JPH0573266B2 - - Google Patents

Info

Publication number
JPH0573266B2
JPH0573266B2 JP61265195A JP26519586A JPH0573266B2 JP H0573266 B2 JPH0573266 B2 JP H0573266B2 JP 61265195 A JP61265195 A JP 61265195A JP 26519586 A JP26519586 A JP 26519586A JP H0573266 B2 JPH0573266 B2 JP H0573266B2
Authority
JP
Japan
Prior art keywords
heat dissipation
circuit board
thermally conductive
block
package
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP61265195A
Other languages
English (en)
Japanese (ja)
Other versions
JPS63119554A (ja
Inventor
Yukio Yamaguchi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Electric Co Ltd filed Critical Nippon Electric Co Ltd
Priority to JP61265195A priority Critical patent/JPS63119554A/ja
Priority to EP87301651A priority patent/EP0236065B1/en
Priority to DE8787301651T priority patent/DE3766384D1/de
Priority to US07/018,408 priority patent/US4781244A/en
Publication of JPS63119554A publication Critical patent/JPS63119554A/ja
Publication of JPH0573266B2 publication Critical patent/JPH0573266B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
    • H05K7/20445—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing the coupling element being an additional piece, e.g. thermal standoff
    • H05K7/20454—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing the coupling element being an additional piece, e.g. thermal standoff with a conformable or flexible structure compensating for irregularities, e.g. cushion bags, thermal paste

Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP61265195A 1986-02-25 1986-11-07 パツケ−ジの放熱構造 Granted JPS63119554A (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP61265195A JPS63119554A (ja) 1986-11-07 1986-11-07 パツケ−ジの放熱構造
EP87301651A EP0236065B1 (en) 1986-02-25 1987-02-25 Liquid cooling system for integrated circuit chips
DE8787301651T DE3766384D1 (de) 1986-02-25 1987-02-25 Fluessigkeitskuehlungssystem fuer integrierte schaltungschips.
US07/018,408 US4781244A (en) 1986-02-25 1987-02-25 Liquid cooling system for integrated circuit chips

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP61265195A JPS63119554A (ja) 1986-11-07 1986-11-07 パツケ−ジの放熱構造

Publications (2)

Publication Number Publication Date
JPS63119554A JPS63119554A (ja) 1988-05-24
JPH0573266B2 true JPH0573266B2 (2) 1993-10-14

Family

ID=17413863

Family Applications (1)

Application Number Title Priority Date Filing Date
JP61265195A Granted JPS63119554A (ja) 1986-02-25 1986-11-07 パツケ−ジの放熱構造

Country Status (1)

Country Link
JP (1) JPS63119554A (2)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1993016882A1 (fr) * 1992-02-26 1993-09-02 Seiko Epson Corporation Dispositif electronique additionnel et systeme electronique
EP0598902A4 (en) * 1992-02-26 1995-06-28 Seiko Epson Corp ADDITIONAL ELECTRONIC DEVICE AND ELECTRONIC SYSTEM.
US8213431B2 (en) 2008-01-18 2012-07-03 The Boeing Company System and method for enabling wireless real time applications over a wide area network in high signal intermittence environments
EP0608418B1 (en) 1992-05-20 1998-11-04 Seiko Epson Corporation Cartridge for electronic apparatus
KR100421028B1 (ko) * 2002-05-11 2004-03-04 삼성전자주식회사 프린터용 급지 장치

Also Published As

Publication number Publication date
JPS63119554A (ja) 1988-05-24

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