JPH0574841A - X-y table device of bonder - Google Patents

Abstract

(57) [Summary] [Object] To provide an XY table device capable of moving a bonder such as a wire bonder in the XY directions at high speed and with high accuracy. A base member 1, an XY direction moving device 30 for moving the base member 1 in XY directions, and a movement for slidably mounted on the base member 1 via an air bearing 6 to support a bonder 20. The table 5 is provided around the moving table 5, and the moving table 5 is moved in the XY direction.
It comprises linear motors 8 and 9 for moving in the directions, and the base member 1 and the moving table 5 are connected by a spring member 3 which is bendable in the XY directions.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an XY table device for a bonder, and more specifically, it eliminates the need for a guide means for a moving table to reduce the weight of the device and increase the moving speed of the bonder. is there.

[0002]

2. Description of the Related Art As an XY table device 100 used in a wire bonder for connecting a semiconductor chip and a substrate with a wire, movable tables 101A and 101B are slidably mounted on a guide body 105 as shown in FIG. Further, moving table devices 100A and 100B configured by slidably mounting the sub moving tables 103A and 103B in the XY directions on the moving table 101B via the air bearings 102 formed of air outlets are orthogonal to each other in the XY directions. It is known that the two upper and lower stages are combined. In this device, the moving tables 101A and 101B and the sub moving tables 103A and 103B are slid by a ball screw 106 or a linear motor 107 driven by motors MX and MY.

Reference numeral 20 is a wire bonder supported by the sub-moving table 103B, 21 is a drive unit thereof, 22 is a horn extending from the drive unit 21, 23 is a capillary tool held at the tip of the horn 22, and 24 is a capillary. The wire is inserted through the tool 23. In this device, the electrodes of the semiconductor chip 26 and the electrodes of the substrate 25 are connected by the wires 24 while driving the motor M and the linear motor 107 to move the wire bonder 20 in the XY directions.

In the XY table device 100, guide portions 104 are integrally formed on both sides of the moving table 101B so that the sub moving table 103A does not wobble in the lateral direction when sliding, and the sub moving table 103 is also provided.
Guided portions 103a that fit into the guide portions 104 are formed on both sides of A.

[0005]

Sub-movement table 10
In order to surely prevent the fluctuation of 3A, the guide portion 104 and the guided portion 103a are strongly formed of a heavy material such as stainless steel. For this reason, the entire apparatus becomes heavy, the loads on the motors MX and MY become extremely large, and the sub-moving tables 103A and 103B cannot slide at a high speed, so that the work efficiency of wire bonding does not increase and the moving inertia is large. The accuracy of the stop positions of the sub movement tables 103A and 103B is also poor, and there is a problem that defective bonding is likely to occur frequently.

Therefore, it is an object of the present invention to provide an XY table device in which the weight of the entire device is reduced, the moving speed of the bonder is increased, and the stop position accuracy is improved.

[0007]

To this end, the present invention provides a base member and an X for moving the base member in the XY directions.
A Y-direction moving device, a moving table slidably mounted on the base member via an air bearing to support the bonder, and provided around the moving table to move the moving table in the XY directions. A linear motor is configured, and the base member and the moving table are connected by a spring material that is bendable in the XY directions.

[0008]

According to the above construction, sliding of the moving table in the XY directions is allowed by bending the spring member,
Further, the spring material prevents the air pressure from varying due to excessive lifting of the moving table. Moreover, since the moving table slides in the XY directions by the linear motors provided around the moving table, the moving table is less likely to wobble in the lateral direction, and the guide portion 104 and the guided portion 103 of the above-described conventional device are difficult.
It is possible to reduce the weight of the device by eliminating a. Therefore, the load of the linear motor, which is the driving means, is reduced, the moving speed of the bonder such as the wire bonder supported by the sub moving table can be increased, and the moving inertia can be decreased to improve the stop position accuracy.

[0009]

Embodiments of the present invention will now be described with reference to the drawings.

FIG. 1 is a perspective view of an XY table device.
Reference numeral 1 is a base member, and a recessed portion 2 is formed in the center thereof. The base member 1 is placed on an XY-direction moving device 30 which is movable in the XY directions. 30a
Is an X table, 30b is a Y table, MX is an X-direction motor, and MY is a Y-direction motor. When the motors MX and MY are driven, a ball screw (not shown) rotates and the base member 1 moves in the XY directions. To do. The XY direction moving device 30 including a ball screw is suitable for moving a target object such as the wire bonder 20 by a large stroke.

Reference numeral 3 is a wire spring as a bendable spring material, which is erected at the center of the recess 2 (see also FIG. 3). The wire spring 3 has a length such that the upper end thereof slightly projects from the upper surface of the base member 1. Reference numeral 5 denotes a movable table slidably mounted on the base member 1, and the wire spring 3 is provided at the center of the rear surface of the movable table 5.
The upper end of the wire spring 3 is connected, and the wire spring 3 allows the moving table 5 to move a short stroke in the XY directions.
Further, the wire spring 3 also allows the moving table 5 to rotate in the θ direction by being twisted.

In FIG. 1, 20 is a wire bonder, which is a drive box 21 provided on the moving table 5,
It comprises a horn 22 protruding from the drive box 21, and a bonding tool 23 such as a capillary tool or a wedge tool held at the tip of the horn 22. A wire 24 is inserted into the bonding tool 23.

In FIG. 3, reference numeral 6 denotes an air blowout hole which constitutes an air bearing and is formed in the base member 1. When the air blows out from each air blow hole 6, the moving table 5 slightly floats above the base member 1 slidably. In this case, the wire spring 3 prevents the movable table 5 from excessively floating and rattling due to air pressure.

In FIGS. 1 and 2, reference numeral 7 denotes a frame portion, and the moving table 5 is arranged inside the frame portion 7. Reference numerals 8 are magnets, which are attached to both side portions of the side surface of the moving table 5, respectively. Reference numeral 9 denotes a coil, which is disposed on each inner surface of the frame portion 7 at a position facing the magnet 8. This magnet 8 and coil 9
Constitutes a linear motor as a drive means for moving the moving table 5 in the XYθ directions, and when a current is passed through this coil 9, the moving table 5 is moved by a minute amount in the XY directions by a magnetic force. By configuring the moving means of the moving table 5 as described above, the heavy guide portion 104 and the guided portion 103a as in the above-described conventional device are unnecessary,
By making the device lighter in weight, the moving speed of the moving table 5 can be increased and the accuracy of the stop position can be improved.

In FIG. 1, reference numeral 10 is a mark for detecting the position of the moving table 5, and two marks are formed at corners of the base member 1 on a diagonal line. Reference numeral 11 denotes a camera, which is arranged at a corner of the moving table 5 on the side of each mark 10. Each camera 11 has a corresponding mark 1
By observing 0, the position of the moving table 5 is detected.

The present apparatus has the above-mentioned structure, and its operation will be described below. In FIG. 2, the wire bonder 20 is moved by a large stroke from the origin position (solid line position in FIG. 2) to the work position (chain line position) by driving the XY direction moving device 30. Further, in order to connect the substrate 25 and the chip 26 with the wire 24 at the working position, the wire bonder 20 is repeatedly moved in the XY directions at high speed for a short stroke by driving the linear motors 8 and 9 to move the moving table 5 in the XY direction. It is done by slightly sliding in the direction.

The moving table 5 moves for a short stroke by energizing the coil 9 while slightly floating by the air pressure, but the movement of this short stroke is allowed by the bending of the wire spring 3. (See the dashed line in Figure 3). Further, the wire table 3 prevents the movable table 5 from excessively floating and rattling due to the air pressure. Therefore, the movable table 5 can be moved in the desired direction without rattling, and its stop position accuracy is extremely high. It will be good. In this case, there is a limit to the amount of bending of the wire spring 3,
Therefore, the movement of the large stroke is performed by the XY direction moving device 30.
The high speed movement of the short stroke at the work position is performed by the linear motors 8 and 9.

As described above, according to the present apparatus, it is possible to perform wire bonding with high accuracy while repeatedly moving the wire bonder 20 in the XY directions at a short stroke speed.

In wire bonding, the wire bonder 20 is moved a short stroke in the X and Y directions at the working position, and is repeated a large number of times. Therefore, a high moving speed of the bonder 20 and a high degree of stop position accuracy are required. It Thus, in the present device, the entire device is lightened, and the loads on the linear motors 8 and 9 are remarkably reduced, so that the moving table 5 can be moved at high speed, and lateral fluctuation and unnecessary floating are also prevented. In addition, the accuracy of the stop position of the bonder 20 is significantly improved.

The XY table device according to the present invention is
The invention is not limited to the wire bonder, and can be applied to, for example, an inner lead bonder for bonding a film carrier lead and a chip electrode, a bump forming bonder for forming a bump on an electrode of a flip chip with a wire, and the like.

[0021]

As described above, according to the present invention, the base member, the movable table slidably mounted on the base member via the air bearing to support the bonder, and the movable table are provided around the movable table. And a linear motor for moving the moving table in the XY directions. The base member and the moving table are connected by a spring material bendable in the XY directions to form an XY table device. It is possible to reduce the weight and perform wire bonding or the like while moving the moving table with high speed and high accuracy. Moreover, it is possible to prevent the movement table from wobbling due to variations in air pressure, and to move the movement table in a desired direction in a stable manner. It is extremely advantageous as an XY table device that needs to be operated.

[Brief description of drawings]

FIG. 1 is a perspective view of an XY table device of a bonder according to the present invention.

FIG. 2 is a plan view of the device.

FIG. 3 is a sectional view of the main part of the device.

FIG. 4 is a perspective view of an XY table device of a bonder according to a conventional means.

[Explanation of symbols]

 1 Base Member 3 Spring Material 5 Moving Table 6 Air Bearing 8 Magnet (Linear Motor) 9 Coil (Linear Motor) 20 Bonder 30 XY Direction Moving Device

Claims (1)

[Claims] 1. A base member, an XY-direction moving device for moving the base member in XY directions, a moving table slidably mounted on the base member via an air bearing to support a bonder, and A moving table comprising a linear motor provided around the moving table to move the moving table in the XY directions, wherein the base member and the moving table are connected by a spring material that is bendable in the XY directions. apparatus.