JPH0570172A - Highly expandable composite material - Google Patents
Highly expandable composite materialInfo
- Publication number
- JPH0570172A JPH0570172A JP3262763A JP26276391A JPH0570172A JP H0570172 A JPH0570172 A JP H0570172A JP 3262763 A JP3262763 A JP 3262763A JP 26276391 A JP26276391 A JP 26276391A JP H0570172 A JPH0570172 A JP H0570172A
- Authority
- JP
- Japan
- Prior art keywords
- composite material
- powder
- thermal expansion
- tridymite
- coefficient
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000002131 composite material Substances 0.000 title claims abstract description 34
- 239000000843 powder Substances 0.000 claims abstract description 49
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims abstract description 22
- 239000011521 glass Substances 0.000 claims abstract description 22
- 238000002844 melting Methods 0.000 claims abstract description 16
- 229910052905 tridymite Inorganic materials 0.000 claims abstract description 15
- 230000008018 melting Effects 0.000 claims abstract description 11
- 239000000919 ceramic Substances 0.000 claims abstract description 8
- 229910052751 metal Inorganic materials 0.000 abstract description 9
- 239000002184 metal Substances 0.000 abstract description 9
- MCMNRKCIXSYSNV-UHFFFAOYSA-N Zirconium dioxide Chemical compound O=[Zr]=O MCMNRKCIXSYSNV-UHFFFAOYSA-N 0.000 abstract description 6
- 238000002156 mixing Methods 0.000 abstract description 5
- CPLXHLVBOLITMK-UHFFFAOYSA-N Magnesium oxide Chemical compound [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 abstract description 4
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 abstract description 4
- ODINCKMPIJJUCX-UHFFFAOYSA-N Calcium oxide Chemical compound [Ca]=O ODINCKMPIJJUCX-UHFFFAOYSA-N 0.000 abstract description 3
- 239000000292 calcium oxide Substances 0.000 abstract description 3
- 235000012255 calcium oxide Nutrition 0.000 abstract description 3
- HNQGTZYKXIXXST-UHFFFAOYSA-N calcium;dioxido(oxo)tin Chemical compound [Ca+2].[O-][Sn]([O-])=O HNQGTZYKXIXXST-UHFFFAOYSA-N 0.000 abstract description 2
- 239000000395 magnesium oxide Substances 0.000 abstract description 2
- BNEMLSQAJOPTGK-UHFFFAOYSA-N zinc;dioxido(oxo)tin Chemical compound [Zn+2].[O-][Sn]([O-])=O BNEMLSQAJOPTGK-UHFFFAOYSA-N 0.000 abstract description 2
- 238000007789 sealing Methods 0.000 description 9
- 239000000203 mixture Substances 0.000 description 7
- 239000011248 coating agent Substances 0.000 description 6
- 238000000576 coating method Methods 0.000 description 6
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 4
- 238000005452 bending Methods 0.000 description 4
- 239000000945 filler Substances 0.000 description 4
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 4
- 239000011787 zinc oxide Substances 0.000 description 4
- 235000014692 zinc oxide Nutrition 0.000 description 4
- 229910004298 SiO 2 Inorganic materials 0.000 description 3
- WUKWITHWXAAZEY-UHFFFAOYSA-L calcium difluoride Chemical compound [F-].[F-].[Ca+2] WUKWITHWXAAZEY-UHFFFAOYSA-L 0.000 description 3
- 229910001634 calcium fluoride Inorganic materials 0.000 description 3
- 239000010987 cubic zirconia Substances 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- 239000002245 particle Substances 0.000 description 3
- 239000003566 sealing material Substances 0.000 description 3
- 230000007704 transition Effects 0.000 description 3
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 2
- KGBXLFKZBHKPEV-UHFFFAOYSA-N boric acid Chemical compound OB(O)O KGBXLFKZBHKPEV-UHFFFAOYSA-N 0.000 description 2
- 239000004327 boric acid Substances 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- LQBJWKCYZGMFEV-UHFFFAOYSA-N lead tin Chemical compound [Sn].[Pb] LQBJWKCYZGMFEV-UHFFFAOYSA-N 0.000 description 2
- 229910052697 platinum Inorganic materials 0.000 description 2
- 239000010453 quartz Substances 0.000 description 2
- 239000002994 raw material Substances 0.000 description 2
- 239000000377 silicon dioxide Substances 0.000 description 2
- 238000005245 sintering Methods 0.000 description 2
- 239000004575 stone Substances 0.000 description 2
- 229910015902 Bi 2 O 3 Inorganic materials 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 230000005260 alpha ray Effects 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- OYLGJCQECKOTOL-UHFFFAOYSA-L barium fluoride Chemical compound [F-].[F-].[Ba+2] OYLGJCQECKOTOL-UHFFFAOYSA-L 0.000 description 1
- 229910001632 barium fluoride Inorganic materials 0.000 description 1
- 229910000019 calcium carbonate Inorganic materials 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000010304 firing Methods 0.000 description 1
- 229910052748 manganese Inorganic materials 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 238000013001 point bending Methods 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
Landscapes
- Glass Compositions (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は高膨張性複合材料に関
し、より詳しくは金属製ＩＣパッケージの気密封着やサ
ーミスタの被覆等に使用される高膨張性複合材料に関す
るものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a high-expansion composite material, and more particularly to a high-expansion composite material used for hermetically sealing a metal IC package, coating a thermistor and the like.
【０００２】[0002]
【従来の技術】ＩＣを実装するための高信頼性パッケー
ジには、アルミナセラミックが広く用いられているが、
近年、ＩＣの大型化に伴い、ＩＣから発生する熱を効率
良く放散するために、より熱伝導率の大きい材料を用い
てパッケージを作製することが検討されている。このよ
うなものとして、例えばアルミニウム、銅、及びこれら
をベースとした合金を使用した金属製パッケージが提案
されている。2. Description of the Related Art Alumina ceramics are widely used for high reliability packages for mounting ICs.
In recent years, with the increase in size of ICs, in order to efficiently dissipate the heat generated from the ICs, it has been considered to manufacture a package using a material having a higher thermal conductivity. As such, for example, metal packages using aluminum, copper, and alloys based on these have been proposed.
【０００３】ところがこの金属製パッケージは、熱膨張
係数が１４０〜２３０×１０-7／℃と高いために、アル
ミナセラミック製パッケージに使用されている低膨張の
封着材料を使用することができない。However, since this metal package has a high coefficient of thermal expansion of 140 to 230 × 10 −7 / ° C., it is impossible to use the low expansion sealing material used in the alumina ceramic package.
【０００４】このような事情から、米国特許第４８１９
７３０号において、ＰｂＯ−Ｂ2 Ｏ3 系、ＰｂＯ−Ｚｎ
Ｏ−Ｂ2 Ｏ3 系等の低融点ガラス粉末と、フッ化カルシ
ウム粉末やフッ化バリウム粉末を混合した高膨張の封着
材料が提案されている。Under these circumstances, US Pat. No. 4819
In No. 730, PbO-B 2 O 3 system, PbO-Zn
A high-expansion sealing material has been proposed in which a low-melting glass powder such as OB 2 O 3 system is mixed with calcium fluoride powder or barium fluoride powder.
【０００５】[0005]
【発明が解決しようとする課題】しかしながら、上記米
国特許に開示の封着材料は、機械的強度が不十分であ
り、実用に耐えないという問題を有している。However, the sealing material disclosed in the above U.S. Patent has a problem that it has insufficient mechanical strength and cannot be practically used.
【０００６】また、Ｎｉ、Ｍｎ、Ｃｏ等の酸化物を焼結
した半導体であるサーミスタは、素子を保護するために
その表面をガラスで被覆しているが、このガラスには、
ＰｂＯ−Ｂ2 Ｏ3 −ＳｉＯ2 系等の被覆用ガラスが用い
られている。The thermistor, which is a semiconductor obtained by sintering an oxide of Ni, Mn, Co or the like, has its surface coated with glass to protect the element.
PbO-B 2 O 3 coating glass -SiO 2 system and the like are used.
【０００７】しかしながら、従来使用されている被覆用
ガラスは、熱膨張係数がサーミスタのそれ（１００〜１
１０×１０-7／℃）よりかなり低い７０〜８０×１０-7
／℃程度であり、しかも機械的強度が低いために、クラ
ックが発生し易いという問題を有している。However, the conventionally used coating glass has a coefficient of thermal expansion that of that of a thermistor (100 to 1).
70-80 x 10 -7, which is considerably lower than 10 x 10 -7 / ° C)
Since it is about / ° C and the mechanical strength is low, there is a problem that cracks are likely to occur.
【０００８】本発明は上記事情に鑑みなされたもので、
９０〜２２０×１０-7／℃程度の高い熱膨張係数を有
し、しかも機械的強度が高く、金属製ＩＣパッケージの
気密封着やサーミスタの被覆に好適な高膨張性複合材料
を提供することを目的とする。The present invention has been made in view of the above circumstances,
To provide a high-expansion composite material having a high coefficient of thermal expansion of about 90 to 220 × 10 -7 / ° C., high mechanical strength, and suitable for airtight sealing of metal IC packages and coating of thermistors. With the goal.
【０００９】[0009]
【課題を解決するための手段】本発明者は種々の研究を
行った結果、トリジマイト（ＳｉＯ2 ）粉末をフィラー
として添加することにより、上記目的が達成できること
を見いだし、本発明として提案するものである。As a result of various studies, the present inventor has found that the above object can be achieved by adding tridymite (SiO 2 ) powder as a filler, and proposes the present invention. is there.
【００１０】即ち、本発明の高膨張性複合材料は、低融
点ガラス粉末 ４５〜９５体積％、トリジマイト粉末
５〜５０体積％、セラミック粉末 ０〜４０体積％が混
合されてなることを特徴とする。That is, the high expansion composite material of the present invention comprises low melting glass powder 45 to 95% by volume and tridymite powder.
5 to 50% by volume and 0 to 40% by volume of ceramic powder are mixed.
【００１１】[0011]
【作用】本発明の高膨張性複合材料は、低融点ガラス粉
末、トリジマイト粉末、及びセラミック粉末が混合され
てなり、３０〜２５０℃において９０〜２２０×１０-7
／℃の熱膨張係数を有し、また高い機械的強度を有する
ものである。The high-expansion composite material of the present invention is a mixture of low-melting glass powder, tridymite powder, and ceramic powder, and 90-220 × 10 −7 at 30-250 ° C.
It has a thermal expansion coefficient of / ° C. and high mechanical strength.
【００１２】本発明の高膨張性複合材料において、フィ
ラーとして使用するトリジマイト粉末は３０〜２５０℃
における熱膨張係数が３００×１０-7／℃と非常に高
く、しかも機械的強度の高いものである。なおトリジマ
イト粉末の形状を球形にしたり、またこれらの表面にＺ
ｎＯからなる被膜を形成しておくことにより、複合材料
の流動性を改善することが可能である。In the highly expansive composite material of the present invention, the tridymite powder used as a filler is 30 to 250 ° C.
Has a very high coefficient of thermal expansion of 300 × 10 −7 / ° C. and high mechanical strength. In addition, the shape of tridymite powder can be made spherical, or Z
By forming a film made of nO, it is possible to improve the fluidity of the composite material.
【００１３】トリジマイト粉末の混合割合を上記のよう
に限定した理由は、トリジマイト粉末が５体積％より少
ないと熱膨張係数の高い複合材料が得られなくなるとと
もに機械的強度が低下し、一方５０体積％より多いと複
合材料の熱膨張係数が大きくなりすぎるためである。The reason why the mixing ratio of the tridymite powder is limited as described above is that if the tridymite powder is less than 5% by volume, a composite material having a high thermal expansion coefficient cannot be obtained and the mechanical strength is lowered, while 50% by volume is obtained. This is because the thermal expansion coefficient of the composite material becomes too large when the amount is larger.
【００１４】本発明の高膨張性複合材料において、セラ
ミック粉末としてアルミナ、ジルコニア、マグネシア、
カルシア、すず酸亜鉛、すず酸カルシウム等の酸化物粉
末を４０体積％以下混合することができる。即ち、トリ
ジマイト粉末は、上記したように熱膨張係数が極めて高
いため、これのみをフィラーとして使用すると、複合材
料の熱膨張係数が高くなりすぎることがある。このよう
な場合、上記したようなセラミック粉末を１種又は２種
以上混合することによって、所望の熱膨張係数に調整す
ることが可能である。In the highly expansive composite material of the present invention, alumina, zirconia, magnesia,
Oxide powders such as calcia, zinc stannate, and calcium stannate can be mixed in an amount of 40 vol% or less. That is, since the tridymite powder has an extremely high thermal expansion coefficient as described above, the thermal expansion coefficient of the composite material may become too high when only this is used as a filler. In such a case, it is possible to adjust the thermal expansion coefficient to a desired value by mixing one or more of the above-mentioned ceramic powders.
【００１５】セラミック粉末の混合割合を上記のように
限定した理由は、これらのフィラーを４０体積％より多
くするとトリジマイト粉末を添加する余地が小さくな
り、熱膨張係数の高い複合材料が得られなくなることに
よる。The reason why the mixing ratio of the ceramic powder is limited as described above is that if the amount of these fillers is more than 40% by volume, the room for adding the tridymite powder becomes small and a composite material having a high thermal expansion coefficient cannot be obtained. by.
【００１６】また本発明の高膨張性複合材料において、
低融点ガラス粉末としては、例えばＰｂＯ−Ｂ2 Ｏ3
系、ＰｂＯ−ＺｎＯ−Ｂ2 Ｏ3 系、ＰｂＯ−ＰｂＦ2 −
Ｂ2 Ｏ3 系、ＰｂＯ−Ｖ2 Ｏ5 系、ＰｂＯ−Ｖ2 Ｏ5 −
ＴｅＯ2 系、ＰｂＯ−Ｖ2 Ｏ5−Ｐ2 Ｏ5 系、ＰｂＯ−
Ｂｉ2 Ｏ3 −Ｂ2 Ｏ3 −ＴｅＯ2 系ガラス等を使用する
ことができる。なお、ＩＣパッケージの封着に使用する
場合、実装するＩＣに悪影響を及ぼさないように封着温
度を５００℃以下にする必要がある。このような場合、
３５０℃以下の転移点を有する低融点ガラスを使用する
ことが好ましい。In the high expansion composite material of the present invention,
The low melting point glass powder, for example, PbO-B 2 O 3
System, PbO-ZnO-B 2 O 3 system, PbO-PbF 2 -
B 2 O 3 system, PbO-V 2 O 5 system, PbO-V 2 O 5 -
TeO 2 system, PbO-V 2 O 5 -P 2 O 5 system, PbO-
Bi 2 O 3 -B 2 O 3 can be used -TeO 2 based glass or the like. When used for sealing an IC package, it is necessary to set the sealing temperature to 500 ° C. or lower so that the mounted IC is not adversely affected. In such cases,
It is preferable to use a low melting point glass having a transition point of 350 ° C. or lower.
【００１７】低融点ガラス粉末の混合割合を上記のよう
に限定した理由は、低融点ガラス粉末が４５体積％より
少ないと複合材料の流動性が低下し、９５体積％より多
いと複合材料の機械的強度が不十分になるためである。The reason why the mixing ratio of the low-melting glass powder is limited as described above is that when the low-melting glass powder is less than 45% by volume, the fluidity of the composite material is lowered, and when it is more than 95% by volume, the mechanical strength of the composite material is low. This is because the physical strength becomes insufficient.
【００１８】[0018]
【実施例】以下、本発明の高膨張性複合材料を実施例及
び比較例に基づいて説明する。EXAMPLES The high-expansion composite material of the present invention will be described below based on Examples and Comparative Examples.
【００１９】（実施例１）低融点ガラス粉末、トリジマ
イト粉末、立方晶ジルコニア粉末をそれぞれ体積％で６
０％、２５％、１５％の割合で混合し、金属製ＩＣパッ
ケージ封着用複合材料を作製した。Example 1 Low-melting-point glass powder, tridymite powder, and cubic zirconia powder were each contained at 6% by volume.
The mixture was mixed at a ratio of 0%, 25%, and 15% to prepare a composite material for metal IC package sealing.
【００２０】低融点ガラス粉末は次のようにして調製し
た。The low melting glass powder was prepared as follows.
【００２１】重量％でＰｂＯ ８４．３％、Ｂ2 Ｏ3 １
１．９％、ＺｎＯ ２．８％、ＳｉＯ2 １．０％の組成
になるように、鉛丹、硼酸、亜鉛華、及び珪石粉を調合
し、白金るつぼを用いて９００℃で１時間溶融した後、
水冷ローラーにより、薄板状に成形した。次いでこの成
形物をボールミルにて粉砕し、２５０メッシュの篩を通
過させて低融点ガラス粉末を得た。このガラスは３０〜
２５０℃における熱膨張係数が１１２×１０-7／℃、転
移点が３００℃であった。PbO 84.3% by weight%, B 2 O 3 1
Mix lead tin, boric acid, zinc white, and silica stone powder so that the composition is 1.9%, ZnO 2.8%, and SiO 2 1.0%, and melt at 900 ° C. for 1 hour using a platinum crucible. After doing
A water-cooled roller was used to form a thin plate. Next, this molded product was crushed by a ball mill and passed through a 250-mesh sieve to obtain a low melting point glass powder. This glass is 30 ~
The thermal expansion coefficient at 250 ° C. was 112 × 10 −7 / ° C., and the transition point was 300 ° C.
【００２２】トリジマイト粉末は、平均粒径６μｍの石
英粉末を１４５０℃で１６時間加熱してトリジマイト化
したものを使用した。As the tridymite powder, a quartz powder having an average particle size of 6 μm was heated at 1450 ° C. for 16 hours to form tridymite.
【００２３】立方晶ジルコニアは次のようにして調製し
た。まず、低α線タイプのジルコニア原料及び炭酸カル
シウムをＺｒＯ2 ８０ｍｏｌ％、ＣａＯ ２０ｍｏｌ％
の割合になるように調合し、１５５０℃で１６時間焼成
した。その後、この焼成物をボールミルにて粉砕し、３
５０メッシュの篩を通過させて平均粒径５μｍの立方晶
ジルコニアを得た。Cubic zirconia was prepared as follows. First, a low α-ray type zirconia raw material and calcium carbonate were added to ZrO 2 80 mol% and CaO 20 mol%.
And the mixture was baked at 1550 ° C. for 16 hours. Then, the fired product was crushed with a ball mill and
It was passed through a 50-mesh sieve to obtain cubic zirconia having an average particle size of 5 μm.
【００２４】この複合材料は、３０〜２５０℃における
熱膨張係数が１６０×１０-7／℃、、封着温度が４３０
℃、曲げ強度が５８０ｋｇ／ｃｍ2 であり、誘電率が１
２．５であった。This composite material has a coefficient of thermal expansion of 160 × 10 −7 / ° C. at 30 to 250 ° C. and a sealing temperature of 430.
℃, flexural strength 580kg / cm 2 , dielectric constant 1
It was 2.5.
【００２５】さらにこの複合材料を用いて、Ａｌ ７０
重量％、Ｓｉ ３０重量％よりなり、１６０×１０-7／
℃の熱膨張係数を有する金属製パッケージ（１８リー
ド）の封着を行った。封着は、通常行われているように
ビークルを用いて複合材料をペースト化し、パッケージ
にスクリーン印刷した後、空気中、４３０℃で１０分間
熱処理した。このようにして得られた封着物は気密性の
高いものであった。Further, by using this composite material, Al 70
% By weight, 30% by weight of Si, 160 × 10 −7 /
A metal package (18 leads) having a coefficient of thermal expansion of ° C was sealed. The sealing was performed by making the composite material into a paste using a vehicle as usual, and screen-printing the package, followed by heat treatment in air at 430 ° C. for 10 minutes. The sealed product thus obtained was highly airtight.
【００２６】なお、熱膨張係数は、外径４ｍｍ、長さ５
０ｍｍに加熱成形した試料を用いて、石英押棒式熱膨張
計により測定し、曲げ強度は、複合材料を加熱して作製
したブロックから１０×１０×５０ｍｍの大きさに切り
出した試料を用いて３点曲げ試験により求めた。また誘
電率は、外径３５ｍｍ、厚さ１．５ｍｍの円板状に加熱
成形した試料を用いて、ＬＣＲメーター（２５℃、１Ｍ
Ｈｚ）によって測定した。The coefficient of thermal expansion is 4 mm in outer diameter and 5 in length.
Using a sample heat-molded to 0 mm, it was measured by a quartz push rod type thermal dilatometer, and bending strength was measured using a sample cut into a size of 10 × 10 × 50 mm from a block prepared by heating a composite material. It was determined by a point bending test. Further, the dielectric constant was measured by using an LCR meter (25 ° C., 1M, using a sample heat-formed into a disk shape having an outer diameter of 35 mm and a thickness of 1.5 mm.
Hz).
【００２７】（比較例）実施例１において使用した低融
点ガラス粉末６０体積％と、フッ化カルシウム粉末４０
体積％を混合して複合材料を得た。Comparative Example 60% by volume of the low melting point glass powder used in Example 1 and 40 calcium fluoride powder
The volume% was mixed to obtain a composite material.
【００２８】この複合材料は、３０〜２５０℃における
熱膨張係数が１４８×１０-7／℃、封着温度が４３０
℃、誘電率が１１．９であり、実施例１の複合材料とほ
ぼ同等の値を示した。またこの複合材料を用いて、実施
例１で使用した金属製パッケージを同様の方法で封着し
たところ、気密性の高い封着物が得られた。しかしなが
ら、曲げ強度は４００ｋｇ／ｃｍ2 であり、実施例１の
複合材料に比べて１８０ｋｇ／ｃｍ2 も低かった。This composite material has a coefficient of thermal expansion of 30 to 250 ° C. of 148 × 10 −7 / ° C. and a sealing temperature of 430.
C., the dielectric constant was 11.9, which was almost the same value as the composite material of Example 1. When the metal package used in Example 1 was sealed by the same method using this composite material, a hermetically sealed product was obtained. However, the bending strength was 400 kg / cm 2 , which was 180 kg / cm 2 lower than that of the composite material of Example 1.
【００２９】なお、フッ化カルシウム粉末は、原料粉末
を１０００℃で５時間焼成して粒成長させた後、ボール
ミルにて粉砕し、３５０メッシュの篩を通過させて、平
均粒径５μｍの粉末としたものを使用した。The calcium fluoride powder is obtained by firing the raw material powder at 1000 ° C. for 5 hours for grain growth, crushing it with a ball mill, and passing it through a 350-mesh sieve to obtain a powder having an average particle size of 5 μm. I used what I did.
【００３０】（実施例２）低融点ガラス粉末９０体積％
と、トリジマイト粉末１０体積％を混合し、サーミスタ
被覆用複合材料を得た。(Example 2) Low-melting glass powder 90% by volume
And 10% by volume of tridymite powder were mixed to obtain a thermistor coating composite material.
【００３１】低融点ガラス粉末は次のようにして調製し
た。The low melting point glass powder was prepared as follows.
【００３２】重量％でＰｂＯ ７０．０％、Ｂ2 Ｏ3 １
７．０％、ＺｎＯ ３．０％、ＳｉＯ2 １０．０％の組
成になるように、鉛丹、硼酸、亜鉛華、及び珪石粉を調
合し、白金るつぼを用いて１１００℃で１時間溶融した
後、水冷ローラーにより、薄板状に成形した。次いでこ
の成形物をボールミルにて粉砕し、２５０メッシュの篩
を通過させて低融点ガラス粉末を得た。このガラスは３
０〜２５０℃における熱膨張係数が８１×１０-7／℃、
転移点が４００℃、曲げ強度が３００ｋｇ／ｃｍ2 であ
った。% By weight of PbO 70.0%, B 2 O 3 1
Mix lead tin, boric acid, zinc white, and silica stone powder so that the composition is 7.0%, ZnO 3.0%, and SiO 2 10.0%, and melt for 1 hour at 1100 ° C using a platinum crucible. After that, a water-cooled roller was used to form a thin plate. Next, this molded product was crushed by a ball mill and passed through a 250-mesh sieve to obtain a low melting point glass powder. This glass is 3
Coefficient of thermal expansion at 0 to 250 ° C. is 81 × 10 −7 / ° C.,
The transition point was 400 ° C. and the bending strength was 300 kg / cm 2 .
【００３３】トリジマイト粉末は、実施例１と同様にし
て作製した。Tridymite powder was prepared in the same manner as in Example 1.
【００３４】この複合材料は、３０〜２５０℃における
熱膨張係数が９２×１０-7／℃、熱処理温度が５００
℃、曲げ強度が５００ｋｇ／ｃｍ2 であった。This composite material has a coefficient of thermal expansion at 30 to 250 ° C. of 92 × 10 −7 / ° C. and a heat treatment temperature of 500.
° C., the bending strength was 500 kg / cm 2.
【００３５】さらにこの複合材料を用いて、ＮｉＯを焼
結してなるサーミスタ（熱膨張係数１００×１０-7／
℃）を被覆したところ、クラックは全く認められなかっ
た。Further, using this composite material, a thermistor made by sintering NiO (coefficient of thermal expansion: 100 × 10 -7 /
No crack was observed at all.
【００３６】[0036]
【発明の効果】以上説明したように本発明の低融点高膨
張性複合材料は、熱膨張係数が９０〜２２０×１０-7／
℃と高く、しかも機械的強度が高いため、金属製ＩＣパ
ッケージの気密封着やサーミスタの被覆に好適である。As described above, the low melting point and high expansion composite material of the present invention has a thermal expansion coefficient of 90 to 220 × 10 -7 /
Since it is as high as ℃ and has high mechanical strength, it is suitable for hermetically sealing metal IC packages and coating thermistors.
Claims (1)
トリジマイト粉末５〜５０体積％、セラミック粉末 ０
〜４０体積％が混合されてなることを特徴とする高膨張
性複合材料。1. Low melting glass powder 45 to 95% by volume,
Tridymite powder 5 to 50% by volume, ceramic powder 0
A high-expansion composite material, characterized by being mixed in an amount of -40% by volume.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP26276391A JP3227735B2 (en) | 1991-09-12 | 1991-09-12 | High expansion composite material |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP26276391A JP3227735B2 (en) | 1991-09-12 | 1991-09-12 | High expansion composite material |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0570172A true JPH0570172A (en) | 1993-03-23 |
| JP3227735B2 JP3227735B2 (en) | 2001-11-12 |
Family
ID=17380254
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP26276391A Expired - Fee Related JP3227735B2 (en) | 1991-09-12 | 1991-09-12 | High expansion composite material |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3227735B2 (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006151774A (en) * | 2004-12-01 | 2006-06-15 | Nippon Electric Glass Co Ltd | Sealing material |
| JP2008032753A (en) * | 2002-08-07 | 2008-02-14 | Matsushita Electric Ind Co Ltd | Load sensor and manufacturing method thereof |
| JP2015205801A (en) * | 2014-04-22 | 2015-11-19 | 株式会社ノリタケカンパニーリミテド | Glass bonding material |
| JP2015205800A (en) * | 2014-04-22 | 2015-11-19 | 株式会社ノリタケカンパニーリミテド | High thermal expansion filler composition and method of producing the same |
-
1991
- 1991-09-12 JP JP26276391A patent/JP3227735B2/en not_active Expired - Fee Related
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008032753A (en) * | 2002-08-07 | 2008-02-14 | Matsushita Electric Ind Co Ltd | Load sensor and manufacturing method thereof |
| JP2006151774A (en) * | 2004-12-01 | 2006-06-15 | Nippon Electric Glass Co Ltd | Sealing material |
| JP2015205801A (en) * | 2014-04-22 | 2015-11-19 | 株式会社ノリタケカンパニーリミテド | Glass bonding material |
| JP2015205800A (en) * | 2014-04-22 | 2015-11-19 | 株式会社ノリタケカンパニーリミテド | High thermal expansion filler composition and method of producing the same |
Also Published As
| Publication number | Publication date |
|---|---|
| JP3227735B2 (en) | 2001-11-12 |
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