JPH0552501A - measuring device - Google Patents

Abstract

(57) [Abstract] [Purpose] By being able to select the measurement range for the thickness of the IC card and the combined thickness of warpage and deformation, it is possible to
Provided is a measuring device capable of simplifying measurement and shortening measurement time. [Structure] A displacement of a reference thickness is detected by a displacement sensor 11 by sandwiching an IC card with parallel plates from above and below, and a reference table 8 is made slidable, so that a measurement range according to an application can be selected.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an apparatus for measuring the thickness of a thin plate-like object to be measured such as an IC card.

[0002]

2. Description of the Related Art Conventionally, the thickness of an IC card 1 is measured by a micrometer 2 as shown in FIG. 5, or the warp and deformation of the IC card 1 is shown on a surface plate 3 as shown in FIG. To measure.

[0003]

Since the conventional measuring method is performed as described above, only partial thickness measurement can be performed in the thickness measurement, and in the warpage and deformation measurement, the measurement standard is ambiguous depending on the measurer. The result has a problem that the measurement error in accuracy becomes large. In addition, the data that takes into account each measurement result shows that the IC card is
Although a defect is judged, there is a problem that a large number of man-hours are required to start the measurement and obtain the result.

The present invention has been made in order to solve the above-mentioned problems, and it is possible to collectively detect a combination of thickness, warpage and deformation, and to select a measurement range according to the application. Another object of the present invention is to obtain a measuring device capable of shortening the measurement processing time by quantifying the criteria for warpage and deformation.

[0005]

SUMMARY OF THE INVENTION A measuring device according to the present invention is a minimum combined thickness of a measured object and warp and deformation by sandwiching a thin plate-shaped measured object from above and below with two parallel flat plates. The value is detected by a displacement sensor, and a measurement range can be selected by providing a parallel movable reference stand.

[0006]

According to the present invention, the object to be measured is sandwiched by the parallel plates, and the minimum value of the combined thickness of the object and the warp and the deformation can be detected by applying a light load to the extent that the warp and the deformation are not corrected. At the same time, the measurement range can be selected according to the application by using the reference table on which the object to be measured which can be moved in parallel is placed.

[0007]

DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to the drawings. In FIG. 1, 5 is an elevating plate that moves up and down, 6 is a displacement plate, 7 is an IC card, 8 is a reference stand for fixing the IC card 7, 9 is a positioning point for selecting the measurement range of the IC card 7, and 10 is an IC card. 7 is a ball plunger lock fixed at the measurement position, 11 is a displacement sensor for measuring the thickness, and 12 is a motor. In FIG. 2, 13 is a dummy card for measurement. In FIG. 3, 14 is a spring that adjusts the load of the displacement plate 6 in contact with the object to be measured, 15 is a warped or deformed IC card, and 16 is a guide corresponding to the object to be measured. In FIG. 4, reference numeral 17 designates the object to be measured as a displacement sensor 1.
A block gauge for adjusting the measurement range to 1 and a cam 18 for moving the lifting plate 5 up and down are connected to the motor 12. Reference numeral 19 is a linear guide for sliding the reference table 8 while maintaining the parallel state.

Next, the operation will be described. In FIG. 3, a guide 16 for the object to be measured and a block gauge 17 are attached to the reference table 8.
Then, the dummy card 13 for the object to be measured is fixed, the reference base 8 is moved to the ball plunger lock 10 by the linear guide 19, and fixed at the positioning point A9a.
The cam 18 shown in FIG. 3 coupled to the motor 12 shown in FIG.
Contact with a light load. The displacement sensor 11 detects the distance to the displacement plate 6 as the thickness of the dummy card 13. This detection distance is set as 0 reference. Hereinafter, the 0 reference of the positioning point B9b and the same point C9c is set.

Next, the IC card 7 is fixed to the reference table 8,
Positioning point A9a to point C9 according to the above procedure
c is measured and the difference from each 0 reference is detected. Further, when changing the measurement object, the guide 16 and the block gauge 17 for another measurement object are attached to the reference base 8, and the 0 reference of the position points A9a to C9c is set in the above-mentioned manner to perform the measurement. To do.

Although the thickness measurement of the IC card is described in the above embodiment, not only the IC card but also any component having a thin plate-like structure such as a magnetic card, a microcomputer card, a calculator frame, etc. may be used. Has the same effect as.

[0011]

As described above, according to the present invention, the thickness of the object to be measured and the sled and the deformation are measured at the same time, and the slidable reference table is provided, so that the standard of the sled and the deformation is fixed. In addition, the measurement can be performed according to the application, the measurement method can be simplified and the measurement can be performed with high accuracy, and the man-hours can be significantly reduced.

[Brief description of drawings]

FIG. 1 is a perspective view of a measuring device according to an embodiment of the present invention.

FIG. 2 is a perspective view showing the outer shapes of an IC card and a dummy card.

FIG. 3 is a side view of FIG.

FIG. 4 is a front view of FIG.

FIG. 5 is a front view of measuring the thickness of a conventional IC card.

FIG. 6 is a perspective view of measuring the warp of a conventional IC card.

[Explanation of symbols]

 5 Elevating Plate 6 Displacement Plate 7 IC Card 8 Reference Base 9 Positioning Point 10 Ball Plunger Lock 11 Displacement Sensor 12 Motor 13 Dummy Card 16 Guide 17 Block Gauge 18 Cam 19 Linear Guide

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[Procedure amendment]

[Submission date] January 17, 1992

[Procedure Amendment 1]

[Document name to be amended] Statement

[Name of item to be corrected] 0003

[Correction method] Change

[Correction content]

[0003]

Since the conventional measuring method is performed as described above, only partial thickness measurement can be performed in the thickness measurement, and in the warpage and deformation measurement, the measurement standard is ambiguous depending on the measurer. There was a problem that the result was likely to have an error . Furthermore, although the quality of the IC card is judged based on the data in which each measurement result is taken into consideration, there is a problem that a large number of man-hours are required to start the measurement and obtain the result.

[Procedure Amendment 2]

[Document name to be amended] Statement

[Correction target item name] 0007

[Correction method] Change

[Correction content]

[0007]

DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to the drawings. In FIG. 1, 5 is an elevating plate that moves up and down, 6 is a displacement plate, 7 is an IC card, 8 is a reference stand for fixing the IC card 7, 9 is a positioning point for selecting the measurement range of the IC card 7, and 10 is an IC card. 7 is a ball plunger lock fixed at the measurement position, 11 is a displacement sensor for measuring the thickness, and 12 is a motor. In FIG. 2, 13 is a dummy card for measurement. In FIG. 3, 14 is a spring that adjusts the load of the displacement plate 6 in contact with the object to be measured, 15 is a warped or deformed IC card, and 16 is a guide corresponding to the object to be measured. In FIG. 4, reference numeral 17 designates the object to be measured as a displacement sensor 1.
A block gauge for adjusting the measurement range to 1 and a cam 18 for moving the lifting plate 5 up and down are connected to the motor 12. Reference numeral 19 is a linear guide that slides the reference table 8 while maintaining the parallel state , and 20 is a lowering stop position of the lifting plate 5.
It is a lower limit stopper for the lifting plate that determines

[Procedure 3]

[Document name to be amended] Statement

[Correction target item name] 0008

[Correction method] Change

[Correction content]

Next, the operation will be described. In FIG. 3, a guide 16 for the object to be measured and a block gauge 17 are attached to the reference table 8.
Then, the dummy card 13 for the object to be measured is fixed, the reference base 8 is moved to the ball plunger lock 10 by the linear guide 19, and fixed at the positioning point A9a.
The lift plate 5 is lowered by the cam 18 of FIG. 3 connected to the motor 12 of FIG. 1 and hits the lower limit stopper 20 to stop at a fixed position.
At the same time, the displacement plate 6 causes the spring 14 on the dummy card 13.
Contact with a light load. The displacement sensor 11 detects the distance to the displacement plate 6 as the thickness of the dummy card 13. This detection distance is set as 0 reference. Hereinafter, the 0 reference of the positioning point B9b and the same point C9c is set.

Claims (1)

[Claims] 1. A thin plate-shaped object to be measured is sandwiched between two flat plates in a parallel state, a light load is applied to the object to be measured, and a minimum value of combined thickness, warpage and deformation is detected, and A measuring apparatus characterized in that it is possible to select several measuring ranges by providing a slidable base and a ball plunger lock while maintaining the parallel state.