JPH0558661B2 - - Google Patents

Info

Publication number
JPH0558661B2
JPH0558661B2 JP1050447A JP5044789A JPH0558661B2 JP H0558661 B2 JPH0558661 B2 JP H0558661B2 JP 1050447 A JP1050447 A JP 1050447A JP 5044789 A JP5044789 A JP 5044789A JP H0558661 B2 JPH0558661 B2 JP H0558661B2
Authority
JP
Japan
Prior art keywords
plating
conductive line
film
film carrier
wiring lead
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP1050447A
Other languages
English (en)
Japanese (ja)
Other versions
JPH02229444A (ja
Inventor
Yoshio Suzuki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shindo Denshi Kogyo KK
Original Assignee
Shindo Denshi Kogyo KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shindo Denshi Kogyo KK filed Critical Shindo Denshi Kogyo KK
Priority to JP1050447A priority Critical patent/JPH02229444A/ja
Publication of JPH02229444A publication Critical patent/JPH02229444A/ja
Publication of JPH0558661B2 publication Critical patent/JPH0558661B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Wire Bonding (AREA)
JP1050447A 1989-03-02 1989-03-02 フィルムキャリアのメッキ用導電ライン除去方法 Granted JPH02229444A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1050447A JPH02229444A (ja) 1989-03-02 1989-03-02 フィルムキャリアのメッキ用導電ライン除去方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1050447A JPH02229444A (ja) 1989-03-02 1989-03-02 フィルムキャリアのメッキ用導電ライン除去方法

Publications (2)

Publication Number Publication Date
JPH02229444A JPH02229444A (ja) 1990-09-12
JPH0558661B2 true JPH0558661B2 (cs) 1993-08-27

Family

ID=12859118

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1050447A Granted JPH02229444A (ja) 1989-03-02 1989-03-02 フィルムキャリアのメッキ用導電ライン除去方法

Country Status (1)

Country Link
JP (1) JPH02229444A (cs)

Also Published As

Publication number Publication date
JPH02229444A (ja) 1990-09-12

Similar Documents

Publication Publication Date Title
EP0359775A1 (en) Process for providing an improved electroplated tape automated bonding tape and the product produced thereby
KR20060086296A (ko) 접전 단자를 갖는 프린트 기판, 전자 기기 및 그 제조 방법
EP0277118B1 (en) Removable commoning bar
JP2000091722A (ja) プリント配線板及びその製造方法
JP2001358257A (ja) 半導体装置用基板の製造方法
JPH02229444A (ja) フィルムキャリアのメッキ用導電ライン除去方法
JPH09153664A (ja) 大電流用基板
JPH0466385B2 (cs)
JP2987182B2 (ja) プリント配線板
JP4150464B2 (ja) ２メタルテープキャリアパッケージとその製造方法
JPH087649Y2 (ja) プリント配線板
JPH03250691A (ja) カードエッジコネクタ実装基板の端子メッキ方法
JPS5892291A (ja) プリント配線板の製造方法
KR100476409B1 (ko) 인쇄회로기판의 도금방법
JPH05235200A (ja) 電子部品搭載用基板
JPS6223478B2 (cs)
JPH08172256A (ja) プリント配線板及びその製造方法
JPS5879795A (ja) プリント配線板の製造方法
JPH01251692A (ja) マスキング層形成方法
JPS63289892A (ja) マスキング層形成方法
JPH05327184A (ja) 電子部品搭載用基板の製造方法
JPH0443698A (ja) 多層積層配線基板
JPH0317236B2 (cs)
JPH01143386A (ja) プリント配線板の製造方法
JPS6365699A (ja) 多層印刷配線板およびその製造方法