JPH0570923U - Resin mold - Google Patents

Abstract

(57) [Abstract] [Purpose] A resin mold for secondary molding used in a method of manufacturing a wiring board by a two-shot method, which is capable of forming a resin injection pressure and a mold surface without forming an unnecessary plating portion. (EN) A molding die capable of preventing damage to circuit components due to friction. [Structure] In order to prevent the contact of the tip surfaces 13a to 16a of the protrusions, which are the parts constituting the circuit of the primary molded product 11, with the mold surface, the protrusions are projected from the mold surface into the cavity 18. Positioning pin 19 as a support for the primary molded product
A resin molding die 17 in which a is formed.

Description

[Detailed description of the device]

[0001]

[Industrial applications]

 The present invention relates to a resin molding die used for a so-called two-shot method, and more particularly to improvement of a structure of a resin molding die used for obtaining a secondary molded product.

[0002]

[Prior Art]

 As an example of a method for manufacturing a three-dimensional wiring board or the like, a MID (Molded interconnection Devices) metallization method by a two-shot method has been conventionally known (“Surface Technology”, Vol. 41, No. 7, 1990). The three-dimensional wiring board has a structure in which a conductive portion for forming a circuit is formed on the surface of a resin molded product. At the time of manufacture, a plateable part and a non-plateable part are formed on the surface of the resin molded product, and by plating the whole, a conductive part for forming the above circuit is formed on the plateable part. Form.

The above-described two-shot method is used to selectively form the plateable part and the non-plateable part. For example, after obtaining a primary molded product, its surface is subjected to etching treatment and catalytic treatment to make it possible to plate the outer surface, and then secondary molding is performed to cover the area other than the portion to be plated with the secondary molding material. After that, the plating method and the molding material containing the catalyst are used to obtain the primary molded product, and then the area excluding the areas where plating is possible is covered by the secondary molding, and the surface of the obtained secondary molded product is covered. A method of plating after etching has been proposed.

By the way, when molding the above-mentioned primary molded product in the secondary molding die, the resin injection pressure at the time of secondary molding and the metal mold for inserting the primary molded product into the mold cavity. The surface of the primary molded product was sometimes damaged due to friction with the mold surface. In particular, when the part existing on the outer surface of the primary molded product and finally constituting the circuit (region that can be plated) is damaged, it is finally formed. There was a problem that the adhesion strength of the circuit to the molded product was reduced and the reliability was reduced.

Therefore, a method has been proposed in which a positioning protrusion is provided on the primary molded product itself as shown in FIGS. 2 and 3. FIG. 2 is a cross-sectional view showing a state in which the primary molded product 1 is arranged in the cavity 3 of the mold 2 for secondary molding, and FIG. 3 is a perspective view showing the primary molded product 1. The primary molded product 1 has a structure in which positioning protrusions 1a are formed near the corners. In addition, 1b shows the part plated to finally form a circuit. The secondary molding die 2 is composed of an upper die 2a and a lower die 2b, and the cavity 3 is formed by the concave portion of the lower die 2b.

The positioning protrusion 1a is brought into contact with the mold surface of the upper mold 2a or the lower mold 2b in a state where the mold 2 is closed, so that the portion 1b constituting the circuit of the primary molded product 1 is raised. The height is formed so as not to come into contact with the surface of the mold 2a or the lower mold 2b. That is, by providing the positioning protrusion 1a having the above height, the resin injection pressure at the time of secondary molding and the contact with the mold surface at the time of inserting the primary molded product 1 into the cavity 3 are prevented, and The damage to the portion 1b forming the circuit was prevented.

[0007]

[Problems to be solved by the device]

 However, in the primary molded product 1 shown in FIG. 3, since the positioning protrusion 1a, which is not necessary originally, is provided, the resin material is excessively consumed by that amount. Moreover, in the finally obtained secondary molded product, as shown in FIG. 4 (in FIG. 4, the surface of the primary molded product is hatched to distinguish it from the secondary molded product). .), The tip end surface of the positioning pin 1a is exposed on the surface of the secondary molded product 4. As a result, a plating film was also formed on the tip surface of the positioning protrusion 1a when the secondary molded product 4 was plated, although the tip surface of the positioning protrusion 1a was originally not required to be plated. Therefore, in some cases, the circuit may be short-circuited with the circuit formed on the portion 1b constituting the circuit, which may affect the characteristics.

Therefore, an object of the present invention is not only to reduce the consumption of resin material, but also to form a plating film with sufficient strength only in a necessary portion without forming a plating film in an unnecessary portion. Another object of the present invention is to provide a resin molding die for secondary molding that enables the formation of a resin.

[0009]

[Means for Solving the Problems]

 The present invention is a mold for secondary molding used in a two-shot method in which a primary molded product is placed in a mold for secondary molding to perform secondary molding. In order to prevent contact with the surface of the mold, the resin molded mold is characterized in that a primary molded product support is formed so as to project from the mold surface into the cavity.

[0010]

[Action]

 In the present invention, the above-mentioned primary molded product support portion is formed on the molding die side, which prevents the primary molded product from contacting the surface of the mold with the primary molded product inside the secondary molding mold. Is located in. Therefore, it is possible to prevent the predetermined portion of the primary molded product from being damaged due to the resin injection pressure and the contact with the secondary molding die. Moreover, since the primary molded product support portion is formed on the molding die side, no extra molding material is required to obtain the primary molded product. In addition, no unnecessary plateable portion is formed on the surface of the finally obtained secondary molded product.

[0011]

[Explanation of Examples]

 Hereinafter, a resin molding die according to an embodiment of the present invention will be described with reference to FIGS. 1, 5 and 6. FIG. 5 is a perspective view showing a primary molded product to be inserted into a molding die according to an embodiment of the present invention. The primary molded product 11 has a structure in which the projections 13 and 14 are formed on the upper surface of the plate 12 and the projections 15 and 16 are formed on the lower surface. The tip surfaces 13a to 16a of the ridges 13 to 16 are shaped so that a circuit is finally formed by plating. That is, the tip surfaces 13a to 16a form the plating-required portion of the secondary molded product.

FIG. 1 is a cross-sectional view showing a state in which the primary molded product 11 is arranged in a molding die 17 of this embodiment. The molding die 17 has an upper die 17a and a lower die 17b, and a cavity 18 is formed by the concave portion of the lower die 17b. The feature of this embodiment is that a positioning pin 19a as a primary molded product supporting portion is embedded and fixed in the upper mold 17a and the lower mold 17b so as to extend from the upper mold 17a and the lower mold 17b into the cavity 18. It will be. The positioning pin 19a may be integrally formed with the upper die 17a and the lower die 17b.

The positioning pins 19 a are protrusions 13 to 16 which are parts constituting a circuit of the primary molded product 11 when the primary molded product 11 is inserted into the cavity 18 and the resin molding die 17 is closed. The front end surfaces 13a to 16a are configured to have a height such that they do not contact the surface of the upper mold 17a or the lower mold 17b. Therefore, when the mold 17 is closed, the tip surfaces 13a to 16a of the ridges 13 to 16 are arranged with a gap from the upper mold 17a or the lower mold 17b as shown in the drawing. Therefore, it is possible to reliably prevent damage to the tip surfaces 13a to 16a during the work of inserting the primary molded product 11 into the molding die 17 and during the work of injecting the molding material.

FIG. 6 is a perspective view of a secondary molded product obtained by performing the secondary molding using the molding die 17. As is clear from FIG. 6, in the obtained secondary molded product 20, the tip surfaces 13a and 14a of the ridges 13 and 14 are exposed on the surface, and the tip surfaces 13a and 14a of the ridges 13 and 14 are exposed on the surface by the plating process performed later. A plated film is formed to form a circuit portion. On the other hand, a hole 21 is formed in the portion where the positioning pin 19a was provided. Therefore, as shown in FIG. 4, in the secondary molded product obtained by the conventional method, the unnecessary plating film was finally formed on the tip surface of the positioning protrusion 1a, whereas in the molding die of this embodiment. When No. 17 is used, such an unnecessary plating film is not formed. Therefore, it is possible to prevent a trouble caused by a short circuit with the circuit portion.

As shown in FIG. 7, the movement of the protrusions 13 to 16 of the primary molded product 11 is used as a primary molded product support portion formed by projecting from the upper mold 17a and the lower mold 17b of the molding die 17. When the positioning pin 22 is formed so as to be restricted in the horizontal direction and the paper surface-paper spine direction in FIG. 7, accurate positioning of the primary molded product 11 in the mold 17 can also be achieved. As described above, if the primary molded product supporting portion of the present invention has a shape that also positions the primary molded product 11 in the left-right direction, the secondary molded product can be formed with higher accuracy. ..

[0016]

[Effect of the device]

 According to the present invention, when the MID is obtained by the two-shot method, since the above-mentioned primary molded product supporting portion is formed in the secondary molding mold, the insertion work of the primary molded product into the secondary molding mold and the It is possible to reliably prevent damage to the part where plating is scheduled during the resin injection work. Therefore, the reliability of the plating film formed in the subsequent process can be improved.

Moreover, since the unnecessary plated portion is not formed in the finally obtained secondary molded product, it is possible to prevent the reliability of the circuit from being lowered due to the formation of the unnecessary plated portion, and further, the primary molded product supporting portion. By devising the shape of the above, not only the above effects can be obtained, but also the positioning of the primary molded product in the cavity during secondary molding can be performed with high accuracy, which results in higher accuracy. It is possible to obtain a high secondary molded product.

[Brief description of drawings]

FIG. 1 is a cross-sectional view showing a state where a secondary molded product is placed in a resin molding die of an example.

FIG. 2 is a cross-sectional view showing a state where a primary molded product is placed in a conventional resin molding die.

FIG. 3 is a perspective view showing a primary molded product prepared by a conventional method.

FIG. 4 is a perspective view showing a secondary molded product obtained by a conventional method.

FIG. 5 is a perspective view showing a primary molded product used in Examples.

FIG. 6 is a perspective view showing a secondary molded product obtained by using the mold of the example.

FIG. 7 is a sectional view showing a state in which a primary molded product is placed in a resin molding die of another embodiment of the present invention.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 11 ... Primary molded product 13a-16a ... Tip surface which comprises the circuit of a primary molded product 17 ... Resin molding die 18 ... Cavity 19a ... Positioning pin as a primary molded product support part

Claims (1)

[Scope of utility model registration request] 1. A secondary molding die used in a two-shot method in which a primary molded article is placed in a secondary molding die to obtain a secondary molded article. In order to prevent contact with the mold surface, a primary molded product support portion is formed so as to project from the mold surface into the cavity, and a resin molding mold.