TWI414802B - - Google Patents

Info

Publication number
TWI414802B
TWI414802B TW100126932A TW100126932A TWI414802B TW I414802 B TWI414802 B TW I414802B TW 100126932 A TW100126932 A TW 100126932A TW 100126932 A TW100126932 A TW 100126932A TW I414802 B TWI414802 B TW I414802B
Authority
TW
Taiwan
Prior art keywords
semiconductor devices
tray unit
plate member
sections
bottom plate
Prior art date
Application number
TW100126932A
Other languages
Chinese (zh)
Other versions
TW201205099A (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of TW201205099A publication Critical patent/TW201205099A/en
Application granted granted Critical
Publication of TWI414802B publication Critical patent/TWI414802B/zh

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2893—Handling, conveying or loading, e.g. belts, boats, vacuum fingers

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

Provided is a tray unit, on which a plurality of semiconductor devices to be inspected can be mounted. The tray unit has a bottom plate member that forms the bottom portion, and a semiconductor device mounting tray, which is placed on the bottom plate member, and is divided into a plurality of sections in the horizontal direction, each of said sections mounting and holding a plurality of semiconductor devices. The tray unit is removably placed on a semiconductor device inspecting apparatus that tests in batch the electrical characteristics of the semiconductor devices by having the terminals provided in the semiconductor devices facing the upper surface side.
TW100126932A 2010-07-30 2011-07-29 Tray unit and semiconductor device inspecting apparatus TW201205099A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2010171857 2010-07-30
JP2010292784A JP4765127B1 (en) 2010-07-30 2010-12-28 Tray unit and semiconductor device inspection device

Publications (2)

Publication Number Publication Date
TW201205099A TW201205099A (en) 2012-02-01
TWI414802B true TWI414802B (en) 2013-11-11

Family

ID=44693557

Family Applications (1)

Application Number Title Priority Date Filing Date
TW100126932A TW201205099A (en) 2010-07-30 2011-07-29 Tray unit and semiconductor device inspecting apparatus

Country Status (3)

Country Link
JP (1) JP4765127B1 (en)
TW (1) TW201205099A (en)
WO (1) WO2012014899A1 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI568056B (en) * 2014-05-12 2017-01-21 燦美工程股份有限公司 Substrate inspection device and method

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9114645B2 (en) 2012-06-18 2015-08-25 Cimpress Schweiz Gmbh System and method for printing on multiple different articles of manufacture by the same printing system in a conveyor system
US9656481B2 (en) 2012-06-18 2017-05-23 Cimpress Schweiz Gmbh Integrated imprinting system and trays for selectively processing items on tray
US9156293B2 (en) 2012-06-18 2015-10-13 Cimpress Schweiz Gmbh Manufacturing tray with customized inlays for processing different types of articles of manufacture
EP2871059A1 (en) * 2013-11-07 2015-05-13 Vistaprint Schweiz GmbH Conveyance printing system and method for printing on multiple different types of articles of manufacture
US10031178B2 (en) * 2015-04-21 2018-07-24 Keysight Technologies, Inc. Portable vacuum chamber and an associated automated test system and method for the testing of electronic devices
KR102393040B1 (en) * 2015-11-27 2022-05-03 (주)테크윙 Docking apparatus for testing electronic devices
JP6178969B1 (en) * 2016-08-19 2017-08-16 合同会社Pleson Tray exchange type burn-in test unit
JP6842355B2 (en) * 2017-04-28 2021-03-17 株式会社アドバンテスト Carrier for electronic component testing equipment
JP6471401B1 (en) * 2017-10-31 2019-02-20 合同会社Pleson Semiconductor wafer test unit
TWI694263B (en) * 2019-03-07 2020-05-21 雍智科技股份有限公司 Aging test circuit board module
JP7506922B2 (en) * 2019-12-18 2024-06-27 株式会社クオルテック Power Cycle Test Equipment
JP7523794B2 (en) * 2020-01-29 2024-07-29 株式会社クオルテック Semiconductor device testing equipment
KR102837279B1 (en) * 2020-07-24 2025-07-23 삼성전자주식회사 System for semiconductor package test and manufacturing method for semiconductor package using the same
KR102716715B1 (en) 2021-07-22 2024-10-11 세메스 주식회사 Tray elevating apparatus of test handler
CN116679183A (en) * 2023-08-03 2023-09-01 深圳市诺泰芯装备有限公司 IGBT product testing method and device
CN118549781B (en) * 2024-04-16 2025-02-14 南通华隆微电子股份有限公司 A packaged diode aging test fixture

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0572269A (en) * 1991-09-10 1993-03-23 Hitachi Electron Eng Co Ltd Measuring jig for ic tester
CN1705095A (en) * 2004-06-03 2005-12-07 新泻精密株式会社 Semiconductor inspection apparatus and tray for inspection parts used thereof
US20080036482A1 (en) * 2006-08-09 2008-02-14 Fujitsu Limited Carrier tray for use with prober
TW200824032A (en) * 2006-10-27 2008-06-01 Advantest Corp Customer tray and electronic component testing apparatus

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07260879A (en) * 1994-03-25 1995-10-13 Advantest Corp Interface for test head of ic tester
JP3825504B2 (en) * 1996-07-12 2006-09-27 株式会社日本マイクロニクス Integrated circuit chip tray
JP2000304808A (en) * 1999-04-23 2000-11-02 Matsushita Electric Ind Co Ltd Inspection equipment for semiconductor devices
JP4715601B2 (en) * 2006-04-07 2011-07-06 住友電気工業株式会社 Electrical connection parts
WO2010021038A1 (en) * 2008-08-20 2010-02-25 株式会社アドバンテスト Electronic component handling apparatus and electronic component test system

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0572269A (en) * 1991-09-10 1993-03-23 Hitachi Electron Eng Co Ltd Measuring jig for ic tester
CN1705095A (en) * 2004-06-03 2005-12-07 新泻精密株式会社 Semiconductor inspection apparatus and tray for inspection parts used thereof
US20080036482A1 (en) * 2006-08-09 2008-02-14 Fujitsu Limited Carrier tray for use with prober
TW200824032A (en) * 2006-10-27 2008-06-01 Advantest Corp Customer tray and electronic component testing apparatus

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI568056B (en) * 2014-05-12 2017-01-21 燦美工程股份有限公司 Substrate inspection device and method

Also Published As

Publication number Publication date
WO2012014899A1 (en) 2012-02-02
JP4765127B1 (en) 2011-09-07
JP2012047717A (en) 2012-03-08
TW201205099A (en) 2012-02-01

Similar Documents

Publication Publication Date Title
TWI414802B (en)
TW201129814A (en) Electrical connecting apparatus and testing system using the same
TWI562388B (en) Wafer level optoelectronic device packages and methods for making the same
NZ593472A (en) Mattress having double spring support system
IN2015DN01363A (en)
EP2500732A3 (en) Specimen analyzer
CA2775432C (en) Measuring device for determining a leg-and-foot length for measurement of stockings, in particular medical compression stockings
JP2013053898A5 (en) Semiconductor test jig
SG11201401955YA (en) Wafer support apparatus and semiconductor processing device having same
EP2709145A3 (en) Inline metrology for attaining full wafer map of uniformity and surface charge
SG196747A1 (en) Thinned and flexible semiconductor elements on three dimensional surfaces
SG11201405703RA (en) Probe card for an apparatus for testing electronic devices
EP2879986A4 (en) DEVICE COMPRISING AN INTERPOSER BETWEEN A SEMICONDUCTOR AND A SUBSTRATE
MX2015005120A (en) Wire sorting fixture and method of sorting wires.
MY180308A (en) Docking device, docking method
EP2584596A3 (en) Testing device for testing wafers for electronic circuits and related method
MY170414A (en) Test device for testing a pop stacked-chip
IN2014DN03279A (en)
FR2986937B1 (en) EXTRACTIBLE SUPPORT DEVICE FOR ELECTRICAL EQUIPMENT
WO2011098906A3 (en) Electric generator pole device
JP2014519039A5 (en)
HK1224253A1 (en) An apparatus and methods for identifying both sides of a test board
NZ611509A (en) Bra storage device
MY180103A (en) System for testing semiconductors
SG196693A1 (en) Method and apparatus for the engagement of ic units

Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees