JPH0574825A - Die bonding apparatus - Google Patents

Abstract

(57) [Summary] [Objective] To provide a die bonding apparatus capable of high-speed operation and free of dust. A head unit 1 and a first direct motor 11 for reciprocating the head unit 1 in a lateral direction are provided, and the head unit 1 includes a nozzle shaft 3 having a nozzle 2 and a nozzle shaft 3. It is composed of a second direct motor 21 that moves up and down, and a third direct motor 31 that rotates the nozzle shaft 3 by θ around its axis.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a die bonding apparatus in which a direct motor is used to perform a lifting operation of a nozzle shaft, a .theta. Rotation operation, and a lateral movement operation of a head portion.

[0002]

2. Description of the Related Art FIG. 3 is a perspective view of a conventional die bonding apparatus for mounting a chip on a substrate. In the figure, reference numeral 100 denotes a head portion, which has a nozzle shaft 101.
A nozzle 102 is attached to the lower end of the nozzle shaft 101, and the chip P of the wafer 103 is adsorbed by the nozzle 102 and transferred and mounted on a substrate 104 such as a lead frame.

Reference numeral 105 denotes a motor, which rotates the nozzle shaft 101 by θ through the timing belt 106 to set the rotation angle. The nozzle shaft 101, the motor 105, and the like are held by the elevating plate 108 via the bracket 107. A nut 109 is mounted on the back surface of the lifting plate 108.
When the ball screw 110 screwed to 9 is rotated by the motor 111, the elevating plate 108 moves up and down to move the wafer 103.
The pickup operation of the upper chip P and the mounting operation on the substrate 104 are performed. Reference numeral 112 is a vertical linear guide.

Reference numeral 113 is a sliding plate, and the linear guide 112 is mounted on the front surface of the sliding plate 113. A nut 114 is mounted on the back surface of the sliding plate 113, and when a ball screw 115 screwed onto the nut 114 is rotated by a motor 116, the sliding plate 113 reciprocates laterally. Reference numeral 117 is a horizontal linear guide.

Next, the operation will be described. The motor 116 is driven to move the sliding plate 113 in the lateral direction, and the nozzle 102
Is positioned right above the chip P on the wafer 103. Next, the motor 111 is driven and the nozzle 102 is moved up and down to adsorb and pick up the chip P. Next, the motor 116 is driven to move the sliding plate 113 in the lateral direction Y, and the nozzle 102 is positioned directly above the substrate 104.
Then, by driving the motor 111, the nozzle 102
Are moved up and down to mount the chip P on the substrate 104. During the above operation, by driving the motor 105, the nozzle 10
Set the rotation angle of 2.

[0006]

In the above-mentioned conventional means, the nozzle 102 is rotated, lifted, and headed by the timing belt 106, nuts 109 and 114, ball screws 110 and 115, and linear guides 112 and 117.
A horizontal movement operation of 0 is performed. However, in such mechanical means, the motors 105, 111,
There is a problem that the load of 116 is extremely heavy and it is difficult to speed up the operation.

In order to prevent dust from adhering to the chip P, die bonding is performed in a clean room. In the above conventional means, however, the timing belt 106 and the ball screws 110 and 115 are driven by mechanical friction associated with driving. Dust, metal powder, belt powder, and grease powder were scattered, and the cleanliness of the clean room was likely to deteriorate.

Therefore, an object of the present invention is to provide a die bonding apparatus which can solve the problems of the above conventional means.

[0009]

To this end, the present invention provides a head portion and a first reciprocating lateral movement of the head portion.
And a second direct motor that moves the nozzle shaft up and down, and a third motor that rotates the nozzle shaft by θ about its axis. It is composed of a direct motor.

[0010]

According to the above construction, the rotation operation of the nozzle, the up-and-down operation, and the movement of the head portion in the lateral direction are all performed by the direct motor, which enables high-speed operation and dust generation from parts. Can be eliminated.

[0011]

Embodiments of the present invention will now be described with reference to the drawings.

FIG. 1 is a perspective view of a die bonding apparatus, and FIG. 2 is an exploded view of a main part. Reference numeral 1 denotes a head portion, which has a collet type nozzle 2 as a chip supply portion for adsorbing a chip P on a wafer 51. Reference numeral 52 is a substrate on which the chip P is mounted. Reference numeral 11 is a first direct motor composed of a linear motor, and includes a horizontal guide 12 and
It has a slider 13 that slides on the guide 12, and the head unit 1 is mounted on the slider 13 and moves in the lateral direction Y. Reference numeral 14 is a coil provided on the guide 12, and 15 and 16 are a yoke and a magnet provided on the lower surface of the slider 13. An air hole 17 that constitutes an air receiver is formed in the slider 13, and the slider 13 floats slightly above the guide 12 and moves in the lateral direction Y.

In FIG. 2, reference numeral 21 is a second direct motor which is a linear motor provided in the head portion 1. Reference numeral 22 denotes a yoke, into which the nozzle shaft 3 is attached, and the nozzle 2 is attached to the lower portion of the nozzle shaft 3.
Is installed. The yoke 22 has a disk shape, a magnet 23 is attached to the peripheral surface thereof, and a coil 24 is provided outside the magnet 23. Therefore, the coil 24
When the current is applied to the nozzle shaft 3, the nozzle shaft 3 moves up and down in the vertical direction Z, and the nozzle 2 performs the pickup operation of the chip P on the wafer 51 and the mounting operation of the chip on the substrate 52.

Reference numeral 31 is a third direct motor which is a linear motor and is provided with a magnet 32, a core 33 and a coil 34. A spline 4 is attached to the nozzle shaft 3, and the spline 4 passes through the center of the magnet 32 so as to be lifted and lowered. Coil 3
When the nozzle shaft 3 is energized, the nozzle shaft 3 rotates in the θ direction around its axis.

This die bonding apparatus has the above-mentioned structure, and its operation will be described below.

By driving the first direct motor 11,
The head unit 1 is moved directly above the wafer 51. Next, the second direct motor 21 is driven to move the nozzle 2 up and down, and the chip P on the wafer 51 is adsorbed and picked up. Next, the first direct motor 11 is driven to move the head unit 1 to a position directly above the substrate 52, and the second direct motor 21 is driven to move this chip P to the substrate 5
Installed in 2. By driving the third direct motor 31 during the above operation, the nozzle shaft 3 is rotated by θ, and the rotation angles of the nozzle 2 and the tip P are set.

This device, like the conventional means shown in FIG.
Since the timing belt, nut, and ball screw are not used at all, the load on the direct motors 11, 21 and 31 is extremely small, the operation speed can be increased, and dust is not generated due to mechanical friction, so that the clean room is clean. The degree does not decrease.

In the present invention, the chip P on the wafer 51 is
Are transferred to the misalignment correction stage, where X of the chip P is transferred.
The present invention can also be applied to a die bonding apparatus in which the head portion 1 picks up the chip P and mounts it on the substrate 52 after correcting the displacement in the Yθ direction.

[0019]

As described above, the present invention includes a head portion and a first direct motor that reciprocates the head portion in the lateral direction, and the head portion includes a nozzle shaft having a nozzle, Since the second direct motor for moving the nozzle shaft up and down and the third direct motor for rotating the nozzle shaft by θ about the shaft center are provided, the load of the direct motor is extremely small and the operation speed is increased. In addition, since no dust is generated, it is possible to solve the deterioration of cleanliness of the clean room.

[Brief description of drawings]

FIG. 1 is a perspective view of a die bonding apparatus according to the present invention.

FIG. 2 is an exploded view of essential parts of a die bonding apparatus according to the present invention.

FIG. 3 is a perspective view of a conventional die bonding apparatus.

[Explanation of symbols]

 1 Head Part 2 Nozzle 3 Nozzle Shaft 11 First Direct Motor 21 Second Direct Motor 31 Third Direct Motor 51 Chip Supply Section 52 Substrate

Claims (1)

[Claims] 1. A head unit and a first direct motor for reciprocating the head unit in a lateral direction. The head unit has a nozzle shaft having a nozzle and a second shaft for moving the nozzle shaft up and down. And a third direct motor for rotating the nozzle shaft by θ about its axis.