JPH0552603A - Manufacture of variable capacity type sensor - Google Patents
Manufacture of variable capacity type sensorInfo
- Publication number
- JPH0552603A JPH0552603A JP21245891A JP21245891A JPH0552603A JP H0552603 A JPH0552603 A JP H0552603A JP 21245891 A JP21245891 A JP 21245891A JP 21245891 A JP21245891 A JP 21245891A JP H0552603 A JPH0552603 A JP H0552603A
- Authority
- JP
- Japan
- Prior art keywords
- sacrificial layer
- conductor
- insulating film
- substrate
- insulating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H05K999/00—
Landscapes
- Measurement Of Mechanical Vibrations Or Ultrasonic Waves (AREA)
- Measuring Fluid Pressure (AREA)
- Measurement Of Length, Angles, Or The Like Using Electric Or Magnetic Means (AREA)
- Testing Or Calibration Of Command Recording Devices (AREA)
- Transmission And Conversion Of Sensor Element Output (AREA)
Abstract
(57)【要約】
【目的】 簡単で精度のよい平行平板構造の可変容量型
センサを製造する方法を提供する。
【構成】 基板１を構成する導体５の表面に所定の均一
な厚さの犠牲層６を形成し、この犠牲層６の一部の絶縁
台座３に相当する領域をエッチングにより除去し、その
上から絶縁膜７を形成し、絶縁膜７の犠牲層６の上面部
分を除去した後、犠牲層７の表面に平板２を構成する所
定の厚さの導体８を形成し、その後に前記犠牲層６の残
り部分をエッチングにより除去して、平板２と基板１と
を絶縁台座３で連結した平行平板構造を形成する。
(57) [Summary] [Object] To provide a method of manufacturing a variable capacitance type sensor having a parallel plate structure which is simple and accurate. [Structure] A sacrificial layer 6 having a predetermined uniform thickness is formed on a surface of a conductor 5 which constitutes a substrate 1, and a part of the sacrificial layer 6 corresponding to an insulating pedestal 3 is removed by etching. The insulating film 7 is formed from the insulating film 7, the upper surface portion of the sacrificial layer 6 of the insulating film 7 is removed, and then the conductor 8 having a predetermined thickness forming the flat plate 2 is formed on the surface of the sacrificial layer 7, and then the sacrificial layer 7 is formed. The remaining portion of 6 is removed by etching to form a parallel plate structure in which the flat plate 2 and the substrate 1 are connected by the insulating pedestal 3.
Description
【０００１】[0001]
【産業上の利用分野】本発明は平行平板構造の可変容量
型センサの製造方法に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing a variable capacitance type sensor having a parallel plate structure.
【０００２】[0002]
【従来技術】例えばマイクロフォン（音圧）、加速度、
圧力等を検出する可変容量型センサとして、狭い間隔の
平行平板構造をもつ可変容量センサがある。2. Description of the Related Art For example, a microphone (sound pressure), acceleration,
As a variable capacitance sensor that detects pressure and the like, there is a variable capacitance sensor having a parallel plate structure with a narrow interval.
【０００３】これは、図２、図３に示すように、導電材
料で形成した基板１の上に、数μｍ〜数十μｍの非常に
狭い間隔をもって薄膜状の導電材料で形成した平板２
を、四隅の絶縁台座３を介して固定し、両者間の電位差
を検出するようにしたものである。As shown in FIGS. 2 and 3, this is a flat plate 2 made of a thin film conductive material on a substrate 1 made of a conductive material with a very narrow interval of several μm to several tens of μm.
Is fixed via the insulating pedestals 3 at the four corners, and the potential difference between the two is detected.
【０００４】この場合、基板１と平板２との平行度が、
センサ出力の直線性に大きな影響を及ぼすため、精度よ
く平行につくる必要があった。In this case, the parallelism between the substrate 1 and the flat plate 2 is
Since it has a great influence on the linearity of the sensor output, it was necessary to make them parallel with high accuracy.
【０００５】従来の製造方法について図４から図６に示
す。図４は、基板１に対して平板２をビス４により固定
する方法である。図５は絶縁台座３を接着剤により固定
する方法である。また、図６は絶縁台座３を加熱接合し
て固定する方法である。A conventional manufacturing method is shown in FIGS. FIG. 4 shows a method of fixing the flat plate 2 to the substrate 1 with screws 4. FIG. 5 shows a method of fixing the insulating pedestal 3 with an adhesive. Further, FIG. 6 shows a method of fixing the insulating pedestal 3 by heating and bonding.
【０００６】[0006]
【発明が解決しようとする課題】しかしながら、前記ビ
ス４により固定する第１の方法では、平行度が悪く、組
立、調整に手間と時間がかかる。第２の方法は、接着剤
の厚み等により、平行度が出しにくく、さらに第３の方
法は、加熱接合時の熱による残留応力が発生し、これを
除去するのに多くの時間を必要とした。However, in the first method of fixing with the screw 4, the parallelism is poor and it takes time and effort to assemble and adjust. In the second method, parallelism is difficult to be obtained due to the thickness of the adhesive, and in the third method, residual stress due to heat at the time of heating and joining is generated, and it takes a lot of time to remove it. did.
【０００７】このように、いずれの方法によっても、能
率よく高精度な平行平板を構成することができなかっ
た。As described above, it was not possible to construct an efficient and highly accurate parallel plate by either method.
【０００８】本発明はこのような問題を解決するために
提案されたもので、簡単で精度のよい平行平板構造の容
量センサを製造する方法を提供することを目的とする。The present invention has been proposed to solve such a problem, and an object thereof is to provide a method of manufacturing a capacitive sensor having a parallel plate structure which is simple and accurate.
【０００９】[0009]
【課題を解決するための手段】本発明は、基板を構成す
る導体の表面に所定の均一な厚さの犠牲層を形成し、こ
の犠牲層の一部の絶縁台座に相当する領域をエッチング
により除去し、その上から絶縁膜を形成し、絶縁膜の犠
牲層の上面部分を除去した後、犠牲層の表面に平板を構
成する所定の厚さの導体を形成し、その後に前記犠牲層
の残り部分をエッチングにより除去して、平板と基板と
を絶縁台座で連結した平行平板構造を形成するものであ
る。According to the present invention, a sacrifice layer having a predetermined uniform thickness is formed on the surface of a conductor forming a substrate, and a part of the sacrifice layer corresponding to an insulating pedestal is etched. After removing, an insulating film is formed from above, the upper surface portion of the sacrificial layer of the insulating film is removed, and then a conductor having a predetermined thickness that forms a flat plate is formed on the surface of the sacrificial layer, and then the sacrificial layer of the sacrificial layer is formed. The remaining part is removed by etching to form a parallel plate structure in which a plate and a substrate are connected by an insulating pedestal.
【００１０】[0010]
【実施例】以下、本発明の実施例を図１（Ａ）〜（Ｇ）
に基づいて説明する。EXAMPLE An example of the present invention will be described below with reference to FIGS.
It will be explained based on.
【００１１】図１（Ａ）のように、まず基板１を構成す
るため導体（Ａｌ）５の表面に、所定の均一な厚さの犠
牲層（ＳｉＯ2）６を形成する。この厚さは平行平板の
間隔に一致させるもので、数μｍ〜数十μｍの厚さとす
る。As shown in FIG. 1A, first, a sacrificial layer (SiO 2 ) 6 having a predetermined uniform thickness is formed on the surface of the conductor (Al) 5 for forming the substrate 1. This thickness is made to match the distance between the parallel flat plates and is set to several μm to several tens of μm.
【００１２】図１（Ｂ）（Ｃ）（Ｄ）のように、絶縁台
座３を構成するため、この犠牲層６の一部を台座の大き
さと配置間隔に対応して、エッチング（フォトリン）に
より除去し、その上から絶縁膜（Ｓｉ3Ｎ4）７を形成す
る。そして、犠牲層６の表面上に位置する絶縁膜７をエ
ッチングにより除去し、犠牲層６の内部には絶縁台座３
に対応する部分だけ絶縁膜７を残す。As shown in FIGS. 1B, 1C and 1D, a part of the sacrificial layer 6 is etched (photophosphor) in accordance with the size and arrangement interval of the pedestal to form the insulating pedestal 3. Then, the insulating film (Si 3 N 4 ) 7 is formed thereon. Then, the insulating film 7 located on the surface of the sacrificial layer 6 is removed by etching, and the insulating pedestal 3 is provided inside the sacrificial layer 6.
The insulating film 7 is left only in the portion corresponding to.
【００１３】図１（Ｅ）のように、この表面に所定の均
一な厚さの導体（Ｐｏｌｙ−Ｓｙ）８を形成する。この
導体８が前記平板２に対応する。As shown in FIG. 1 (E), a conductor (Poly-Sy) 8 having a predetermined uniform thickness is formed on this surface. The conductor 8 corresponds to the flat plate 2.
【００１４】そして、図１（Ｆ）において、この導体８
の一部をエッチングにより除去し、平板２の形状に相当
する部分だけ残す。そして、最後に図１（Ｇ）として示
すように、犠牲層６のすべてをエッチングにより除去
し、導体５の上面に導体８の平板部分と、絶縁膜７の台
座部分のみを残す。Then, in FIG. 1 (F), this conductor 8
Is removed by etching, leaving only a portion corresponding to the shape of the flat plate 2. Finally, as shown in FIG. 1G, the sacrificial layer 6 is entirely removed by etching, leaving only the flat plate portion of the conductor 8 and the pedestal portion of the insulating film 7 on the upper surface of the conductor 5.
【００１５】このようにして、異なる材質で蒸着等によ
り薄膜の積層状態をつくり、その後に中間に位置する犠
牲層６を取り除くことにより、組立や調整、接着や接合
をすることなく平行度の高い平行平板構造の容量センサ
を製造することができる。In this way, thin layers are formed of different materials by vapor deposition or the like, and then the sacrificial layer 6 located in the middle is removed, whereby the parallelism is high without assembly, adjustment, bonding or joining. A capacitance sensor having a parallel plate structure can be manufactured.
【００１６】[0016]
【発明の効果】以上のように本発明によれば、組立や調
整を一切必要とすることなしに、非常に狭い間隔におい
て平行度の高い平行平板構造のセンサを簡単に製造で
き、またこの結果、容量型センサの出力特性の直線性も
大幅に改善できる。As described above, according to the present invention, it is possible to easily manufacture a sensor having a parallel plate structure having a high degree of parallelism at a very narrow interval without requiring any assembly or adjustment. The linearity of the output characteristics of the capacitive sensor can be greatly improved.
【図１】本発明の実施例を示すもので、（Ａ）〜（Ｇ）
は製造過程を順に説明する断面図である。FIG. 1 shows an embodiment of the present invention, in which (A) to (G)
[FIG. 4] is a cross-sectional view for sequentially explaining a manufacturing process.
【図２】通常の可変容量型センサの平面図である。FIG. 2 is a plan view of a normal variable capacitance type sensor.
【図３】同じくその側面図である。FIG. 3 is a side view of the same.
【図４】従来のセンサ製造方法を示す説明図である。FIG. 4 is an explanatory view showing a conventional sensor manufacturing method.
【図５】同じく他のセンサ製造方法を示す説明図であ
る。FIG. 5 is an explanatory diagram showing another sensor manufacturing method of the same.
【図６】同じくさらに他のセンサ製造方法を示す説明図
である。FIG. 6 is an explanatory view showing yet another sensor manufacturing method.
【符号の説明】 １ 基板 ２ 平板 ３ 絶縁台座 ５ 導体 ６ 犠牲層 ７ 絶縁膜 ８ 導体[Explanation of symbols] 1 substrate 2 flat plate 3 insulating pedestal 5 conductor 6 sacrificial layer 7 insulating film 8 conductor
Claims (1)
な厚さの犠牲層を形成し、この犠牲層の一部の絶縁台座
に相当する領域をエッチングにより除去し、その上から
絶縁膜を形成し、絶縁膜の犠牲層の上面部分を除去した
後、犠牲層の表面に平板を構成する所定の厚さの導体を
形成し、その後に前記犠牲層の残り部分をエッチングに
より除去して、平板と基板とを絶縁台座で連結した平行
平板構造を形成することを特徴とする可変容量型センサ
の製造方法。1. A sacrificial layer having a predetermined uniform thickness is formed on a surface of a conductor forming a substrate, a part of the sacrificial layer corresponding to an insulating pedestal is removed by etching, and an insulating film is formed on the sacrificial layer. And removing the upper surface portion of the sacrificial layer of the insulating film, forming a conductor having a predetermined thickness to form a flat plate on the surface of the sacrificial layer, and then removing the remaining portion of the sacrificial layer by etching. A method for manufacturing a variable capacitance type sensor, comprising forming a parallel plate structure in which a flat plate and a substrate are connected by an insulating pedestal.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP21245891A JP3126043B2 (en) | 1991-08-23 | 1991-08-23 | Manufacturing method of variable capacitance type sensor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP21245891A JP3126043B2 (en) | 1991-08-23 | 1991-08-23 | Manufacturing method of variable capacitance type sensor |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0552603A true JPH0552603A (en) | 1993-03-02 |
| JP3126043B2 JP3126043B2 (en) | 2001-01-22 |
Family
ID=16622966
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP21245891A Expired - Fee Related JP3126043B2 (en) | 1991-08-23 | 1991-08-23 | Manufacturing method of variable capacitance type sensor |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3126043B2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH1093335A (en) * | 1996-05-17 | 1998-04-10 | Boeing Co:The | Zero redundant planar array with circular symmetry over broad frequency range |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3882606B2 (en) | 2001-12-14 | 2007-02-21 | 富士ゼロックス株式会社 | Color toner set for electrophotography, color developer for electrophotography, color image forming method and color image forming apparatus |
-
1991
- 1991-08-23 JP JP21245891A patent/JP3126043B2/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH1093335A (en) * | 1996-05-17 | 1998-04-10 | Boeing Co:The | Zero redundant planar array with circular symmetry over broad frequency range |
Also Published As
| Publication number | Publication date |
|---|---|
| JP3126043B2 (en) | 2001-01-22 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |