JPH0574884A - probe - Google Patents

Abstract

PURPOSE:To supply probes with a needle at a narrow span and maintain the conventional probe needle fixing strength at the same time. CONSTITUTION:Probe needle layers are implanted on the peripheral area of a probe board 1 having an opening section in such a fashion that they may form a plurality of needle layers 5a, 5b. A semiconductor integrated circuit 7 is circuit-tested by placing the needle layers in contact with bonding pads laid out on the circuit 7 one by one.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a probe used for circuit testing of semiconductor integrated circuits.

[0002]

2. Description of the Related Art A semiconductor integrated circuit is subjected to a circuit test in a wafer state before being assembled into a package. FIG. 1 is a partial cross-sectional view of a probe used in that case, which is shown together with a semiconductor integrated circuit to be tested. FIG. 2 is a partial plan view of the probe and shows the positional relationship between the probe needle and the semiconductor integrated circuit.

In these drawings, 1 is a probe substrate having an opening. A plurality of probe needles 2 are provided on the lower surface of the probe substrate 1 at the base end portions thereof.
Is radially fixed to the periphery of the opening by the resin 3 and is planted so that its tip faces obliquely downward toward the center of the opening.

When performing a circuit test, the probe needle 2 is used.
A semiconductor integrated circuit 7 is arranged on the tip side of the semiconductor integrated circuit 7, and the probe 2 is brought into contact with the bonding pad 8 arranged on the semiconductor integrated circuit 7 to perform a circuit test. Note that FIG. 1 shows only two probe needles. As shown in FIG. 2, a plurality of probe needles 2 are provided so that one bonding pad corresponds to one probe needle.

In such a conventional probe, if the density of the probe needles 2 is too high, the adjacent probe needles 2 may come into contact with each other or the resin 3 for fixing the probe needles 2 may have a weak fixing strength. Occurs. In order to solve this, it is conceivable to make the probe needle thin, but the necessary needle pressure cannot be applied.

[0006]

Due to the above-mentioned reasons, the distance between the probe needles cannot be reduced to a certain extent or more.
Therefore, the distance between the bonding pads of the semiconductor integrated circuit cannot be narrowed, and the probe needle distance governs the size of the semiconductor integrated circuit, which causes a problem that the size of the semiconductor integrated circuit becomes larger than necessary. The present invention has been made in view of such circumstances, and a probe capable of narrowing the probe needle interval as compared with the conventional probe needle while maintaining the same degree of needle fixing strength as the conventional probe needle, and applying a necessary needle pressure. An object of the present invention is to provide a semiconductor integrated circuit having a small size.

[0007]

A probe according to the present invention has probe needles implanted in a plurality of layers.

[0008]

In the probe of the present invention, since the probe needles are implanted in a plurality of layers, each of the probe needles on the substrate is brought into contact with each of the bonding pads on the semiconductor integrated circuit. When probe needles are implanted at different positions in the circumferential direction, if the needle implantation area on the substrate is equal to the conventional one, it is possible to have more than double the number of probe needles while maintaining the same needle fixing strength as the conventional one. it can. Further, it is possible to apply the necessary needle pressure as the thickness and length of the probe needle, which is the same as the conventional one.

[0009]

DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be described in detail below with reference to the drawings showing the embodiments thereof. FIG. 3 shows a first embodiment of the present invention together with a semiconductor integrated circuit to be tested. In the figure, reference numeral 1 denotes a probe substrate having an opening. A plurality of probe needles 5a of the first layer are provided on the lower surface of the probe substrate 1, and the base end portions thereof are radially formed by resin 3 around the opening of the probe substrate 1. The second probe substrate 4 having an opening is fixed to the lower surface of the second probe substrate 4.
Further, on the lower surface thereof, the second layer probe needle 5b is located at a position different from that of the first layer probe needle 5a in the circumferential direction, and its base end portion is made of resin 6 on the inner peripheral portion of the second probe substrate 4. It is planted by being fixed radially. (The probe needle is shown in Fig. 3.
Only two of 5a and 5b are shown. )

The second probe substrate 4 is for separating the probe needles 5a and 5b of the first layer and the second layer from each other and further increasing the fixing strength of those needles. Further, the tips of the probe needles 5a and 5b of the first and second layers are both directed obliquely downward toward the center of the opening, and the probe needle is attached to the bonding pad 8 arranged on the semiconductor integrated circuit 7 during the circuit test. 5a
And 5b are in different positions so that they come into contact with each other.

FIG. 4 shows a second embodiment of the present invention together with a semiconductor integrated circuit to be tested. FIG. 5 is a partial plan view thereof. In these figures, reference numeral 1 denotes a probe substrate having an opening, and a plurality of first-layer probe needles 5a are provided on the lower surface of the probe substrate 1 and the base end portion thereof is the probe substrate 1
Are radially fixed to the periphery of the opening by the resin 3, and a plurality of second-layer probe needles 5b are arranged on the upper surface of the probe substrate 1 in the circumferential direction with the first-layer probe needles 5a. In contrast, the base end portion is radially fixed to the inner peripheral portion of the probe substrate 1 by the resin 6 and is implanted. (Only two probe needles 5a and 5b are shown in FIG. 4, and the resin 3 is omitted in FIG. 5.)

Further, the tip of the probe needle 5a of the first layer is directed obliquely downward toward the center of the opening, and the tip of the probe needle 5b of the second layer passes through the opening and obliquely downward toward the center of the opening. Facing. Further, at the time of the circuit test, the positions are different so that the probe needles 5a and 5b alternately contact the bonding pad 8 arranged on the semiconductor integrated circuit 7.

In the first and second embodiments described above, the probe substrate 1 or 4 is sandwiched between the probe needle 5a of the first layer and the probe needle 5b of the second layer to increase the fixing strength of the probe. In the case where the needle implantation area of the substrate 1 is the same as the conventional one, the fixing strength of the needles can be kept the same, and more than twice the number of needles can be implanted, so that the probe needle interval can be narrowed.

FIG. 6 is a partial plan view of the third embodiment of the present invention, showing the semiconductor integrated circuit to be tested. Example 3
The probe needles 9a and 9b in FIG. 6 are obtained by thinning and shortening the probe needle 5a of the first layer and the probe needle 5b of the second layer in FIG. 4 of the probe described in the second embodiment.

The probe needles 9a and 9b are the probe needles of the second embodiment.
By making it thinner than 5a and 5b, the probe needle interval can be naturally narrowed as compared with the second embodiment. When the probe needle is made thinner, the needle pressure becomes weaker due to the bending of the needle, but the probe needle spacing becomes narrower, so the needle implantation area on the substrate can be narrowed and the opening surface of the probe substrate becomes smaller. Therefore, the distance between the bonding pad 8 and the periphery of the opening of the probe substrate 1 is shortened, and the length of the probe needle can be shortened. As a result, the necessary needle pressure can be obtained.

Further, in the second and third embodiments,
The length of the probe needles due to the difference in layers, that is, the probe needles of the first layer and the probe needles of the second layer 5a and 5b (Fig. 5) and 9a and 9b.
There is a slight difference in the needle pressure of the needles implanted in each layer due to the slightly different length of the needles (Fig. 6), but make the long needles thicker than the short ones or make the short needles longer. By making the needle thinner than the needle, the needle pressure that can be applied to the needle of each layer can be made equal.

[0017]

By implanting the probe needles in a plurality of layers as described above, the needle fixing strength is kept the same in the same needle implant area on the probe substrate as the conventional one, and more than twice the probe needles are implanted. can do. As a result, the distance between the probe needles becomes narrower, and it is possible to adapt to a bonding pad having a narrow arrangement distance, so that the size of the semiconductor integrated circuit can be minimized. Also, in the past, the probe needle had to be long because the opening of the probe board was widened in order to widen the area where the needle was planted.However, when the same number of needles as in the past was planted, the opening could be made narrower Since thin probe needles can be used, the present invention has excellent effects such as being able to further narrow the probe needle interval.

[Brief description of drawings]

FIG. 1 is a partial cross-sectional view of a conventional probe.

FIG. 2 is a partial plan view showing a positional relationship between a probe needle of a conventional probe and a semiconductor integrated circuit.

FIG. 3 is a partial cross-sectional view of the probe according to the first embodiment of the present invention.

FIG. 4 is a partial sectional view of a probe according to a second embodiment of the present invention.

FIG. 5 is a partial plan view showing a positional relationship between a probe needle and a semiconductor integrated circuit according to a second embodiment of the present invention.

FIG. 6 is a partial plan view showing a positional relationship between a probe needle and a semiconductor integrated circuit according to a third embodiment of the present invention.

[Explanation of symbols]

 1 probe board 2 probe needle 5a 1st layer probe needle 5b 2nd layer probe needle 7 semiconductor integrated circuit 8 bonding pad

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[Procedure amendment]

[Submission date] February 7, 1992

[Procedure Amendment 1]

[Document name to be amended] Statement

[Name of item to be corrected] 0002

[Correction method] Change

[Correction content]

[0002]

2. Description of the Related Art A semiconductor integrated circuit is subjected to a circuit test in a wafer state before being assembled into a package. FIG. 5 is a partial cross-sectional view of the probe used at that time, and it is shown together with the semiconductor integrated circuit to be tested. FIG. 6 is a partial plan view of the probe, showing a positional relationship between the probe needle and the semiconductor integrated circuit.

[Procedure Amendment 2]

[Document name to be amended] Statement

[Correction target item name] 0004

[Correction method] Change

[Correction content]

When performing a circuit test, the probe needle 2 is used.
A semiconductor integrated circuit 7 is arranged on the tip side of the semiconductor integrated circuit 7, and the probe 2 is brought into contact with the bonding pad 8 arranged on the semiconductor integrated circuit 7 to perform a circuit test. Note that FIG. 5 shows only two probe needles. As shown in FIG. 6 , the plurality of implanted probe needles 2 correspond to one probe needle and one bonding pad.

[Procedure 3]

[Document name to be amended] Statement

[Correction target item name] 0009

[Correction method] Change

[Correction content]

[0009]

DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be described in detail below with reference to the drawings showing the embodiments thereof. 1 shows a first embodiment of the present invention together with a semiconductor integrated circuit to be tested. In the figure, reference numeral 1 denotes a probe substrate having an opening. A plurality of probe needles 5a of the first layer are provided on the lower surface of the probe substrate 1, and the base end portions thereof are radially formed by resin 3 around the opening of the probe substrate 1. The second probe substrate 4 having an opening is fixed to the lower surface of the second probe substrate 4.
Further, on the lower surface thereof, the second layer probe needle 5b is located at a position different from that of the first layer probe needle 5a in the circumferential direction, and its base end portion is made of resin 6 on the inner peripheral portion of the second probe substrate 4. It is planted by being fixed radially. (The probe needle is shown in Fig. 1.
Only two of 5a and 5b are shown. )

[Procedure amendment 4]

[Document name to be amended] Statement

[Correction target item name] 0011

[Correction method] Change

[Correction content]

FIG . 2 shows a second embodiment of the present invention together with a semiconductor integrated circuit to be tested. FIG. 3 is a partial plan view thereof. In these figures, reference numeral 1 denotes a probe substrate having an opening, and a plurality of first-layer probe needles 5a are provided on the lower surface of the probe substrate 1 and the base end portion thereof is the probe substrate 1
Are radially fixed to the periphery of the opening by the resin 3, and a plurality of second-layer probe needles 5b are arranged on the upper surface of the probe substrate 1 in the circumferential direction with the first-layer probe needles 5a. In contrast, the base end portion is radially fixed to the inner peripheral portion of the probe substrate 1 by the resin 6 and is implanted. ( Figure
Probe needles 5a to 2, and only one by two 5b is shown in FIG. 3 resin 3 is omitted. )

[Procedure Amendment 5]

[Document name to be amended] Statement

[Correction target item name] 0014

[Correction method] Change

[Correction content]

FIG . 4 is a partial plan view of a third embodiment of the present invention, which is shown together with a semiconductor integrated circuit to be tested. Example 3
The probe needles 9a and 9b in FIG. 4 are obtained by narrowing and shortening the first layer probe needle 5a and the second layer probe needle 5b in FIG. 2 of the probe described in the second embodiment.

[Procedure Amendment 6]

[Document name to be amended] Statement

[Correction target item name] 0016

[Correction method] Change

[Correction content]

Further, in the second and third embodiments,
The length of the probe needles due to the difference in the layers, that is, the probe needles of the first layer and the probe needles of the second layer 5a and 5b ( Fig. 3 ) and 9a and 9b.
There is a slight difference in the needle pressure of the needles implanted in each layer due to the slightly different length of the needles ( Fig. 4 ), but make the long needle thicker than the short needle or make the short needle longer. By making the needle thinner than the needle, the needle pressure that can be applied to the needle of each layer can be made equal.

[Procedure Amendment 7]

[Document name to be amended] Statement

[Name of item to be corrected] Brief explanation of the drawing

[Correction method] Change

[Correction content]

[Brief description of drawings]

FIG. 1 is a partial cross-sectional view of a probe according to a first embodiment of the present invention.
Is.

FIG. 2 is a partial sectional view of a probe according to a second embodiment of the present invention.
Is.

FIG. 3 is a probe needle and a semiconductor device according to a second embodiment of the present invention .
It is a partial top view showing the positional relationship of a product circuit.

FIG. 4 is a probe needle and a semiconductor device according to a third embodiment of the present invention .
It is a partial top view showing the positional relationship of a product circuit.

FIG. 5 is a partial cross-sectional view of a conventional probe.

FIG. 6 is a probe needle of a conventional probe and a semiconductor integrated circuit.
It is a partial plan view showing the positional relationship of.

[Explanation of Codes] 1 probe substrate 2 probe needle 5a first layer probe needle 5b second layer probe needle 7 semiconductor integrated circuit 8 bonding pad

[Procedure Amendment 8]

[Document name to be corrected] Drawing

[Correction target item name] All drawings

[Correction method] Change

[Correction content]

[Figure 1]

[Fig. 2]

[Figure 3]

[Figure 4]

[Figure 5]

[Figure 6]

Claims (1)

[Claims] 1. A probe having a probe needle provided on a probe substrate, wherein the probe needle is provided in a plurality of layers on the probe substrate, wherein the probe needle is brought into contact with a conductive portion of a semiconductor integrated circuit to perform a circuit test. A probe characterized by being implanted.