JPH0558111B2 - - Google Patents

Description

[Detailed Description of the Invention] [Industrial Application Field] The present invention provides an earthen floor that forms a floor on the ground without leaving any space under the floor, resulting in a floor with excellent heat insulation, moisture proofing, soundproofing, etc. Regarding floor construction methods.

[Conventional technology] Traditionally, when constructing a dirt floor, the ground height was adjusted by embanking as necessary, and then mulch was laid down, and then plastic film (hereinafter referred to as ``film'') and heat insulating material were placed on top of it. This is done by laying each layer separately and then pouring concrete on top of it. As a heat insulating material, a hard synthetic resin foam board (hereinafter referred to as "foam board") is usually used, and the film functions as a moisture barrier layer.

[Problems to be solved by the invention] By the way, the top surface of the chestnuts is sprinkled with a small amount of sand to smooth the surface, but if this sand covers the layer of chestnuts too thick, the floor becomes unstable. Therefore, it is only used to fill the gaps between the chestnuts, and it is difficult to avoid the chestnuts coming into contact with the film or insulation material above them. Furthermore, since the film and the insulation material must be laid separately and over a wide area, when the insulation material is laid after the film has been laid, the insulation material must be laid on top of the film. First, after the insulation material has been laid, concrete must be placed on top of it.

As mentioned above, the film and insulation material are often stepped on on the chestnut, so during installation work, the film may hit the corner of the chestnut and be stepped on, or the worker may kick the film, causing the intended result to fail. There is a possibility that moisture resistance cannot be obtained. Furthermore, when foam boards are used as insulation materials, they are not only easily broken when stepped on by workers, but also because they are lightweight, the broken parts can be blown away by the wind, causing the insulation to deteriorate. .

[Means for Solving the Problems] The measures taken to solve the above problems will be explained with reference to FIG. 1, which corresponds to an explanatory diagram of an embodiment of the present invention. The above-mentioned problem is solved by using an earthen floor construction method in which a foam board 4 insulation material with a film 3 bonded to the bottom surface in advance is laid on top of the foam board 4, and concrete 5 is poured on top of that. This is what I did.

[Function] According to the present invention, the film 3 for imparting moisture resistance to the earthen floor to be constructed and the foam board 4 as a heat insulating material are bonded in advance, so that both are installed at the same time. . Therefore, film 3
The workability is better than the conventional method in which the laying of foam board 4 and the foam board 4 are carried out separately. In addition, the film 3 and the foam board 4 can be laid down without the worker directly standing on the film 3, and the film 3 can be laid on the foam board 4 in advance.
Since the film 3 is integrally bonded with the film 3 and is difficult to tear during construction, the moisture-proof property is less likely to deteriorate due to damage to the film 3 during construction.

On the other hand, the film 3 is placed on the bottom surface of the foam board 4 in advance.
By joining them together, the foam board 4 is reinforced, and even if a worker steps on the foam board 4 when pouring concrete 5, etc., the foam board 4 becomes difficult to break. In addition, even if the foam board 4 breaks, the broken part will be held by the film 3 and will not be blown away by the wind.
There is no significant drop in insulation properties due to missing parts.

[Example] In Fig. 1, reference numeral 6 denotes a foundation, and first, the height of the ground 1 inside the foundation is adjusted by applying embankment as necessary. It is preferable to attach a heat insulating material 7 to the outer surface of the foundation 6 in order to prevent heat from escaping from the sides. This heat insulating material 7 may be made of the same material as the foam board 4 described later, or may be made of a different material.

Spread chestnuts 2 on the ground 1 inside the foundation 6.
The thickness of the layer of split chestnuts 2 may be determined as appropriate depending on the hardness of the ground 1 and the like. Further, it is preferable that sand 8 is sprinkled on the layer of split chestnuts 2 to fill the gaps between the split chestnuts 2 and to make the upper surface substantially flat. By doing so, it becomes easier to horizontally install the foam board 4 with the film 3 to be laid next, and it becomes easier to level the floor surface.

Next, a foam board 4 with a film 3 bonded to its lower surface in advance is placed on the chestnut 2.

Film 3 has a thickness of about 50 to 200μ,
For example, polyethylene, polypropylene, polyvinyl chloride, or the like coated or laminated with a heat-sealable plastic such as ethylene-vinyl acetate copolymer or ethylene-acrylic acid copolymer can be suitably used. When such a film 3 is used, it can be bonded to the foam board 4 by utilizing the fusion bonding of the heat-sealable plastic layer. However, other films may be bonded to the foam board 4 using an adhesive or the like.

It is preferable that the foam board 4 is hard so as to withstand the load from the floor surface. Specifically, for example, polystyrene, polyurethane, polyethylene,
Foams such as polyvinyl chloride and phenolic resin,
Foams made by adding inorganic fillers to these plastics can be mentioned. Most preferred is a pressed foamed polystyrene plate such as Styrofoam (trade name). Since the foam board 4 is protected from moisture by the film 3 on the lower surface, it does not need to be a skin board, but may be a cut board. Further, the foam board 4 preferably has a compressive strength of about 2 Kgf/cm ² or more so as to withstand the load.

With earthen floors, when the indoor temperature becomes excessively high, a certain amount of heat is released to the ground 1, and together with the installation of the insulation material 7 on the outside of the foundation, the heat is stored in the ground 1, and when the indoor temperature drops. It is preferable to have a function of releasing this into the room. From this, the foam board 4 should have a thermal conductivity of about 0.015 to 0.040 kcal・Hr・℃ and a thickness of 20 to 100 mm, optimally about 25 to 50 mm, rather than a thick one with excessively high insulation properties. is preferred.

The foam boards 4 to which the films 3 have been bonded in advance can be laid by simply arranging the adjacent foam boards 4 with their sides facing each other. However, as shown in FIG. 2, the film 3 is made to protrude outward from the foam board 4, and the adjacent film 3 is
It is preferable to lay the attached foam boards 4 one on top of the other, since this will increase the moisture resistance of the joint.

Concrete 5 is placed on the foam board 4 with the film 3 laid as described above, and its upper surface is leveled and finished with mortar 9 to complete the construction of the earthen floor. When the floor area is large, it is preferable to place the concrete 5 after reinforcing the foam board 4 with the film 3 attached.

In FIG. 1, 10 is the finishing mortar for the 6 parts of the foundation, 11 is the foundation, 12 is the exterior wall material, and 13 is the caulking.

[Effects of the Invention] According to the present invention, the moisture resistance of the floor is greatly reduced due to damage to the film 3 during construction, and the foam board 4
Insulation properties do not deteriorate significantly due to cracks in the insulation, making it easier to create a comfortable indoor environment as designed. Furthermore, construction efficiency is improved and work time can be shortened.

[Brief explanation of the drawing]

FIG. 1 is an explanatory diagram of one embodiment of the present invention, and FIG. 2 is an explanatory diagram of a foam board to which a film has been bonded in advance. 1: Ground, 2: Chestnut, 3: Plastic film, 4: Synthetic resin foam board, 5: Concrete,
6: Foundation, 7: Insulation, 8: Sand, 9: Leveling mortar, 10: Finishing mortar, 11: Foundation, 1
2: External wall material, 13: Caulking.

Claims (1)

[Claims] 1. An earthen floor construction method characterized by laying chestnuts on the ground, arranging insulation material made of synthetic resin foam board with plastic film bonded to the bottom surface in advance, and pouring concrete on top of it. ,