JPH05508055A - Method of manufacturing electrical equipment - Google Patents
Method of manufacturing electrical equipmentInfo
- Publication number
- JPH05508055A JPH05508055A JP91510583A JP51058391A JPH05508055A JP H05508055 A JPH05508055 A JP H05508055A JP 91510583 A JP91510583 A JP 91510583A JP 51058391 A JP51058391 A JP 51058391A JP H05508055 A JPH05508055 A JP H05508055A
- Authority
- JP
- Japan
- Prior art keywords
- mixture
- electrically conductive
- materials
- conductive powder
- electrode
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 9
- 239000000463 material Substances 0.000 claims description 88
- 239000000203 mixture Substances 0.000 claims description 73
- 239000002245 particle Substances 0.000 claims description 35
- 239000000843 powder Substances 0.000 claims description 31
- 238000000034 method Methods 0.000 claims description 30
- 229920000642 polymer Polymers 0.000 claims description 24
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 17
- 239000007769 metal material Substances 0.000 claims description 14
- -1 polyethylene Polymers 0.000 claims description 13
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 11
- 239000002861 polymer material Substances 0.000 claims description 10
- 229910052799 carbon Inorganic materials 0.000 claims description 9
- 239000006229 carbon black Substances 0.000 claims description 9
- 238000010438 heat treatment Methods 0.000 claims description 8
- 239000004698 Polyethylene Substances 0.000 claims description 7
- 229920000573 polyethylene Polymers 0.000 claims description 7
- 229920001169 thermoplastic Polymers 0.000 claims description 6
- 239000004416 thermosoftening plastic Substances 0.000 claims description 6
- 229920001940 conductive polymer Polymers 0.000 claims description 5
- 229910052759 nickel Inorganic materials 0.000 claims description 5
- 230000035515 penetration Effects 0.000 claims description 5
- 239000002344 surface layer Substances 0.000 claims description 5
- 238000004132 cross linking Methods 0.000 claims description 4
- 239000000155 melt Substances 0.000 claims description 4
- 239000012255 powdered metal Substances 0.000 claims description 3
- 238000005245 sintering Methods 0.000 claims description 3
- 239000007787 solid Substances 0.000 claims description 3
- 238000011282 treatment Methods 0.000 claims description 3
- 229920000098 polyolefin Polymers 0.000 claims description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims 1
- 239000010931 gold Substances 0.000 claims 1
- 229910052737 gold Inorganic materials 0.000 claims 1
- 238000006116 polymerization reaction Methods 0.000 claims 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 12
- 229910052802 copper Inorganic materials 0.000 description 12
- 239000010949 copper Substances 0.000 description 12
- 239000010410 layer Substances 0.000 description 11
- 239000004020 conductor Substances 0.000 description 8
- 238000003825 pressing Methods 0.000 description 7
- 229910052751 metal Inorganic materials 0.000 description 5
- 239000002184 metal Substances 0.000 description 5
- 239000011148 porous material Substances 0.000 description 5
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 4
- 239000011248 coating agent Substances 0.000 description 4
- 238000000576 coating method Methods 0.000 description 4
- 239000003575 carbonaceous material Substances 0.000 description 3
- 238000013329 compounding Methods 0.000 description 3
- 238000005498 polishing Methods 0.000 description 3
- 239000004743 Polypropylene Substances 0.000 description 2
- 239000007772 electrode material Substances 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- 150000004767 nitrides Chemical class 0.000 description 2
- 229920001083 polybutene Polymers 0.000 description 2
- 229920001155 polypropylene Polymers 0.000 description 2
- 239000004071 soot Substances 0.000 description 2
- WCVOGSZTONGSQY-UHFFFAOYSA-N 2,4,6-trichloroanisole Chemical compound COC1=C(Cl)C=C(Cl)C=C1Cl WCVOGSZTONGSQY-UHFFFAOYSA-N 0.000 description 1
- QYEXBYZXHDUPRC-UHFFFAOYSA-N B#[Ti]#B Chemical compound B#[Ti]#B QYEXBYZXHDUPRC-UHFFFAOYSA-N 0.000 description 1
- 229910001369 Brass Inorganic materials 0.000 description 1
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 1
- 229930040373 Paraformaldehyde Natural products 0.000 description 1
- 239000004952 Polyamide Substances 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 229910033181 TiB2 Inorganic materials 0.000 description 1
- 229910007948 ZrB2 Inorganic materials 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- VWZIXVXBCBBRGP-UHFFFAOYSA-N boron;zirconium Chemical compound B#[Zr]#B VWZIXVXBCBBRGP-UHFFFAOYSA-N 0.000 description 1
- 239000010951 brass Substances 0.000 description 1
- 239000003610 charcoal Substances 0.000 description 1
- 239000010941 cobalt Substances 0.000 description 1
- 229910017052 cobalt Inorganic materials 0.000 description 1
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 229920001577 copolymer Polymers 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 239000012467 final product Substances 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 238000007731 hot pressing Methods 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- 150000001247 metal acetylides Chemical class 0.000 description 1
- 229910001092 metal group alloy Inorganic materials 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 229910052750 molybdenum Inorganic materials 0.000 description 1
- 239000011733 molybdenum Substances 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 229920000139 polyethylene terephthalate Polymers 0.000 description 1
- 239000005020 polyethylene terephthalate Substances 0.000 description 1
- 229920006324 polyoxymethylene Polymers 0.000 description 1
- QQONPFPTGQHPMA-UHFFFAOYSA-N propylene Natural products CC=C QQONPFPTGQHPMA-UHFFFAOYSA-N 0.000 description 1
- 125000004805 propylene group Chemical group [H]C([H])([H])C([H])([*:1])C([H])([H])[*:2] 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 230000001012 protector Effects 0.000 description 1
- 239000004576 sand Substances 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- KKEYFWRCBNTPAC-UHFFFAOYSA-L terephthalate(2-) Chemical compound [O-]C(=O)C1=CC=C(C([O-])=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-L 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
- H01C7/02—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material having positive temperature coefficient
- H01C7/027—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material having positive temperature coefficient consisting of conducting or semi-conducting material dispersed in a non-conductive organic material
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
- H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
- H01B1/24—Conductive material dispersed in non-conductive organic material the conductive material comprising carbon-silicon compounds, carbon or silicon
Landscapes
- Dispersion Chemistry (AREA)
- Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Ceramic Engineering (AREA)
- Electromagnetism (AREA)
- Thermistors And Varistors (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Dc-Dc Converters (AREA)
- Fuses (AREA)
- Electrical Discharge Machining, Electrochemical Machining, And Combined Machining (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Noodles (AREA)
- Battery Electrode And Active Subsutance (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるため要約のデータは記録されません。 (57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】 電気 置の製造方法 本発明は、電気装置、特に過電流保護装置で、二つの平行な表面が与えられたせ いぜい100iΩcmの抵抗率を有する電気伝導性重合体組成物の本体、及び前 記平行な表面と接触して配置された二つの電極を有し、然も、前記重合体組成物 が重合体材料と該重合体材料中に分布された電気伝導性粉末材料がちなる電気装 置を製造する方法に関する。[Detailed description of the invention] Electric equipment manufacturing method The present invention is an electrical device, especially an overcurrent protection device, in which two parallel surfaces are provided. a body of an electrically conductive polymer composition having a resistivity of no more than 100 iΩcm; two electrodes placed in contact with said parallel surfaces, and said polymer composition electrical equipment consisting of a polymeric material and an electrically conductive powder material distributed within the polymeric material. The present invention relates to a method of manufacturing a device.
過電流保護装置の形をしたそのような電気装置の一つの型はPTC素子(正の温 度係数〉、即ち、抵抗率の温度係数が正である素子である。上記種類のPTC素 子の抵抗は低く、例えば、80℃まで広がることがある素子の通常の作動範囲で 数百分の一層であり、温度と共に僅かに増大する。もし素子の温度がこの値を越 えると、例えば、過電流のために越えると、抵抗は一層急速に増大し、成る臨界 温度を越えると、素子は低抵抗がらlOkΩ以上の抵抗値になることがある高抵 抗状態へ急に変化する。One type of such electrical device in the form of an overcurrent protector is a PTC element (positive temperature temperature coefficient>, that is, the temperature coefficient of resistivity is positive. The above types of PTC elements The resistance of the device is low, e.g. over the normal operating range of the device which can extend up to 80°C. It is several hundred times smaller and increases slightly with temperature. If the element temperature exceeds this value, For example, when exceeded due to overcurrent, the resistance increases even more rapidly, reaching a critical When the temperature is exceeded, the element has a low resistance but a high resistance that can reach a resistance value of 10kΩ or more. Suddenly changes to anti-state.
上記種類の電気装置のための電気伝導性重合体の本体を従来用いられていた方法 で製造する場合、その使用重合体がもし熱可塑性状態、例えば、ポリエチレンで あるならば、それを溶融し、通常式る形の炭素又は金属材料又は炭素と金属材料 との混合物からなる伝導性粉末材料と混合(配合)する、この方法は多くの制約 を受けている1例えば、伝導性材料を導入するためには、重合体材料が比較的低 い粘度を持たなければならず、そのような場合でも、希望の充分高い含有量の炭 素を混合することは不可能なことがある。配合操作中強力な処理を行うことも、 伝導性材料が漬れたり、或は別な影響を受けて望ましくない変化を生ずるような 危険を伴う。配合後、生成した混合物を押出し、圧搾成形、又は成る他のやり方 で成形することに関連した処理にかけると、その形成された生成物中の材料に7 丈しくない異方性が生ずる危険を伴っている。上記方法は製造した最終物品に再 現性のある性質を得るのに問題を与えることがある。Methods traditionally used to prepare bodies of electrically conductive polymers for electrical devices of the above type If the polymer used is in a thermoplastic state, e.g. If there is, it is melted to produce carbon or metal materials or carbon and metal materials in the usual form. This method has many limitations when mixing (compounding) conductive powder materials consisting of a mixture of For example, in order to introduce conductive materials, polymeric materials are required to have relatively low It must have a high viscosity, and even in such cases, the desired sufficiently high content of charcoal It may not be possible to mix elements. It is also possible to perform strong processing during the compounding operation. Conductive materials may be immersed or otherwise affected, resulting in undesirable changes. It's dangerous. After compounding, the resulting mixture may be extruded, compressed, or otherwise formed. When subjected to processing associated with forming with There is a risk that undesirable anisotropy will occur. The above method is used to recycle the final product manufactured. This can cause problems in obtaining certain properties.
重合体組成物の本体を形成した後、その本体に適用法に従い電極を与える。電極 は通常金属箔がらなり、加熱しながら本体にプレスすることにより適用される。After forming the body of the polymeric composition, the body is provided with electrodes according to the method of application. electrode is usually made of metal foil and is applied by pressing it onto the body while heating.
本発明によれば、従来技術に伴われる上記制約が除かれ、電気装置の製造のかな りの簡単化が得られる。According to the present invention, the above-mentioned limitations associated with the prior art are removed, and the manufacturing of electrical devices is improved. This simplifies the process.
即ち、本発明は、従来可能であったものよりもがなり高い粘度を有する重合体材 料を使用することができるようにしている。それにより、伝導性材料の種類及び 含有量に関し、かなり一層自由に選択することができるようになる。伝導性材料 は望ましくない結果をもたらす処理にはかけない、異方性の危険を伴う成形は行 われない。That is, the present invention provides for the production of polymeric materials having a much higher viscosity than previously possible. You can use the fee. Thereby, the type of conductive material and There is much more freedom in choosing the content. conductive material should not be subjected to treatments that would lead to undesirable results, and should not be formed with the risk of anisotropy. It won't happen.
電極は別な操作工程を行うことなく適用することができる。特に重要な利点は、 その方法は電極と重合体組成物い装置を得ることができることである。The electrodes can be applied without further operating steps. Particularly important advantages are: The method is that it is possible to obtain a device with electrodes and polymer compositions.
本発明によれば、重合体材料で、100μ肩より小さく、その材料の少なくとも 50%が40μ1未満である粒径を有する粉末状の熱可塑性状態の重合体材料と 、+00μ1未満の粒径の電気伝導性粉末材料とを固体乾燥状態で混合して混合 物にし、その混合物中の重合体材料が、それら材料の全体積の少なくとも30% を占め、電気伝導性粉末材料が少なくとも20%を占めており、その混合物を電 極と一緒にプレス及び前記重合体材料が少なくとも粒子表面で溶融する温度への 加熱にかけ、同時に混合物の永久的凝集本体を形成すると共に電極をその凝集本 体に固定することによって好ましい結果が得られる。その時重合体材料の粒子は 完全にそれらの独自性を失う。According to the invention, the polymeric material is smaller than 100μ shoulder and at least a polymeric material in a powdered thermoplastic state having a particle size of which 50% is less than 40 μl; , and an electrically conductive powder material with a particle size of less than +00μ1 in a solid dry state. and the polymeric materials in the mixture account for at least 30% of the total volume of those materials. and the electrically conductive powder material accounts for at least 20%, and the mixture is electrically conductive. Press together with a pole and heat to a temperature at which the polymeric material melts at least on the particle surface. heating and simultaneously forming a permanently agglomerated body of the mixture and moving the electrode into the agglomerated body. Favorable results are obtained by fixation on the body. Then the particles of polymeric material are Completely lose their uniqueness.
製造された装置に特に良好な再現性を与える本発明の好ましい態様に従えば、重 合体材料と電気伝導性粉末材料との混合物を、室温又は重合体材料が溶融する温 度よりもかなり低い他の温度でプレス操作にかけ、同時に前形成本体を形成し、 然る後、その前形成本体の形の混合物を電極と一緒に、永久的凝集本体を形成し 且つ!極を固定するためのプレス及び加熱にかける。According to a preferred embodiment of the invention, which gives particularly good reproducibility to the manufactured devices, The mixture of the combined material and the electrically conductive powder material is heated at room temperature or at a temperature at which the polymeric material melts. subjected to a pressing operation at another temperature significantly lower than Thereafter, the mixture in the form of the preformed body is combined with the electrode to form a permanently cohesive body. and! Press and heat to fix the poles.
を極として、粉末金属材料から予め製造した板で、混合物に面した側が多孔質構 造を持ち、そして混合物とは反対の側へ重合体材料が透過するのを防ぐように重 合体材料に対して不透過性になっている板を用いるのが好ましい、この種類の電 極を用いた場合、重合体材料がそれら電極の外側に絶縁性又あったとしても僅か にしか伝導性でない被覆を与えることなく、伝導性重合体組成物に電極が効果的 に固定される1重合体材料はそれが熱可塑性状態になっている時に電極の気孔中 に、その電極を透過することなく入って行く、最初から完全に多孔質の板は、外 側に金属被覆を、例えば電解的に与えることにより重合体材料の透過に対して不 透過性にしてもよい、多孔質電極の表面層を、例えばレーザー技術を用いて溶融 及び固化し、電極の他の部分はそれらの多孔質状態に変化を与えない状態にした まま、外側を気密にすることもできる。混合物に面した側の方を多孔質表面構造 に維持し、重合体材料の透過に対して板を気密にする別の方法は、板の焼結を通 常還元性雰囲気中で、使用金属電極材料の溶融温度よりはがなり低いそれに必要 な温度で行い、焼結後、板の外側を研磨又は他の機械的処理にかけることである 。しかし、上述のものとは異なった型の電極を用いることもできる0例えば、粉 末状態の電極材料を伝導性重合体組成物の表面に層の形で適用し、然る後、それ を永久的に凝集した本体に形成し且つ電極を固定するためのプレス及び加熱にか けてもよい。そのような場合にも、電極が重合体材料の透過に対し気密になるよ うな対策、例えば、それらに混合物とは反対の側に金属材料の気密な被覆を与え ることによりそのような対策を取るのが好ましい。A plate prefabricated from powdered metal material with a porous structure on the side facing the mixture as the pole. with a structure and a weight to prevent penetration of the polymeric material to the side opposite the mixture. It is preferable to use plates that are impermeable to the coalescing material. When electrodes are used, the polymeric material on the outside of those electrodes has little, if any, insulating properties. Electrodes can be effectively applied to conductive polymer compositions without providing a coating that is only conductive. The polymer material is fixed in the pores of the electrode when it is in its thermoplastic state. The plate, which is completely porous to begin with, passes through its electrodes without passing through the outside. By applying a metal coating on the side, for example electrolytically, it is impervious to the penetration of the polymeric material. The surface layer of the porous electrode, which may be made transparent, is melted using e.g. laser technology. and solidified, leaving the other parts of the electrode unchanged in their porous state. You can also make the outside airtight. Porous surface structure on the side facing the mixture Another method of making the plate airtight and against permeation of polymeric materials is through sintering the plate. In a normally reducing atmosphere, peeling must be lower than the melting temperature of the metal electrode material used. after sintering, the outside of the plate is subjected to polishing or other mechanical treatment. . However, different types of electrodes than those mentioned above may also be used, e.g. The terminal electrode material is applied in a layer to the surface of the conductive polymer composition, after which it is Pressing and heating to form a permanently cohesive body and fix the electrodes. You can leave it. In such cases, the electrodes should also be made hermetic to the penetration of the polymeric material. such measures as, for example, giving them an airtight covering of metallic material on the side opposite the mixture. It is preferable to take such measures by
電極の金属材料はニッケル又は銅からなるのが有利であるが、充分な電気伝導度 を有する純粋金属又は金属合金の形の他の金属材料を用いてもよい、金属材料の 適当な粒径は0.5μl〜20μlであり、電極の適当な厚さはlO0〜100 0μlである。もし電極に金属被覆を、例えば電解的に与えるならば、被覆は銅 からなるのが有利である。Advantageously, the metal material of the electrodes consists of nickel or copper, but with sufficient electrical conductivity. Other metal materials in the form of pure metals or metal alloys having a The suitable particle size is 0.5 μl to 20 μl, and the suitable thickness of the electrode is 100 to 100 μl. It is 0 μl. If the electrode is provided with a metal coating, e.g. electrolytically, the coating is copper. It is advantageous to consist of
銅は電極が別のものを基礎にしている時のその材料とは無関係に、問題の電極内 に横方向にも充分分散した電気伝導度を与える。他の点では多孔質な電極の気密 な表面層は、全電極の厚さの3〜30%の量の厚さを有するのが有利である。Copper is present in the electrode in question, regardless of its material when the electrode is based on another. This provides electrical conductivity that is sufficiently distributed in the lateral direction as well. Hermetic sealing of otherwise porous electrodes Advantageously, the surface layer has a thickness in the amount of 3 to 30% of the total electrode thickness.
本発明の有利な態様によれば、装置の製造に重合体材料として架橋可能な線状重 合体を用いる0重合体材料の架橋能力を利用する場合、重合体材料と伝導性材料 との混合物を電極と一緒に、永久的に凝集した本体を形成し且つ電極を固定する ためのプレス及び加熱にかけた後、架橋を行う0重合体材料の架橋を行うことに より製造された装置の一層大きな機械的及び熱的安定性を達成することができる 。According to an advantageous embodiment of the invention, crosslinkable linear polymers are used as the polymeric material for the production of the device. When using the crosslinking ability of polymeric materials, polymeric materials and conductive materials together with the electrode to form a permanently cohesive body and fix the electrode. After being subjected to pressing and heating for crosslinking, the polymer material is crosslinked. Greater mechanical and thermal stability of the manufactured device can be achieved .
重合体材料は好ましくは、ポリエチレン、ポリプロピレン、ポリブテン、又はエ チレンとプロピレンとの共重合体の如きポリオレフィンからなる。特に好ましい のはHDポリエチレンである。しかし、充分微細な粒径にし、乾燥状態で導電性 材料と混合し、その混合物を永久的に凝集した重合体組成物の本体に形成し且つ 電極を固定するためのプレス及び加熱にかけた時に熱可塑性状態に転移すること ができる他の線状重合体を用いることができる。そのような他の線状重合体の例 は、ポリアミド、ポリエチレンテレフタレート、ポリブテンテレフタレート、及 びポリオキシメチレンである。The polymeric material is preferably polyethylene, polypropylene, polybutene, or It consists of a polyolefin such as a copolymer of tyrene and propylene. particularly preferred is HD polyethylene. However, by making the particle size sufficiently fine, it becomes conductive in a dry state. and forming the mixture into a body of a permanently aggregated polymeric composition; Transforms into a thermoplastic state when pressed and heated to fix the electrode. Other linear polymers that can be used can be used. Examples of such other linear polymers is polyamide, polyethylene terephthalate, polybutene terephthalate, and and polyoxymethylene.
重合体材料は少なくとも5%の結晶化度を有する。The polymeric material has a crystallinity of at least 5%.
重合体材料の粒径は、5〜100μlで、その中で材料の少なくとも50%が4 0μlより小さな粒径を有するのが好ましい。The particle size of the polymeric material is between 5 and 100 μl, in which at least 50% of the material Preferably it has a particle size of less than 0 μl.
重合体組成物中の適当な電気伝導性材料の例として、カーボンブラックの如き伝 導性炭素粉末の形の炭素;例えば、ニッケル、タングステン、モリブデン、コバ ルト、銅、銀、アルミニウム及び真鍮の如き金属材料:例えば、Z r B 2 及びTiB2の如き硼化物:例えば、ZrN及びTiNの如き窒化物;例えば、 ■20.及びTiOの如き酸化物;例えば、TaC,WC及びZrCの如き炭化 物;同様に例示した材料の二種類以上の混合物、例えば煤とニッケルとの混合物 を挙げることができる。カーボンブラックの如き伝導性炭素粉末の粒径は通常0 .O1〜0.1Oμlであり、金属材料の粒径は好ましくは0.5〜100μl であり、硼化物、窒化物、酸化物、及び炭化物の粒径は好ましくは0.01〜1 00μlである。電気伝導性粉末材料の少なくとも一部分は、電極の気孔の断面 より小さな粒径を有し、その結果粉末材料の一部分は重合体材料が電極の気孔中 に入る時、その重合体材料に伴われて行くことができるのが好ましい。Examples of suitable electrically conductive materials in polymeric compositions include electrically conductive materials such as carbon black. Carbon in the form of conductive carbon powder; e.g. nickel, tungsten, molybdenum, cobalt Metal materials such as copper, silver, aluminum and brass: e.g. Z B 2 and borides such as TiB2; nitrides such as ZrN and TiN; ■20. and oxides such as TiO; carbides such as TaC, WC and ZrC. mixture of two or more similarly exemplified materials, such as a mixture of soot and nickel can be mentioned. The particle size of conductive carbon powder such as carbon black is usually 0. .. The particle size of the metal material is preferably 0.5 to 100 μl. and the particle size of boride, nitride, oxide, and carbide is preferably 0.01 to 1 00 μl. At least a portion of the electrically conductive powder material is in a cross section of the pores of the electrode. It has a smaller particle size, so that a portion of the powder material is absorbed by the polymer material into the pores of the electrode. Preferably, it can be carried along with the polymeric material as it enters the cell.
重合体材料は、混合物から構成された重合体組成物中のこれら材料の全体積の3 0〜80%占め、電気伝導性粉末材料は20〜70%を占めるのが適切である。The polymeric materials account for 3% of the total volume of these materials in the polymeric composition made up of the mixture. Suitably, the electrically conductive powder material accounts for 0 to 80%, and the electrically conductive powder material accounts for 20 to 70%.
もし電気伝導性材料が炭素と金属材料との混合物からなるならば、重合体材料の 含有量が、優れたPTC効果を有する装置中のそれら材料の全体積の65〜80 %で、電気伝導性粉末材料の含有量が20〜35%であるのが好ましい、を気任 導性粉末材料の中で、炭素は5〜75体積%、金属材料は25〜95体積%を占 めるのが好ましい。If the electrically conductive material consists of a mixture of carbon and metallic materials, the The content is 65-80% of the total volume of those materials in the device with excellent PTC effect. %, preferably the content of electrically conductive powder material is 20-35%. In the conductive powder material, carbon accounts for 5 to 75% by volume, and metal material accounts for 25 to 95% by volume. It is preferable to
本発明を多くの実施例を記述することにより詳細に説明する。The invention will be explained in detail by describing a number of embodiments.
実施例1 メルト インデックス(M I +90/ 2 )40g/10分、密度0.9 60g/cz”、粒径5〜90μlで、そのうち材料の50%より多くのものが 24〜36μlの粒径であるHDポリエチレン〔スイス、ブレのブラスト・レー バー(PLAST−LABOR)S、A、からのN B 60111) 75体 積部を、7μl未溝の粒径を有するニッケル粉末13体積部、0.040〜0. 048μlの粒径を有するN550型(A S T Pvl )のカーボンブラ ック12体積部と混合し、重合体組成物の形の混合物にした。その混合物を円筒 状空洞及び一つ又は二つの可動性円筒状型を有する成形工具中で室温及び70M Paの圧力でプレスし、直径251m及び高さ1.5zzの予め成形した円板に した。Example 1 Melt index (MI +90/2) 40g/10min, density 0.9 60g/cz”, particle size 5-90μl, of which more than 50% of the material HD polyethylene with a particle size of 24-36 μl [Blast Ray, Bre, Switzerland] Bar (PLAST-LABOR) S, A, N B from 60111) 75 bodies The bulk part was mixed with 13 parts by volume of nickel powder having a particle size of 7 μl without grooves, 0.040-0. Carbon bra of type N550 (AST Pvl) with a particle size of 048 μl The mixture was mixed with 12 parts by volume of a polymer composition. Pour the mixture into a cylinder room temperature and 70 M in a forming tool with a shaped cavity and one or two movable cylindrical molds. Pressed at a pressure of Pa into a preformed disc with a diameter of 251 m and a height of 1.5 zz. did.
同じ成形工具で、4〜7μlの粒径のニッケル粉末をプレスすることにより、厚 さ0.6xrxの板の形の二つの電極を作った。プレスは室温及び70MPaの 圧力で行われた。板は貫通気孔を有する多孔質である。各板には一方の側に20 μ肩厚の銅層が電解的に与えられ、その銅層は一つにはその層が気密であること により貫通孔を存在させないようにし、二つには放射状に分布した高伝導性表面 層を与えていた。By pressing nickel powder with a particle size of 4 to 7 μl using the same forming tool, the thickness Two electrodes in the form of plates with a diameter of 0.6xrx were made. The press was operated at room temperature and at 70 MPa. Made under pressure. The plate is porous with through-holes. Each board has 20 on one side A copper layer of μ shoulder thickness is applied electrolytically, and the copper layer must be airtight in part. to avoid the presence of through-holes, and two have a radially distributed highly conductive surface. It gave it layers.
各平らな鍔上にニッケルti板の一つを有する重合体組成物の板を、再び成形工 具中に銅層を外側に向けて再び入れ、そこでそれら3枚の板を積み重ねたものを 先ず室温及び70MPaの圧力でプレスし、次に圧力を変えずに150℃でプレ スする。それによって重合体組成物は永久的に凝集した本体を形成し、それに電 極が、重合体組成物が電極の気孔中に入るか、少なくとも重合体材料と電極の気 孔より小さな粒径を有する電気伝導性粉末材料で機械的に固定される1重合体組 成物は50zΩcm未満の抵抗率を有する。製造された装置はPTC素子として 用いるのに適し、優れていた。The plates of the polymer composition with one nickel-ti plate on each flat collar are again molded. Place the copper layer back into the filling with the copper layer facing outward, and then place the three plates stacked together. First press at room temperature and a pressure of 70 MPa, then press at 150 °C without changing the pressure. To do so. The polymer composition thereby forms a permanently cohesive body to which an electrical The electrode is arranged such that the polymer composition enters the pores of the electrode, or at least the polymeric material and the electrode A set of polymers mechanically fixed with an electrically conductive powder material having a particle size smaller than the pores. The composition has a resistivity of less than 50 zΩcm. The manufactured device is used as a PTC element. It was excellent and suitable for use.
実施例2 装置を実施例1に記載したやり方で製造した。但し電極の外側上の銅層は、重合 体組成物の板とニッケル電極の板との積層体を室温でプレスして凝集本体にする まで適用しなかった点が異なる。電極の外側に銅層を適用した後、凝集本体を7 0MPaの圧力及び150℃の温度でプレスにかけた。Example 2 The device was manufactured in the manner described in Example 1. However, the copper layer on the outside of the electrode is polymerized. The laminate of the body composition plate and the nickel electrode plate is pressed at room temperature into a cohesive body. The difference is that it was not applied until then. After applying the copper layer on the outside of the electrode, the agglomerated body is 7 It was pressed at a pressure of 0 MPa and a temperature of 150°C.
実施例3 装置を実施例に記載したやり方で製造した。但し外側に気密な銅層を与える代わ りに、室温でプレスした電極板を約400℃で水素ガス雰囲気中で4時間焼結に かけ、次に重合体組成物とは反対の側を320メツシユの湿った研磨紙を用いて 研磨した点が異なっていた。研磨により表面層の変形が行われ、その結果気密に なった。これにより、重合体組成物に面した側では多孔質の表面構造を持つが、 貫通孔は持たない電極板が得られた。従って、それらはホットプレス中重合体材 料に対し不透過性になった。Example 3 The device was manufactured in the manner described in the Examples. However, instead of providing an airtight copper layer on the outside, First, the electrode plate pressed at room temperature was sintered at approximately 400°C in a hydrogen gas atmosphere for 4 hours. and then sand the side opposite the polymer composition with 320 mesh damp abrasive paper. The difference was in the polishing. Polishing deforms the surface layer, resulting in an airtight became. This results in a porous surface structure on the side facing the polymer composition; An electrode plate without through holes was obtained. Therefore, they are polymer materials during hot pressing. It has become impermeable to water.
実施例4 装置を実施例1に記載したやり方で製造した。但し銅層を外側に与える代わりに 、多孔質電極をレーザーを使用して約50μ置の深さまで表面層を溶融し、それ を固化することにより気密にした点が異なっている。装置はPTC素子として使 用するのに適し、優れていた。Example 4 The device was manufactured in the manner described in Example 1. However, instead of providing a copper layer on the outside , the surface layer of the porous electrode is melted using a laser to a depth of about 50 μm, and then The difference is that it is made airtight by solidifying it. The device can be used as a PTC element. It was excellent and suitable for use.
実施例5 装置を実施例1〜4に記載した方法のいずれかで製造した。熱処理を用いた最後 のプレス後、重合体組成物を、装置全体を電子照射することにより、重合体材料 の架橋度が80%になる丈で架橋した1重合体組成物は501Ωcyt未満の抵 抗率を持っていた。装置はPTC素子として使用するのに適し、優れていた。Example 5 Devices were manufactured using any of the methods described in Examples 1-4. Last using heat treatment After pressing, the polymer composition is made into a polymer material by irradiating the entire device with electrons. A monopolymer composition cross-linked to a length where the degree of cross-linking is 80% has a resistance of less than 501 Ωcyt. had resistance. The device was suitable and excellent for use as a PTC element.
実施例6 実施例1、実施例3、又は実施例4に記載したやり方で電極を製造した。それら 電極を、粉末状態、即ち、前形成してない実施例1に記載した重合体組成物と一 緒に、実施例1に記載した種類の成形工具の空洞中に、重合体組成物の両側に電 極を置き、気密な層(実施例1及び4)を外側に向けて入れた9重合体組成物と 電極とを70MPaの圧力で150℃の温度でプレスにかけた。重合体組成物は 50xΩcx未溝の抵抗率を持っていた。装置はPTC素子として使用するのに 適し、優れていた。Example 6 Electrodes were made in the manner described in Example 1, Example 3, or Example 4. those The electrode was combined with the polymer composition described in Example 1 in powdered form, i.e. without preforming. At the same time, in the cavity of a forming tool of the type described in Example 1, an electric current was placed on both sides of the polymer composition. 9 polymer composition with the poles placed and the airtight layer (Examples 1 and 4) facing outward. The electrodes were pressed at a pressure of 70 MPa and a temperature of 150°C. The polymer composition is It had an ungrooved resistivity of 50xΩcx. The device is used as a PTC element. It was suitable and excellent.
実施例7 装置を実施例1〜6に記載した方法のいずれかで製造した。但しそこで述べたポ リエチレンの代わりに、メルト インデックスが70g/10分、密度0.91 6g/cz’、粒径5〜35μlで、その内10〜14μ漏の粒径のものが材料 の50%より多いLDポリエチレン(ブラスト・レーバーS、A、からのHX 16H)を用いた点が異なる。重合体組成物は501Ωcx未溝の抵抗率を持っ ていた。製造された装置はPTC素子として使用するのに適し、優れていた。Example 7 Devices were manufactured using any of the methods described in Examples 1-6. However, the points mentioned there Instead of polyethylene, melt index is 70g/10min, density 0.91 6g/cz', particle size 5-35μl, of which the particle size is 10-14μl. LD polyethylene (HX from Blast Labor S, A, 16H) is used. The polymer composition has an ungrooved resistivity of 501Ωcx was. The manufactured device was suitable and excellent for use as a PTC element.
実施例8 装置を実施例1.2.3.4又は6に記載した方法のいずれかで製造した。但し そこで述べたポリエチレンの代わりに、メルト インデックス(M I 230 15 )が100g/10分、密度0.905g/c+vコ、粒径5〜90μl で、その内24〜36μlの粒径のものが材料の50%より多いポリプロピレン (ブラスト・レーバーS、A、からのPBO580)を用いたこと及びホットプ レスを170℃で行なった点が異なる。Example 8 Devices were manufactured using either the methods described in Examples 1.2.3.4 or 6. however Instead of the polyethylene mentioned there, melt index (M I 230 15) is 100g/10 minutes, density 0.905g/c+vco, particle size 5-90μl Of these, polypropylene particles with a particle size of 24 to 36 μl account for more than 50% of the material. (PBO580 from Blast Labor S, A) and hot plate. The difference is that the reaction was carried out at 170°C.
実施例9 装置を実施例1〜8に記載した方法のいずれかで製造した。但しそこで言及した 13体積部のニッケル粉末と12体積部のカーボンブラックの形の電気伝導性粉 末材料の代わりに、45μm未満の粒径を有するZrNを50体積部用いた点が 異なっていた。重合体組成物は50蹴ΩC1未満の抵抗率を持っていた。Example 9 Devices were manufactured using any of the methods described in Examples 1-8. However, it was mentioned there Electrically conductive powder in the form of 13 parts by volume of nickel powder and 12 parts by volume of carbon black The point is that 50 parts by volume of ZrN having a particle size of less than 45 μm was used instead of the powder material. It was different. The polymer composition had a resistivity of less than 50 ohms C1.
実施例10 装置を実施例9に記載したやり方で製造した。但しZrNの代わりに6〜lOμ lより小さい粒径のTiNを用いた点が異なっていた。重合体組成物は35覆Ω C11未満の抵抗率を持っていた。Example 10 The device was manufactured in the manner described in Example 9. However, instead of ZrN, 6~lOμ The difference was that TiN with a particle size smaller than 1 was used. The polymer composition is 35Ω It had a resistivity of less than C11.
実施例11 装置を実施例1〜8に記載した方法のいずれかで製造した。但しそこで言及した 13体積部のニッケル粉末と12体積部のカーボンブラックの形の電気伝導性粉 末材料の代わりに、13体積部の同じカーボンブラックと6〜10μlの粒径を 有するTiNを52体積部用いた点が異なっていた6重合体組成物は35zΩc m未満の抵抗率を持っていた。Example 11 Devices were manufactured using any of the methods described in Examples 1-8. However, it was mentioned there Electrically conductive powder in the form of 13 parts by volume of nickel powder and 12 parts by volume of carbon black Instead of the powder material, 13 parts by volume of the same carbon black and a particle size of 6-10 μl were added. The hexapolymer composition differed in that it used 52 parts by volume of TiN with 35 zΩc It had a resistivity of less than m.
実施例12 装置を実施例1Oに記載したやり方で製造した。但しTiNの代わりに45μl より小さい粒径のZ r B 2を用いた点が異なっていた。重合体組成物は3 0履Ωcm未満の抵抗率を持っていた。Example 12 The device was manufactured in the manner described in Example 1O. However, instead of TiN, 45μl The difference was that ZrB2 with a smaller particle size was used. The polymer composition is 3 It had a resistivity of less than 0Ωcm.
実施例13 装置を実施例9に記載したやり方で製造した。但しZrNの代わりに45μlよ り小さい粒径のTiB、を用いた点が異なっていた。Example 13 The device was manufactured in the manner described in Example 9. However, instead of ZrN, use 45 μl. The difference was that TiB with a smaller particle size was used.
実施例14 装置を実施例1〜8に記載した方法のいずれかで製造した。但しそこで言及した 13体積部のニッケル粉末と12体積部のカーボンブラックの形の電気伝導性粉 末材料の代わりに、実施例1の場合と同じ種類の煤を120体積部用いた点が異 なっていた。Example 14 Devices were manufactured using any of the methods described in Examples 1-8. However, it was mentioned there Electrically conductive powder in the form of 13 parts by volume of nickel powder and 12 parts by volume of carbon black The difference is that 120 parts by volume of the same type of soot as in Example 1 was used instead of the powder material. It had become.
実施例15 装置を実施例1〜8に記載した方法のいずれかで製造した。但しそこで言及した 13体積部のニッケル粉末と12体積部のカーボンブラックの形の電気伝導性粉 末材料の代わりに、実施例1の場合と同じ種類のニッケル粉末を60体積部用い た点が異なっていた。Example 15 Devices were manufactured using any of the methods described in Examples 1-8. However, it was mentioned there Electrically conductive powder in the form of 13 parts by volume of nickel powder and 12 parts by volume of carbon black Instead of the powder material, 60 parts by volume of nickel powder of the same type as in Example 1 was used. The difference was that
実施例1〜15で述べた全ての場合で、重合体材料の粒子はそれらの独自性を完 全に失った。In all cases described in Examples 1-15, the particles of polymeric material have completed their identity. Totally lost.
!−」L−に つの電極の間に配置された重合体組成物で、重合体材料と該重合体材料中に分布 された電気伝導性粉末材料からなる重合体組成物を有する電気装置、特に過電流 保護装置が、前記重合体材料で、100μlより小さく、その材料の少なくとも 50%が40μl未満である粒径を有する粉末状の熱可塑性状態の重合体材料と 、100μ1未満の粒径の電気伝導性粉末材料とを固体乾燥状態で混合して混合 物にし、その混合物中の前記重合体材料が、それら材料の全体積の少なくとも3 0%を占め、前記電気伝導性粉末材料が少なくとも20%を占めており、その混 合物を電極と一緒にプレス及び前記重合体材料が少なくとも粒子表面で溶融する 温度への加熱にかけ、同時に混合物の永久的凝集本体を形成すると共に、電極を その凝集本体に固定することにより製造される。! -” to L- a polymeric composition disposed between two electrodes, with a polymeric material and a polymeric composition distributed within the polymeric material; Electrical devices with polymeric compositions consisting of electrically conductive powder materials, especially for The protective device is made of said polymeric material and is smaller than 100 μl and contains at least a polymeric material in a powdered thermoplastic state with a particle size of which 50% is less than 40 μl; , and an electrically conductive powder material with a particle size of less than 100μ1 in a solid dry state. the polymeric materials in the mixture occupy at least 3% of the total volume of the materials. 0%, the electrically conductive powder material accounts for at least 20%, and the mixture pressing the compound together with an electrode and melting the polymer material at least on the particle surface. The electrodes are subjected to heating to a temperature that simultaneously forms a permanently agglomerated body of the mixture. It is produced by fixing it on its agglomerated body.
国際調査報告 国際調査報告 PCr/SE 91100375international search report international search report PCr/SE 91100375
Claims (16)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| SE9001990-2 | 1990-06-05 | ||
| SE9001990A SE468026B (en) | 1990-06-05 | 1990-06-05 | SET TO MAKE AN ELECTRIC DEVICE |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH05508055A true JPH05508055A (en) | 1993-11-11 |
| JP2836959B2 JP2836959B2 (en) | 1998-12-14 |
Family
ID=20379667
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3510583A Expired - Fee Related JP2836959B2 (en) | 1990-06-05 | 1991-05-28 | Method of manufacturing electrical device |
Country Status (6)
| Country | Link |
|---|---|
| EP (1) | EP0533760B1 (en) |
| JP (1) | JP2836959B2 (en) |
| AT (1) | ATE186793T1 (en) |
| DE (1) | DE69131787T2 (en) |
| SE (1) | SE468026B (en) |
| WO (1) | WO1991019297A1 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107230511A (en) * | 2016-03-24 | 2017-10-03 | 瑞侃电子(上海)有限公司 | Conductive polymer compositions, electric device and preparation method thereof |
Families Citing this family (23)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE4221309A1 (en) * | 1992-06-29 | 1994-01-05 | Abb Research Ltd | Current limiting element |
| JP2965815B2 (en) * | 1993-04-05 | 1999-10-18 | アルプス電気株式会社 | Solderable conductive paste for film formation |
| DE59306823D1 (en) * | 1993-08-25 | 1997-07-31 | Abb Research Ltd | Electrical resistance element and use of this resistance element in a current limiter |
| IT1267672B1 (en) * | 1994-01-17 | 1997-02-07 | Hydor Srl | THERMAL SENSITIVE RESISTIVE COMPOUND, ITS METHOD OF REALIZATION AND USE |
| DE4427161A1 (en) * | 1994-08-01 | 1996-02-08 | Abb Research Ltd | Process for the manufacture of a PTC resistor and resistor produced thereafter |
| DE19520869A1 (en) * | 1995-06-08 | 1996-12-12 | Abb Research Ltd | PTC resistor |
| US5793276A (en) * | 1995-07-25 | 1998-08-11 | Tdk Corporation | Organic PTC thermistor |
| US5614881A (en) * | 1995-08-11 | 1997-03-25 | General Electric Company | Current limiting device |
| DE19534442A1 (en) * | 1995-09-16 | 1997-03-27 | Abb Research Ltd | Over-current protection device for 11 to 17 kV networks |
| DE19548741A1 (en) * | 1995-12-23 | 1997-06-26 | Abb Research Ltd | Process for the production of a material for PTC resistors |
| US5929744A (en) * | 1997-02-18 | 1999-07-27 | General Electric Company | Current limiting device with at least one flexible electrode |
| US6535103B1 (en) | 1997-03-04 | 2003-03-18 | General Electric Company | Current limiting arrangement and method |
| US5977861A (en) * | 1997-03-05 | 1999-11-02 | General Electric Company | Current limiting device with grooved electrode structure |
| US6191681B1 (en) | 1997-07-21 | 2001-02-20 | General Electric Company | Current limiting device with electrically conductive composite and method of manufacturing the electrically conductive composite |
| US6373372B1 (en) | 1997-11-24 | 2002-04-16 | General Electric Company | Current limiting device with conductive composite material and method of manufacturing the conductive composite material and the current limiting device |
| DE19800470A1 (en) * | 1998-01-09 | 1999-07-15 | Abb Research Ltd | Resistor element for current limiting purposes especially during short-circuits |
| US6290879B1 (en) | 1998-05-20 | 2001-09-18 | General Electric Company | Current limiting device and materials for a current limiting device |
| US6124780A (en) * | 1998-05-20 | 2000-09-26 | General Electric Company | Current limiting device and materials for a current limiting device |
| US6133820A (en) * | 1998-08-12 | 2000-10-17 | General Electric Company | Current limiting device having a web structure |
| DE19915525A1 (en) * | 1999-04-07 | 2000-11-02 | Bosch Gmbh Robert | Temperature sensor with at least one conductor track and method for producing a temperature sensor |
| US6323751B1 (en) | 1999-11-19 | 2001-11-27 | General Electric Company | Current limiter device with an electrically conductive composite material and method of manufacturing |
| WO2002079302A1 (en) * | 2001-03-28 | 2002-10-10 | Perplas Ltd | Composite obtainable by sintering an inorganic material with one or more polymers |
| FR3038710B1 (en) | 2015-07-10 | 2021-05-28 | Cpc Tech | SENSOR WITH A PHYSICAL CHARACTERISTIC, PREFERABLY INCLUDING A MULTI-LAYER STRUCTURE |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE2309834A1 (en) * | 1973-02-28 | 1974-08-29 | Bosch Gmbh Robert | METHOD OF MANUFACTURING CARBON BRUSHES FOR ELECTRIC MACHINERY |
| US4533685A (en) * | 1983-07-26 | 1985-08-06 | Hudgin Donald E | Polymer-metal blend |
| EP0185783A1 (en) * | 1984-12-20 | 1986-07-02 | General Electric Company | Improved EMI shielding effecttiveness of thermoplastics |
| JPH02504333A (en) * | 1986-01-14 | 1990-12-06 | レイケム・コーポレイション | conductive polymer composition |
-
1990
- 1990-06-05 SE SE9001990A patent/SE468026B/en not_active IP Right Cessation
-
1991
- 1991-05-28 DE DE69131787T patent/DE69131787T2/en not_active Expired - Fee Related
- 1991-05-28 AT AT91910990T patent/ATE186793T1/en not_active IP Right Cessation
- 1991-05-28 JP JP3510583A patent/JP2836959B2/en not_active Expired - Fee Related
- 1991-05-28 EP EP91910990A patent/EP0533760B1/en not_active Expired - Lifetime
- 1991-05-28 WO PCT/SE1991/000375 patent/WO1991019297A1/en not_active Ceased
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107230511A (en) * | 2016-03-24 | 2017-10-03 | 瑞侃电子(上海)有限公司 | Conductive polymer compositions, electric device and preparation method thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2836959B2 (en) | 1998-12-14 |
| WO1991019297A1 (en) | 1991-12-12 |
| EP0533760A1 (en) | 1993-03-31 |
| DE69131787D1 (en) | 1999-12-23 |
| SE9001990L (en) | 1991-12-06 |
| SE468026B (en) | 1992-10-19 |
| SE9001990D0 (en) | 1990-06-05 |
| EP0533760B1 (en) | 1999-11-17 |
| ATE186793T1 (en) | 1999-12-15 |
| DE69131787T2 (en) | 2000-06-21 |
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