JPH0552905A - Integrated circuit testing adapter - Google Patents

Abstract

PURPOSE:To surely bring the contact tips of sockets into contact with the bumps of a circuit chip by fitting the sockets with the contact tips faced to chip pins to a fixing cap which is mounted on a fixing table by means of a mounting device and fixes an integrated circuit chip on the fixing table. CONSTITUTION:After an integrated circuit chip 11 is mounted on a fixing table 4, a fixing cap 3 is put on the table 4 and the cap 3 is fixed by means of a fixing device 2. As a result, sockets 1 with contact tips fitted to the cap 3 are surely brought into contact with the bumps 12 of the chip 11. Therefore, when the measurement terminal 22 of a measuring instrument 21 is connected to the socket 1 at the time of measuring the bumps 12, prescribed measurement can be made. Thus the measurement operation becomes easier and the occurrence of imperfect contact and wrong connection can be prevented between the bumps 12 and terminal 12.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an integrated circuit test adapter, and more particularly to an integrated circuit test adapter for measuring an integrated circuit chip having bumps or the like.

[0002]

2. Description of the Related Art In the prior art, when an integrated circuit chip having bumps is bench-tested, the tip of a measuring terminal of a measuring device is brought into direct contact with the bump to be measured.

[0003]

In the prior art, since the tip of the measuring terminal of the measuring instrument is brought into contact with the bumps at three places, the range of the measuring instrument is adjusted or the position of the waveform is adjusted. There has been a problem that the tip of the measurement terminal is once removed from the bump, the measuring instrument is adjusted, and then the bump is brought into contact again. In addition, if the distance between bumps is small, the tip of the measurement terminal may be in poor contact with the bump, and by measuring different bumps or repeating a large number of measurements, the bump may be considerably damaged at the tip of the measurement terminal. There was a point.

[0004]

SUMMARY OF THE INVENTION An integrated circuit test adapter of the present invention comprises a fixing base made of an insulating material for mounting an integrated circuit chip and an insulating material for fixing an object to be measured placed on the fixing base. It consists of a fixed cap made of objects and a mounting base made of an insulator for mounting the above-mentioned fixed base and fixed cap, and a socket with a contact tip for touching each pin of the integrated circuit chip is used as the fixed cap. I have it.

[0005]

DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will now be described with reference to the drawings. 1A and 1B are a sectional view and a plan view showing an embodiment of the present invention.

The integrated circuit chip 11 is mounted on the fixed base 4,
The lid is closed with the fixing cap 3 and then fixed with the fixing device 2. As a result, the socket 1 with a contact tip attached to the fixed cap 3 becomes the bump 12 of the DUT 11.
Is reliably contacted with. Therefore, when the bumps 12 of the integrated circuit chip 11 are to be accurately measured, a predetermined measurement can be performed by connecting the measurement terminal 22 of the measuring device 21 to the socket 1 with a contact tip.

[0007]

As described above, since the contact tip of the contact tip socket provided in the integrated circuit test adapter is surely brought into contact with the bump of the integrated circuit chip, the measuring terminal of the measuring instrument is connected to the contact tip socket. The measurement operation can be performed easily by connecting to. Further, it is possible to minimize scratches on the bumps of the integrated circuit chip due to the measuring terminals of the measuring device, and it is possible to prevent contact failure or erroneous contact between the bumps and the measuring terminals.

[Brief description of drawings]

1A and 1B are a sectional view and a plan view showing an embodiment of the present invention.

[Explanation of symbols]

 1 Socket with contact tip 2 Fixing device 3 Fixing cap 4 Fixing stand 11 Integrated circuit chip 12 Bump 21 Measuring instrument 22 Measuring terminal

Claims (1)

[Claims] 1. A fixed base made of an insulating material for mounting an integrated circuit chip, and a fixed cap mounted on the fixed base,
It is composed of an attachment device made of an insulating material for attaching the above-mentioned fixing base and fixing cap, and a conductive pin which comes into contact with a signal of an integrated circuit chip or a GND pin is attached to the fixing cap, and the cap. 2. An integrated circuit test adapter, wherein a conductor electrically connected to the conductive pin is provided on the opposite surface to which the integrated circuit chip is attached.