JPH0572197U - Assembly equipment for electronic components - Google Patents

Abstract

(57) [Summary] [Purpose] The purpose is to be able to automatically change the position of the detection device according to the position of the bat mark. [Structure] The CPU (68) has a bat mark detection sensor (6) at the position of the bat mark (7) indicating that the printed circuit board (2) on the inheritance conveyor (4) stored in the RAM (69) is defective. To move.

Description

[Detailed description of the device]

[0001]

[Industrial applications]

 The present invention relates to an assembly device of electronic parts for performing a predetermined work on a printed circuit board on a work table.

[0002]

[Prior Art]

 As this type of prior art, there is one disclosed in Japanese Utility Model Laid-Open No. 2-36100 filed previously by the present applicant.

However, since the mounting position of the detection device is adjusted by the screw according to the position of the bad mark, the skill of the operator is required.

[0004]

[Problems to be solved by the device]

 Therefore, it is an object to automatically change the position of the detection device according to the position of the bad mark.

[0005]

[Means for Solving the Problems]

 Therefore, the present invention is an apparatus for assembling electronic components for performing a predetermined operation on a printed circuit board on a work table, and an inheritance conveyor for supplying the board to the work table and a board on the inheritance conveyor where the board is not mounted. A bad mark detection device that detects whether or not a bad mark indicating that the product is a good product, a storage device that stores a position where the bad mark is attached, and a position of the bad mark stored in the storage device And a control device for controlling the bad mark detection device to move.

[0006]

[Action]

 With the above configuration, the control device moves the bad mark detection device to the position of the bad mark indicating that the board on the inheritance conveyor stored in the storage device is defective.

[0007]

【Example】

 An embodiment of the present invention will be described in detail below with reference to the drawings.

(1) is a component mounting apparatus for mounting an electronic component (3) on a split substrate (2) having a plurality of identical substrate patterns.

Reference numeral (4) is an inheriting conveyor that inherits the boards (2) sequentially supplied from an upstream device (not shown) and transfers them to an XY table (5) as a work table for performing component mounting work.

Reference numeral (6) is a bad mark detection sensor for detecting a bad mark (7) attached to the board (2) waiting on the transfer conveyor (4) and showing a defective product. Since the bad mark detection sensor (6) is moved XY by the XY moving mechanism (8), it can be applied to the substrate (2) in which the position of the bad mark (7) is different. In the XY movement mechanism (8), the ball screw (10) is rotated by the rotation of the X-axis motor (9), and the X table (12) is moved to the linear guides (13) (13) by the movement of the slider (11). Along it is moved in the X direction. Further, the ball screw (15) is rotated on the X table (12) by the rotation of the Y-axis motor (14) to move the slider (16) along the linear guide (17) to move the slider (16). The bad mark detection sensor (6) attached to the (16) via the attachment fitting (18) is moved to a predetermined position.

Here, the XY table (5) will be described.

Reference numeral (20) denotes an XY table driving unit, which is provided with a base (21), a first guide rail (22), a slider (23), and an X-axis motor (24) on the base (21). X-direction moving table (25) mounted so as to be movable in the X-direction, and the second guide rail (26), slider (27), and Y-axis motor (on the X-direction moving table (25). 28) and a Y-direction movement table (29) mounted so as to be movable in the Y direction.

A substrate support table (31) is installed on the XY table drive unit (20), and the substrate support table (31) is moved by a lifting device (33) via a guide shaft (32). Lifting control is possible.

The elevating device (33) includes a drive cylinder (36) that pushes up and rotates a pressure lever (35) that vertically rotates about a support shaft (34) as a center of rotation, and a drive cylinder (36). The pressure contact lever (35) is provided at the free end of the pressure contact lever (35) and is in pressure contact with the lower portion of the substrate support table (31).

Further, (38) and (38) are a pair of left and right substrate transfer chutes installed on the substrate support table (31) so as to face each other, and transfer belts (39) and (39) are provided at their upper ends. Substrate supporting conveyance paths (40) (40) in which the above () are incorporated are formed.

Further, (41) is a backup base as a substrate backup device installed on the substrate support table (31) corresponding to the space between the substrate transfer chutes (38, 38). The backup base (41) is guided by a guide shaft (42) so as to be able to move up and down in the Z direction, and the feed screw shaft (43) and the feed screw shaft (43) are connected to the timing pulleys (44) (44). ) And a drive motor (46) for rotating in the forward and reverse directions via a timing belt (45). In the figure, (47) and (47) are backup pins implanted on the backup base (41).

Reference numeral (50) is a vertical movement mechanism (not shown) for mounting the component (3) taken out from a component supply device (not shown) by a desired suction nozzle (51) on the substrate (2) on the XY table (5). The mounting head is Four nozzles (51) are mounted on the head (50), and a nozzle mounting portion (52) is rotated by a rotation mechanism (not shown) to select a desired nozzle (51).

Reference numeral (54) is a delivery conveyor of a mounting device that conveys the board (2) on which the components are mounted on the XY table (5) to a downstream device (not shown).

(55) is a stopper that can move up and down by a vertical movement mechanism (not shown) that regulates the substrate (2) conveyed on the inheritance conveyor (4) to a predetermined position on the conveyor (4). Reference numeral (56) is a stopper that can move the substrate (2) to a predetermined position on the XY table (5) and can move up and down in the same manner.

Reference numeral (57) is a sensor for detecting that the substrate (2) has been conveyed onto the XY table (5), and (58) is the substrate (2) being conveyed onto the transfer conveyor (54). It is a sensor that detects the arrival.

Reference numeral (60) denotes an operation unit, such as a numeric keypad (61) for inputting data, a cursor key (62), and a SET key (for selecting and setting data on a screen of a CRT (67) described later at the time of data input. 63), a teaching key (64) for setting various data input modes, a start key (65) for starting operation, and the like.

Reference numeral (66) is an interface, which is the bad mark detection sensor (6), X-axis motors (9), (24), Y-axis motors (14), (28), drive cylinder (36), drive The motor (46), the sensors (57), (58), the CRT (67), etc. are connected, while the respective control elements of these are controlled by the CPU (68) as a control device. ..

Reference numeral (69) is a RAM as a storage device, which is NC data such as data regarding the position of the butt mark (7) on the substrate (2), mount M data regarding the mounting position, and mount A data regarding each position of the repeating pattern. Memorize Further, (70) is also a ROM as a storage device for storing the operation program.

The operation will be described below.

First, the teach key (64) is pressed to cause the CRT (67) to display the NC DATA INFORMATION screen shown in FIG. On this screen, move the cursor (not shown) to the "1.PCB-1" position with the cursor key (62) and press the SET key (63) to select the type of board (2) to be handled.

Then, when the start key (65) is pressed, the mounting operation is started based on the mount M data and mount A data shown in FIGS. 5 and 6 below.

The mount M data for the board (2) having the board name PCB-1 shown in FIG. 5 will be described.

First, the bat mark detection command “B” is issued to the control command (C) in step 1 (M001), and the coordinate position (X1, Y1) on the substrate (2), which is the bat mark position, is changed. It has been entered. The coordinate position (X1, Y1) is a position from the origin position of the bat mark detection sensor (6).

Steps 2 (M002) to 7 (M007) show the component mounting positions on the board (2).

“P” input to the control command (C) in step 8 (M008) indicates that the mounting position data ends and that there is a repeating pattern.

The mount A data for the board (2) having the board name PCB-1 shown in FIG. 6 will be described.

Step 1 (M001) shows the offset position with respect to the first substrate pattern, and step 2 (M002) shows the offset position with respect to the second substrate pattern.

“E” input to the control command (C) in step 3 (M003) indicates the end of all data. That is, the substrate (2) is a split substrate composed of a set of substrate patterns.

When the substrate (2) is conveyed from the upstream device to the inheritance conveyor (4) with the stopper (55) raised by the vertical movement mechanism, the movement of the substrate (2) is restricted by the stopper (55). To be done.

At this position, the CPU (68) reads the data regarding the position of the bat mark (7) from the RAM (69) and controls the XY moving mechanism (8) to control the bad mark (7) on the substrate (2). The butt mark detection sensor (7) is moved upward to detect whether or not the bad mark (7) is attached to the substrate pattern on the left side of the substrate (2) first. Next, the bad mark detection sensor (6) is moved by the XY moving mechanism (8) to the position on the right board pattern where the bad mark (7) is supposed to be if the board is defective. Then, the operation of detecting the bad mark (7) is continued. That is, the coordinate positions (X1, Y1) and (0000000) on the substrate (2) input in step 1 (M001) of the mount M data and mount A data shown in FIGS. 5 and 6 are added. The sensor (6) is moved to the coordinate position (X1, Y1) and the presence or absence of the bat mark (7) is detected. Further, the sensor (6) is added to the coordinate position (X1, Y1) of the step 1 (M001) of the mounter M data and the coordinate position (1000000) of the step 2 (M002) of the mount A data. Is moved to detect the presence or absence of the back mark (7) on the right board pattern. However, since the control command of the next step 3 (M003) is “E” (the split board (2) is Consists of a board pattern.)

These detection results are stored in the RAM (69).

Next, after the mounting work of step 2 (M002) to step 7 (M007) shown in FIG. 5 is completed on the board (2) on the XY table (5) shown in FIG. The substrate (2) on the transfer conveyor (4) is transferred to the XY table (5) side while being transferred to the transfer conveyor (54) side and the regulation by the stopper (55) is released. When the sensor (57) detects the front end of the substrate (2), the stopper (56) is raised to regulate the substrate (2) to a predetermined position. Here, based on the presence / absence data of the bad mark (7) stored in the RAM (69), the component (3) will be attached to the board pattern without the bad mark (7).

Hereinafter, a case where both substrate patterns have no butt mark (7) will be described.

In this case, the drive cylinder (36) drives the substrate support table (31) to descend via the guide shaft (32). Further, the back-up base (41) is raised by the rotation of the drive motor (46), and the back-up pins (47) (47) are brought into contact with the back surface of the substrate (2) as shown in FIG. The board (2) having a different board thickness can be dealt with by adjusting the rotation amount of the drive motor (46).

Here, component mounting is sequentially performed on the board pattern on the left side of step 2 (M002) of the mount M data in FIG. At this time, the coordinate position (0000, 0000) of step 1 (M001) of the mount A data is always added to the coordinate position of each step of the mount M data. That is, the X-axis movement table (25) is driven by driving the X-axis motor (24) and the Y-direction movement table (29) is moved by driving the Y-axis motor (28), and the components sucked by the suction nozzle (51) are moved. The mounting positions (X2, Y2) on the substrate (2) are moved below (3). Then, the nozzle (51) is lowered and the component (3) is mounted on the substrate (2) as shown in FIG.

Thereafter, similarly, the mounting work is continued until step 7 (M007), and since the control command in step 8 (M008) is “P”, the mounting work for the left board pattern is completed.

Next, the work of mounting on the right board pattern is performed. At this time, the component (3) is sequentially mounted at the mounting position where the coordinate position (1000000) of step 2 (M002) of the mount A data is always added to the coordinate position of each step of the mount M data. ..

Then, for the substrate (2) which has been mounted on both substrate patterns, the backup base (41) is lowered by the rotation of the drive motor (46), and the substrate is driven by the drive cylinder (36). After the support table (31) is lifted, it is conveyed to the delivery conveyor (54) side. At this time, the substrate (2) on the inheritance conveyor (4) is also conveyed to the XY table (5) side.

It should be noted that the component mounting work is not performed on the board pattern having the butt mark (7), and it is skipped.

In addition, although the present embodiment has been described by taking the split substrate as an example, the present invention can be similarly applied to a normal substrate without such multi-chamfering and is provided with a butt mark (7). For example, parts mounting work is not performed.

Further, the invention is not limited to the component mounting apparatus, and may be applied to an adhesive application apparatus for applying an adhesive on a substrate, a screen printing machine for printing a solder paste through a screen, or the like.

[0047]

[Effect of the device]

 As described above, according to the present invention, the position of the detection device can be automatically changed according to the position of the bad mark.

[Brief description of drawings]

FIG. 1 is a schematic circuit diagram of the device of the present invention.

FIG. 2 is a perspective view of the same.

FIG. 3 is a side view of the same.

FIG. 4 is a diagram showing NC data regarding mounting.

FIG. 5 is a diagram showing NC data regarding mounting.

FIG. 6 is a diagram showing NC data regarding mounting.

[Explanation of symbols]

 (4) Transfer conveyor (6) Bad mark detection sensor (7) Bad mark (8) XY movement mechanism (68) CPU (69) RAM

 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Akio Watanabe 2-18 Keihan Hondori, Moriguchi City, Osaka Sanyo Electric Co., Ltd.

Claims (1)

[Scope of utility model registration request] 1. An electronic component assembling apparatus for performing a predetermined operation on a printed circuit board on a work table, and an inheritance conveyor for supplying the board to the operation table, and a defective board for the board on the inheritance conveyor. A bad mark detecting device for detecting whether or not a bad mark indicating that
A storage device for storing the position to which the bad mark is attached;
An apparatus for assembling electronic parts, comprising: a control device that controls the bad mark detection device to move to a position of the bad mark stored in the storage device.