JPH0566016B2 - - Google Patents

Info

Publication number
JPH0566016B2
JPH0566016B2 JP3036487A JP3648791A JPH0566016B2 JP H0566016 B2 JPH0566016 B2 JP H0566016B2 JP 3036487 A JP3036487 A JP 3036487A JP 3648791 A JP3648791 A JP 3648791A JP H0566016 B2 JPH0566016 B2 JP H0566016B2
Authority
JP
Japan
Prior art keywords
support plate
cavity
resin
mold
gate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP3036487A
Other languages
English (en)
Japanese (ja)
Other versions
JPH04211139A (ja
Inventor
Takaaki Yokoyama
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sanken Electric Co Ltd
Original Assignee
Sanken Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sanken Electric Co Ltd filed Critical Sanken Electric Co Ltd
Priority to JP3036487A priority Critical patent/JPH04211139A/ja
Publication of JPH04211139A publication Critical patent/JPH04211139A/ja
Publication of JPH0566016B2 publication Critical patent/JPH0566016B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/015—Manufacture or treatment of bond wires
    • H10W72/01515—Forming coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
JP3036487A 1991-02-07 1991-02-07 樹脂封止形半導体装置の製造方法 Granted JPH04211139A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3036487A JPH04211139A (ja) 1991-02-07 1991-02-07 樹脂封止形半導体装置の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3036487A JPH04211139A (ja) 1991-02-07 1991-02-07 樹脂封止形半導体装置の製造方法

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP59122047A Division JPS612348A (ja) 1984-06-15 1984-06-15 樹脂封止形半導体装置の製造方法

Publications (2)

Publication Number Publication Date
JPH04211139A JPH04211139A (ja) 1992-08-03
JPH0566016B2 true JPH0566016B2 (2) 1993-09-20

Family

ID=12471182

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3036487A Granted JPH04211139A (ja) 1991-02-07 1991-02-07 樹脂封止形半導体装置の製造方法

Country Status (1)

Country Link
JP (1) JPH04211139A (2)

Also Published As

Publication number Publication date
JPH04211139A (ja) 1992-08-03

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Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees