JPH0564785U - Mechanism that keeps the temperature of the components and cables in the thermostatic chamber at the same temperature - Google Patents
Mechanism that keeps the temperature of the components and cables in the thermostatic chamber at the same temperatureInfo
- Publication number
- JPH0564785U JPH0564785U JP1284592U JP1284592U JPH0564785U JP H0564785 U JPH0564785 U JP H0564785U JP 1284592 U JP1284592 U JP 1284592U JP 1284592 U JP1284592 U JP 1284592U JP H0564785 U JPH0564785 U JP H0564785U
- Authority
- JP
- Japan
- Prior art keywords
- cable
- socket
- chamber
- temperature
- mounting plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000005855 radiation Effects 0.000 abstract description 3
- 238000012360 testing method Methods 0.000 description 4
- 238000010586 diagram Methods 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
Landscapes
- Testing Of Individual Semiconductor Devices (AREA)
- Tests Of Electronic Circuits (AREA)
Abstract
(57)【要約】
【目的】 ソケット取付板4の下にケーブル用室6を設
け、ケーブル用室6からケーブル5をソケット2に導
き、恒温槽1内の空気をケーブル用室6内に循環させ、
ケーブル5による放熱のため部品10の温度が下がらな
いようにする。
【構成】 ソケット取付板4は恒温槽1内に取り付けら
れ、部品10を挿入するソケット2が取り付けられ、ソ
ケット2を挟んで吸込口3Aと吸出口3Bをもつ。ケー
ブル用室6はソケット取付板4の下部に設けられ、ソケ
ット2に接続されるケーブル5が導かれる。ファン7は
恒温槽1内の空気をケーブル用室6内にも循環させる。
(57) [Abstract] [Purpose] The cable chamber 6 is provided under the socket mounting plate 4, the cable 5 is guided from the cable chamber 6 to the socket 2, and the air in the constant temperature bath 1 is circulated in the cable chamber 6. Let
Make sure that the temperature of the component 10 does not drop due to heat radiation by the cable 5. [Structure] A socket mounting plate 4 is mounted in a constant temperature bath 1, a socket 2 into which a component 10 is inserted is mounted, and a socket 2 has a suction port 3A and a suction port 3B. The cable chamber 6 is provided below the socket mounting plate 4, and the cable 5 connected to the socket 2 is guided. The fan 7 circulates the air in the constant temperature bath 1 also in the cable chamber 6.
Description
【0001】[0001]
この考案は、ICなどの部品を温度試験する場合に、部品と部品に接続される ケーブルを同じ温度にする機構についてのものである。 The present invention relates to a mechanism for making a component and a cable connected to the component have the same temperature when a component such as an IC is subjected to a temperature test.
【0002】[0002]
次に、従来技術による恒温槽の構成を図4により説明する。図4の11は恒温 槽、12はソケット取付板、2はソケット、5はケーブル、7はファン、9はヒ ータ、10はICなどの部品である。図4では、恒温槽11内にソケット取付板 12が取り付けられ、ソケット2に試験用のケーブル5が接続される。ソケット 2には温度試験を受ける部品10が挿入される。 Next, the structure of the constant temperature oven according to the prior art will be described with reference to FIG. Reference numeral 11 in FIG. 4 is a thermostat, 12 is a socket mounting plate, 2 is a socket, 5 is a cable, 7 is a fan, 9 is a heater, 10 is a component such as an IC. In FIG. 4, the socket mounting plate 12 is mounted in the constant temperature bath 11, and the test cable 5 is connected to the socket 2. The component 10 to be subjected to the temperature test is inserted into the socket 2.
【0003】[0003]
図4では、ファン7でヒータ9の熱を恒温槽11内に循環させるが、ケーブル 5が外気に触れるので、恒温槽11内を温度制御しても、外気温がケーブル5か ら部品10に伝導され、部品10が設定温度に達しないという問題がある。例え ば、外気温が20℃、設定温度が 120℃、設定温度分布が± 2℃の場合、ケーブル 5の放熱の影響で部品10が 118℃に達しないことがある。 In FIG. 4, the heat of the heater 9 is circulated in the constant temperature bath 11 by the fan 7, but since the cable 5 touches the outside air, even if the temperature inside the constant temperature bath 11 is controlled, the outside air temperature changes from the cable 5 to the part 10. There is a problem that the component 10 does not reach the set temperature due to conduction. For example, if the outside air temperature is 20 ° C, the set temperature is 120 ° C, and the set temperature distribution is ± 2 ° C, the heat radiation from the cable 5 may prevent the component 10 from reaching 118 ° C.
【0004】 ケーブル5による部品10の放熱をなくすため、ソケット取付板12を厚くす ると、ケーブル5がその分だけ長くなり、部品10を試験する高周波特性が悪く なる。この考案はソケット取付板12の下にケーブル用室を設け、このケーブル 用室からケーブル5をソケット2に導き、恒温槽11内の空気をこのケーブル用 室に循環させ、ケーブル5のために部品10の温度が下がらないようにすること を目的とする。If the socket mounting plate 12 is made thicker in order to eliminate the heat radiation of the component 10 due to the cable 5, the cable 5 becomes longer by that amount, and the high frequency characteristics for testing the component 10 deteriorate. This invention provides a cable chamber under the socket mounting plate 12, guides the cable 5 to the socket 2 from the cable chamber, circulates the air in the constant temperature chamber 11 to the cable chamber, and installs parts for the cable 5. The purpose is to prevent the temperature of 10 from dropping.
【0005】[0005]
この目的を達成するため、この考案では、恒温槽1内に取り付けられ、部品1 0を挿入するソケット2が取り付けられ、ソケット2を挟んで吸込口3Aと吸出 口3Bをもつソケット取付板4と、ソケット取付板4の下部に設けられ、ソケッ ト2に接続されるケーブル5が導かれるケーブル用室6と、恒温槽1内の空気を 循環させるファン7とを備え、恒温槽1内の空気をケーブル用室6内に循環させ る。 In order to achieve this object, in the present invention, a socket 2 which is installed in a constant temperature bath 1 and in which a component 10 is inserted is installed, and a socket mounting plate 4 having a suction port 3A and a suction port 3B with the socket 2 interposed therebetween. , A cable chamber 6 provided under the socket mounting plate 4 for guiding the cable 5 connected to the socket 2, and a fan 7 for circulating the air in the constant temperature chamber 1 Is circulated in the cable chamber 6.
【0006】[0006]
次に、この考案による恒温槽の構成を図1により説明する。図1の1は恒温槽 、3Aは吸込口、3Bは吸出口、4はソケット取付板、6はソケット取付板4の 下に設けられたケーブル用室であり、その他は図4と同じものである。図1の吸 込口3Aと吸出口3Bはソケット2を挟んでソケット取付板4にあけられる穴で あり、ソケット取付板4の下にケーブル用室6を設け、ケーブル5をケーブル用 室6からソケット2に導くものである。 Next, the structure of the constant temperature oven according to the present invention will be described with reference to FIG. 1 in FIG. 1 is a thermostatic chamber, 3A is a suction port, 3B is a suction port, 4 is a socket mounting plate, 6 is a cable chamber provided under the socket mounting plate 4, and the others are the same as those in FIG. is there. The suction port 3A and the suction port 3B in FIG. 1 are holes that are opened in the socket mounting plate 4 with the socket 2 interposed therebetween. A cable chamber 6 is provided under the socket mounting plate 4, and the cable 5 is moved from the cable chamber 6 It leads to the socket 2.
【0007】 次に、図1の主要部外観斜視図を図2に示す。図2から明らかなように、ケー ブル用室6内を恒温槽1内の空気が循環するので、ケーブル5が部品10と同じ 温度になり、外気に接するケーブル5によって部品10の温度が下がるのを防ぐ ことができる。Next, FIG. 2 shows an external perspective view of the main part of FIG. As is clear from FIG. 2, since the air in the thermostatic chamber 1 circulates in the cable chamber 6, the temperature of the cable 5 becomes the same as that of the component 10, and the temperature of the component 10 decreases due to the cable 5 contacting the outside air. Can be prevented.
【0008】 次に、この考案による他の恒温槽の構成を図3により説明する。図3は図1の 吸込口3Aにファン8を取り付けたものであり、ケーブル用室6内にファン8に より恒温槽1内の空気を強制的に循環させる。Next, the configuration of another constant temperature oven according to the present invention will be described with reference to FIG. In FIG. 3, a fan 8 is attached to the suction port 3A of FIG. 1, and the fan 8 forcibly circulates the air in the thermostatic chamber 1 in the cable chamber 6.
【0009】[0009]
この考案によれば、ソケット取付板の下にケーブル用室を設け、ケーブル用室 にケーブルを導き、恒温槽内の空気をケーブル用室に循環させるので、ケーブル が恒温槽内の部品と同じ温度になり、部品の温度がケーブルで下がるのを防ぐこ とができる。 According to this invention, the cable chamber is provided under the socket mounting plate, the cable is guided to the cable chamber, and the air in the constant temperature chamber is circulated to the cable chamber, so that the cable has the same temperature as the components in the constant temperature chamber. This will prevent the temperature of the parts from dropping with the cable.
【図1】この考案による恒温槽の構成図である。FIG. 1 is a block diagram of a constant temperature bath according to the present invention.
【図2】図1の主要部外観斜視図である。FIG. 2 is an external perspective view of the main part of FIG.
【図3】この考案による他の恒温槽の構成図である。FIG. 3 is a schematic view of another constant temperature oven according to the present invention.
【図4】従来技術による恒温槽の構成図である。FIG. 4 is a configuration diagram of a constant temperature oven according to a conventional technique.
1 恒温槽 2 ソケット 3A 吸込口 3B 吸出口 4 ソケット取付板 5 ケーブル 6 ケーブル用室 7 ファン 8 ファン 9 ヒータ 10 部品 1 Constant Temperature Bath 2 Socket 3A Suction Port 3B Suction Port 4 Socket Mounting Plate 5 Cable 6 Cable Chamber 7 Fan 8 Fan 9 Heater 10 Parts
Claims (2)
を挿入するソケット(2) が取り付けられ、ソケット(2)
を挟んで吸込口(3A)と吸出口(3B)をもつソケット取付板
(4) と、 ソケット取付板(4) の下部に設けられ、ソケット(2) に
接続されるケーブル(5) が導かれるケーブル用室(6)
と、 恒温槽(1) 内の空気を循環させる第1のファン(7) とを
備え、 恒温槽(1) 内の空気をケーブル用室(6) 内に循環させる
ことを特徴とする恒温槽内の部品とケーブルを同じ温度
にする機構。1. A component (10) mounted in a thermostatic chamber (1).
Insert the socket (2) and insert the socket (2)
Socket mounting plate with suction port (3A) and suction port (3B) sandwiching
(4) and a cable chamber (6) provided at the bottom of the socket mounting plate (4) for guiding the cable (5) connected to the socket (2).
And a first fan (7) for circulating the air in the constant temperature chamber (1), and the air in the constant temperature chamber (1) is circulated in the cable chamber (6). A mechanism that keeps the components inside and the cable at the same temperature.
け、ケーブル用室(6) 内に恒温槽(1) 内の空気を強制的
に循環させる請求項1記載の恒温槽内の部品とケーブル
を同じ温度にする機構。2. A thermostat according to claim 1, wherein a second fan (8) is attached to the suction port (3A), and the air in the thermostat (1) is forcedly circulated in the cable chamber (6). A mechanism that keeps the components inside and the cable at the same temperature.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1284592U JPH0564785U (en) | 1992-02-07 | 1992-02-07 | Mechanism that keeps the temperature of the components and cables in the thermostatic chamber at the same temperature |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1284592U JPH0564785U (en) | 1992-02-07 | 1992-02-07 | Mechanism that keeps the temperature of the components and cables in the thermostatic chamber at the same temperature |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0564785U true JPH0564785U (en) | 1993-08-27 |
Family
ID=11816733
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1284592U Pending JPH0564785U (en) | 1992-02-07 | 1992-02-07 | Mechanism that keeps the temperature of the components and cables in the thermostatic chamber at the same temperature |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0564785U (en) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61201451A (en) * | 1985-03-04 | 1986-09-06 | Hitachi Electronics Eng Co Ltd | Support structure of ic socket |
| JPH03137707A (en) * | 1989-10-24 | 1991-06-12 | Tabai Espec Corp | Temperature control method for thermostat for heating sample treatment |
-
1992
- 1992-02-07 JP JP1284592U patent/JPH0564785U/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61201451A (en) * | 1985-03-04 | 1986-09-06 | Hitachi Electronics Eng Co Ltd | Support structure of ic socket |
| JPH03137707A (en) * | 1989-10-24 | 1991-06-12 | Tabai Espec Corp | Temperature control method for thermostat for heating sample treatment |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US5486681A (en) | Device for heating up electronic boards | |
| US4336569A (en) | Control panel assembly | |
| KR100199218B1 (en) | Test head cooling system | |
| JP3970785B2 (en) | Carrier module for semiconductor element test handler and test tray having the same | |
| US5461540A (en) | Heat dissipation device for personal computers | |
| US6154042A (en) | Uniform temperature environmental testing apparatus for semiconductor devices | |
| US20070017230A1 (en) | Power supply with a cooling function | |
| CN208821142U (en) | A kind of cabinet using semiconductor cooler for heat dissipation | |
| JP2780818B2 (en) | Constant temperature bath | |
| JP2002286792A (en) | Semiconductor device mounting equipment | |
| CN218212281U (en) | Carbonization test box | |
| CN113905527B (en) | Resin plugging device and method for PCB | |
| JPH0537512Y2 (en) | ||
| CN223666644U (en) | An equipment box for an external circulation ventilation duct | |
| EP0181704A2 (en) | Domestic cookers | |
| JPH03188383A (en) | Heating tester for semiconductor element | |
| JPH0633430Y2 (en) | Temperature chamber for IC handler | |
| JPS6252327A (en) | Heating unit | |
| JPH05126901A (en) | Semiconductor testing device | |
| CN115389905A (en) | High-temperature latch-up effect detection system of integrated circuit | |
| CN216905793U (en) | Temperature regulating and controlling device for machine room cabinet | |
| JPH05136229A (en) | Burn-in equipment | |
| WO2016032512A1 (en) | Thermal management door assembly | |
| JPS63120417A (en) | Apparatus for manufacturing semiconductor | |
| KR200376961Y1 (en) | Heater for semiconductor test apparatus |