JPH0573865A - Metallic terminal plate for rotary head and production thereof - Google Patents
Metallic terminal plate for rotary head and production thereofInfo
- Publication number
- JPH0573865A JPH0573865A JP25981291A JP25981291A JPH0573865A JP H0573865 A JPH0573865 A JP H0573865A JP 25981291 A JP25981291 A JP 25981291A JP 25981291 A JP25981291 A JP 25981291A JP H0573865 A JPH0573865 A JP H0573865A
- Authority
- JP
- Japan
- Prior art keywords
- metal
- terminal plate
- plate
- rotary head
- copper foil
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 19
- 239000000758 substrate Substances 0.000 claims abstract description 41
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 35
- 239000011889 copper foil Substances 0.000 claims abstract description 35
- 238000000137 annealing Methods 0.000 claims abstract description 10
- 229910052751 metal Inorganic materials 0.000 claims description 117
- 239000002184 metal Substances 0.000 claims description 117
- 238000000034 method Methods 0.000 claims description 21
- 239000000853 adhesive Substances 0.000 claims description 18
- 230000001070 adhesive effect Effects 0.000 claims description 18
- 238000004080 punching Methods 0.000 claims description 13
- 238000010438 heat treatment Methods 0.000 claims description 12
- 238000003825 pressing Methods 0.000 claims description 5
- 238000004381 surface treatment Methods 0.000 claims description 4
- 238000000059 patterning Methods 0.000 claims description 3
- 230000007261 regionalization Effects 0.000 claims description 3
- 229910000679 solder Inorganic materials 0.000 abstract description 9
- 238000004804 winding Methods 0.000 abstract description 7
- 238000005406 washing Methods 0.000 abstract 2
- 229910001369 Brass Inorganic materials 0.000 description 5
- 239000010951 brass Substances 0.000 description 5
- 239000011248 coating agent Substances 0.000 description 4
- 238000000576 coating method Methods 0.000 description 4
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 2
- CDBYLPFSWZWCQE-UHFFFAOYSA-L Sodium Carbonate Chemical compound [Na+].[Na+].[O-]C([O-])=O CDBYLPFSWZWCQE-UHFFFAOYSA-L 0.000 description 2
- ORTQZVOHEJQUHG-UHFFFAOYSA-L copper(II) chloride Chemical compound Cl[Cu]Cl ORTQZVOHEJQUHG-UHFFFAOYSA-L 0.000 description 2
- 238000001035 drying Methods 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- ZNQVEEAIQZEUHB-UHFFFAOYSA-N 2-ethoxyethanol Chemical compound CCOCCO ZNQVEEAIQZEUHB-UHFFFAOYSA-N 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 description 1
- 229920000877 Melamine resin Polymers 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- XSQUKJJJFZCRTK-UHFFFAOYSA-N Urea Chemical compound NC(N)=O XSQUKJJJFZCRTK-UHFFFAOYSA-N 0.000 description 1
- 230000005856 abnormality Effects 0.000 description 1
- 229920000800 acrylic rubber Polymers 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000004202 carbamide Substances 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 229960003280 cupric chloride Drugs 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 239000003599 detergent Substances 0.000 description 1
- QGBSISYHAICWAH-UHFFFAOYSA-N dicyandiamide Chemical compound NC(N)=NC#N QGBSISYHAICWAH-UHFFFAOYSA-N 0.000 description 1
- 229920001971 elastomer Polymers 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 238000007429 general method Methods 0.000 description 1
- 239000000696 magnetic material Substances 0.000 description 1
- JDSHMPZPIAZGSV-UHFFFAOYSA-N melamine Chemical compound NC1=NC(N)=NC(N)=N1 JDSHMPZPIAZGSV-UHFFFAOYSA-N 0.000 description 1
- 238000003801 milling Methods 0.000 description 1
- 230000007935 neutral effect Effects 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 238000001259 photo etching Methods 0.000 description 1
- 229920000058 polyacrylate Polymers 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 229910000029 sodium carbonate Inorganic materials 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Abstract
Description
【０００１】[0001]
【産業上の利用分野】この発明は、８ミリ、１／２ＶＴ
Ｒ、Ｒ−ＤＡＴ等に使用される回転ヘッド用金属端子板
およびその製造方法に関する。BACKGROUND OF THE INVENTION This invention is 8 mm, 1/2 VT.
The present invention relates to a metal terminal plate for a rotary head used for R, R-DAT, etc. and a method for manufacturing the same.
【０００２】[0002]
【従来の技術】図３の（ａ）および（ｂ）に示したよう
に、回転ヘッド用の端子板２は、金属板１上に積層され
た構造（以下、回転ヘッド用金属端子板と称する）で使
用される。そしてこの端子板２は、ベースフィルム３上
に接着剤４を介して銅箔からなる端子部５が積層され、
さら端子部５の端に半田層６が形成された構造を有して
いる。2. Description of the Related Art As shown in FIGS. 3A and 3B, a rotary head terminal plate 2 is laminated on a metal plate 1 (hereinafter referred to as a rotary head metal terminal plate). ) Used in. In this terminal board 2, a terminal portion 5 made of copper foil is laminated on a base film 3 with an adhesive 4 interposed therebetween,
Further, it has a structure in which the solder layer 6 is formed on the end of the terminal portion 5.
【０００３】このような回転ヘッド用金属端子板の製造
方法としては、従来より一般に、予め所定の表面パター
ンを有する端子板２を製造し、その端子板２と金属板１
とを接着剤により貼り合わせるという方法がとられてい
る。すなわち、エポキシ樹脂製の絶縁基板からなるベー
スフィルム３上に銅箔を接着し、次いでこの銅箔をフォ
トエッチング等により所定のパターンにエッチングして
端子部５を形成し、さらに、予め端子部５の端部以外の
部分にレジスト７を塗布した後端子部５の端部に半田層
６を形成し、外形を打ち抜いて所定の表面パターンを有
する端子板２を製造する。一方、金属板を、取り付け穴
１ａを有する所定の形状に打ち抜き、この打ち抜いた金
属板１と所定の表面パターンを形成した端子板２とを接
着剤８により貼り合わせる。As a method for manufacturing such a metal terminal plate for a rotary head, conventionally, a terminal plate 2 having a predetermined surface pattern is generally manufactured in advance, and the terminal plate 2 and the metal plate 1 are manufactured.
The method of attaching and with an adhesive is used. That is, a copper foil is adhered onto a base film 3 made of an insulating substrate made of epoxy resin, and then the copper foil is etched into a predetermined pattern by photoetching or the like to form a terminal portion 5, and further the terminal portion 5 is previously formed. After the resist 7 is applied to the portions other than the end portions, the solder layer 6 is formed on the end portions of the terminal portions 5 and the outer shape is punched out to manufacture the terminal board 2 having a predetermined surface pattern. On the other hand, a metal plate is punched into a predetermined shape having a mounting hole 1a, and the punched metal plate 1 and the terminal plate 2 having a predetermined surface pattern are bonded with an adhesive 8.
【０００４】しかしながら、このような製造方法におい
ては、所定の表面パターンを形成した端子板２と金属板
１との貼り合わせにおいて位置ずれが生じやすいという
問題があった。また、貼り合わせの接着強度も十分でな
く、さらに、個々の端子板２と金属板１とを貼り合わせ
ることにより回転ヘッド用金属端子板を１つずつ製造す
るので、回転ヘッド用金属端子板の生産性を向上させる
ことができないという問題もあった。However, in such a manufacturing method, there is a problem that a positional deviation is likely to occur when the terminal plate 2 having a predetermined surface pattern and the metal plate 1 are bonded together. In addition, the bonding strength of the bonding is not sufficient, and furthermore, the metal terminal plates for rotary heads are manufactured one by one by bonding the individual terminal plates 2 and the metal plate 1 to each other. There was also a problem that productivity could not be improved.
【０００５】そこで、上記のような一般的な回転ヘッド
用金属端子板の製造方法に対して、近年、金属板と銅箔
とを絶縁接着剤を介して加熱加圧することにより一体成
形して金属基板を形成し、その金属基板の銅箔をパター
ン形成し、パターン形成した金属基板に打ち抜き加工を
施して回転ヘッド用金属端子板を製造する方法が提案さ
れている（特開平２−４２６１７号公報）。この方法に
よれば、予め金属板と銅箔を一体成形した金属基板を形
成し、この金属基板に対して所定のパターン形成をする
ので金属板と端子板との位置合わせに伴う問題が解消さ
れ、金属板と端子板との接着強度も向上させることがで
きる。また、金属板と銅箔を一体成形した金属基板に多
数のパターンを形成し、それを打ち抜いて切り離すこと
により一度に多数の回転ヘッド用金属端子板を製造でき
るので生産性も向上させることが可能となる。Therefore, in recent years, in contrast to the general method for manufacturing a metal terminal plate for a rotary head, a metal plate and a copper foil are integrally molded by heating and pressing them through an insulating adhesive. A method has been proposed in which a board is formed, a copper foil of the metal board is patterned, and the patterned metal board is punched to manufacture a metal terminal plate for a rotary head (Japanese Patent Laid-Open No. 2-42617). ). According to this method, a metal substrate in which a metal plate and a copper foil are integrally formed in advance is formed, and a predetermined pattern is formed on the metal substrate. Therefore, the problem associated with the alignment of the metal plate and the terminal plate is solved. Also, the adhesive strength between the metal plate and the terminal plate can be improved. In addition, it is possible to improve productivity because it is possible to manufacture many metal terminal plates for rotary heads at once by forming many patterns on a metal substrate integrally molded with a metal plate and copper foil, and punching and separating them. Becomes
【０００６】[0006]
【発明が解決しようとする課題】しかしながら、特開平
２−４２６１７号公報に記載の方法によれば、パターン
形成した金属基板を単に打ち抜くことにより回転ヘッド
用金属端子板を製造するので、その回転ヘッド用金属端
子板には打ち抜きにより生じたバリや変形が残存するこ
ととなる。そのため、回転ヘッド用金属端子板を回転ド
ラムに取り付けた際にヘッドチップとの位置精度を高く
することができず、アジマス角度等に問題をきたし、製
品の信頼性を低下させるという問題があった。また、金
属板の先端部（図３の１ｂ）が打ち抜かれたままの形状
となっているので、回転ヘッド用金属端子板にヘッドチ
ップを取り付けた際に、その巻線や絶縁被膜を損傷する
という問題もあった。However, according to the method disclosed in Japanese Patent Laid-Open No. 2-42617, a metal terminal plate for a rotary head is manufactured by simply punching out a patterned metal substrate. Burrs and deformations caused by punching remain on the metal terminal plate for use. Therefore, when the metal terminal plate for the rotary head is attached to the rotary drum, the positional accuracy with the head chip cannot be increased, which causes a problem in the azimuth angle and the like, and reduces the reliability of the product. .. Further, since the tip of the metal plate (1b in FIG. 3) is still punched out, when the head chip is attached to the metal terminal plate for the rotary head, its winding and insulating coating are damaged. There was also a problem.
【０００７】この発明は以上のような従来技術の問題点
を解決しようとするものであり、金属板と銅箔とを絶縁
接着剤を介して加熱加圧することにより一体成形して金
属基板を形成し、その金属基板の銅箔をパターン形成
し、パターン形成した金属基板に表面処理および打ち抜
き加工を施して製造する回転ヘッド用金属端子板におい
て、回転ヘッド用金属端子板を回転ドラムに取り付けた
際にヘッドチップに対して高い位置精度が得られるよう
にし、また、回転ヘッド用金属端子板にヘッドチップを
取り付けた際に巻線や絶縁被膜が損傷されないようにす
ることを目的としている。The present invention is intended to solve the problems of the prior art as described above, and a metal plate and a copper foil are integrally molded by heating and pressing through an insulating adhesive to form a metal substrate. A metal terminal plate for a rotary head, which is manufactured by patterning the copper foil of the metal substrate and subjecting the patterned metal substrate to a surface treatment and a punching process, when the metal terminal plate for the rotary head is attached to the rotary drum. In addition, it is intended to obtain high positional accuracy with respect to the head chip, and to prevent the winding and the insulating film from being damaged when the head chip is attached to the rotary terminal metal terminal plate.
【０００８】[0008]
【課題を解決するための手段】上記の目的を達成するた
めに、この発明は、金属板と銅箔とを絶縁接着剤を介し
て加熱加圧することにより一体成形して金属基板を形成
し、その金属基板の銅箔をパターン形成し、パターン形
成した金属基板に表面処理および打ち抜き加工を施して
回転ヘッド用金属端子板を製造する方法において、打ち
抜き加工後さらに金属基板の先端部のテーパー加工、バ
レル加工、アニール加工、パターン形成面と反対側の金
属板面のラップ加工を順次行うことを特徴とする回転ヘ
ッド用金属端子板の製造方法を提供し、また、そのよう
な製造方法により製造した回転ヘッド用金属端子板を提
供する。To achieve the above object, the present invention forms a metal substrate by integrally molding a metal plate and a copper foil by heating and pressing them through an insulating adhesive. In the method of manufacturing a metal terminal plate for a rotary head by patterning a copper foil of the metal substrate and subjecting the patterned metal substrate to a surface treatment and a punching process, after the punching process, further tapering the tip portion of the metal substrate, Provided is a method for manufacturing a metal terminal plate for a rotary head, which comprises sequentially performing barrel processing, annealing processing, and lapping of a metal plate surface opposite to a pattern formation surface, and also manufactured by such a manufacturing method. A metal terminal plate for a rotary head is provided.
【０００９】以下、この発明を図面に基づいて詳細に説
明する。なお、各図中、同一符号は同一または同等の構
成要素を表している。The present invention will be described below in detail with reference to the drawings. In the drawings, the same reference numerals represent the same or equivalent constituent elements.
【００１０】この発明の回転ヘッド用金属端子板は、図
１の（ａ）および（ｂ）に示したように、金属板１上
に、絶縁層９、所定のパターンに形成された銅箔からな
る端子部５、端子部５の端部を除く部分に形成されたレ
ジスト７と端子部５の端部上に形成された半田層６が順
次積層され、金属板１の先端部１ｂはテーパー付けされ
た構造を有している。また、パターン形成面の反対側の
金属板面はラップ加工されている。As shown in FIGS. 1 (a) and 1 (b), the metal terminal plate for a rotary head of the present invention comprises an insulating layer 9 and a copper foil formed in a predetermined pattern on a metal plate 1. The terminal portion 5, the resist 7 formed on the portion other than the end portion of the terminal portion 5, and the solder layer 6 formed on the end portion of the terminal portion 5 are sequentially laminated, and the tip portion 1b of the metal plate 1 is tapered. It has a structured structure. The metal plate surface opposite to the pattern forming surface is lapped.
【００１１】このような回転ヘッド用金属端子板の製造
方法は、金属板１と銅箔とから金属基板を形成し、その
金属基板の銅箔をパターン形成し、その後パターン形成
した金属基板に打ち抜き加工を施すまでは特開平２−４
２６１７号に記載の方法と同様に行うことができる。In such a method of manufacturing a metal terminal plate for a rotary head, a metal substrate is formed from the metal plate 1 and a copper foil, the copper foil of the metal substrate is patterned, and then the metal substrate is punched into the patterned metal substrate. Until processing is performed, JP-A-2-4
It can be carried out in the same manner as the method described in No. 2617.
【００１２】すなわち、金属板１としては、厚さ０．５
〜２ｍｍ程度の真鍮、アルミニウム等の非磁性材料を使
用することができる。好ましくは、加工性、剛性、価格
等の点から真鍮を使用する。That is, the metal plate 1 has a thickness of 0.5.
A non-magnetic material such as brass or aluminum having a thickness of about 2 mm can be used. Preferably, brass is used in terms of workability, rigidity, price and the like.
【００１３】また銅箔としては、電解銅箔や圧延銅箔で
１／２〜２０Ｚ（２オンス）のものを使用することがで
きる。As the copper foil, electrolytic copper foil or rolled copper foil of 1/2 to 20 Z (2 ounce) can be used.
【００１４】このような金属板１と銅箔を一体成形する
のに使用する絶縁接着剤であって、金属板１と銅箔の間
で絶縁層９を形成するものとしては、ポリエステル系、
エポキシ系、ウレタン系、シリコーン系、ポリイミド
系、メラミン系、ウレア系、フェノール系等の種々の熱
硬化性樹脂接着剤を使用することができ、それらの加熱
加圧方法も常法に従うことができる。The insulating adhesive used for integrally molding the metal plate 1 and the copper foil, which forms the insulating layer 9 between the metal plate 1 and the copper foil, is a polyester-based adhesive.
Various thermosetting resin adhesives such as epoxy type, urethane type, silicone type, polyimide type, melamine type, urea type, and phenol type can be used, and the heating and pressing method thereof can also follow the usual method. ..
【００１５】金属板１と銅箔を一体成形した金属基板に
対して、その銅箔にパターン形成し、さらに種々の表面
処理をする方法についても特に制限はない。例えば銅箔
上にドライフィルムレジストをラミネート後露光する
か、あるいは銅箔上にレジストを印刷した後、エッチン
グして銅箔を所定形状の端子部５にパターン形成し、さ
らにその端子部５の端部以外の部分にレジスト７を印刷
し、次いでロール半田することにより端子部５の端部に
半田層６を形成する。なお、このような表面パターの形
成においては、回転ヘッド用金属端子板の多数個分のパ
ターン形成を同時に行ってもよい。There is also no particular limitation on the method of forming a pattern on the copper foil of the metal substrate integrally formed with the metal plate 1 and the copper foil and further performing various surface treatments. For example, a dry film resist is laminated on a copper foil and then exposed, or after a resist is printed on the copper foil, the copper foil is etched to form a pattern on the terminal portion 5 having a predetermined shape, and the end of the terminal portion 5 is further patterned. The resist 7 is printed on the portions other than the portions, and then the solder layer 6 is formed on the end portions of the terminal portions 5 by roll soldering. In addition, in the formation of such a surface pattern, the pattern formation for a large number of rotary terminal metal terminal plates may be simultaneously performed.
【００１６】パターン形成した金属基板を打ち抜く方法
としては、一般的なプレス機やレ−ザー加工機で打ち抜
く方法によることができる。The metal substrate on which the pattern is formed can be punched out by a general press machine or laser processing machine.
【００１７】この発明においては、金属基板を打ち抜い
た後には、金属基板の先端部のテーパー加工、バレル加
工、アニール加工、ラップ加工を順次行う。In the present invention, after punching out the metal substrate, taper processing, barrel processing, annealing processing, and lapping processing of the tip of the metal substrate are sequentially performed.
【００１８】すなわち、金属基板の打ち抜き後には、ま
ず、金属基板の先端部１ｂのテーパー加工を行う。これ
により、回転ヘッド用金属端子板にヘッドチップを取り
付けた際に、その金属基板の先端部１ｂが巻線や絶縁被
膜を損傷するのを防止することができる。テーパー加工
の方法としては、たとえばフライス盤にて所定の角度に
調整した切刃を回転させ、テーパー付けすればよい。That is, after punching the metal substrate, first, the tip portion 1b of the metal substrate is tapered. Thereby, when the head chip is attached to the metal terminal plate for the rotary head, the tip portion 1b of the metal substrate can be prevented from damaging the winding and the insulating coating. As a method of tapering, for example, a cutting blade adjusted to a predetermined angle with a milling machine may be rotated to taper it.
【００１９】テーパー加工をした後には、打ち抜きやテ
ーパー加工により生じたバリ等を除くためにバレル加工
を施す。バレル加工の方法としては、回転バレル機によ
り小粒子、水などを使用して２時間位加工する方法が好
ましい。After the taper processing, barrel processing is performed in order to remove burrs and the like caused by punching and taper processing. As a method of barrel processing, a method of processing for about 2 hours using small particles, water, etc. by a rotary barrel machine is preferable.
【００２０】バレル加工後には、加工歪み等を除去する
ためにアニール加工を行う。アニール加工の条件として
は、１００〜３００℃で１〜３時間加熱することが好ま
しい。加熱温度が１００℃未満で加熱時間が１時間未満
であると加工歪みを除くことが難しく、加熱温度が３０
０℃を超し加熱時間が３時間を超すと金属基板の接着剤
が劣化し易くなるので好ましくない。After barrel processing, annealing processing is performed to remove processing strain and the like. As a condition of annealing, heating at 100 to 300 ° C. for 1 to 3 hours is preferable. When the heating temperature is less than 100 ° C. and the heating time is less than 1 hour, it is difficult to remove processing strain, and the heating temperature is 30
If the heating temperature exceeds 0 ° C. and the heating time exceeds 3 hours, the adhesive of the metal substrate is likely to deteriorate, which is not preferable.
【００２１】アニール加工の後には、回転ヘッド用金属
端子板の使用時にヘッドチップが接着される面、すなわ
ちパターン形成面と反対側の金属板１の面に、ヘッドチ
ップの取り付け精度を高く維持し、またその接着強度を
高めるために、ラップ加工を行う。ラップ加工の方法と
しては、片面ラップにて所定の厚みとなるまで行うのが
好ましい。After the annealing process, the head chip mounting accuracy is kept high on the surface to which the head chip is adhered when the rotary head metal terminal plate is used, that is, the surface of the metal plate 1 opposite to the pattern forming surface. Lapping is performed to increase the adhesive strength. As a method of lapping, it is preferable to carry out lapping on one side until a predetermined thickness is obtained.
【００２２】ラップ加工した後は、表面に付着した油分
や有機物を除去するために、超音波洗浄機等でトリクレ
ンやアセトン、中性洗剤を使用して洗浄する。After lapping, in order to remove oil and organic substances attached to the surface, it is washed with trichlene, acetone or a neutral detergent in an ultrasonic cleaner or the like.
【００２３】以上のようにして製造されるこの発明の回
転ヘッド用金属端子板は、金属板１の片側をパターン形
成すされたものである限り種々の形態をとることができ
る。例えば、取り付け穴１ａが図１に示したように金属
板１の中央部にあるものの他、図２に示すように金属板
１の端部に形成されたものでもよい。The metal terminal plate for a rotary head of the present invention manufactured as described above can take various forms as long as one side of the metal plate 1 is patterned. For example, the mounting hole 1a may be formed at the center of the metal plate 1 as shown in FIG. 1 or may be formed at the end of the metal plate 1 as shown in FIG.
【００２４】[0024]
【作用】この発明の回転ヘッド用金属端子板の製造方法
によれば、金属板と銅箔とを一体成形した金属基板に所
定のパターンを形成し、打ち抜いた後、さらに金属基板
の先端部のテーパー加工、バレル加工、アニール加工、
パターン形成面と反対側の金属板面に対するラップ加工
を順次行う。このため、金属基板の打ち抜きや先端部の
テーパー加工により生じたバリがバレル加工により除去
され、また加工歪みもアニール加工により除去される。
さらに、ヘッドチップの接着面となる金属板面、すなわ
ちパターン形成面と反対側の金属板面に対してラップ加
工を行うので、その金属板面の平面度が向上し、厚さも
一定となり、ヘッドチップの取り付け精度が高く維持さ
れると共に、その接着強度が高くなる。したがって、こ
の発明の製造方法により製造された回転ヘッド用金属端
子板は、その端子板の表面パターンの外形に対する位置
ずれが極めて小さく、かつ回転ドラムに取り付けた際に
ヘッドチップに対して高い位置精度を有するものとな
る。According to the method of manufacturing a metal terminal plate for a rotary head of the present invention, after a predetermined pattern is formed on a metal substrate integrally formed with a metal plate and a copper foil and punched, the tip portion of the metal substrate is further removed. Taper processing, barrel processing, annealing processing,
Lapping is sequentially performed on the metal plate surface opposite to the pattern forming surface. Therefore, burrs generated by punching the metal substrate and tapering the tip end are removed by barreling, and processing strains are also removed by annealing.
Further, since the metal plate surface that is the bonding surface of the head chip, that is, the metal plate surface opposite to the pattern forming surface is lapped, the flatness of the metal plate surface is improved and the thickness becomes constant, The chip mounting accuracy is kept high and the adhesive strength thereof is increased. Therefore, the metal terminal plate for a rotary head manufactured by the manufacturing method of the present invention has a very small positional deviation with respect to the outer shape of the surface pattern of the terminal plate, and has a high positional accuracy with respect to the head chip when mounted on the rotary drum. Will have.
【００２５】また、この発明の製造方法においてはテー
パー加工により金属基板の先端部にテーパー付けするの
で、回転ヘッド用金属端子板の使用時に取り付ける巻線
や絶縁被膜の損傷が防止される。Further, in the manufacturing method of the present invention, since the tip of the metal substrate is tapered by taper processing, damage to the winding and the insulating coating attached when the metal terminal plate for the rotary head is used can be prevented.
【００２６】[0026]
【実施例】以下、この発明の実施例を具体的に説明す
る。 実施例１ 図１の（ａ）および（ｂ）に示したような回転ヘッド用
金属端子板を製造した。この場合、金属板１としては、
厚さ１．０ｍｍの真鍮板を使用し、銅箔としては、電解
銅箔（１０Ｚ（１オンス）、古河サーキットフォイル
（株）製）を使用した。そして、これらを接着する絶縁
接着剤として、エピコート１００７（商品名、シェル化
学（株）製）８０部、ジシアンジアミド２０部およびア
クリルゴム１０部をエチルセロソルブ１００部に溶解し
たものを調製し、この絶縁接着剤を銅箔に乾燥後の厚み
が３５μｍとなるように塗布し、１４０℃で５分間乾燥
した。次いで、これと真鍮板とを積層し、１７０℃、３
０Ｋｇ／ｃｍ2 、３０分で熱圧着し、銅箔と真鍮板とが
一体となった金属基板を製造した。EXAMPLES Examples of the present invention will be specifically described below. Example 1 A metal terminal plate for a rotary head as shown in FIGS. 1A and 1B was manufactured. In this case, as the metal plate 1,
A brass plate having a thickness of 1.0 mm was used, and an electrolytic copper foil (10Z (1 ounce), manufactured by Furukawa Circuit Foil Co., Ltd.) was used as the copper foil. Then, an insulating adhesive for adhering these was prepared by dissolving 80 parts of Epicoat 1007 (trade name, manufactured by Shell Chemical Co., Ltd.), 20 parts of dicyandiamide and 10 parts of acrylic rubber in 100 parts of ethyl cellosolve, and insulating the same. The adhesive was applied to a copper foil so that the thickness after drying was 35 μm, and dried at 140 ° C. for 5 minutes. Next, this and a brass plate are laminated, and 170 ° C., 3
By thermocompression bonding at 0 Kg / cm 2 for 30 minutes, a metal substrate in which a copper foil and a brass plate were integrated was manufactured.
【００２７】次ぎに、この金属基板の銅箔上にドライフ
ィルム（ＨＧ １．５ｍｉｌ、ダイナケム社製）をゴム
ロールにて、１０５℃、２〜３Ｋｇ／ｃｍ2 、２ｍ／分
の条件でラミネートした。そしてラミネートしたドライ
フィルムを露光し、炭酸ソーダで現像し、塩化第二銅で
エッチングして銅箔を所定の端子パターンに形成した。
次いで、端子パターンの端部以外の部分に、レジスト
（Ｓ−４０Ｇ、太陽インク工業製）を乾燥後の厚さが１
５〜２５μｍとなるようにスクリーン印刷により塗布
し、１４５℃、２０分間で硬化乾燥させた。そしてロー
ル半田により端子パターンの端部に厚さ約１００μｍの
半田層を形成した。すなわち、溶融した半田浴中に金属
ロールを回転させ、この金属ロールに半田を付着させた
後、金属基板のパターン形成面に接触させた。Next, a dry film (HG 1.5 mil, manufactured by Dynachem Co.) was laminated on the copper foil of the metal substrate with a rubber roll under the conditions of 105 ° C., 2-3 Kg / cm 2 , and 2 m / min. The laminated dry film was exposed, developed with sodium carbonate, and etched with cupric chloride to form a copper foil in a predetermined terminal pattern.
Next, the resist (S-40G, manufactured by Taiyo Ink Kogyo Co., Ltd.) has a thickness of 1 after drying on a portion other than the end portions of the terminal pattern.
It was applied by screen printing so as to have a thickness of 5 to 25 μm, and cured and dried at 145 ° C. for 20 minutes. Then, a solder layer having a thickness of about 100 μm was formed on the end portion of the terminal pattern by roll soldering. That is, a metal roll was rotated in a molten solder bath, solder was attached to the metal roll, and then contacted with the pattern forming surface of the metal substrate.
【００２８】次ぎに、打ち抜きプレス機によりパターン
形成した金属基板を打ち抜き、金属基板の先端部をテー
パー角（図１の角度θ）４５度にテーパー付けし、回転
バレル機を用いてバレル加工した。Next, the metal substrate on which the pattern was formed was punched by a punching press machine, the tip of the metal substrate was tapered to a taper angle (angle θ in FIG. 1) of 45 degrees, and barrel processing was performed using a rotary barrel machine.
【００２９】続いて、２５０℃の恒温槽に１時間おいて
アニール処理し、パターン形成面と反対側の金属板に、
片面ラップによりラップ加工を施した。その後、トリク
レンを使用して超音波洗浄機で洗浄し、回転ヘッド用金
属端子板を得た。Then, it is annealed in a constant temperature bath at 250 ° C. for 1 hour, and the metal plate on the side opposite to the pattern forming surface is
Lapping was performed by wrapping on one side. Then, it was cleaned with an ultrasonic cleaner using trichlene to obtain a metal terminal plate for a rotary head.
【００３０】得られた回転ヘッド用金属端子板の外観検
査を顕微鏡を用いて行ったところ、バリなどは見られ
ず、ラップ加工面は極めて平面性に優れていた。また、
金属板と端子板のパターンとの間の耐電圧は、５ＫＶ、
１分間以上で異常なく、外形とパターンとのずれは０．
２ｍｍ以下となっていた。When the appearance of the obtained rotary terminal metal terminal plate was inspected with a microscope, no burrs or the like were found and the lapping surface was extremely flat. Also,
The withstand voltage between the metal plate and the pattern of the terminal plate is 5 KV,
There is no abnormality after 1 minute or more, and the deviation between the outer shape and the pattern is 0.
It was less than 2 mm.
【００３１】[0031]
【発明の効果】この発明の回転ヘッド用金属端子板によ
れば、その端子板の外形に対する位置ずれを極めて小さ
くすると共に、回転ヘッド用金属端子板を回転ドラムに
取り付けた際のヘッドチップに対する位置精度を高くす
ることが可能となる。また、回転ヘッド用金属端子板に
ヘッドチップを取り付けた際に巻線や絶縁被膜が損傷さ
れることを解消することも可能となる。According to the metal terminal plate for a rotary head of the present invention, the positional deviation with respect to the outer shape of the terminal plate is made extremely small, and the position with respect to the head chip when the metal terminal plate for the rotary head is attached to the rotary drum. It is possible to increase the accuracy. In addition, it is possible to eliminate damage to the winding and the insulating coating when the head chip is attached to the rotary terminal metal terminal plate.
【図１】この発明の実施例の回転ヘッド用金属端子板の
平面図（ａ）と断面図（ｂ）である。FIG. 1 is a plan view (a) and a sectional view (b) of a metal terminal plate for a rotary head according to an embodiment of the present invention.
【図２】この発明の他の実施例の回転ヘッド用金属端子
板の平面図である。FIG. 2 is a plan view of a metal terminal plate for a rotary head according to another embodiment of the present invention.
【図３】従来の回転ヘッド用金属端子板の平面図（ａ）
と断面図（ｂ）である。FIG. 3 is a plan view of a conventional rotary head metal terminal plate (a).
It is a sectional view (b).
１ 金属板 １ｂ 金属板の先端部 ２ 端子板 ３ ベースフィルム ４ 接着剤 ５ 銅箔からなる端子部 ６ 半田層 ７ レジスト ８ 接着剤 ９ 絶縁層 1 Metal Plate 1b Tip of Metal Plate 2 Terminal Plate 3 Base Film 4 Adhesive 5 Terminal Part Made of Copper Foil 6 Solder Layer 7 Resist 8 Adhesive 9 Insulating Layer
Claims (3)
熱加圧することにより一体成形して金属基板を形成し、
その金属基板の銅箔をパターン形成し、パターン形成し
た金属基板に表面処理および打ち抜き加工を施して回転
ヘッド用金属端子板を製造する方法において、打ち抜き
加工後さらに金属基板の先端部のテーパー加工、バレル
加工、アニール加工、パターン形成面と反対側の金属板
面のラップ加工を順次行うことを特徴とする回転ヘッド
用金属端子板の製造方法。1. A metal substrate and a copper foil are integrally molded by heating and pressing through an insulating adhesive to form a metal substrate,
In the method of manufacturing a metal terminal plate for a rotary head by patterning a copper foil of the metal substrate and subjecting the patterned metal substrate to a surface treatment and a punching process, after the punching process, further tapering the tip portion of the metal substrate, A method of manufacturing a metal terminal plate for a rotary head, which comprises sequentially performing barrel processing, annealing processing, and lapping of a metal plate surface opposite to a pattern formation surface.
３時間加熱することにより行う請求項１記載の回転ヘッ
ド用金属端子板の製造方法。2. Annealing is performed at 100 to 300 ° C. for 1 to
The method for producing a metal terminal plate for a rotary head according to claim 1, which is performed by heating for 3 hours.
の製造方法により製造した回転ヘッド用金属端子板。3. A metal terminal plate for a rotary head manufactured by the method for manufacturing a metal terminal plate for a rotary head according to claim 1.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP25981291A JPH0573865A (en) | 1991-09-11 | 1991-09-11 | Metallic terminal plate for rotary head and production thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP25981291A JPH0573865A (en) | 1991-09-11 | 1991-09-11 | Metallic terminal plate for rotary head and production thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0573865A true JPH0573865A (en) | 1993-03-26 |
Family
ID=17339346
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP25981291A Pending JPH0573865A (en) | 1991-09-11 | 1991-09-11 | Metallic terminal plate for rotary head and production thereof |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0573865A (en) |
-
1991
- 1991-09-11 JP JP25981291A patent/JPH0573865A/en active Pending
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