JPH0574888A - Wafer probing device - Google Patents

Abstract

PURPOSE:To eliminate an overlapped process and enhance productivity by removing chips which a chip visual inspection decided as a non-conforming article from the articles intended for property inspections and performing the property inspections for only those chips which are decided as conforming articles by visual inspection. CONSTITUTION:A chip visual inspection result is transmitted from a floppy disk 8 to a memory 7. Then, a wafer 4 located in a wafer 3 at a chuck top is transferred for chip inspections. During the chip inspection, the chuck top operates based on the decision obtained from a chip visual inspection. When chips are rejected due to their defective appearance, they are marked with a marking device 11 unconditionally. Those visually defective chips alone are picked up for a P/W marking inspection. After all chips are inspected and decided in a similar manner in the following processes, defective chips are marked and P/W inspection work ends, which makes it possible to improve inspection efficiency and enhance productivity as well.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a wafer probing apparatus, and in particular, a chip (integrated circuit made in a wafer) that is judged to be defective in appearance by a chip appearance inspection apparatus is
A semiconductor wafer probing device having a function of subjecting only chips whose appearance is judged to be non-defective to P / W check (a step of testing the function and characteristics of the chip) to the test which is not subject to the P / W check. Regarding

[0002]

2. Description of the Related Art In a conventional P / W check test, it is judged whether the product has a malfunction or a characteristic is out of specification.
Bad marking is done. However, since it does not have the function to detect the appearance-related defects related to the quality, whether or not a person can check the appearance of the chips before and after the P / W check and manually mark the defective chips in the quality check appearance check. Alternatively, a method of performing a chip visual inspection by a chip visual inspection device, passing the information of the defective chip to a probing device dedicated to marking, performing defective marking, and then performing P / W check.

A specific example will be described with reference to the flow charts shown in FIGS. 5 to 7 and the block diagrams shown in FIGS. 8 to 10.

First, in FIGS. 5 and 8, the semiconductor wafer 4 is loaded into the chip visual inspection apparatus (process 20). Here, the controller 6 controls the appearance inspection device 1, the appearance recognition device 5, and the storage device 7, performs the appearance inspection of the chip (processes 21 to 23), and records the result in the storage device 7 (process 24). Hereinafter, appearance inspection is performed on all the chips in the wafer, and each chip is recorded in the storage device 7. After all chips have been checked (process 25), data is transferred from the storage device 7 to the floppy disk 8 (process 26), the work of the chip appearance inspection is completed, and the wafer is wafer-out (process 27).

Next, referring to FIGS. 6 and 9, the wafer is loaded into the defective marking device (process 30). At this time,
The data of the floppy disk 8 of FIG. After processing 31 to 33, FIG.
On the basis of this data, the controller 6 of (1) marks the chips in the wafer 4 which have become defective in appearance by the marking device 11 (process 34).

After this, in FIGS. 7 and 10, the wafer 4 is loaded into the P / W check (process 42) (process 4).
0), a characteristic test is performed for each chip, and the quality is judged (process 4).
Based on 3), the defective chip is marked by the marking device 11 (process 44). At this time, a characteristic test is also performed on the chips having a defective appearance in the previous step, and the defective marking steps are duplicated.

[0007]

In the above-mentioned conventional method, P / P is applied even to a chip which has already been judged to be defective in appearance.
A characteristic test is performed by the W check, and a defective marking step is performed to mark a defective chip based on the result of the chip visual inspection, and a defective marking step is performed based on the result of the P / W check test. Are duplicated, inefficient, and poor in productivity.

SUMMARY OF THE INVENTION It is an object of the present invention to provide a wafer probing apparatus which solves the above problems, eliminates duplication steps, and improves productivity.

[0009]

The structure of the wafer probing apparatus of the present invention is such that the chips judged to be defective in the chip visual inspection in the previous step are not subjected to the characteristic test and the chips are judged to be good in appearance. A recording device and a floppy disk are provided so that the characteristic test is performed only on the object.

[0010]

1 is a flow chart showing a chip appearance inspection procedure before P / W check according to an embodiment of the present invention, and FIG. 2 is a block diagram showing the chip appearance inspection apparatus of FIG.

FIG. 3 is a flow chart showing the contents of a P / W check using the wafer probing apparatus of the embodiment of the present invention, and FIG. 4 is a block diagram showing the wafer probing apparatus of the embodiment of the present invention.

First, FIGS. 1 and 2 will be briefly described to explain the present invention. The controller 6 controls the appearance inspection device 1, the appearance recognition device 5, and the storage device 7 to perform the appearance inspection on all the chips formed in the semiconductor wafer on the chuck top 3 (Process 5).
0 to 52), the appearance determination result is recorded in the storage device 7 corresponding to the chip (processing 53, 54). After the visual inspection is completed for all chips (process 55), the data in the storage device 7 is transferred to the floppy disk 8 (process 56), and the chip visual inspection work for the wafer is completed (process 5).
7).

Next, referring to FIGS. 3 and 4, the wafer processed by the appearance apparatus of FIGS. 1 and 2 is loaded (process 6).
0). Since the P / W check is performed on the wafer 4 set in the wafer probing apparatus 2, first, the chip appearance inspection result obtained in the preceding process corresponding to the chip is shown in FIG.
From the floppy disk 8 to the storage device 7.

After that, the wafer 4 on the wafer 3 on the chuck top 3 is moved to test the chip. At this time, the chip is operated based on the judgment obtained by the chip visual inspection (processes 61 and 62), and in the case of a chip having a defective external appearance (process 63), it is unconditionally marked by the marking device 11 (process 66). Only chips that have been judged to be non-defective in appearance are subjected to the P / W check test (process 64). After the same judgment and test for all chips, defective chips are marked and the P / M work is completed (processes 66 to 68).

Since the wafer probing apparatus shown in FIG. 4 according to the present embodiment has the function of combining the conventional functions of FIG. 9 and FIG. 10, by using the wafer probing apparatus of the present embodiment, the wafer probing apparatus of FIG. No bad marking equipment is required.

As described above, this embodiment is a process (P / W process) for testing the function and characteristics of the integrated circuit formed in the wafer.
In this case, by adding a recording device and a floppy disk device to the wafer probing device, chips judged to be defective in appearance by the chip appearance inspection device in the previous process are not subjected to the characteristic test and are regarded as good in appearance. It is characterized by conducting a characteristic test by P / W check for only the chips that have

[0017]

As described above, according to the present invention, the result of the appearance / non-definition judgment corresponding to the in-wafer chip obtained by the chip appearance inspection device can be directly determined by P / W without passing through a separate defect marking device. Since it is incorporated into the wafer probing device for checking, it has the effects of improving efficiency and improving productivity.

[Brief description of drawings]

FIG. 1 is a flowchart showing a chip appearance inspection procedure before a P / W check according to an embodiment of the present invention.

FIG. 2 is a block diagram showing the chip visual inspection apparatus of FIG.

FIG. 3 is a flow chart showing the contents of P / W check using the wafer probing apparatus of one embodiment of the present invention.

FIG. 4 is a block diagram showing the wafer probing apparatus of FIG.

FIG. 5 is a flowchart showing a conventional chip appearance inspection procedure.

FIG. 6 is a flowchart showing a conventional defective chip marking procedure.

FIG. 7 is a flowchart showing a conventional P / W check wafer probing procedure.

FIG. 8 is a block diagram showing the inspection device of FIG.

9 is a block diagram showing the defective chip marking device of FIG. 6. FIG.

10 is a block diagram showing the wafer probing apparatus of FIG.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 Appearance inspection device 2 Wafer probing device 3 Chuck top 4 Wafer 5 Appearance recognition device 6 Controller for control 7 Storage device 8 Proppy disk 9 Function / characteristic test device 10 Probe 11 Marking device 20-27, 30-36, 40- 46,50-57,6
0-68 processing

Claims (1)

[Claims] 1. A recording device and a recording device are provided so that a characteristic test is performed only on the chips that are judged to be good in appearance, without subjecting the chips that have been determined to be defective as a result of the visual inspection of chips in the previous process to the characteristics test. A wafer probing apparatus having a floppy disk.