JPH056660Y2 - - Google Patents
Info
- Publication number
- JPH056660Y2 JPH056660Y2 JP1986195655U JP19565586U JPH056660Y2 JP H056660 Y2 JPH056660 Y2 JP H056660Y2 JP 1986195655 U JP1986195655 U JP 1986195655U JP 19565586 U JP19565586 U JP 19565586U JP H056660 Y2 JPH056660 Y2 JP H056660Y2
- Authority
- JP
- Japan
- Prior art keywords
- bonding
- lead
- tip
- gigantic
- present
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/0711—Apparatus therefor
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/701—Tape-automated bond [TAB] connectors
Landscapes
- Wire Bonding (AREA)
Description
【考案の詳細な説明】
〔産業上の利用分野〕
本考案は半導体装置の組立におけるギヤングボ
ンデイング装置に関する。[Detailed Description of the Invention] [Industrial Application Field] The present invention relates to a gigantic bonding apparatus for assembling semiconductor devices.
従来、この種のギヤングボンデイング装置は第
４図に示すようにキヤリアテープ３に予め設けら
れたリード２と、半導体ペレツト１とを熱圧着す
るために、加熱されたボンデイングツール４をリ
ード２に押しあて加圧することによつて接続を行
つていた。
Conventionally, as shown in FIG. 4, this type of gigantic bonding apparatus uses a heated bonding tool 4 to bond a semiconductor pellet 1 to a lead 2 provided in advance on a carrier tape 3 by thermocompression. The connection was made by pressing and applying pressure.
上述した従来のギヤングボンデイング装置は、
加熱されたボンデイングツール４をリード先端部
に押し付けることによりリード２を加熱する必要
があり、リード２から逃げる熱のために予めボン
デイングツール４を高温に加熱せねばならず、ま
た圧着時間を短縮できないという欠点があつた。
The conventional gigantic bonding device described above is
It is necessary to heat the lead 2 by pressing the heated bonding tool 4 against the tip of the lead, and the bonding tool 4 must be heated to a high temperature in advance because of the heat escaping from the lead 2, and the crimping time cannot be shortened. There was a drawback.
本考案の目的は短時間に信頼性の高いギヤング
ボンデイングを可能にするギヤングボンデイング
装置を提供することにある。 An object of the present invention is to provide a gigantic bonding device that enables highly reliable gigantic bonding in a short period of time.
〔考案の従来技術に対する相違点〕
上述した従来のギヤングボンデイング装置に対
し、本考案のギヤングボンデイング装置は予めリ
ード２の先端を加熱しておくことにより短時間に
信頼性の高いギヤングボンデイングを可能とする
という独創的内容を有する。[Differences between the invention and the conventional technology] In contrast to the above-mentioned conventional guyung bonding device, the guyung bonding device of the present invention can perform highly reliable guyang bonding in a short time by heating the tip of the lead 2 in advance. It has an original content that makes it possible.
本考案はテープ状のフイルムキヤリアに予め取
付けられたリードと半導体ペレツトとをボンデイ
ングツールにて熱圧着する装置において、リード
先端を予熱する予熱装置を具備したことを特徴と
するギヤングボンデイング装置である。
The present invention is a gang bonding device that uses a bonding tool to thermocompression bond a lead attached to a tape-shaped film carrier and a semiconductor pellet in advance, and is characterized by being equipped with a preheating device that preheats the tip of the lead. .
以下、本考案の実施例を図により説明する。 Hereinafter, embodiments of the present invention will be described with reference to the drawings.
（実施例 １）
第１図、第２図において、この実施例はリード
２と半導体ペレツト１とを熱圧着するボンデイン
グツール４と、リード２の先端部を加熱する赤外
線ランプ等の光源５と、光源５からの光をリード
２の先端部に向けて屈折反射させるミラー６と、
集光用レンズ７とを備え、２個の光源５，５から
の光を４箇所のミラー６にて反射させることによ
りレンズ７を通してリード２の先端部に集光さ
せ、リードの予熱を行うものである。(Embodiment 1) In FIGS. 1 and 2, this embodiment includes a bonding tool 4 for thermocompression bonding the lead 2 and the semiconductor pellet 1, a light source 5 such as an infrared lamp for heating the tip of the lead 2, a mirror 6 that refracts and reflects the light from the light source 5 toward the tip of the lead 2;
It is equipped with a focusing lens 7, and by reflecting the light from the two light sources 5, 5 on four mirrors 6, it is focused through the lens 7 onto the tip of the lead 2, and preheats the lead. It is.
第１図、第２図において、テープキヤリア３に
設けられたリード２はボンデイングツール４によ
り熱圧着される以前より予め赤外線ランプ等の光
源５により照射された光により加熱される。ミラ
ー６とレンズ７により光源５の光が集光される。 In FIGS. 1 and 2, the leads 2 provided on the tape carrier 3 are heated by light emitted from a light source 5 such as an infrared lamp before being thermocompression bonded by a bonding tool 4. The light from the light source 5 is focused by the mirror 6 and the lens 7.
（実施例 ２） 第３図は本考案の実施例２の上面図である。(Example 2) FIG. 3 is a top view of Embodiment 2 of the present invention.
この実施例では赤外線ランプ等の光源５を合計
４灯に増やすことにより、各面のリードを均一に
加熱できるようにしたものである。 In this embodiment, the number of light sources 5 such as infrared lamps is increased to four in total, thereby making it possible to uniformly heat the leads on each side.
以上説明したように本考案はフイルムキヤリア
に設けられたリード先端を赤外線ランプ等の光源
を用いて予め加熱することにより、接合強度の高
いボンデイングを得ることが可能であり、またリ
ードの予熱によりボンデイングツールにかかる熱
的なストレスを低減することが可能であることか
らボンデイングツールの寿命を伸ばすことができ
る効果がある。
As explained above, the present invention makes it possible to obtain a bond with high bonding strength by preheating the tip of the lead provided on the film carrier using a light source such as an infrared lamp, and also enables bonding to be achieved by preheating the lead. Since it is possible to reduce the thermal stress applied to the tool, it has the effect of extending the life of the bonding tool.
第１図は本考案の実施例１を示す図、第２図は
同平面図、第３図は本考案の実施例２を示す図、
第４図は従来のギヤングボンデイング装置を示す
図である。
１……半導体ペレツト、２……リード、３……
フイルムキヤリア、４……ボンデイングツール、
５……光源、６……ミラー、７……集光レンズ。
FIG. 1 is a diagram showing a first embodiment of the present invention, FIG. 2 is a plan view of the same, and FIG. 3 is a diagram showing a second embodiment of the present invention.
FIG. 4 is a diagram showing a conventional gigantic bonding device. 1... Semiconductor pellet, 2... Lead, 3...
Film carrier, 4...bonding tool,
5...Light source, 6...Mirror, 7...Condensing lens.
Claims (1)
たリードと半導体ペレツトとをボンデイングツー
ルにて熱圧着する装置において、リード先端を予
熱する予熱装置を具備したことを特徴とするギヤ
ングボンデイング装置。 A gigantic bonding device for thermocompression-bonding a semiconductor pellet with a lead pre-attached to a tape-like film carrier using a bonding tool, the device being equipped with a preheating device for preheating the tip of the lead.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986195655U JPH056660Y2 (en) | 1986-12-19 | 1986-12-19 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986195655U JPH056660Y2 (en) | 1986-12-19 | 1986-12-19 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS63100834U JPS63100834U (en) | 1988-06-30 |
| JPH056660Y2 true JPH056660Y2 (en) | 1993-02-19 |
Family
ID=31153738
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1986195655U Expired - Lifetime JPH056660Y2 (en) | 1986-12-19 | 1986-12-19 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH056660Y2 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02205334A (en) * | 1989-02-03 | 1990-08-15 | Orient Watch Co Ltd | Manufacturing method of semiconductor device |
-
1986
- 1986-12-19 JP JP1986195655U patent/JPH056660Y2/ja not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPS63100834U (en) | 1988-06-30 |
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