JPH0554272B2 - - Google Patents

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Publication number
JPH0554272B2
JPH0554272B2 JP56112572A JP11257281A JPH0554272B2 JP H0554272 B2 JPH0554272 B2 JP H0554272B2 JP 56112572 A JP56112572 A JP 56112572A JP 11257281 A JP11257281 A JP 11257281A JP H0554272 B2 JPH0554272 B2 JP H0554272B2
Authority
JP
Japan
Prior art keywords
type
layer
amorphous silicon
amorphous semiconductor
amorphous
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP56112572A
Other languages
Japanese (ja)
Other versions
JPS5814583A (en
Inventor
Yoshihiro Hamakawa
Yoshihisa Oowada
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kanegafuchi Chemical Industry Co Ltd
Original Assignee
Kanegafuchi Chemical Industry Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kanegafuchi Chemical Industry Co Ltd filed Critical Kanegafuchi Chemical Industry Co Ltd
Priority to JP56112572A priority Critical patent/JPS5814583A/en
Priority to DE8888117644T priority patent/DE3280418T2/en
Priority to DE8282106293T priority patent/DE3280112D1/en
Priority to EP88117644A priority patent/EP0309000B1/en
Priority to EP82106293A priority patent/EP0070509B2/en
Priority to US06/399,312 priority patent/US4450316A/en
Publication of JPS5814583A publication Critical patent/JPS5814583A/en
Priority to US06/552,951 priority patent/US4499331A/en
Priority to US06/552,952 priority patent/US4491682A/en
Publication of JPH0554272B2 publication Critical patent/JPH0554272B2/ja
Granted legal-status Critical Current

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Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10FINORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F77/00Constructional details of devices covered by this subclass
    • H10F77/20Electrodes
    • H10F77/244Electrodes made of transparent conductive layers, e.g. transparent conductive oxide [TCO] layers
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10FINORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F71/00Manufacture or treatment of devices covered by this subclass
    • H10F71/10Manufacture or treatment of devices covered by this subclass the devices comprising amorphous semiconductor material
    • H10F71/103Manufacture or treatment of devices covered by this subclass the devices comprising amorphous semiconductor material including only Group IV materials
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02EREDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00Energy generation through renewable energy sources
    • Y02E10/50Photovoltaic [PV] energy
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02PCLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50Manufacturing or production processes characterised by the final manufactured product

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  • Photovoltaic Devices (AREA)

Description

【発明の詳細な説明】[Detailed description of the invention]

本発明は、新規なアモルフアスシリコン系光起
電力素子に関する。 シラン(SiH4)のプラズマ分解法で得られる
アモルフアスシリコンは、W.E.Spear等によつ
て、PH3やB2H6でドープする事により、その伝
導度を大きく変える事ができることが発見され
(1976年)、D.E.Carlson等によつてアモルフアス
シリコンを用いた太陽電池が試作(1976年)され
て以来注目を集め、アモルフアスシリコン薄膜太
陽電池の効率を改善する研究が活発に行なわれて
いる。 これまでの研究により、アモルフアスシリコン
薄膜光電素子の構造としてはシヨツトキーバリヤ
ー型、pin型、MIS型、ヘテロ接合型があり、そ
のうち前三者が高効率太陽電池として有望視され
ている。すなわちシヨツトキーバリヤー型で5.5
%(D.E.カールソン他、1977年)、MIS型で4.8%
(J.I.B ウイルソン他、1978)、pin型で4.5%(浜
川圭弘 1978)の変換効率が達成されている。 pin ジヤンクシヨン型太陽電池の場合、p型
又はn型アモルフアスシリコンではキヤリヤーの
寿命が短かく、有効なキヤリヤーにならず、また
光の吸収係数がi層に比べて大きい事からp層で
の光の吸収ロスが大きい点に問題があつた。 このような欠点を改良する為にインバーテイド
pin型の光電素子が提案されている。すなわちn
型アモルフアスシリコン側から光を照射する素子
である。この素子はp型に比べると光の吸収係数
が比較的小さい為にやや有利と考えられる。しか
しこのn型アモルフアスシリコンでも光の吸収ロ
スがある点ではp型と変りない。 本発明者は、pin型光電変換の効率を改善する
為に鋭意研究した結果、a−Si(1-x-y)CxNyで示さ
れ、且つ水素又はフツ素を含むアモルフアス半導
体のp型又はn型ドープ薄膜を、pin接合光電素
子のp又はn層の少なくとも一方に用いる事によ
り短絡電流と開放電圧を大巾に改善できることを
見い出したもので、太陽電池や光スイツチ等の光
起電力素子として用いることができる。以下にそ
の詳細を説明する。 本発明に用いるアモルフアスシリコンは、シラ
ン(SiH4)又はその誘導体又はフツ化シラン又
はその誘導体、又はこれらの混合物と、水素又は
水素で希釈したアルゴン、ヘリウム等の不活性ガ
スとの混合ガスを、容量結合法又は誘導結合法に
よる高周波グロー分解又は直流グロー放電分解す
ることにより得られる。混合ガスのシランの濃度
は、通常0.5〜50%、好ましくは1〜20%である。 基板の温度は200〜300℃が好ましく、透明電極
(ITO、Sno2等)を蒸着したガラスや高分子フイ
ルム、金属等、太陽電池等の光起電力素子の構成
に必要なあらゆる基板が含まれる。 光起電力素子の基本構成は、第1図のa,bに
代表例が示される。aはp側から光を照射するタ
イプで、例えばガラス−透明電極−p−i−n−
Alの構成、bはn側から光を照射するタイプで、
例えばステンレス−p−i−n−透明電極の構成
である。その他、p層又はn層と透明電極の間に
薄い絶縁層をつけたり、薄い金属層をつけた構造
でもよい。要はp−i−n接合を基本とするもの
であればいかなる構成でもよい。 シラン若しくはその誘導体、又はフツ化シラン
若しくはその誘導体、又はこれらの混合物のグロ
ー放電分解で得られる約10-7秒以上のキヤリヤー
寿命で約1017cm-3eV-1以下の局在準位密度および
10-3cm2/V以上の易動度をもつ真性アモルフアス
シリコン(以下、i型a−Siという)をi層とし
て、p型とn型ドープ半導体で接合したpin接合
構造にするわけであるが、本発明ではp層又はn
層の少なくとも一方、すなわち少なくとも光を照
射する側に、一般式a−Si(1-x-y)CxNyで示され、
且つ水素又はフツ素を含むアモルフアス半導体の
p型又はn型ドープ薄膜を用いることを特徴とす
る。p層とn層の両方に用いてもよい。又このア
モルフアス半導体を用いない他方のドープ層は、
上記i型a−Siを、p型でもちいる場合は周期率
表族の元素でドープし、n型で用いる場合は周
期率表族の元素でドープすればよい。 前記アモルフアス半導体は、一般式a−
Si(1-x-y)CxNyで示されるアモルフアスシリコン・
カーボンナイトライドである。これはシリコンの
水素又はフツ素化合物と炭素およびチツ素の水素
又はフツ素化合物をグロー放電分解して得られる
ものであつて、その中に0.5〜30atom%の水素及
び/又はフツ素を含む。また、これはp型又はn
型に不純物でドープされることが望ましいもので
ある。さらに好ましくは光学的バンドギヤツプが
約1.85eV以上であり且つ20℃における電気伝導
度が約10-8(Ωcm)-1以上であり、且つp−i−n
接合した場合の拡散電位Vdが約1.1Volts以上で
あるp型又はn型アモルフアス半導体を満足する
ものが推奨される。 このアモルフアス半導体は、光学的バンドギヤ
ツプが大きくその為に、p−i−n接合光起電力
素子の窓材料として用いると、短絡電流Jscの増
加は当然考えられるが、いずれの場合も非常に大
きな開放電圧Vocを示す。本発明の光起電力素子
においても特願昭56−66689号と同様に第2図に
示すバンドプロフアイルの拡散電位Vdとその素
子の開放電圧Vocに相関がある。 本発明の場合Vdは約1.1volts以上であることが
望ましいが、この関係は光照射する側のアモルフ
アス半導体の種類に関係なくほぼ同一の傾向を示
す。この拡散電位Vdは光照射する側のアモルフ
アス半導体の光学的バンドギヤツプEg.optから
p、nドープ層のフエルミレベルEfの差を差し
引く事によつて得られる。すなわち第2図に示す
ようにn側の伝導帯のエネルギーレベルEcn、p
側の価電子帯のエネルギーレベルをEvpとして、
電気伝導度の温度依存性から活性化エネルギー
ΔEpとΔEnが求められる。p型の場合ΔEp=Ef
−Evp、n型の場合ΔEn=Ecn−EfでeVd=Eg.
opt−(ΔEp+ΔEn)である。 n側から光照射する場合も同様にn型アモルフ
アス半導体の光学的バンドギヤツプEg.optから
p、nのフエルミレベルEfの差を差し引いて求
められる。 本発明で用いる一般式a−Si(1-x-y)CxNyで表わ
されるアモルフアス半導体はEg.optが約1.85eV
以上で且つVdが約1.1volts以上であることが望ま
しい。このような条件を満たすアモルフアス半導
体を用いたヘテロ接合光起電力素子はJscとVoc
が著しく改善される。 本発明で用いる上記半導体は、さらに室温(20
℃)での電気伝導度が10-8(Ω・cm)-1以上である
ことが望ましい。これ以下であるとフイルフアク
タ−FFが小さくなり変換効率が実用的でなくな
るからである。 本発明のヘテロ接合光起電力素子を、その実施
例により以下に具体的に説明すると、次の通りで
ある。代表的な構造は透明電極/p型a−
Si(1-x-y)CxNy/i型a−Si/n型a−Si/電極の
構造で、透明電極側から光を照射する。透明電極
はITOやSnO2、特にSnO2が好ましく、ガラス基
板にあらかじめ蒸着して用いたりp型アモルフア
ス半導体上に直接蒸着してもよい。光を照射する
側のp型a−Si(1-x-y)CxNy層の厚みは約30Åから
300Å好ましくは50Åから200Å、i型a−Si層の
厚みは本発明の場合限定されないが約2500〜
10000Åが用いられる。n型a−Si層の厚みは限
定されないが約150Å〜600Åが用いられる。又こ
のn型a−Siの代わりにn型a−Si(1-x-y)CxNy
用いてもよい。 もう1つの代表的な構造は 透明電極/p型a−Si(1-x-y)CxNy/i型a−
Si/p型a−Si/電極の構造で、透明電極側から
光を照射する。光を照射する側のn型a−
Si(1-x-y)CxNyの厚みは約30Åから300Å好ましく
は50Å〜200Å、i型a−Si層の厚みは限定され
ないが約2500Å〜10000Åが通常用いられる。p
型a−Si層の厚みは限定されないが約150Å〜600
Åが用いられる。又このp型a−Siの代わりに本
発明のp型a−Si(1-x-y)CxNyを用いても良い。透
明電極の素材及び蒸着法については前同様であ
る。 次に本発明の効果について説明する。内径11cm
の石英反応管を用い13.56MHzの高周波でグロー
放電分解を行う。i型a−Siは、水素で希釈した
シランを2〜10Torrでグロー放電分解して得ら
れる。n型a−Siは水素で希釈したシランとフオ
スフイン(PH3)(PH3/SiH4=0.5モル%)を同
様にグロー放電分解して得られる。p型a−
Si(1-x-y)CxNyは水素で希釈したシラン、メタン
(CH4)、アンモニア(NH3)、ジポラン(B2H6
(B/(Si+C+N)=0.5atom%)を同様にグロ
ー放電分解して得られる。ここでa−Si(1-x-y)Cx
Nyは、グロー放電時のガス組成を変量してその
アトミツクフラクシヨン(x+y)が0.80〜0.05
になるようにした。 太陽電池の構成は、25Ω/□のSnO2薄膜のつ
いたガラス基板の該SnO2面にp型a−Si(1-x-y)Cx
Ny、i型a−Si、n型a−Siの順に堆積し最後
に3.3mm2のアルミニウムを蒸着してAM−1(100
mW/cm2)のソーラーシユミレーターで太陽電池
特性を調べた。グロー放電時の基板温度は250℃
で行つた。又、i層は5000Å、n層は500Å、p
型a−Si(1-x-y)CxNy層の厚みは135Åである。p
型a−Si(1-x-y)CxNyの膜組成x、yを変化させた
場合の太陽電池特性を表−1に示す。
The present invention relates to a novel amorphous silicon-based photovoltaic device. WESpear and others discovered that the conductivity of amorphous silicon obtained by plasma decomposition of silane (SiH 4 ) could be greatly changed by doping it with PH 3 or B 2 H 6 (1976). Since solar cells using amorphous silicon were prototyped by Carlson et al. (1976), they have attracted attention, and research has been actively conducted to improve the efficiency of amorphous silicon thin-film solar cells. Research has shown that amorphous silicon thin-film photovoltaic devices can be structured as Schottky barrier type, pin type, MIS type, or heterojunction type, of which the first three are considered to be promising as high-efficiency solar cells. i.e. 5.5 for shot key barrier type.
% (DE Carlson et al., 1977), 4.8% for MIS type
(JIB Wilson et al., 1978), and a pin type conversion efficiency of 4.5% (Keihiro Hamakawa, 1978) has been achieved. pin In the case of junction type solar cells, p-type or n-type amorphous silicon has a short carrier life and is not an effective carrier, and the light absorption coefficient is larger than that of the i-layer, so light in the p-layer is The problem was that the absorption loss was large. Inverted to improve these shortcomings
A pin-type photoelectric element has been proposed. That is, n
This is an element that irradiates light from the amorphous silicon side. This element is considered to be somewhat advantageous because it has a relatively small light absorption coefficient compared to the p-type element. However, this n-type amorphous silicon is no different from the p-type in that there is light absorption loss. As a result of intensive research in order to improve the efficiency of pin - type photoelectric conversion, the present inventor discovered that p-type or It was discovered that by using an n-type doped thin film in at least one of the p or n layer of a pin junction photoelectric device, the short circuit current and open circuit voltage can be greatly improved. It can be used as The details will be explained below. The amorphous silicon used in the present invention is prepared using a mixed gas of silane (SiH 4 ) or its derivatives, fluorinated silane or its derivatives, or a mixture thereof, and hydrogen or an inert gas such as argon or helium diluted with hydrogen. , by high frequency glow decomposition or direct current glow discharge decomposition using a capacitive coupling method or an inductive coupling method. The concentration of silane in the mixed gas is usually 0.5 to 50%, preferably 1 to 20%. The temperature of the substrate is preferably 200 to 300℃, and includes all substrates necessary for the construction of photovoltaic elements such as solar cells, such as glass, polymer film, and metal with transparent electrodes (ITO, Sno 2, etc.) vapor-deposited. . Representative examples of the basic configuration of a photovoltaic device are shown in FIG. 1, a and b. A is a type that irradiates light from the p side, for example, glass-transparent electrode-p-i-n-
The configuration of Al, b is the type that irradiates light from the n side,
For example, the structure is a stainless steel pin transparent electrode. In addition, a structure in which a thin insulating layer or a thin metal layer is provided between the p-layer or n-layer and the transparent electrode may be used. In short, any structure may be used as long as it is based on a pin junction. A localized level density of about 10 17 cm -3 eV -1 or less with a carrier lifetime of about 10 -7 seconds or more obtained by glow discharge decomposition of silane or its derivatives, or fluorinated silanes or its derivatives, or mixtures thereof. and
Intrinsic amorphous silicon (hereinafter referred to as i-type a-Si) with a mobility of 10 -3 cm 2 /V or more is used as the i layer, and a pin junction structure is created in which p-type and n-type doped semiconductors are joined. However, in the present invention, p layer or n
At least one of the layers, that is, at least the side to which light is irradiated, is represented by the general formula a-Si (1-xy) C x N y ,
It is also characterized by using a p-type or n-type doped thin film of an amorphous semiconductor containing hydrogen or fluorine. It may be used for both the p layer and the n layer. The other doped layer that does not use this amorphous semiconductor is
When the i-type a-Si is used as a p-type, it may be doped with an element of the periodic table group, and when it is used as an n-type, it may be doped with an element of the periodic table group. The amorphous semiconductor has the general formula a-
Amorphous silicon denoted by Si (1-xy) C x N y
It is carbon nitride. This is obtained by glow discharge decomposition of hydrogen or fluorine compounds of silicon and hydrogen or fluorine compounds of carbon and nitrogen, and contains 0.5 to 30 atom% of hydrogen and/or fluorine. Also, this is p-type or n-type
It is desirable that the mold be doped with impurities. More preferably, the optical bandgap is about 1.85 eV or more, the electrical conductivity at 20°C is about 10 -8 (Ωcm) -1 or more, and the pin
A p-type or n-type amorphous semiconductor having a diffusion potential Vd of approximately 1.1 Volts or more when bonded is recommended. This amorphous semiconductor has a large optical bandgap, so if it is used as a window material for a pin junction photovoltaic device, it is natural that the short circuit current Jsc will increase, but in any case, the Indicates voltage Voc. In the photovoltaic device of the present invention, as in Japanese Patent Application No. 56-66689, there is a correlation between the diffusion potential Vd of the band profile shown in FIG. 2 and the open circuit voltage Voc of the device. In the case of the present invention, Vd is preferably about 1.1 volts or more, but this relationship shows almost the same tendency regardless of the type of amorphous semiconductor on the side to which light is irradiated. This diffusion potential Vd is obtained by subtracting the difference between the fermi levels Ef of the p- and n-doped layers from the optical bandgap Eg.opt of the amorphous semiconductor on the side to which light is irradiated. In other words, as shown in Figure 2, the energy level of the n-side conduction band Ecn,p
Assuming the energy level of the side valence band as Evp,
Activation energies ΔEp and ΔEn can be determined from the temperature dependence of electrical conductivity. For p-type, ΔEp=Ef
−Evp, for n-type ΔEn=Ecn−Ef and eVd=Eg.
opt−(ΔEp+ΔEn). In the case of light irradiation from the n side, it is similarly determined by subtracting the difference between the p and n fermi levels Ef from the optical band gap Eg.opt of the n-type amorphous semiconductor. The amorphous semiconductor represented by the general formula a-Si (1-xy) C x N y used in the present invention has an Eg.opt of approximately 1.85 eV.
It is desirable that the voltage is above and that Vd is about 1.1 volts or above. A heterojunction photovoltaic device using an amorphous semiconductor that satisfies these conditions has Jsc and Voc.
is significantly improved. The above-mentioned semiconductor used in the present invention can further be used at room temperature (20
It is desirable that the electrical conductivity at ℃) is 10 -8 (Ω cm) -1 or higher. This is because if it is less than this, the film factor FF becomes small and the conversion efficiency becomes impractical. The heterojunction photovoltaic device of the present invention will be specifically described below using examples thereof. The typical structure is transparent electrode/p type a-
With the structure of Si (1-xy) C x N y /i-type a-Si/n-type a-Si/electrode, light is irradiated from the transparent electrode side. The transparent electrode is preferably made of ITO or SnO 2 , particularly SnO 2 , and may be used by being vapor-deposited on a glass substrate in advance, or may be directly vapor-deposited on a p-type amorphous semiconductor. The thickness of the p-type a-Si (1-xy) C x N y layer on the side that is irradiated with light is approximately 30 Å.
300 Å, preferably 50 Å to 200 Å, and the thickness of the i-type a-Si layer is not limited in the case of the present invention, but is about 2500 Å to 200 Å.
10000 Å is used. The thickness of the n-type a-Si layer is not limited, but approximately 150 Å to 600 Å is used. Moreover, n-type a-Si (1-xy) C x N y may be used instead of this n-type a-Si. Another typical structure is transparent electrode/p type a-Si (1-xy) C x N y /i type a-
With a Si/p-type a-Si/electrode structure, light is irradiated from the transparent electrode side. n-type a- on the side that irradiates light
The thickness of Si (1-xy) C x N y is about 30 Å to 300 Å, preferably 50 Å to 200 Å, and the thickness of the i-type a-Si layer is not limited, but is usually about 2,500 Å to 10,000 Å. p
The thickness of the type a-Si layer is not limited, but is approximately 150 Å to 600 Å.
Å is used. Moreover, p-type a-Si (1-xy) C x N y of the present invention may be used instead of this p-type a-Si. The material and vapor deposition method for the transparent electrode are the same as before. Next, the effects of the present invention will be explained. Inner diameter 11cm
Glow discharge decomposition is performed using a high frequency of 13.56MHz using a quartz reaction tube. I-type a-Si is obtained by glow discharge decomposition of silane diluted with hydrogen at 2 to 10 Torr. N-type a-Si can be similarly obtained by glow discharge decomposition of silane diluted with hydrogen and phosphine (PH 3 ) (PH 3 /SiH 4 =0.5 mol %). p type a-
Si (1-xy) C x N y is silane diluted with hydrogen, methane (CH 4 ), ammonia (NH 3 ), diporane (B 2 H 6 )
(B/(Si+C+N)=0.5 atom%) is similarly obtained by glow discharge decomposition. Here a−Si (1-xy) C x
Ny varies the gas composition during glow discharge, and its atomic flux (x+y) is 0.80 to 0.05.
I made it so that The solar cell has a p-type a-Si (1-xy) C x on the SnO 2 surface of a glass substrate with a 25Ω/□ SnO 2 thin film.
AM - 1 (100
The solar cell characteristics were investigated using a solar simulator (mW/cm 2 ). Substrate temperature during glow discharge is 250℃
I went there. Also, the i layer is 5000 Å, the n layer is 500 Å, and the p
The thickness of the type a-Si (1-xy) C x N y layer is 135 Å. p
Table 1 shows the solar cell characteristics when the film compositions x and y of type a-Si (1-xy) C x N y were varied.

【表】【table】

【表】 この表から判るようにシラン100%の場合、変
換効率(以下、ηという)4.6%であるのに対し
てa−Si(1-x-y)CxNyを用いるとx=0.05 y=0.05
でもη=6.5%と増加し、x=0.10 y=0.20では
η=7.3%にも改善される。x=0.3 y=0.3では
η=7.6%にも達しシラン100%の時に比し極めて
高い値が得られる。ここで注目すべき点はa−
Si(1-x-y)CxNyは光学的禁止帯巾がa−Siより大き
くなることから短絡電流Jscの増加は当然である
にしても、開放電圧Vocの増加は予想外で、この
両者の改良によつてこのような効率の改善がなさ
れている。 これらの結果はSiF4とCH4、NH3を用いても
全く同様であつた。 このa−Si(1-x-y)CxNyの光学的バンドギヤツプ
Eg.optは、表−1に示すようにa−Siよりも大き
な値を示しているので、これらのアモルフアス半
導体を窓材料にすればJscの増加は当然期待され
る。ところがJscだけでなくVocも著しく改良さ
れる。この理由について拡散電位VdとVocの関
係を調べてみると第3図に示すように、Vocと
Vdの間には明瞭な直線関係がある事が判る。す
なわちVdの増加とともにVocは直線的に増加す
る。この事は、光学的バンドギヤツプの大きなア
モルフアス半導体をp−i−n接合光起電力素子
の窓材料にすれば、拡散電位の増加によつてVoc
も改良される事を示している。 以上を要するに、一般式a−Si(1-x-y)CxNyで示
されるアモルフアス半導体(0.05≦x≦0.75、
0.05≦y≦0.75、0.05≦x+y≦0.80)、すなわち
Eg.optが約1.85eV以上で20℃における電気伝導
度が10-8(Ωcm)-1以上であり、且つp−i−n接
合の拡散電位Vdが1.1volt以上のアモルフアス半
導体を窓材料としたヘテロ接合光起電力素子は、
JscだけでなくVocも著しく改良され、その結果
光電変換効率ηも顕著に改善されるわけである。
これらの効果は第1図bの太陽電池の構成でn側
にn型a−Si(1-x-y)CxNyを用いても同様に発現さ
れる。
[Table] As can be seen from this table, in the case of 100% silane, the conversion efficiency (hereinafter referred to as η) is 4.6%, whereas when using a-Si (1-xy) C x N y , x = 0.05 y =0.05
However, it increases to η = 6.5% and improves to η = 7.3% when x = 0.10 and y = 0.20. When x=0.3 and y=0.3, η=7.6%, which is an extremely high value compared to when silane is 100%. The important point here is a-
Si (1-xy) C x N y has a larger optical bandgap than a-Si, so it is natural that the short circuit current Jsc will increase, but the increase in the open circuit voltage Voc is unexpected, and both This improvement in efficiency has been achieved through improvements in . These results were exactly the same even when SiF 4 , CH 4 , and NH 3 were used. This a-Si (1-xy) C x N y optical bandgap
Since Eg.opt shows a larger value than a-Si as shown in Table 1, it is naturally expected that Jsc will increase if these amorphous semiconductors are used as window materials. However, not only Jsc but also Voc is significantly improved. As for the reason for this, when we examine the relationship between the diffusion potential Vd and Voc, we find that Voc and
It can be seen that there is a clear linear relationship between Vd. That is, Voc increases linearly as Vd increases. This means that if an amorphous semiconductor with a large optical bandgap is used as the window material for a pin junction photovoltaic element, the VV
It also shows that it can be improved. In summary, the amorphous semiconductor ( 0.05≦ x 0.75,
0.05≦y≦0.75, 0.05≦x+y≦0.80), i.e.
The window material is an amorphous semiconductor whose Eg.opt is approximately 1.85 eV or higher, the electrical conductivity at 20°C is 10 -8 (Ωcm) -1 or higher, and the pin junction diffusion potential Vd is 1.1 volt or higher. The heterojunction photovoltaic device is
Not only Jsc but also Voc is significantly improved, and as a result, photoelectric conversion efficiency η is also significantly improved.
These effects are similarly exhibited even when n-type a-Si (1-xy) C x N y is used on the n-side in the solar cell configuration shown in FIG. 1b.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図aはp層側から光を照射するタイプの光
起電力素子を示す構造図であつて、図中1はガラ
ス、2は透明電極、3はp型アモルフアス半導
体、4はi型a−Si、5はn型半導体(例えばn
型a−Si)、6は電極である。同bはn層側から
光を照射するタイプを示す構造図で、7は電極基
板、8はp型a−Si、9はi型a−Si、10はn
型アモルフアス半導体、11は透明電極である。
第2図は本発明に係るヘテロp−i−n接合光起
電力素子のエネルギーバンドプロフアイルであ
る。第3図はp型のアモルフアス半導体を窓側に
した場合の拡散電位Vdと開放電圧の関係を示す
グラフである。
Figure 1a is a structural diagram showing a photovoltaic element of the type that irradiates light from the p-layer side, in which 1 is glass, 2 is a transparent electrode, 3 is a p-type amorphous semiconductor, and 4 is an i-type a -Si, 5 is an n-type semiconductor (e.g. n
Type a-Si), 6 is an electrode. Figure b is a structural diagram showing a type in which light is irradiated from the n-layer side, where 7 is an electrode substrate, 8 is a p-type a-Si, 9 is an i-type a-Si, and 10 is an n-layer.
type amorphous semiconductor, 11 is a transparent electrode.
FIG. 2 is an energy band profile of a heterop-i-n junction photovoltaic device according to the present invention. FIG. 3 is a graph showing the relationship between the diffusion potential Vd and the open circuit voltage when a p-type amorphous semiconductor is placed on the window side.

Claims (1)

【特許請求の範囲】 1 i層に真性アモルフアスシリコンを用いたp
−i−n接合素子の表裏両面に電極を設けてなる
アモルフアス太陽電池において、少なくとも光を
照射する側のドープ層に光学的バンドギヤツプが
1.85eV以上で20℃における電気伝導度が10-8(Ω
cm)-1以上であり、且つp−i−n接合した場合
の拡散電位Vdが1.1Volt以上である一般式a−
Si(1-x-y)CxNyで表わされるアモルフアス半導体の
p型又はn型ドープ薄膜を用いることを特徴とす
るアモルフアスシリコン系ヘテロ接合光起電力素
子。 2 前記光照射側のドープ層に用いるアモルフア
ス半導体は、0.05≦x≦0.75、0.05≦y≦0.75、
0.05≦x+y≦0.80であることを特徴とする特許
請求の範囲第1項に記載のアモルフアスシリコン
系光起電力素子。
[Claims] 1. A p-type film using intrinsic amorphous silicon in the i-layer.
In an amorphous solar cell in which electrodes are provided on both the front and back sides of a -i-n junction element, an optical bandgap exists at least in the doped layer on the side to which light is irradiated.
At 1.85eV or higher, the electrical conductivity at 20℃ is 10 -8
cm) -1 or more, and the diffusion potential Vd in the case of pin junction is 1.1 Volt or more.
An amorphous silicon-based heterojunction photovoltaic device characterized by using a p-type or n-type doped thin film of an amorphous semiconductor represented by Si (1-xy) C x N y . 2. The amorphous semiconductor used for the doped layer on the light irradiation side has the following properties: 0.05≦x≦0.75, 0.05≦y≦0.75,
The amorphous silicon-based photovoltaic device according to claim 1, characterized in that 0.05≦x+y≦0.80.
JP56112572A 1981-07-17 1981-07-17 Amorphous semiconductor and amorphous semiconductor- amorphous silicon heterojunction photo voltaic element Granted JPS5814583A (en)

Priority Applications (8)

Application Number Priority Date Filing Date Title
JP56112572A JPS5814583A (en) 1981-07-17 1981-07-17 Amorphous semiconductor and amorphous semiconductor- amorphous silicon heterojunction photo voltaic element
DE8888117644T DE3280418T2 (en) 1981-07-17 1982-07-14 AMORPHOUS SEMICONDUCTOR AND PHOTOVOLTAIC DEVICE MADE OF AMORPHOUS SILICON.
DE8282106293T DE3280112D1 (en) 1981-07-17 1982-07-14 AMORPHOUS SEMICONDUCTOR AND PHOTOVOLTAIC DEVICE MADE OF AMORPHIC SILICON.
EP88117644A EP0309000B1 (en) 1981-07-17 1982-07-14 Amorphous semiconductor and amorphous silicon photovoltaic device
EP82106293A EP0070509B2 (en) 1981-07-17 1982-07-14 Amorphous semiconductor and amorphous silicon photovoltaic device
US06/399,312 US4450316A (en) 1981-07-17 1982-07-19 Amorphous silicon photovoltaic device having two-layer transparent electrode
US06/552,951 US4499331A (en) 1981-07-17 1983-11-17 Amorphous semiconductor and amorphous silicon photovoltaic device
US06/552,952 US4491682A (en) 1981-07-17 1983-11-17 Amorphous silicon photovoltaic device including a two-layer transparent electrode

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP56112572A JPS5814583A (en) 1981-07-17 1981-07-17 Amorphous semiconductor and amorphous semiconductor- amorphous silicon heterojunction photo voltaic element

Publications (2)

Publication Number Publication Date
JPS5814583A JPS5814583A (en) 1983-01-27
JPH0554272B2 true JPH0554272B2 (en) 1993-08-12

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Country Link
JP (1) JPS5814583A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0853201A (en) * 1994-08-10 1996-02-27 Hiromi Hatakeyama Dust box

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61232685A (en) * 1985-04-09 1986-10-16 Agency Of Ind Science & Technol Amorphous silicon solar cell and its manufacturing method
JPH0689843B2 (en) * 1985-10-07 1994-11-14 トヨタ自動車株式会社 Torque converter output shaft speed detection method for automatic transmission

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CA1123525A (en) * 1977-10-12 1982-05-11 Stanford R. Ovshinsky High temperature amorphous semiconductor member and method of making same
JPS5513938A (en) * 1978-07-17 1980-01-31 Shunpei Yamazaki Photoelectronic conversion semiconductor device and its manufacturing method

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0853201A (en) * 1994-08-10 1996-02-27 Hiromi Hatakeyama Dust box

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