JPH0564905A - Manufacture of thermal head - Google Patents
Manufacture of thermal headInfo
- Publication number
- JPH0564905A JPH0564905A JP22926591A JP22926591A JPH0564905A JP H0564905 A JPH0564905 A JP H0564905A JP 22926591 A JP22926591 A JP 22926591A JP 22926591 A JP22926591 A JP 22926591A JP H0564905 A JPH0564905 A JP H0564905A
- Authority
- JP
- Japan
- Prior art keywords
- heat
- layer
- thermal head
- heat generating
- heating resistor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 16
- 238000010438 heat treatment Methods 0.000 claims abstract description 55
- 239000004020 conductor Substances 0.000 claims abstract description 33
- 239000000758 substrate Substances 0.000 claims abstract description 30
- 239000000463 material Substances 0.000 claims description 26
- 238000000034 method Methods 0.000 claims description 5
- 230000015572 biosynthetic process Effects 0.000 abstract description 3
- 239000010410 layer Substances 0.000 description 63
- 239000010408 film Substances 0.000 description 15
- 230000001681 protective effect Effects 0.000 description 13
- 238000005299 abrasion Methods 0.000 description 7
- 238000010586 diagram Methods 0.000 description 5
- 229920001721 polyimide Polymers 0.000 description 5
- 238000004544 sputter deposition Methods 0.000 description 5
- 229910018509 Al—N Inorganic materials 0.000 description 4
- 238000005530 etching Methods 0.000 description 4
- PNEYBMLMFCGWSK-UHFFFAOYSA-N Alumina Chemical compound [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 3
- 239000012790 adhesive layer Substances 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- 239000009719 polyimide resin Substances 0.000 description 3
- 239000010409 thin film Substances 0.000 description 3
- 239000004642 Polyimide Substances 0.000 description 2
- 229910004298 SiO 2 Inorganic materials 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 238000000206 photolithography Methods 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 230000035939 shock Effects 0.000 description 2
- 229910001220 stainless steel Inorganic materials 0.000 description 2
- 239000010935 stainless steel Substances 0.000 description 2
- 238000007740 vapor deposition Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910018557 Si O Inorganic materials 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000007864 aqueous solution Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000020169 heat generation Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 238000012827 research and development Methods 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 230000004043 responsiveness Effects 0.000 description 1
- LIVNPJMFVYWSIS-UHFFFAOYSA-N silicon monoxide Inorganic materials [Si-]#[O+] LIVNPJMFVYWSIS-UHFFFAOYSA-N 0.000 description 1
- 238000009751 slip forming Methods 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
Landscapes
- Electronic Switches (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、プリンタ、ファクシミ
リ等における発熱抵抗体を電気的に発熱させることによ
って印字を行うサーマルヘッドの製造方法に関するもの
である。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of manufacturing a thermal head for printing by electrically heating a heating resistor in a printer, a facsimile or the like.
【０００２】[0002]
【従来の技術】従来、感熱式のプリンタにおいては、基
板上に１又は複数の発熱抵抗体を設けてサーマルヘッド
を形成し、電極導体を介して上記発熱抵抗体に駆動電流
を流すことによって発熱させ、この熱を利用して感熱記
録紙に印字したり、熱転写フィルムによって熱転写して
印字することができる。そして、発熱抵抗体と基板間に
保温層が形成され、発熱抵抗体が発生した熱が上記保温
層に蓄熱されるようになっている（柴田進著「サーマル
ヘッド技術」、沖電気研究開発第１２６号、Ｖｏｌ．５
２，Ｎｏ．２，１９８５参照）。2. Description of the Related Art Conventionally, in a thermal printer, one or a plurality of heating resistors are provided on a substrate to form a thermal head, and a driving current is passed through the heating resistors via electrode conductors to generate heat. Then, the heat can be used to print on a heat-sensitive recording paper, or can be transferred by a heat transfer film to print. A heat insulating layer is formed between the heat generating resistor and the substrate, and the heat generated by the heat generating resistor is stored in the heat insulating layer (Susumu Shibata, "Thermal Head Technology", Oki Electric Research and Development No. 1). No. 126, Vol.5
2, No. 2, 1985).
【０００３】図２は従来のサーマルヘッドの概略図であ
る。図の（ａ）はサーマルヘッドの平面を、（ｂ）はサ
ーマルヘッドの断面を示している。図において、斜線で
示した部分Ａが発熱部分であり、両側に電極導体部分Ｂ
が形成され、外部駆動回路と接続される。１は基板であ
り、耐熱性があり、熱伝導性の良好なアルミナセラミッ
クが用いられる。２は上記基板１の上に形成された保温
層であり、熱効率及び熱応答性を決定する重要な働きを
しており、薄膜型のサーマルヘッドでは表面平滑度をも
得るためにグレーズガラス層が用いられている。上記保
温層２の上には発熱抵抗体３が形成され、該発熱抵抗体
３の上に電極導体４が形成される。薄膜型のサーマルヘ
ッドにおいては、発熱抵抗体３にＴａ−Ｓｉ、Ｔａ
2 Ｎ、Ｔａ−Ｓｉ−Ｏ等が用いられている。また、電極
導体４にはＡｕ、Ａｌ等が使用され、発熱部分Ａ以外の
電気抵抗を下げている。発熱抵抗体３は、高温の熱衝撃
を受けるため、酸化して抵抗値が変化しやすい。保護膜
５はこの変化を抑制するために形成される膜であり、Ｓ
ｉＯ2 などが用いられる。最上層に形成された耐摩耗層
６は、サーマルヘッドを用いて図示しない感熱記録紙に
印字する時に、感熱記録紙との摩擦によって発熱抵抗体
３が摩耗しないように形成されており、耐摩耗性が良
く、下地との密着性が良好なＴａ2 Ｏ5 、ＳｉＣ等が用
いられている。FIG. 2 is a schematic view of a conventional thermal head. In the figure, (a) shows the plane of the thermal head, and (b) shows the cross section of the thermal head. In the figure, a shaded portion A is a heat generating portion, and electrode conductor portions B are provided on both sides.
Is formed and is connected to an external drive circuit. Reference numeral 1 is a substrate, and an alumina ceramic having heat resistance and good thermal conductivity is used. Reference numeral 2 is a heat insulating layer formed on the substrate 1 and plays an important role in determining thermal efficiency and thermal response. In a thin film type thermal head, a glaze glass layer is provided to obtain surface smoothness. It is used. A heating resistor 3 is formed on the heat retaining layer 2, and an electrode conductor 4 is formed on the heating resistor 3. In the thin film type thermal head, Ta-Si, Ta and
2 N, Ta-Si-O or the like is used. Further, Au, Al or the like is used for the electrode conductor 4 to reduce the electric resistance other than the heat generating portion A. Since the heating resistor 3 is subjected to a high temperature thermal shock, it is easily oxidized and its resistance value changes. The protective film 5 is a film formed to suppress this change.
iO 2 or the like is used. The abrasion resistant layer 6 formed on the uppermost layer is formed so that the heating resistor 3 is not worn by friction with the thermal recording paper when printing on the thermal recording paper (not shown) using a thermal head. Ta 2 O 5 , SiC, etc., which have good properties and have good adhesion to the base, are used.
【０００４】図３は従来のサーマルヘッドにおける製造
工程の状態図である。図の（ａ）は保温層２を形成する
状態を、（ｂ）及び（ｃ）は発熱抵抗体３及び電極導体
４を形成する状態を、（ｄ）は保護膜５を形成する状態
を、（ｅ）は耐摩耗層６を形成する状態を示している。
図において、アルミナセラミックの基板１の上に、保温
層２として基板１の全面又は発熱部分Ａ（図２）にガラ
スを主成分とするグレーズ層を印刷法などによって形成
し、焼成する。次に、発熱抵抗体３をスパッタ法などに
よって形成し、更に電極導体４を蒸着法などによって形
成する。その後、ホトリソグラフィ、エッチング等によ
って図２の（ａ）に示すような発熱抵抗体パターンを形
成する。次に、図示しない外部駆動回路と接触させられ
る電極導体部分Ｂ以外の発熱部分Ａの周辺に、スパッタ
法などによって保護膜５を形成する。最後に保護膜５と
同じ部分又は感熱記録紙の接触する部分にスパッタ法に
よって耐摩耗層６を形成し、完成させる。FIG. 3 is a state diagram of a manufacturing process in a conventional thermal head. In the figure, (a) shows a state where the heat insulating layer 2 is formed, (b) and (c) show a state where the heating resistor 3 and the electrode conductor 4 are formed, and (d) shows a state where the protective film 5 is formed. (E) shows a state in which the abrasion resistant layer 6 is formed.
In the figure, a glaze layer containing glass as a main component is formed on the entire surface of the substrate 1 or the heat generating portion A (FIG. 2) as the heat retaining layer 2 on the alumina ceramic substrate 1 by a printing method or the like, and is baked. Next, the heating resistor 3 is formed by a sputtering method or the like, and the electrode conductor 4 is further formed by a vapor deposition method or the like. Then, a heating resistor pattern as shown in FIG. 2A is formed by photolithography, etching or the like. Next, the protective film 5 is formed around the heat generating portion A other than the electrode conductor portion B which is brought into contact with an external driving circuit (not shown) by a sputtering method or the like. Finally, the abrasion resistant layer 6 is formed by the sputter method on the same portion as the protective film 5 or on the portion in contact with the thermal recording paper, and is completed.
【０００５】[0005]
【発明が解決しようとする課題】しかしながら、上記従
来のサーマルヘッドの製造方法においては、感熱記録紙
の送り方向の印字密度を高めるために発熱部分Ａの長さ
を短くすると、電極導体４の厚さによって感熱記録紙と
発熱部分Ａの間に空間が生じ、熱効率が低下する。ま
た、電極導体４の発熱部分Ａ側の端部が異常摩耗して保
護膜５が破損し、発熱抵抗体３の抵抗値が変化しやすく
なる。However, in the above-described conventional method of manufacturing a thermal head, if the length of the heat generating portion A is shortened in order to increase the printing density in the feeding direction of the thermal recording paper, the thickness of the electrode conductor 4 is reduced. As a result, a space is created between the heat-sensitive recording paper and the heat generating portion A, and the thermal efficiency is reduced. Further, the end portion of the electrode conductor 4 on the heat generating portion A side is abnormally worn, the protective film 5 is damaged, and the resistance value of the heat generating resistor 3 is likely to change.
【０００６】また、サーマルヘッドの印字速度を向上さ
せるため、保温層２にガラスより熱伝導の悪いホリイミ
ド樹脂などを用い、更に駆動回路のＣＭＯＳ化のため発
熱抵抗体３にＴｉ−Ｂ−Ｎ、Ｔｉ−Ａｌ−Ｎ等の高抵抗
材料を用いた場合、従来の製造方法のように先に保温層
２を形成すると、発熱抵抗体３の材料のＴＣＲ（Temper
ature Coefficient of Resistance)を改善するのに必要
な熱処理を行うことができない。Further, in order to improve the printing speed of the thermal head, a heat-insulating layer 2 is made of, for example, a polyimide resin having a poorer thermal conductivity than glass, and a heating resistor 3 is made of Ti-B-N to make the driving circuit CMOS. When a high resistance material such as Ti-Al-N is used, if the heat retaining layer 2 is formed first as in the conventional manufacturing method, the TCR (Temper) of the material of the heating resistor 3 is formed.
The heat treatment required to improve the ature coefficient of resistance cannot be performed.
【０００７】本発明は、上記従来のサーマルヘッドの製
造方法の問題点を解決して、紙送り方向の印字密度を高
くすることができ、消費電力が少なく、高速で印字を行
うことができるとともに、サーマルヘッドを製造する際
に熱処理を行うことが可能なサーマルヘッドの製造方法
を提供することを目的とする。The present invention solves the above-mentioned problems of the conventional thermal head manufacturing method, can increase the printing density in the paper feed direction, consumes less power, and can perform printing at high speed. An object of the present invention is to provide a method of manufacturing a thermal head, which is capable of performing heat treatment when manufacturing the thermal head.
【０００８】[0008]
【課題を解決するための手段】そのために、本発明のサ
ーマルヘッドの製造方法においては、基板とは別に用意
した形成基材の上に、発熱抵抗体を保護するための少な
くとも１層から成る外側層を形成し、上記外側層の上に
発熱抵抗体を形成して該発熱抵抗体の上に電極導体を形
成する。次に、該電極導体を包囲するように上記発熱抵
抗体の上から保温層を形成する。Therefore, in the method of manufacturing a thermal head according to the present invention, an outer side composed of at least one layer for protecting the heating resistor is formed on a base material prepared separately from the substrate. A layer is formed, a heating resistor is formed on the outer layer, and an electrode conductor is formed on the heating resistor. Next, a heat insulating layer is formed on the heating resistor so as to surround the electrode conductor.
【０００９】上記外側層、発熱抵抗体、電極導体及び保
温層によって発熱部が構成される。そして、該発熱部を
反転させて保温層側を基板に接着し、上記形成基材を除
去する。A heating portion is constituted by the outer layer, the heating resistor, the electrode conductor and the heat retaining layer. Then, the heat generating portion is inverted and the heat insulating layer side is adhered to the substrate, and the forming base material is removed.
【００１０】[0010]
【作用】本発明によれば、上記のように基板とは別に用
意した形成基材の上に、発熱抵抗体を保護するための少
なくとも１層から成る外側層を形成し、上記外側層の上
に発熱抵抗体を形成して該発熱抵抗体の上に電極導体を
形成する。この段階で、発熱抵抗体を熱処理することが
できる。According to the present invention, an outer layer consisting of at least one layer for protecting the heating resistor is formed on the base material prepared separately from the substrate as described above, and the outer layer is formed on the outer layer. A heating resistor is formed on the electrode, and an electrode conductor is formed on the heating resistor. At this stage, the heating resistor can be heat treated.
【００１１】次に、該電極導体を包囲するように上記発
熱抵抗体の上から保温層を形成する。したがって、保温
層を形成する前に熱処理を施しておけば保温層が熱処理
の影響を受けることはない。続いて、上記外側層、発熱
抵抗体、電極導体及び保温層によって構成された発熱部
を反転させて保温層側を基板に接着し、上記形成基材を
除去する。Next, a heat insulating layer is formed on the heating resistor so as to surround the electrode conductor. Therefore, if heat treatment is performed before forming the heat retaining layer, the heat retaining layer is not affected by the heat treatment. Subsequently, the heat generating portion constituted by the outer layer, the heat generating resistor, the electrode conductor and the heat retaining layer is inverted to bond the heat retaining layer side to the substrate, and the forming base material is removed.
【００１２】このようにして、基板の上に保温層、電極
導体、発熱抵抗体及び外側層が順に積層される。In this way, the heat insulating layer, the electrode conductor, the heating resistor and the outer layer are sequentially laminated on the substrate.
【００１３】[0013]
【実施例】以下、本発明の実施例について図面を参照し
ながら詳細に説明する。図１は本発明のサーマルヘッド
の概略図である。図の（ａ）はサーマルヘッドの平面
を、（ｂ）はサーマルヘッドの断面を示している。図の
（ａ）において、斜線で示した部分Ｃが発熱抵抗体形成
領域で、発熱抵抗体の下部において電極導体が形成され
ている部分以外が発熱部分Ｄとなる。Embodiments of the present invention will now be described in detail with reference to the drawings. FIG. 1 is a schematic diagram of a thermal head of the present invention. In the figure, (a) shows the plane of the thermal head, and (b) shows the cross section of the thermal head. In (a) of the figure, a hatched portion C is a heating resistor forming region, and a portion other than the portion below the heating resistor where the electrode conductor is formed is a heating portion D.
【００１４】図の（ｂ）において、１１は熱伝導性の良
好なアルミナセラミックなどを用いた基板である。後述
するように、別の形成基材で形成された発熱積層部１０
が接着層１２によって上記基板１１に転写され、はり着
けられる。保温層１３は熱効率及び熱応答性を決める重
要な働きをしており、ここでは耐熱性を有するポリイミ
ド樹脂などを用いている。上記保温層１３の上部には保
温層１３に埋め込まれた電極導体１４が形成されてい
る。発熱抵抗体１５は電極導体１４及び保温層１３の上
に形成され、図１の（ａ）に示すようにパターン化され
ている。消費電力が少ない薄膜型のサーマルヘッドでは
発熱抵抗体１５にＴａ−Ｂ−Ｎ、Ｔｉ−Ａｌ−Ｎ等が用
いられる。また、電極導体１４にはＡｕ、Ａｌ等が使用
され、発熱部分Ｄ以外の電気抵抗を下げている。In FIG. 1B, reference numeral 11 is a substrate made of alumina ceramic or the like having good thermal conductivity. As will be described later, the heat generating laminated portion 10 formed of another forming base material.
Are transferred to the substrate 11 by the adhesive layer 12 and attached. The heat insulating layer 13 plays an important role in determining heat efficiency and heat responsiveness, and here, a polyimide resin having heat resistance is used. An electrode conductor 14 embedded in the heat retaining layer 13 is formed on the heat retaining layer 13. The heating resistor 15 is formed on the electrode conductor 14 and the heat insulating layer 13, and is patterned as shown in FIG. In the thin film type thermal head with low power consumption, Ta-BN, Ti-Al-N, or the like is used for the heating resistor 15. Further, Au, Al or the like is used for the electrode conductor 14 to reduce the electric resistance except for the heat generating portion D.
【００１５】上記発熱抵抗体１５は、高温の熱衝撃を受
けるため、酸化して抵抗値が変化しやすい。保護膜１６
はこの変化を抑制するために形成され、ＳｉＯ2 などが
用いられる。最上層に形成される耐摩耗層１７は、サー
マルヘッドを用いて感熱記録紙（図示しない）に印字す
る時に、感熱記録紙との摩擦によって発熱抵抗体１５が
摩耗しないように形成されており、耐摩耗性が良く、下
地との密着性が良好なＴａ2 Ｏ5 、ＳｉＣ等が用いられ
ている。Since the heating resistor 15 receives a high temperature thermal shock, it is easily oxidized and its resistance value is changed. Protective film 16
Is formed to suppress this change, and SiO 2 or the like is used. The abrasion resistant layer 17 formed on the uppermost layer is formed so that the heating resistor 15 is not worn by friction with the thermal recording paper when printing on the thermal recording paper (not shown) using a thermal head. Ta 2 O 5 , SiC or the like, which has good wear resistance and good adhesion to the base, is used.
【００１６】図４は本発明のサーマルヘッドにおける製
造工程の状態図である。図の（ａ）は剥離層２８を形成
した状態を、（ｂ）は耐摩耗層１７、保護膜１６及び発
熱抵抗体１５を形成した状態を、（ｃ）は電極導体１４
を形成した状態を、（ｄ）は保温層１３を形成した状態
を、（ｅ）は発熱積層部１０をはり着けた状態を、
（ｆ）は剥離層２８を除去した状態を示している。FIG. 4 is a state diagram of the manufacturing process in the thermal head of the present invention. In the figure, (a) shows a state in which the peeling layer 28 is formed, (b) shows a state in which the abrasion resistant layer 17, the protective film 16 and the heating resistor 15 are formed, and (c) shows the electrode conductor 14.
Is formed, (d) is a state in which the heat insulating layer 13 is formed, (e) is a state in which the heat generating laminated portion 10 is attached,
(F) shows a state in which the peeling layer 28 is removed.
【００１７】まず、サーマルヘッドの基板１１（図１）
とは異なる発熱積層部１０を形成するための形成基材２
０を用意する。この形成基材２０は、後述する発熱抵抗
体１５のための熱処理に耐えられる材料で形成され、剥
離層２８の形成及び剥離が容易であるものがよく、ここ
ではステンレス材を用いる。上記形成基材２０の表面を
鏡面研磨し、表面に剥離層２８を均一に形成するため、
ＫＯＨの水溶液で表面処理する。そして、形成基材２０
を陰極にし、電解銅めっきで剥離層２８を形成する。該
剥離層２８の厚さは１０〜２０μｍ程度がよい。First, the substrate 11 of the thermal head (FIG. 1)
A base material 2 for forming a heat-generating laminated portion 10 different from
Prepare 0. The forming base material 20 is preferably made of a material that can withstand heat treatment for the heating resistor 15 described later, and can easily form and separate the peeling layer 28. Here, a stainless steel material is used. In order to mirror-polish the surface of the forming base material 20 and uniformly form the release layer 28 on the surface,
Surface treatment with an aqueous solution of KOH. And the forming substrate 20
Is used as a cathode, and the release layer 28 is formed by electrolytic copper plating. The thickness of the peeling layer 28 is preferably about 10 to 20 μm.
【００１８】剥離層２８を形成した形成基板２０を洗浄
し、乾燥した後、その表面にＴａ2 Ｏ5 などの材料を用
い、スパッタ法で耐摩耗層１７を約５μｍ程度形成す
る。次に、ＳｉＯ2 などの材料を用い、スパッタ法で保
護膜１６を約２μｍ程度形成する。上記耐摩耗層１７及
び保護膜１６は同一装置内で連続的に形成することが望
ましい。The formed substrate 20 having the peeling layer 28 formed thereon is washed and dried, and then a wear resistant layer 17 is formed on the surface thereof by a sputtering method to a thickness of about 5 μm using a material such as Ta 2 O 5 . Next, a protective film 16 of about 2 μm is formed by a sputtering method using a material such as SiO 2 . It is desirable that the abrasion resistant layer 17 and the protective film 16 be continuously formed in the same apparatus.
【００１９】低消費電力型のサーマルヘッドにおいて
は、発熱抵抗体１５にＴｉ−Ｂ−Ｎ、Ｔｉ−Ａｌ−Ｎ等
の高抵抗材料を用い、駆動用ＩＣをＣＭＯＳ化すること
が必要である。しかし、上記高抵抗材料は、形成直後の
ＴＣＲが高く、ＴＣＲを低くするための熱処理を必要と
する。このような高抵抗材料を用いて発熱抵抗体１５を
形成するには、まずスパッタ法などで保護膜１６上に発
熱抵抗体１５を形成し、真空中又は無酸素雰囲気中で５
００°Ｃ以上の温度で熱処理する。In the low power consumption type thermal head, it is necessary to use a high resistance material such as Ti-BN or Ti-Al-N for the heating resistor 15 and to make the driving IC CMOS. However, the high resistance material has a high TCR immediately after formation, and requires heat treatment to reduce the TCR. In order to form the heat generating resistor 15 using such a high resistance material, first, the heat generating resistor 15 is formed on the protective film 16 by a sputtering method or the like, and the heat generating resistor 15 is formed in vacuum or in an oxygen-free atmosphere.
Heat treatment is performed at a temperature of 00 ° C or higher.
【００２０】次に、電極導体１４を蒸着法などで形成
し、その後ホトリソグラフィ、エッチング等によって図
１（ａ）に示すような発熱抵抗体パターンを形成する。
その次に、ワニス状のポリイミド樹脂などを塗布し、焼
成して保温層１３を形成する。以上示したような形成基
材２０上に形成された発熱積層部１０を、ポリイミド系
などの接着剤を塗布して形成した接着層１２を有する基
板１１に当接させ、加圧し加熱しながら接着する。Next, the electrode conductor 14 is formed by a vapor deposition method or the like, and then a heating resistor pattern as shown in FIG. 1A is formed by photolithography, etching or the like.
Next, a varnish-like polyimide resin or the like is applied and baked to form the heat retaining layer 13. The heat generating laminated portion 10 formed on the forming base material 20 as described above is brought into contact with the substrate 11 having the adhesive layer 12 formed by applying an adhesive such as a polyimide-based material, and is bonded under pressure and heating. To do.
【００２１】最後に、形成基材２０と剥離層２８の界面
で両者を剥離し、剥離層２８及び体摩耗層１７、保護膜
１６の外部駆動回路との接続駆動回路との接続位置とな
る部分をエッチングによって除去し、サーマルヘッドを
完成する。なお、本発明は上記実施例に限定されるもの
ではなく、本発明の趣旨に基づいて種々変形することが
可能であり、これらを本発明の範囲から排除するもので
はない。Lastly, the base material 20 and the peeling layer 28 are peeled from each other at the interface, and the peeling layer 28, the body abrasion layer 17, and the protective film 16 are connected to the external driving circuit. Are removed by etching to complete the thermal head. It should be noted that the present invention is not limited to the above-described embodiments, and various modifications can be made based on the spirit of the present invention, and these are not excluded from the scope of the present invention.
【００２２】例えば、上記実施例においては形成基材２
０にステンレス材を用い、剥離層２８を介して発熱積層
部１０を形成しているが、形成基材２０上に直接発熱積
層部１０を形成し、サーマルヘッドの基板１１に発熱積
層部１０を反転させ、はり着けた後、形成基材２０をエ
ッチングによって除去してもよい。さらに、熱処理を必
要としない発熱抵抗体１５を用いたサーマルヘッドを製
造する場合は、形成基材２０は耐熱性を有していない樹
脂とすることができる。For example, in the above embodiment, the forming substrate 2
Although the heat-generating laminated portion 10 is formed by using a stainless steel material for the heat generating laminated body 0 through the peeling layer 28, the heat-generating laminated portion 10 is formed directly on the forming substrate 20 and the heat-generating laminated portion 10 is formed on the substrate 11 of the thermal head. After being inverted and attached, the forming substrate 20 may be removed by etching. Further, in the case of manufacturing a thermal head using the heating resistor 15 that does not require heat treatment, the forming base material 20 can be made of a resin having no heat resistance.
【００２３】[0023]
【発明の効果】以上詳細に説明したように、本発明によ
れば、形成基材の上に、順に外側層、発熱抵抗体、電極
導体を形成し、該電極導体を包囲するように上記発熱抵
抗体の上から保温層を形成する。続いて、上記外側層、
発熱抵抗体、電極導体及び保温層によって構成された発
熱部を反転させて保温層側を基板に接着し、上記形成基
材を除去する。As described in detail above, according to the present invention, an outer layer, a heating resistor and an electrode conductor are sequentially formed on a forming substrate, and the heat generation is performed so as to surround the electrode conductor. A heat insulating layer is formed on the resistor. Then, the outer layer,
The heat generating portion constituted by the heat generating resistor, the electrode conductor and the heat retaining layer is inverted and the heat retaining layer side is adhered to the substrate, and the forming base material is removed.
【００２４】したがって、感熱記録紙の送り方向の印字
密度を高めるため発熱部分の長さを短くした場合でも発
熱部分の表面は平坦で、感光記録紙と発熱部分の間に空
間が発生せず、熱効率が低下しない。また、発熱部分の
表面が平坦になるため、感熱記録紙を送る際に発熱部分
側の電極導体の端部が異常摩耗せず、保護膜の破損もな
く、発熱抵抗体の抵抗値が変化しない。さらに、サーマ
ルヘッドの印字速度を向上させるため、保温層にポリイ
ミドなどの樹脂を用いた場合においても、発熱抵抗体に
Ｔｉ−Ｂ−Ｎ、Ｔｉ−Ａｌ−Ｎ等の高抵抗材料を用い、
熱処理を施すことができるため、駆動回路をＣＭＯＳ化
した低消費電力型のサーマルヘッドを製造することがで
きる。Therefore, even if the length of the heat generating portion is shortened in order to increase the printing density in the feeding direction of the heat sensitive recording paper, the surface of the heat generating portion is flat and no space is generated between the photosensitive recording paper and the heat generating portion. Thermal efficiency does not decrease. Also, since the surface of the heat generating part is flat, the end of the electrode conductor on the heat generating part side does not abnormally wear when the thermal recording paper is fed, the protective film does not break, and the resistance value of the heat generating resistor does not change. .. Further, in order to improve the printing speed of the thermal head, even when a resin such as polyimide is used for the heat retaining layer, a high resistance material such as Ti-BN or Ti-Al-N is used for the heating resistor,
Since the heat treatment can be performed, it is possible to manufacture a low power consumption type thermal head having a CMOS drive circuit.
【図１】本発明のサーマルヘッドの概略図である。FIG. 1 is a schematic view of a thermal head of the present invention.
【図２】従来のサーマルヘッドの概略図である。FIG. 2 is a schematic view of a conventional thermal head.
【図３】従来のサーマルヘッドにおける製造工程の状態
図である。FIG. 3 is a state diagram of a manufacturing process in a conventional thermal head.
【図４】本発明のサーマルヘッドにおける製造工程の状
態図である。FIG. 4 is a state diagram of a manufacturing process in the thermal head of the present invention.
１１ 基板 １２ 接着層 １３ 保温層 １４ 電極導体 １５ 発熱抵抗体 １６ 保護膜 １７ 耐摩耗層 ２０ 形成基材 11 Substrate 12 Adhesive Layer 13 Heat-Retaining Layer 14 Electrode Conductor 15 Heating Resistor 16 Protective Film 17 Wear-Resistant Layer 20 Base Material
───────────────────────────────────────────────────── フロントページの続き (72)発明者 金森 孝史 東京都港区虎ノ門１丁目７番12号 沖電気 工業株式会社内 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Takashi Kanamori 1-7-12 Toranomon, Minato-ku, Tokyo Oki Electric Industry Co., Ltd.
Claims (1)
するための少なくとも１層から成る外側層を形成し、 （ｂ）上記外側層の上に発熱抵抗体を形成し、 （ｃ）該発熱抵抗体の上に電極導体を形成し、 （ｄ）該電極導体を包囲して保温層を形成し、 （ｅ）上記外側層、発熱抵抗体、電極導体及び保温層か
ら成る発熱部を反転させて保温層側を基板に接着し、 （ｆ）上記形成基材を除去することを特徴とするサーマ
ルヘッドの製造方法。1. An (a) outer layer consisting of at least one layer for protecting the heating resistor is formed on the forming substrate, and (b) a heating resistor is formed on the outer layer, c) forming an electrode conductor on the heating resistor, (d) surrounding the electrode conductor to form a heat retaining layer, and (e) generating heat from the outer layer, the heating resistor, the electrode conductor and the heat retaining layer. A method for manufacturing a thermal head, characterized in that the heat insulating layer side is adhered to the substrate by reversing the portions, and (f) the forming base material is removed.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP22926591A JPH0564905A (en) | 1991-09-10 | 1991-09-10 | Manufacture of thermal head |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP22926591A JPH0564905A (en) | 1991-09-10 | 1991-09-10 | Manufacture of thermal head |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0564905A true JPH0564905A (en) | 1993-03-19 |
Family
ID=16889408
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP22926591A Withdrawn JPH0564905A (en) | 1991-09-10 | 1991-09-10 | Manufacture of thermal head |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0564905A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6184913B1 (en) | 1997-07-23 | 2001-02-06 | Tdk Corporation | Thermal head and method of manufacturing the same |
| US6344868B1 (en) * | 1997-07-23 | 2002-02-05 | Tdk Corporation | Thermal head and method of manufacturing the same |
| US6407764B1 (en) | 1996-12-19 | 2002-06-18 | Tdk Corporation | Thermal head and method of manufacturing the same |
| CN113386469A (en) * | 2020-03-11 | 2021-09-14 | 深圳市博思得科技发展有限公司 | Thermal print head and method of manufacturing the same |
| CN113386470A (en) * | 2020-03-11 | 2021-09-14 | 深圳市博思得科技发展有限公司 | Thermal print head and method of manufacturing the same |
-
1991
- 1991-09-10 JP JP22926591A patent/JPH0564905A/en not_active Withdrawn
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6407764B1 (en) | 1996-12-19 | 2002-06-18 | Tdk Corporation | Thermal head and method of manufacturing the same |
| US6184913B1 (en) | 1997-07-23 | 2001-02-06 | Tdk Corporation | Thermal head and method of manufacturing the same |
| US6344868B1 (en) * | 1997-07-23 | 2002-02-05 | Tdk Corporation | Thermal head and method of manufacturing the same |
| US6614460B2 (en) | 1997-07-23 | 2003-09-02 | Tdk Corporation | Thermal head and method of manufacturing the same |
| CN113386469A (en) * | 2020-03-11 | 2021-09-14 | 深圳市博思得科技发展有限公司 | Thermal print head and method of manufacturing the same |
| CN113386470A (en) * | 2020-03-11 | 2021-09-14 | 深圳市博思得科技发展有限公司 | Thermal print head and method of manufacturing the same |
| CN113386469B (en) * | 2020-03-11 | 2022-07-01 | 深圳市博思得科技发展有限公司 | Thermal print head and method of manufacturing the same |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A300 | Withdrawal of application because of no request for examination |
Free format text: JAPANESE INTERMEDIATE CODE: A300 Effective date: 19981203 |