articles obtained using the respective resin compositions A and B were degreased in the air, the injection molded articles obtained using the resin composition A showed a degreasing treatment of 6°C/Hr. Degreasing can be carried out at a temperature of 250°C at a heating rate of 250°C, and at a temperature of 265°C at a heating rate of 8°C/Hr. Degreasing could be carried out at a temperature of 325°C at a heating rate of /Hr, and at a temperature of 338°C at a heating rate of 8°C/Hr.
In addition, as a result of surface observation using a stereomicroscope, no defects were observed in any of the molded bodies (degreased bodies) after such degreasing, and furthermore, non-destructive inspection using transmitted X-rays revealed no internal defects. No defects were detected.
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ãšããç¹åŸŽãçºæ®ãããã®ã§ããã(Effects of the Invention) As is clear from the above description, according to the present invention, a resin composition consisting of a methacrylic resin, a phthalic acid ester, and a terephthalic acid ester can be blended into a predetermined ceramic powder. By performing injection molding using the kneaded material and degreasing the injection molded product, it becomes possible to carry out the degreasing operation at a low temperature, particularly at a temperature of 350°C or less, This makes it possible to avoid the effects of oxidation on the injection molded product being degreased as much as possible, making it possible to degrease in air and significantly shortening the degreasing time. In addition, the resin etc. are easily removed from the injection molded product, so the residual carbon content is extremely low, and the degreased molded product has the following characteristics: there is almost no risk of defects such as cracks, surface layer peeling, and blistering. It is.
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ã享åãåŸãã®ã§ããã Furthermore, according to the present invention, by changing the ratio of the three components constituting the resin composition blended into the ceramic powder, it is possible to injection mold molded products from simple shapes to complex shapes. You can enjoy the following advantages.
Claims (1)
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城ãšããã»ã©ããã¯ã¹è£œåã®è£œé æ¹æ³ã ïŒ åèšå°åºæåœ¢äœã®è±èãã350â以äžã®æž©åºŠ
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ã®ç¯å²ç¬¬ïŒé èšèŒã®è£œé æ¹æ³ã ïŒ åèšã¡ã¿ã¢ã¯ãªã«ç³»æš¹èãéå床ïŒ10ã150
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å²ç¬¬ïŒé åã¯ç¬¬ïŒé èšèŒã®è£œé æ¹æ³ã[Scope of Claims] 1. When manufacturing a desired ceramic product by injection molding ceramic powder, degreasing the obtained injection molded product, and then sintering it, the injection molding is performed using a methacrylic resin. A method for manufacturing a ceramic product, characterized in that the method is carried out using a kneaded product obtained by blending a resin composition comprising a resin, a phthalate ester, and a terephthalate ester with the ceramic powder. 2. The manufacturing method according to claim 1, wherein the injection molded article is degreased at a temperature of 350° C. or lower. 3 The degree of polymerization of the methacrylic resin: 10 to 150
The method according to claim 1 or 2, wherein the phthalate ester is dicyclohexyl phthalate, and the terephthalate ester is dimethyl terephthalate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61103523A JPS62260764A (en) | 1986-05-06 | 1986-05-06 | Manufacture of ceramic product |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61103523A JPS62260764A (en) | 1986-05-06 | 1986-05-06 | Manufacture of ceramic product |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS62260764A JPS62260764A (en) | 1987-11-13 |
| JPH0550465B2 true JPH0550465B2 (en) | 1993-07-29 |
Family
ID=14356282
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP61103523A Granted JPS62260764A (en) | 1986-05-06 | 1986-05-06 | Manufacture of ceramic product |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62260764A (en) |
-
1986
- 1986-05-06 JP JP61103523A patent/JPS62260764A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS62260764A (en) | 1987-11-13 |
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