JPH0568342B2 - - Google Patents

Description

[Detailed description of the invention]

INDUSTRIAL APPLICATION FIELD The present invention relates to a method for manufacturing a composite metal plate with excellent conductivity, in which a resin film in which a conductive substance is embedded in advance is sandwiched between two metal plates. Conventional technology Conventional methods for imparting conductivity to composite metal plates include mixing and adding fine metal powder to resin,
It is well known to provide metal fibers with a length of 1 to 2 mm or more in a layered manner in a resin layer. Another method is to provide one layer of metal fibers or foil powder in the resin layer in the form of a mesh, as disclosed in JP-A No. 59-215862. Problems to be Solved by the Invention However, among the above-mentioned conventional techniques, in the former method, since the particle size of the powder is too small, it is necessary to add a large amount, which leads to deterioration of the adhesiveness of the resin and high cost. It has the following disadvantages. In addition, the latter method is especially useful when the resin film thickness is as thin as 50 to 70μ.
The ratio of metal fibers or foil powder to resin becomes large, which again has disadvantages such as deterioration of adhesiveness of the resin, deterioration of vibration damping properties, and high cost. Means for Solving the Problems That is, the present invention provides a method for manufacturing a composite metal plate consisting of two metal plates and a resin film disposed between the metal plates, in which the resin film is placed on a softened resin film. A conductive resin film is obtained by dispersing and arranging a conductive substance having a particle size of 100 to 130% or more of the thickness, and further embedding the conductive substance in a resin film using a pressing means, and then dispersing the conductive resin film. The present invention provides a method for manufacturing a conductive composite metal plate, characterized in that metal plates are laminated on both sides of the conductive metal plate. The types of the two metal plates used in the method of the present invention are not particularly limited, and may be cold-rolled steel plates, surface-treated steel plates, etc., and can be used for the intended purpose.
Appropriate selection is made depending on the field. Moreover, the types of these two metal plates may be the same or different types. The thickness of the metal plate is not particularly fixed either. Examples of the resin film disposed between the metal plates include polyethylene, polypropylene, etc., but are not particularly limited. Further, the thickness of the resin film is preferably 50 to 70μ. Examples of the metal used as the conductive material embedded in the resin film include iron,
Examples include brass, stainless steel, etc., but are not particularly limited. The particle size of the conductive substance is 100 to 200%, preferably 100 to 130%, of the thickness of the resin film. The lower limit was set to 100% to facilitate the conduction between the upper and lower two metal plates, and the upper limit was set to 130%.
This was done in order not to impair adhesion. Here, the particle size represents the outer diameter of the conductive substance. Further, within this range, the conduction between the two metal plates constituting the resulting composite metal plate becomes good. The amount of the conductive substance dispersed is preferably 2.0 to 3.0% by volume of the resin film. Upper limit to 3.0%
This is because the properties of the resin will not deteriorate within this range, and the reason why the lower limit was set at 2.0% is to ensure complete conductivity. The shape of the conductive substance is preferably spherical, since this increases the average contact ratio of the conductive substance to the two metal plates constituting the resulting composite metal plate. Such a conductive substance is dispersed on the film in a softened state. The film in a softened state may be softened by heating the formed film again.
It may also be a film that is being formed by extrusion from a die or the like, as long as it is soft enough to embed the conductive substance from the surface by appropriate pressing means. In addition, as a method for supplying and dispersing the conductive substance used in the method of the present invention, a vibrating quantitative feeder, a rotary leaf feeder, a table feeder, a screw feeder, etc. can be used, but a vibrating quantitative feeder device is preferably used. It will be done. Next, pressing is performed, and examples of the pressing means used in the present invention include a presser roll, a hot press, and the like. Any known method can be applied to the method of laminating the two metal plates. For example, any method such as a lamination method using a hot press or a continuous lamination method using a hot roll may be used depending on the production scale, application, etc. Hereinafter, a specific example of the present invention will be described in detail based on the accompanying drawings. FIG. 1 is a schematic diagram of a manufacturing process showing a specific example of the present invention. As shown in FIG. 1, first, a resin film 1 wound into a coil is heated in a heating furnace 2 while being unwound to soften the resin film 1. Although the heating temperature varies depending on the type of resin used, it is preferable that the heating temperature is such that the conductive substance 3 dispersed on the resin film does not scatter before rolling. It should be noted that the softened resin film 1 tends to sag and blister inside the heating furnace 2, and in order to prevent this, the resin film 1 is transported in the advancing direction while the upper and lower surfaces of the blister are held between driving endless belts 7. Next, a fixed amount of the conductive substance 3 is dispersed onto the softened resin film 1 using a vibrating quantitative feeder 6, and then the conductive substance 3 is wound into a coil shape as the resin film 5 using a presser roll 4. take. The gap between the pair of presser rolls 4 is as follows:
The particle size may be approximately the same as the particle size of the conductive substance 3 to be buried. Subsequently, metal plates are laminated on both sides of the conductive resin film 5 by hot roll pressure welding or the like to obtain a conductive composite metal plate as a final product, but the lamination method is not particularly limited. As shown in FIG. 2, a method for producing a film in another embodiment of the present invention is to extrude a molten resin as a resin film 1 through a T-die 10, and before the resin film 1 is completely cooled at the exit of the T-die. An example of a method is to disperse a certain amount of the conductive substance 3 onto the resin film using a vibrating quantitative feeder 6, and then embed it in the resin film 1 using a presser roll 4 to impart conductivity to the resin film. Examples Next, the present invention will be explained in more detail with reference to Examples. Example 1 A conductive composite metal plate was manufactured using the apparatus shown in FIG. A polyethylene resin film having a thickness of 0.07 mm was softened by heating to 90° C. in a heating furnace, and then spherical iron powder having a particle size of 0.074 to 0.104 mm was dispersed on the resin film. The amount of dispersion is 3.0% of the resin film.
It was expressed as volume %. Next, the iron powder is embedded in a resin film using a presser roll to create a conductive resin film, and then two steel plates (thickness 0.6 mm) are laminated onto the conductive resin film using a hot roll to conduct the conductive resin film. A composite metal plate was obtained. The weldability of the obtained composite metal plate was evaluated by the following method. As shown in Fig. 3, composite metal plate 8
Two sheets were overlapped (overlapping length = 40 mm), and spot welding was performed with electrode 9 positioned at the center. Table 1 shows the spot welding conditions and results. The composite metal plate according to the present invention has a test number n=522.
However, all of them could be welded.

[Table] Effects of the invention From the above results, it is possible to inexpensively manufacture a conductive composite metal plate with excellent spot weldability by arranging a resin film in which a conductive substance is embedded in advance between two metal plates. It became possible.

[Brief explanation of drawings]

1 and 2 are schematic diagrams showing a specific example of the method of the present invention, and FIG. 3 is a schematic diagram showing a method for spot welding composite metal plates. The main symbols in the drawings are as follows. 1... Resin film, 2... Heating furnace, 3... Conductive material,
4... Presser roll, 8... Composite metal plate.

Claims (1)

[Claims] 1. In a method for manufacturing a composite metal plate consisting of two metal plates and a resin film disposed between the metal plates, conductive particles having a particle size of 100 to 130% of the thickness of the resin film are placed on the resin film in a softened state. A conductive method characterized by dispersing and arranging a substance, further embedding the conductive substance in a resin film using a pressing means to obtain a conductive resin film, and then laminating metal plates on both sides of the conductive resin film. A method for producing a composite metal plate.