JPH056875U - Multilayer printed wiring board - Google Patents
Multilayer printed wiring boardInfo
- Publication number
- JPH056875U JPH056875U JP1366391U JP1366391U JPH056875U JP H056875 U JPH056875 U JP H056875U JP 1366391 U JP1366391 U JP 1366391U JP 1366391 U JP1366391 U JP 1366391U JP H056875 U JPH056875 U JP H056875U
- Authority
- JP
- Japan
- Prior art keywords
- wiring board
- printed wiring
- multilayer printed
- multilayer
- electronic components
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Abstract
(57)【要約】
【目的】 電子部品を実装する印刷配線板１６の高密度
配線化を計ること。
【構成】 第１の印刷配線板２〜第４の印刷配線板５を
積層して多層印刷配線板１とする。第１の印刷配線板２
には、他の電子部品を取り付けるための穴８及び９を設
ける。第４の印刷配線板５にはリード線１２を取り付け
下面から引き出す。
【効果】 電子部品を多層印刷配線板１を介して他の印
刷配線板に取り付けることにより高密度配線化が可能に
なる。
(57) [Abstract] [Purpose] To achieve high-density wiring of the printed wiring board 16 on which electronic components are mounted. [Structure] The first printed wiring board 2 to the fourth printed wiring board 5 are laminated to form a multilayer printed wiring board 1. First printed wiring board 2
Are provided with holes 8 and 9 for mounting other electronic components. The lead wire 12 is attached to the fourth printed wiring board 5 and pulled out from the lower surface. [Effect] By mounting the electronic component on another printed wiring board via the multilayer printed wiring board 1, high density wiring can be realized.
Description
【０００１】[0001]
本考案は多層印刷配線板に関する。 The present invention relates to a multilayer printed wiring board.
【０００２】[0002]
従来、電子部品を印刷配線板に治具を用いて着脱自在に取り付けている。 Conventionally, electronic parts are detachably attached to a printed wiring board by using a jig.
【０００３】[0003]
しかし、電気機器の小形化、高機能化に伴い、これに組み込む印刷配線板につ いてもより高密度の配線を有するものが必要になってきている。従来の治具を用 いて電子部品を取り付けていたのではこの高密度配線の要求を充分に満足できな い欠点がある。 本考案の目的は、以上の欠点を改良し、実装する印刷配線板の高密度配線を可 能にする多層印刷配線板を提供するものである。 However, with the downsizing and higher functionality of electrical equipment, the printed wiring boards to be incorporated therein also need to have higher density wiring. The conventional jigs used to mount electronic components have the drawback that the requirements for high-density wiring cannot be fully satisfied. An object of the present invention is to provide a multilayer printed wiring board which improves the above drawbacks and enables high density wiring of a printed wiring board to be mounted.
【０００４】[0004]
本考案は、上記の目的を達成するために、絶縁部にリード線を設け引き出すこ とを特徴とする多層印刷配線板を提供するものである。 In order to achieve the above-mentioned object, the present invention provides a multilayer printed wiring board characterized in that a lead wire is provided in an insulating portion and is pulled out.
【０００５】[0005]
従来の電子部品の取付用の治具の代りに、リード線を引き出した多層印刷配線 板を用いているため、各種の電子部品をこの多層印刷配線板に着脱自在に取り付 けることができ、各種の配線が容易に行なえ、高密度配線が可能になる。 Since a multilayer printed wiring board with lead wires is used instead of the conventional jig for mounting electronic components, various electronic components can be detachably mounted on this multilayer printed wiring board. Various wiring can be easily done, and high-density wiring becomes possible.
【０００６】[0006]
以下、本考案を実施例に基づいて説明する。 図１（イ）において、１は多層印刷配線板である。この多層配線板１は図１（ ロ）に示す通り、第１の印刷配線板２〜第４の印刷配線板５を積層したものであ る。第１の印刷配線板２は、第４の印刷配線板５に設けたガイドピン６を通すた めの穴７を短辺の端部に設けるとともに、他の電子部品のリード線を通すための 穴８を長辺の端部に設け、中央部には電子部品を挿入するための穴９を設ける。 第２の印刷配線板３及び第３の印刷配線板４には短辺の端部にガイドピン６を通 すための穴１０及び１１を設けている。また、第４の印刷配線板５には、長辺の 端部にリード線１２を取り付け下面から引き出すとともに、短辺の端部にガイド ピン６を設けている。 Hereinafter, the present invention will be described based on embodiments. In FIG. 1A, 1 is a multilayer printed wiring board. As shown in FIG. 1B, this multilayer wiring board 1 is formed by laminating first printed wiring board 2 to fourth printed wiring board 5. The first printed wiring board 2 is provided with holes 7 for passing the guide pins 6 provided on the fourth printed wiring board 5 at the ends of the short sides and also for passing lead wires of other electronic components. A hole 8 is provided at the end of the long side, and a hole 9 for inserting an electronic component is provided at the center. The second printed wiring board 3 and the third printed wiring board 4 are provided with holes 10 and 11 for passing the guide pins 6 at the ends of the short sides. Further, in the fourth printed wiring board 5, the lead wire 12 is attached to the end of the long side and pulled out from the lower surface, and the guide pin 6 is provided at the end of the short side.
【０００７】 上記実施例の多層印刷配線板１に電子部品を実装して印刷配線板に取り付ける 状態を図２に示す。すなわち、第１の印刷配線板５の穴９に電子部品１３を挿入 する。また、ハイブリッドＩＣ等の電子部品１４のリード線１５を第１の印刷配 線板２の穴８に通し固定する。そして、多層印刷配線板１から引き出したリード 線６を他の印刷配線板１６に設けたスルーホール１７等に通し、半田付け等して 固定する。FIG. 2 shows a state in which electronic components are mounted on the multilayer printed wiring board 1 of the above embodiment and attached to the printed wiring board. That is, the electronic component 13 is inserted into the hole 9 of the first printed wiring board 5. Further, the lead wire 15 of the electronic component 14 such as the hybrid IC is passed through the hole 8 of the first printed wiring board 2 and fixed. Then, the lead wire 6 drawn out from the multilayer printed wiring board 1 is passed through a through hole 17 or the like provided in another printed wiring board 16 and fixed by soldering or the like.
【０００８】[0008]
以上の通り、本考案の多層配線板によれば電子部品を他の印刷配線板に着脱自 在に取り付けることができ、また、この印刷配線板の高密度配線化を計れる。 As described above, according to the multilayer wiring board of the present invention, electronic parts can be detachably attached to another printed wiring board and the printed wiring board can be highly densely wired.
【図１の（イ）】本考案の実施例の斜視図を示す。FIG. 1A shows a perspective view of an embodiment of the present invention.
【図１の（ロ）】本考案の実施例の積層状態を示す。FIG. 1B shows a laminated state of an embodiment of the present invention.
【図２】本考案の実施例の使用状態を示す。FIG. 2 shows a usage state of an embodiment of the present invention.
１…多層印刷配線板、１２…リード線。 1 ... Multilayer printed wiring board, 12 ... Lead wire.
Claims (1)
ド線を設け引き出すことを特徴とする多層印刷配線板。[Claims for utility model registration] 1. A multilayer printed wiring board, wherein a lead wire is provided on an insulating portion of the multilayer printed wiring board and is pulled out.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1366391U JPH056875U (en) | 1991-02-18 | 1991-02-18 | Multilayer printed wiring board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1366391U JPH056875U (en) | 1991-02-18 | 1991-02-18 | Multilayer printed wiring board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH056875U true JPH056875U (en) | 1993-01-29 |
Family
ID=11839443
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1366391U Pending JPH056875U (en) | 1991-02-18 | 1991-02-18 | Multilayer printed wiring board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH056875U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2006115063A1 (en) * | 2005-04-25 | 2006-11-02 | Aisin Seiki Kabushiki Kaisha | Door frame for vehicle |
-
1991
- 1991-02-18 JP JP1366391U patent/JPH056875U/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2006115063A1 (en) * | 2005-04-25 | 2006-11-02 | Aisin Seiki Kabushiki Kaisha | Door frame for vehicle |
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