JPH0572269A - Measuring jig for ic tester - Google Patents

Abstract

(57) [Summary] [Purpose] It is not necessary to prepare many measuring jigs for various types of IC measurement, and it is easy to guarantee the line impedance for various IC measurements. To provide. [Structure] By arranging the signal side contact pins and the ground side contact pins in a checkerboard pattern, and by providing the terminal connection pin block with the signal side contact pins having the coaxial structure, it is easy to guarantee the line impedance and ground each terminal. It is easy to keep the distances for and approximately equal. By providing a socket board so that it can be attached to and detached from this inter-terminal connection pin block, by replacing only the socket board with a socket board on which the IC to be measured is mounted, it is possible to measure ICs of various types and shapes. A corresponding measurement jig can be used, and it is not necessary to prepare many measurement jigs.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an IC tester measuring jig (I / F unit or prober), and more specifically, an I / F unit or prober mounted on a test head is provided for each type of measuring IC. The present invention relates to an I / F unit or a prober capable of measuring a wide variety of ICs without any problem.

[0002]

2. Description of the Related Art An IC test includes an IC in a packaged stage and an IC in a wafer stage, which are combined with an IC handler. In either case, a test head and an IC are usually used. It has a structure in which an I / F unit or a prober is interposed between the test heads and the test head is coupled to the I / F unit or the prober. This prober is provided with a socket board that receives the IC according to the IC to be inspected or a probe card that comes into contact with the terminal portion of the wafer, and a drive signal from the test head side is sent to the IC through the socket or the probe card. The output signal from the IC is transmitted to the test head via the socket or the probe card.

In order to connect the test head to the I / F unit or the prober, a terminal board called a mother board or a contact board is generally provided on the test head side, whereas the I / F unit or the prober side is provided with the terminal board. Contact pins with springs (so-called pogo pins) are arranged corresponding to each terminal of the terminal board. When the I / F unit or the prober corresponding to the IC to be measured is connected to the test head, the terminals on the terminal board and the contact pins of the I / F unit or the prober are connected so as to make proper contact with each other. .. Therefore, a guide post is usually implanted in the I / F unit or the prober side, and a guide post receiving hole for receiving the guide post is provided in the terminal board side. With these, the test head and the I / F unit or the prober are provided. The relative alignment with is performed.

[0004]

By the way, in recent years, ICs have been used.
The number of inspection items for ICs has increased with the increase in the degree of integration and the increase in the number of functions, and accordingly the inspection time has increased, resulting in a decrease in the inspection efficiency for one IC. Moreover, the number of IC types is increasing, and the measurement jigs must be replaced according to the ICs to be measured. Even if the same type is used, different measurement jigs can be used depending on the number of pins and the shape. You have to prepare. As a result, the number of measurement jigs increases, and the time required for the prober replacement work and adjustment before measurement is not lost.

Therefore, in order to avoid such a situation, many ICs are tested in parallel at once. Further, as the number of pins of the IC itself has increased, the number of ICs having a terminal pitch narrower than that of the conventional one has also increased. For this reason, in the measuring jig, the number of terminals in contact with the IC is increased as compared with the conventional one, and high density of terminals is required. As a result, the number of internal wirings of the measurement jig increases, the wiring work is troublesome, the stray capacitance increases, noises are easily picked up between the wirings, and reliable measurement becomes difficult. In addition, the clock speed required for the inspection is improved, and the speed of 50 MHz to 100 MHz or higher is required, so that the conditions of signals flowing between wirings are becoming more severe. One of the conditions is that the line impedance must be guaranteed to be a constant value, for example, 50Ω, and that the distance between the ground and each input / output terminal must be as equal as possible. However, since the types of measurement ICs are increasing, it is quite difficult to match these characteristics when preparing the measurement jigs corresponding to the respective types. An object of the present invention is to solve the above-mentioned problems of the prior art, and it is not necessary to prepare many measuring jigs for the IC measurement of many kinds, and it is possible to measure various ICs. It is to provide a measurement jig for an IC tester that can easily guarantee the line impedance.

[0006]

The features of the measuring jig of the IC tester of the present invention for achieving such an object are as follows:
A first base in which a plurality of first signal-side contact pins and a plurality of first ground-side contact pins that contact the terminals of the first wiring board are arranged in a checkered pattern, and the first base is substantially A second base arranged in parallel and having a plurality of second signal side contact pins and a plurality of second ground side contact pins that are in contact with the terminals of the second wiring board and are arranged in a checkered pattern; Outer cylinders of the plurality of first signal-side contact pins and the plurality of second signal-side contact pins at corresponding positions are integrated into one tube, and the signal line is located at the center. An inter-terminal connection pin block, which has a coaxial structure, is electrically connected to each of the outer cylinders, the first base, the second base, and the first and second ground side contact pins, and the surface is covered. Inspection IC installed And a terminal on which the plurality of first signal-side contact pins and the plurality of first ground-side contact pins respectively come into contact, and a socket of the first signal-side contact pin and the socket. A second wiring board, and a socket board as a first wiring board to which the terminal pins of the above are internally connected, and a holding mechanism for holding the socket board in a detachable relationship with the inter-terminal connection pin block. A plurality of terminals of the substrate are respectively connected to a terminal board provided on the test head side or terminals of the test head.

[0007]

As described above, by arranging the signal-side contact pins and the ground-side contact pins in a checkerboard pattern and providing the terminal-connecting pin block with the signal-side contact pins having the coaxial structure, it is easy to guarantee the line impedance. It is easy to keep the distance between each terminal and the ground substantially equal. By providing a socket board so that it can be attached to and detached from this inter-terminal connection pin block, by replacing only the socket board with a socket board on which the IC to be measured is mounted, it is possible to measure ICs of various types and shapes. A corresponding measurement jig can be used, and it is not necessary to prepare many measurement jigs.

[0008]

1 is a schematic cross-sectional explanatory view of a measuring jig of an IC tester of the present invention, FIG. 2 is an explanatory view of its socket board, FIG. 3 is an explanatory view of a scramble board, and FIG.
FIG. 4 is an explanatory diagram of the inter-terminal connection pin block. Figure 1
In the above, 10 is a test head, and 20 shown by a chain double-dashed line is an IC handler that receives the test head.
The I / F unit 1 is mounted on the test head 10. Reference numeral 11 denotes a mother board provided on the test head 10, and each input / output terminal on the mother board 11 has an I / O terminal.
The contact pins (probe pins) 2, 2, ..., 2 with springs provided on the F unit 1 side are in contact. It should be noted that inside the contact pins 2, 2, ..., 2, a signal connecting wire is arranged at the center position of the circular cross section at both ends thereof, and a coaxial wire filled with ceramics or highly insulating resin is provided on the outside. It is a coaxial pin with a structure.

The I / F unit 1 includes a performance board 3, a contact board 4 connected to the performance board 3, a scramble board 5 connected to the contact board 4, and a contact board 4 connected to the scramble board 5. Through performance board 3
, A socket board 7 connected to the terminal connection pin block 6 and a socket board 7 connected to the terminal connection pin block 6, and the socket board 7 is provided with sockets 8, 8, ... 8 are provided. The socket 8 is arranged corresponding to the measurement IC supply lane of the IC handler 20.

The contact pins 2, 2, ..., 2 provided on the performance board 3 are provided through the coaxial cables 2a, 2a ,. , 4a of the contact board 4 thus formed. Therefore, each connection pin of the performance board 3 is associated with each pin of the contact board 4 in a one-to-one correspondence, and as a result, the motherboard 11 of the test head 10 is connected.
The upper input / output terminals are contact pins 4a, 4a, ...
It means that the cable is led up to 4a by the coaxial cable. Moreover, the contact pins 4a, 4a, ..., 4a are also coaxial pins having the same coaxial structure as the contact pins 2, 2 ,. As a result, it is resistant to noise, the stray capacitance in the cable wiring can be reduced, and the impedance in the wiring up to this point can be made constant.

By the way, the terminal arrangement of the socket pins of the socket board 7 is such that the contact pins 4a, 4a ,.
It is different from the terminal arrangement of 4a. Therefore, the contact pins 4a, 4a ,.
... It is necessary to convert the terminal arrangement of 4a. The scramble board 5 performs this conversion. The scramble board 5 is composed of a substrate having a multilayer wiring structure in which signal lines are sandwiched by ground lines, as will be described later,
The terminal arrangement on the contact board 4 side is the contact pin 4
a, 4a, ..., 4a, necessary pins among these pins are converted into required positions of socket pins, and contact pins 6b, 6b, ...
A board that performs terminal position conversion matching the positions of 6b and 6b and that performs wiring processing such as internally connecting terminals that can be commonly connected. The contact pin 6
The positions of b, 6b, ..., 6b correspond to the positions of the socket pins and have a relationship with the contact pins 6a, 6a ,. .. In other words, as will be described later, the contact pins 6a and 6b are actually one coaxial contact pin, and contact pin portions (needle portions) of the contact pin are provided at both ends thereof.

With the above connection, the processing of the ground line of the coaxial cable 2a becomes a problem. Here, not only the signal line portion of the coaxial cable 2a but also the wiring line on the ground side thereof are contact pins 6b, 6b ,. ...
6b is assigned to the contact pins 6b, 6b, ...
.., 6b so that the ground line is pulled out together with the signal line and sent to the ground terminal of the socket board 7. As a result, all wiring up to the socket board 7 has a coaxial structure, the line impedance is guaranteed to be a predetermined constant value, and the wiring length can be kept substantially the same except for the inside of the scramble board 5. Moreover, the routing of the wiring due to the displacement of the terminal with respect to the socket is completely absorbed by the scramble board 5, and the wiring length here can be adjusted by the routing.

Here, the scramble board 5 and the socket board 7 are connected to each other by connecting a frame 9 (a frame 9 is an outer frame and a bridge frame 9a bridged to outer frame members (see FIG. 1) above and below the drawing). It is attached between the pin blocks 6). The scramble board 5 includes a mounting screw 5a provided at four corners of the board and a frame 9a around the inter-terminal connection pin block 6.
It is removably fixed to the frame 9 by means of a mounting screw 5b attached to, and is detached by this. Similarly, the socket board 7 has mounting screws 7 provided at four corners of the board.
a and a mounting screw 7b mounted on the frame 9a around the inter-terminal connection pin block 6 so as to be detachably fixed to the frame 9.

FIG. 2A is a plan view of the socket board 7. The socket board 7 is provided according to the type of IC to be measured, and even the same type is prepared according to the number of pins and the shape thereof. Part 1
One is the socket board 7 shown in the figure. In addition, 7c is
Positioning guide hole for the handler 20 side, 7d
Is a receiving hole for the mounting screw. This socket board 7
It has 32 sockets, and the wiring therein is a multilayer wiring as shown in a partial sectional view (b) along the wiring line and a partial sectional view (c) crossing the wiring line. .. The guard line 72 is connected to the ground (GND) wiring layer 7
1 is a ground wiring layer which is provided corresponding to the ground side contact pin 6a and is maintained at the ground potential, and is provided so as to sandwich the signal line 73 between the ground wiring layer 71 and the ground wiring layer 71. ing. As a result, the socket board 7 is formed with a microstrip line, thereby ensuring a line impedance of 50Ω,
Moreover, a substrate with low floating capacitance is realized. Note that (b)
Shown above the pad is a plan view of each pad (terminal), and as shown, the pad 75 of the signal line 73 is shown.
Are connected by wiring lines 75b with the positions of the through holes 75a and the pads deviated from each other, and the pads 74 of the guard line 72 have a through hole 74a formed at the center thereof. The relationship between these pads is shown in Figure (d).
As shown in FIG. 5, the pins are in a checkered pattern like the pins of the inter-terminal connection pin block 6. The checkered pattern is repeated by using the array of the pads 74 and 75 of the frame 76 shown by the dotted line as a unit. Also, the socket 8
Are provided on the side of the ground wiring layer 71, and the pins of the socket 8 are connected to the signal line 73 through the through holes provided in the portion of the ground wiring layer 71 from which the copper foil is removed. Not shown.

The scramble board 5 has pads 74 and 75 on the front and back surfaces thereof, and the front and back surfaces are the pad surfaces as shown in FIG. 3 instead of the surface of the socket 8 of FIG. 2 (a). There is. This is the ground wiring layer 71 of FIG.
Is symmetrical and a similar layer is provided on the lower side, and the relationship between the signal line, the guard line and these pads is the same as the above, whereby a line impedance of 50Ω is secured, Substrate with low stray capacitance is realized. The big difference from the socket board 7 is that
As shown in the figure, the connection positions of the pads are arranged differently on the front surface and the back surface, and corresponding ones of them are connected to each other, whereby connection position conversion is performed.

FIG. 4 is a detailed view of the inter-terminal connection pin block 6 that contacts the pad 74 connected to the guard line and the pad 75 connected to the signal line. Figure (a)
As shown in (b) showing the AA cross-sectional view in FIG. 3, the inter-terminal connection pin block 6 has a socket board side base 61 and a scramble board side base 62 arranged substantially in parallel, and a bridge between them. It is a box with a rectangular cross section composed of four pillars 63, and the pillars 63 are formed on the socket board side base 61 by the flanges 61a and 61a extending to both sides and the scramble board side base 62. Each strut 6 is provided via flanges 62a, 62a extending to both sides.
3 is fixed by screws 64, so that the socket board side base 61 and the scramble board side base 62 are joined in a substantially parallel state.

The socket board side base 61 and the scramble board side base 62 are provided with openings corresponding to the socket positions, respectively, as shown in (c) of FIG. 60, and the flanges 61a, 61a, 62a, 62a have guide pins 61b for positioning and coupling to the socket board 7, respectively.
62b is planted (see FIG. 4 (b)). Therefore, on the socket board 7 side and the scramble board 5 side, positioning guide holes (the pin 61 on the socket board 7 are inserted into the guide pins 61b, 62b, respectively)
Although holes are provided corresponding to b, this is not shown in FIG. 2 (a). ) Is provided.

As shown in FIGS. 4A and 4B, the contact pins 6a, 6a, ..., 6a embedded in the socket board side base 61 are connected to the signal side contact pin 65 and the ground. There are side contact pins 66, and they are alternately arranged in a checkered pattern when viewed from the plane. Further, the contact pins 6b, 6b, ..., 6b implanted in the scramble board side base 61 also have the signal side contact pin 67 and the ground side contact pin 68, which are alternately seen from the plane. They are arranged in a checkered pattern. Although the signal-side contact pin 65 and the signal-side contact pin 67 are provided at both ends independently, these are internally connected and the outer cylinder 69 of the main body is common. As a result, there are contact pin portions (needle portions) at both ends, and these contact pin portions are one coaxial contact pin connected by a wiring located at the center (a signal side contact pin 65 and a signal side contact pin 67). And is the coaxial structure described above).

The ground side contact pin 66 and the ground side contact pin 68 are provided independently of each other, but the socket board side base 61, the scramble board side base 62, and the column 63 are made of metal. Therefore, these are electrically connected and are in a conductive state. Further, the outer cylinder 69 of the main body of the signal side contact pin is also the socket board side base 61 and the scramble board side base 62.
It is also directly connected to the ground side contact pins 66 and 68.

By the way, the inter-terminal connection pin block 6
The socket board 7 and the scramble board 5 are fixed by screws through the frames 9 and 9a, and these boards and the inter-terminal connection pin block 6 are in a detachable relationship with the frames 9 and 9a. Therefore, the inter-terminal connection pin block 6 is also attachable / detachable to / from the frames 9, 9a. As a result, the position, arrangement, quantity, etc. of the inter-terminal connection pin block 6 are set in accordance with the type and shape of the IC to be measured, the number of pins, etc. You can freely decide according to the condition.

In particular, in this embodiment, the scramble board 5 is guided to a multi-layer wiring board called a scramble board 5 by using a coaxial cable and a coaxial pin, and the terminals of the I / F unit are directly extended and connected to the scramble board. 5
Wiring processing is performed to organize complicated wiring. In this way, by concentrating complicated wiring on the scramble board 5, there is an effect that the wiring of the entire measuring jig outside the scramble board 5 is simplified. Moreover, even if the inside of the scramble board 5 has complicated wiring, wiring similar to that of the socket board 7 shown in FIG. 2C of the partial cross-sectional view of the wiring line is performed, A signal line (see signal line 73) having a width smaller than the width of the ground wiring is sandwiched between the ground wiring lines (guard line 72, see the ground wiring layer 71), and the signal lines and ground lines run in multiple layers. .. As a result, the mutual shielding effect between the signal lines is high, the stray capacitance can be reduced, and wiring resistant to noise can be realized.

As described above, by adopting the block structure, the signal side contact pin side is made coaxial and the outer cylinder is grounded, and further the ground side contact pins are arranged in a checkered pattern around it. The impedance can be guaranteed and the distance to ground of each terminal in the socket can be kept approximately equal. As a result, excellent high frequency characteristics,
The measurement jig and the test head can be connected in a state where they are not affected by noise. Further, since it has a block structure, if the number of blocks is increased or decreased according to the size of the boards to be coupled, a large number of sockets can be provided in parallel corresponding to various ICs, and the terminals of the boards corresponding to those sockets can be easily installed. Connection can be made. Moreover, since the inter-terminal connection pin block 6, the scramble board 5, and the socket board 7 can be independently attached to and detached from the frames 9 and 9a, many of them can be exchanged according to the type and shape of the IC to be measured. It is possible to support a wide variety of products without preparing the measurement jig of. Even if the socket board 7 cannot handle all types of products, the scramble board 5 can be replaced to handle many types of ICs.

As described above, in the embodiment, the ground-side contact pins in the inter-terminal connection pin block are individually planted in their respective bases.
Similar to the signal-side contact pin, a contact pin may be provided at both ends of the outer cylinder of one contact pin to integrate the outer cylinder. Further, in the embodiment, the socket board is explained as one board, but it may be an assembly board in which some small boards having some sockets are combined. Each small socket board may be attached to a frame. In this case, the frame 9 of the embodiment is provided with a frame 9a bridging in a matrix in the vertical and horizontal directions so that the small socket board is attached to each of the widening positions. Can be

[0024]

As can be understood from the above description, in the present invention, the signal-side contact pins and the ground-side contact pins are arranged in a checkered pattern, and the signal-side contact pins have a coaxial structure. By providing the pin block, it is easy to ensure the route impedance and it is easy to keep the distance between each terminal and the ground substantially equal. By providing a socket board so that it can be attached to and detached from this inter-terminal connection pin block, by replacing only the socket board with a socket board on which the IC to be measured is mounted, it is possible to measure ICs of various types and shapes. A corresponding measurement jig can be used, and it is not necessary to prepare many measurement jigs. Moreover, since the connection between the terminals of the first wiring board and the terminals of the second wiring board by the terminal connection pin block is the coaxial wiring by the coaxial contact pins, the path therebetween can be shortened as compared with the wiring by the ordinary cable. Stray capacitance can also be reduced, so it is less susceptible to noise.

[Brief description of drawings]

FIG. 1 is a schematic cross-sectional explanatory view of an I / F unit of an IC tester of the present invention.

FIG. 2 is an explanatory diagram of the socket board.

FIG. 3 is an explanatory diagram of the scramble board.

FIG. 4 is an explanatory diagram of the inter-terminal connection pin block.

[Explanation of symbols]

1 ... I / F unit, 2 ... Probe pin, 3 ... Performance board, 4 ... Contact board, 5 ... Scramble board, 6 ... Terminal connection pin block, 6a, 6b ... Contact pin, 7 ... Socket board, 8 ... Socket, 7 ... Socket board, 8 ... Socket, 9 ... Frame, 9a ... Bridge frame, 10 ... Test head, 11 ... Motherboard, 20 ... IC handler.

Claims (3)

[Claims] 1. A first base in which a plurality of first signal-side contact pins and a plurality of first ground-side contact pins that come into contact with terminals of a first wiring board are arranged in a checkered pattern, and A plurality of second signal-side contact pins and a plurality of second ground-side contact pins that are arranged substantially parallel to the base of the first wiring board and contact the terminals of the second wiring board; A base, and a plurality of first signal-side contact pins and a plurality of second signal-side contact pins at corresponding positions, respectively, whose outer cylinders are integrated into a single pipe, Forming a coaxial structure in which the outer cylinders are located at the center, and the respective outer cylinders are electrically connected to the first base, the second base, and the first and second ground side contact pins. And the surface Has a socket 査 IC is mounted, having a terminal each of a first signal-side contact pins and a plurality of first ground-side contact pins of the plurality of back surface contacts,
A socket board as a first wiring board in which the terminals of the first signal-side contact pins and the terminal pins of the socket are internally connected, and the socket board can be attached to and detached from the inter-terminal connection pin block. A holding mechanism for holding the second wiring board, wherein the plurality of terminals of the second wiring board is a terminal board provided on the test head side or a wiring board connected to the terminals of the test head, respectively. Measurement jig. 2. The measuring jig for an IC tester according to claim 1, wherein the holding mechanism detachably holds the inter-terminal connection pin block and the socket board. 3. A first base in which a plurality of first signal-side contact pins and a plurality of first ground-side contact pins that come into contact with the terminals of the first wiring board are arranged in a checkered pattern, and the first base. A plurality of second signal-side contact pins and a plurality of second ground-side contact pins that are arranged substantially parallel to the base of the first wiring board and contact the terminals of the second wiring board; A base, and a plurality of first signal-side contact pins and a plurality of second signal-side contact pins at corresponding positions, respectively, whose outer cylinders are integrated into a single pipe, Forming a coaxial structure in which the outer cylinders are located at the center, and the respective outer cylinders are electrically connected to the first base, the second base, and the first and second ground side contact pins. And the surface Has a socket 査 IC is mounted, having a terminal each of a first signal-side contact pins and a plurality of first ground-side contact pins of the plurality of back surface contacts,
A socket board as a first wiring board in which a terminal of a first signal side contact pin and a terminal pin of the socket are internally connected, and a plurality of second signal side contact pins and a plurality of second board on the surface. The ground side has a signal side terminal and a ground side terminal with which each of the ground side contact pins contacts, and the back side has a signal side terminal that contacts the signal side contact pin that is connected to the test head terminal, and a ground side that contacts the ground side contact pin. Scramble as a second wiring board having terminals, the signal side terminals on the front and back sides and the ground side terminals are internally connected, and the positions of the signal side terminals on the front and back sides are changed. A board, and a holding mechanism for holding the terminal connection pin block, the socket board, and the scramble board in a detachable relationship, Measurement jig IC tester, wherein the serial scrambling board is a wiring substrate connected to terminals board or pin of said test head provided on the test head side.