JPH0562802A - Thick-film resistive paste and thick film resistor - Google Patents
Thick-film resistive paste and thick film resistorInfo
- Publication number
- JPH0562802A JPH0562802A JP3250212A JP25021291A JPH0562802A JP H0562802 A JPH0562802 A JP H0562802A JP 3250212 A JP3250212 A JP 3250212A JP 25021291 A JP25021291 A JP 25021291A JP H0562802 A JPH0562802 A JP H0562802A
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- Prior art keywords
- oxide
- weight
- thick film
- resistance
- glass
- Prior art date
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- Apparatuses And Processes For Manufacturing Resistors (AREA)
- Non-Adjustable Resistors (AREA)
Abstract
(57)【要約】
【目的】 本発明の目的は特に高抵抗領域を安定して実
現でき、しかも優れた性能を有する厚膜抵抗被膜を形成
するためのペースト組成物と、それを用いた厚膜抵抗器
を提供することにある。
【構成】 ペースト固形分中に酸化ルテニウム及び/又
はパイロクロア型ルテニウム酸塩15〜50重量%と硼
硅酸鉛系ガラス85〜50重量%とを含有する厚膜抵抗
ペーストにおいて、該ガラス中に酸化錫及び/又は酸化
チタンを0.5〜5重量%含有する点に特徴がある。(57) [Summary] [Object] The object of the present invention is to provide a thick film resistive coating film which can stably realize a high resistance region and has excellent performance, and a paste composition using the same. It is to provide a membrane resistor. [Structure] A thick film resistance paste containing 15 to 50% by weight of ruthenium oxide and / or pyrochlore-type ruthenate and 85 to 50% by weight of lead borosilicate glass in a paste solid content. It is characterized in that it contains 0.5 to 5% by weight of tin and / or titanium oxide.
Description
【0001】[0001]
【産業上の利用分野】本発明は特に高抵抗領域を安定し
て実現でき、しかも優れた性能を有する厚膜抵抗被膜を
形成するためのペースト組成物と、それを用いた厚膜抵
抗器に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a paste composition for forming a thick film resistance film which can stably realize a high resistance region and has excellent performance, and a thick film resistor using the same. It is a thing.
【0002】[0002]
【従来の技術】厚膜抵抗ペーストは、基本的には導電粉
末とガラス粉末を有機質ビヒクルに分散混合せしめた組
成物であり、耐火性の基体上に塗布し、所定の温度で焼
成すれば該基体上に抵抗被膜が形成され、該抵抗被膜に
電極を接続すれば抵抗器となる。2. Description of the Related Art A thick film resistance paste is basically a composition in which a conductive powder and a glass powder are dispersed and mixed in an organic vehicle, and when applied on a refractory substrate and baked at a predetermined temperature, A resistance film is formed on the substrate, and an electrode is connected to the resistance film to form a resistor.
【0003】この抵抗ペーストの導電粉末としては、幅
広い抵抗値を実現でき、しかも抵抗温度係数の小さいも
のが得られることから、酸化ルテニウムやPb2 Ru2
O6 〜7 に代表されるパイロクロア型ルテニウム酸塩を
用いることが多い。As the conductive powder of this resistance paste, a wide resistance value can be realized and a resistance temperature coefficient is small, so that ruthenium oxide or Pb 2 Ru 2 can be obtained.
Pyrochlore-type ruthenate represented by O 6 to 7 is often used.
【0004】また、所望の抵抗値を得るため、面積抵抗
値を例えば1kΩ/□,10kΩ/□,100kΩ/□
のように10倍毎に調整した基準値の抵抗ペーストを用
意し、それらを適宜ブレンドして用いるのが一般的であ
るが、このブレンドにより抵抗値および抵抗温度係数が
概ね中間の値になることが必要で、これを保証するのが
シリーズ化された抵抗ペーストである。Further, in order to obtain a desired resistance value, the area resistance value is, for example, 1 kΩ / □, 10 kΩ / □, 100 kΩ / □.
It is common to prepare a resistance paste with a standard value adjusted every 10 times as described above, and use them by appropriately blending them. However, this blending makes the resistance value and the temperature coefficient of resistance approximately intermediate values. It is necessary to secure this with series resistance paste.
【0005】シリーズで重要なことは使用するガラスを
特定することである。ガラスは導電粉末を基体に結合す
る役目をもち、軟化点、熱膨張係数を適度のものに選定
する必要があるが、抵抗値、抵抗温度係数、ノイズ、耐
電圧等の特性も左右するので、どのようなガラス組成と
するかによってシリーズの特徴が決まる。What is important in the series is to specify the glass to be used. Glass has a function of binding conductive powder to a substrate, and it is necessary to select a softening point and a thermal expansion coefficient that are appropriate, but since the characteristics such as resistance value, resistance temperature coefficient, noise, and withstand voltage also influence, The characteristics of the series are determined by the glass composition used.
【0006】このようなガラスとして、酸化鉛45〜7
5、酸化硅素25〜50、酸化硼素0.1〜5各重量%
を主成分とする硼硅酸鉛系のガラスが一般に用いられ、
これに必要により種々の成分が更に付加される。As such glass, lead oxide 45 to 7
5, silicon oxide 25 to 50, boron oxide 0.1 to 5% by weight each
Generally, lead borosilicate glass containing as a main component is used,
Various components are further added to this if necessary.
【0007】抵抗値は当然導電粉末の配合割合で変り、
ペースト固形分中で導電粉末含有量は通常15〜50重
量%、ガラス粉末含有量は85〜50重量%としてい
る。導電粉末含有量を15重量%以上とするのは、これ
以下では抵抗値の調整が難かしくなる上、ノイズ、耐電
圧等の特性が悪化するからである。The resistance value naturally changes depending on the mixing ratio of the conductive powder,
The conductive powder content in the paste solid content is usually 15 to 50% by weight, and the glass powder content is 85 to 50% by weight. The conductive powder content is set to 15% by weight or more because if it is less than this, it becomes difficult to adjust the resistance value and characteristics such as noise and withstand voltage deteriorate.
【0008】ところが、導電粉末量を15重量%以上と
する場合、高抵抗を実現するために抵抗値増大に効果の
ある酸化チタン、酸化タンタル、酸化ニオブ、チタン酸
塩、タンタル酸塩、ニオブ酸塩等を添加する必要がある
が、これらの材料の添加は抵抗温度係数を負に増大する
ことになる。この抵抗温度係数を一定範囲にする必要か
ら前記抵抗値増大剤の添加に制約があり、5MΩ/□以
上を安定して実現するのは困難であった。However, when the amount of the conductive powder is set to 15% by weight or more, titanium oxide, tantalum oxide, niobium oxide, titanate, tantalate, niobate which has an effect of increasing the resistance value for realizing high resistance is obtained. Although it is necessary to add salt or the like, the addition of these materials negatively increases the temperature coefficient of resistance. Since it is necessary to keep the temperature coefficient of resistance within a certain range, there is a restriction on the addition of the resistance increasing agent, and it is difficult to stably achieve 5 MΩ / □ or more.
【0009】[0009]
【発明が解決しようとする課題】本発明の目的は、導電
粉末量が15重量%以上で高抵抗領域を安定して実現で
き、しかも性能の優れた厚膜抵抗体を形成し得るペース
ト組成物と、それを用いた厚膜抵抗器を提供することに
ある。SUMMARY OF THE INVENTION An object of the present invention is to provide a paste composition capable of stably realizing a high resistance region with an amount of conductive powder of 15% by weight or more, and capable of forming a thick film resistor having excellent performance. And to provide a thick film resistor using the same.
【0010】[0010]
【課題を解決するための手段】上記目的を達成するため
本発明の組成物は、ペースト固形分中に酸化ルテニウム
及び/又はパイロクロア型ルテニウム酸塩を15〜50
重量%と、酸化鉛45〜75、酸化硅素25〜50、酸
化硼素0.1〜5各重量%を主成分とする硼硅酸鉛ガラ
スを85〜50重量%とを含有する厚膜抵抗ペーストに
おいて、該ガラス中に酸化錫及び/又は酸化チタンを
0.5〜5重量%含有する点に特徴がある。To achieve the above object, the composition of the present invention comprises ruthenium oxide and / or pyrochlore type ruthenate in an amount of 15 to 50 in the paste solid content.
A thick film resistance paste containing 45% by weight of lead oxide, 45 to 75% of lead oxide, 25 to 50% of silicon oxide, and 0.1 to 5% by weight of boron oxide of 85 to 50% by weight of lead borosilicate glass. In the above, the glass is characterized by containing 0.5 to 5% by weight of tin oxide and / or titanium oxide.
【0011】又、本発明の厚膜抵抗器は上記組成物を耐
火性基体に適用し、該基体上に抵抗被膜を形成したもの
であり、酸化ルテニウム及び/又はパイロクロア型ルテ
ニウム酸塩を15〜50重量%と、酸化鉛45〜75、
酸化硅素25〜50、酸化硼素0.1〜5各重量%を主
成分とし、更に酸化錫及び/又は酸化チタンを0.5〜
5重量%含有する硼硅酸鉛系ガラスを85〜50重量%
とを含有する抵抗被膜が、耐火性基体上に形成されてい
る点に特徴がある。The thick film resistor of the present invention is obtained by applying the above composition to a refractory substrate and forming a resistance coating on the substrate, and the ruthenium oxide and / or pyrochlore type ruthenate is added to the refractory substrate in an amount of 15 to 15. 50 wt% and lead oxide 45-75,
Silicon oxide 25 to 50, boron oxide 0.1 to 5% by weight as a main component, and tin oxide and / or titanium oxide 0.5 to 0.5
85 to 50% by weight of lead borosilicate glass containing 5% by weight
It is characterized in that the resistance coating containing and is formed on the refractory substrate.
【0012】[0012]
【作用】本発明において用いるガラスの主成分及び含有
量は従来と変らず、酸化鉛45〜75、酸化硅素25〜
50、酸化硼素0.1〜5各重量%である。本発明にお
いてはこの主成分に加え、酸化錫及び/又は酸化チタン
を0.5〜5重量%含有せしめる。ガラス成分中に酸化
錫、酸化チタンの含有量が少な過ぎると効果がなく、又
多過ぎると焼成して得られる抵抗被膜の熱膨張係数が大
きくなり、基体との密着強度が低下するので好ましくな
い。このため酸化錫及び/又は酸化チタンの含有量は
0.5〜5重量%とする必要がある。The main components and contents of the glass used in the present invention are the same as those of the conventional ones, and lead oxide 45 to 75, silicon oxide 25 to
50, and each of boron oxide 0.1 to 5% by weight. In the present invention, in addition to this main component, tin oxide and / or titanium oxide is contained in an amount of 0.5 to 5% by weight. If the content of tin oxide or titanium oxide in the glass component is too small, it is not effective, and if it is too large, the coefficient of thermal expansion of the resistance coating obtained by firing becomes large, and the adhesion strength with the substrate decreases, which is not preferable. .. Therefore, the content of tin oxide and / or titanium oxide needs to be 0.5 to 5% by weight.
【0013】酸化カルシウム、酸化バリウム、酸化スト
ロンチウム等のアルカリ土類金属酸化物は、抵抗温度係
数を正に大きくする効果があり、ガラス中に0.1〜5
重量%含有せしめると良い。アルカリ土類金属酸化物の
含有量が5重量%を超えると抵抗被膜の熱膨張係数が大
きくなり過ぎるので、5重量%を上限とするのが良い。Alkaline earth metal oxides such as calcium oxide, barium oxide and strontium oxide have the effect of positively increasing the temperature coefficient of resistance, and 0.1 to 5 in the glass.
It is better to contain it by weight%. If the content of the alkaline earth metal oxide exceeds 5% by weight, the coefficient of thermal expansion of the resistance coating becomes too large, so 5% by weight is the upper limit.
【0014】又、酸化亜鉛は抵抗被膜の形状効果、即ち
被膜の幅に対する長さの比が小さくなると面積抵抗値が
小さくなる現象を、抑制する働きがあり、ガラス中に
0.1〜5重量%の範囲で含有させることができる。Further, zinc oxide has a function of suppressing the shape effect of the resistance coating, that is, the phenomenon that the area resistance value becomes smaller as the ratio of the length to the width of the coating becomes smaller. It can be contained in the range of%.
【0015】その他ガラス化成分として知られる他の酸
化物を、ガラスの軟化点、熱膨張係数の調整のために
0.1〜5重量%の範囲で含有せしめることができる。Other oxides known as vitrifying components may be contained in the range of 0.1 to 5% by weight in order to adjust the softening point and thermal expansion coefficient of glass.
【0016】このようなガラスの粉末は、ペースト固形
分中で、酸化ルテニウム及び/又はパイロクロア型ルテ
ニウム酸塩からなる導電粉末15〜50重量%に対し、
85〜50重量%含有せしめる。Such a glass powder is contained in the paste solid content in an amount of 15 to 50% by weight of a conductive powder composed of ruthenium oxide and / or pyrochlore-type ruthenate.
The content is 85 to 50% by weight.
【0017】導電粉末とガラス粉末は、適当な有機質ビ
ヒクルと混練してスクリーン印刷に適する性状のペース
ト状とする。この混練の際に酸化チタン、酸化タンタ
ル、酸化ニオブ、チタン酸塩、タンタル酸塩、ニオブ酸
塩等を適量添加して抵抗値を増大せしめることができ
る。これら抵抗値増大剤の添加量は、ペースト固形分中
で0.1〜5重量%とするのが適当である。添加量が多
過ぎると抵抗温度係数が負に増大し過ぎるので、5重量
%を上限とするのが良い。The conductive powder and the glass powder are kneaded with a suitable organic vehicle to form a paste having a property suitable for screen printing. During this kneading, an appropriate amount of titanium oxide, tantalum oxide, niobium oxide, titanate, tantalate, niobate, or the like can be added to increase the resistance value. The added amount of these resistance value increasing agents is appropriately 0.1 to 5% by weight in the paste solid content. If the amount of addition is too large, the temperature coefficient of resistance increases too negatively, so it is preferable to set the upper limit to 5% by weight.
【0018】[0018]
【実施例】実験に当り、表1に示す組成のガラスA,B
及びCを調製した。ガラスAは従来型の組成であり、ガ
ラスB及びCは本発明に係る組成物である。EXAMPLES In experiments, glasses A and B having the compositions shown in Table 1 were used.
And C were prepared. Glass A is a conventional composition and glasses B and C are compositions according to the invention.
【0019】[0019]
【表1】 [Table 1]
【0020】このガラス粉末85重量%とPb2 Ru2
O6,5 粉末15重量%を混合し、この固形分70重量部
に対し、有機質ビヒクル30重量部を添加混練し、表2
に示す実験No.1,8及び13のペーストを得た。85% by weight of this glass powder and Pb 2 Ru 2
15% by weight of O 6,5 powder was mixed, and 30 parts by weight of an organic vehicle was added and kneaded to 70 parts by weight of this solid content.
Experiment No. shown in. Pastes 1, 8 and 13 were obtained.
【0021】これらのペーストを分取して、抵抗値増大
剤としてTa2 O5 又はTiO2 をペースト基準で0.
5,1又は2重量%を添加混合し、表2に示す実験N
o.2〜7,9〜12及び14〜19のペーストを得
た。These pastes were sampled and Ta 2 O 5 or TiO 2 was added as a resistance increasing agent in an amount of 0.
Experiment N shown in Table 2 was mixed by adding 5, 1 or 2% by weight.
o. 2 to 7, 9 to 12 and 14 to 19 pastes were obtained.
【0022】得られた抵抗ペーストを、予め電極を形成
してあるアルミナ基板に所定のパターンで印刷し、乾
燥、焼成して抵抗被膜を形成し、−55℃,25℃,1
25℃での抵抗値の測定から面積抵抗値と抵抗温度係数
(TCR)を算出した。低温側TCR(CTCR)は−
55℃と25℃の間の抵抗温度係数であり、高温側TC
R(HTCR)は25℃と125℃の間のものである。
結果を表2にまとめて示す。The obtained resistance paste is printed in a predetermined pattern on an alumina substrate on which electrodes have been formed in advance, dried and baked to form a resistance film, and the resistance film is formed at -55 ° C, 25 ° C, 1 ° C.
The sheet resistance and the temperature coefficient of resistance (TCR) were calculated from the measurement of the resistance at 25 ° C. Low temperature side TCR (CTCR)-
Temperature coefficient of resistance between 55 ° C and 25 ° C, TC on high temperature side
R (HTCR) is between 25 ° C and 125 ° C.
The results are summarized in Table 2.
【0023】[0023]
【表2】 [Table 2]
【0024】表2よりガラス中に酸化錫又は酸化チタン
を含有せしめた場合、抵抗温度係数を負に過大にするこ
となく抵抗値の増大が可能なことが判る。It can be seen from Table 2 that when tin oxide or titanium oxide is contained in the glass, the resistance value can be increased without negatively increasing the temperature coefficient of resistance.
【0025】[0025]
【発明の効果】本発明により、導電粉末量が15重量%
以上で5MΩ/□以上の高抵抗領域を安定して実現でき
ることとなった。これによりノイズ、耐電圧等の性能を
損うことがなく、優れた抵抗器を製造することができる
ようになった。According to the present invention, the amount of conductive powder is 15% by weight.
With the above, a high resistance region of 5 MΩ / □ or more can be stably realized. As a result, excellent resistors can be manufactured without impairing performance such as noise and withstand voltage.
Claims (8)
/又はパイロクロア型ルテニウム酸塩を15〜50重量
%と、酸化鉛45〜75、酸化硅素25〜50、酸化硼
素0.1〜5各重量%を主成分とする硼硅酸鉛系ガラス
を85〜50重量%とを含有する厚膜抵抗ペーストにお
いて、該ガラス中に酸化錫及び/又は酸化チタンを0.
5〜5重量%含有することを特徴とする厚膜抵抗ペース
ト。1. Ruthenium oxide and / or pyrochlore-type ruthenate in a paste solid content is 15 to 50% by weight, and lead oxide is 45 to 75, silicon oxide is 25 to 50, and boron oxide is 0.1 to 5% by weight. In a thick film resistance paste containing 85 to 50% by weight of lead borosilicate glass whose main component is tin oxide, tin oxide and / or titanium oxide is contained in the glass in an amount of 0.
A thick film resistance paste containing 5 to 5% by weight.
ンタル、酸化ニオブ、チタン酸塩、タンタル酸塩及びニ
オブ酸塩の少くとも1種を0.1〜5重量%含有する請
求項1記載の厚膜抵抗ペースト。2. The paste solid content contains 0.1 to 5% by weight of at least one of titanium oxide, tantalum oxide, niobium oxide, titanate, tantalate and niobate. Thick film resistance paste.
リウム及び酸化ストロンチウムの少くとも1種を0.1
〜5重量%含有する請求項1又は2記載の厚膜抵抗ペー
スト。3. 0.1% of at least one of calcium oxide, barium oxide and strontium oxide is added to the glass.
The thick film resistor paste according to claim 1 or 2, containing 5 to 5% by weight.
量%含有する請求項1,2又は3記載の厚膜抵抗ペース
ト。4. The thick film resistance paste according to claim 1, wherein the glass contains 0.1 to 5% by weight of zinc oxide.
型ルテニウム酸塩を15〜50重量%と、酸化鉛45〜
75、酸化硅素25〜50、酸化硼素0.1〜5各重量
%を主成分とし、更に酸化錫及び/又は酸化チタンを
0.5〜5重量%含有する硼硅酸鉛系ガラスを85〜5
0重量%とを含有する抵抗被膜が、耐火性基体上に形成
されている厚膜抵抗器。5. A ruthenium oxide and / or a pyrochlore type ruthenate of 15 to 50% by weight and a lead oxide of 45 to 50% by weight.
75, silicon oxide 25 to 50, boron oxide 0.1 to 5% by weight as a main component, and tin oxide and / or titanium oxide 0.5 to 5% by weight lead borosilicate glass 85 to 85% 5
A thick film resistor having a resistance coating containing 0% by weight formed on a refractory substrate.
タル、酸化ニオブ、チタン酸塩、タンタル酸塩及びニオ
ブ酸塩の少くとも1種を0.1〜5重量%含有する請求
項5記載の厚膜抵抗器。6. The resistance coating according to claim 5, which contains 0.1 to 5% by weight of at least one of titanium oxide, tantalum oxide, niobium oxide, titanate, tantalate and niobate. Thick film resistor.
リウム及び酸化ストロンチウムの少くとも1種を0.1
〜5重量%含有する請求項5又は6記載の厚膜抵抗器。7. 0.1% of at least one of calcium oxide, barium oxide and strontium oxide in the glass.
The thick film resistor according to claim 5 or 6, containing 5 to 5% by weight.
量%含有する請求項5,6又は7記載の厚膜抵抗器。8. The thick film resistor according to claim 5, wherein the glass contains 0.1 to 5% by weight of zinc oxide.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3250212A JPH0562802A (en) | 1991-09-04 | 1991-09-04 | Thick-film resistive paste and thick film resistor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3250212A JPH0562802A (en) | 1991-09-04 | 1991-09-04 | Thick-film resistive paste and thick film resistor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0562802A true JPH0562802A (en) | 1993-03-12 |
Family
ID=17204494
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3250212A Pending JPH0562802A (en) | 1991-09-04 | 1991-09-04 | Thick-film resistive paste and thick film resistor |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0562802A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2013251535A (en) * | 2012-05-02 | 2013-12-12 | Semiconductor Energy Lab Co Ltd | Trimming resistor, reference voltage generating circuit and reference current generating circuit |
-
1991
- 1991-09-04 JP JP3250212A patent/JPH0562802A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2013251535A (en) * | 2012-05-02 | 2013-12-12 | Semiconductor Energy Lab Co Ltd | Trimming resistor, reference voltage generating circuit and reference current generating circuit |
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