JPH0575236A - Etching device of metal clad laminated board - Google Patents

Abstract

(57) [Abstract] [PROBLEMS] To provide an etching apparatus for a metal-clad laminate that reduces the difference between the in-plane variation and the front-back variation of a metal-clad laminate formed by etching. [Structure] A plurality of etching liquid spray tubes 2 each having an etching liquid injection hole 1 provided at a plurality of longitudinal positions are arranged substantially parallel to a passing direction of a metal-clad laminate 3. The plurality of etching liquid spray tubes 2 are connected to the passage portion 4 of the metal-clad laminate 3.
Are vertically arranged so that the etching solution injection hole 1 faces downward on the upper side and the etching solution injection hole 1 faces downward on the lower side. A pressure adjusting valve 5 is provided in each etching liquid spray tube 2. The action of the etching liquid on the metal-clad laminate 3 by adjusting the individual spray pressure with the pressure control valve 5 so as to increase the spray pressure of the etching liquid spray pipe 2 located at the center of the metal-clad laminate 3. Can be made uniform.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an etching apparatus for forming a circuit on a metal-clad laminate.

[0002]

2. Description of the Related Art An etching apparatus used to form a circuit by applying an etching solution 7 to a metal-clad laminate 3 such as a copper-clad laminate is formed as shown in FIG.
(A) is a top sectional view, (b) is a front sectional view, and (c) is a side sectional view. That is, a plurality of etching solution spray pipes 2 having etching solution spray holes 1 provided at a plurality of locations in the longitudinal direction are arranged substantially parallel to the passing direction of the metal-clad laminate 3, and the plurality of etching solution spray pipes 2 are made of metal. The etching solution injection hole 1 is provided above the passage portion 4 of the laminated laminate plate 3.
On the lower side so that the
The etching devices are formed by arranging them so that they face upward. Further, a pressure adjusting valve 5 is provided at each of the upper etching liquid spray pipes 2 at one location and at each of the lower etching liquid spray pipes 2 at one location. The supply pressure of the liquid 7 can be adjusted. A roller conveyor 6 is provided in two stages between the upper and lower etching liquid spray pipes 2, and the metal-clad laminate 3 is sandwiched between the upper and lower roller conveyors 6 at the entrance 9 of the etching tank 8 by a motor. While being conveyed to the outlet 10 by the rotating roller conveyer 6, the metal-clad laminate 3 is sprayed with the etching solution 7 formed of copper chloride, iron chloride, alkali, etc. The circuit form is performed by etching metal foils such as copper foils on the front and back sides of the laminated laminate plate 3.

[0003]

In the above etching apparatus, the pressure adjusting valve 5 is provided only at each one of the upper and lower etching liquid spray pipes 2, so that the upper etching liquid spray pipes 2 are provided. The spray pressures of the etching liquid spray pipes 2 on the lower side are all the same, and the amount of the etching liquid 7 sprayed from the etching liquid spray pipes 2 to the metal-clad laminate 3 is Almost equal. For this reason, when the metal-clad laminate 3 is large, the etching solution 7 sprayed on the central portion of the metal-clad laminate 3 flows from the central portion of the metal-clad laminate 3 to the end portion of the metal-clad laminate 3 so that the end portion of the metal-clad laminate 3 ends up. The etching treatment level of the portion becomes large, and a difference in the in-plane variation of the etching treatment level partially occurs. Moreover, the etching liquid 7 sprayed on the upper surface of the metal-clad laminate 3 stays, but the etching liquid 7 sprayed on the lower surface does not stay, so that the upper surface is in contact with the etching liquid 7 for a longer time, and the etching treatment level on the front and back sides is higher. The difference in the difference between the two becomes large. Further, when the metal-clad laminate 3 is thin, the etching treatment level on the upper surface becomes higher than that on the lower surface as described above, and therefore the circuit forming portion remaining on the upper surface is smaller than the circuit forming portion remaining on the lower surface. The layered structure of the laminated plate 3 becomes asymmetrical, so that the metal-clad laminated plate 3 is likely to warp like a convex downward, and further, the etching liquid 7 is likely to be accumulated on the upper surface of the metal-clad laminated plate 3. There are various problems that the difference between the front and back variations in the etching finish is further increased.

The present invention has been made in view of the above problems, and provides an etching apparatus for a metal-clad laminate capable of reducing the difference between the in-plane variation and the front-back variation in the etching finish level of the metal-clad laminate. The purpose is to provide.

[0005]

Means for Solving the Problems A plurality of etching liquid spray tubes 2 having etching liquid injection holes 1 provided at a plurality of longitudinal positions are arranged substantially in parallel with a passing direction of a metal-clad laminate 3, and the plurality of etching liquid spray tubes 2 are arranged. The etching liquid spray tube 2 is vertically arranged so that the etching liquid spray hole 1 faces downward on the upper side of the passage 4 of the metal-clad laminate 3 and the etching liquid spray hole 1 faces downward on the lower side. In addition to being provided, a pressure adjusting valve 5 is provided in all of the individual etching solution spray pipes 2.

[0006]

According to the present invention, the pressure control valve 5 provided on each etching liquid spray pipe 2 causes the pressure of the etching liquid spray pipe 2 located at the central portion of the metal-clad laminate 3 to end at the etching liquid spray pipe 2. By adjusting the pressure of each etching liquid spray tube 2 so as to be higher than the pressure of 2, the action of the etching liquid 7 on the metal-clad laminate 3 can be made uniform over the entire surface.

[0007]

EXAMPLES The present invention will be described in detail below with reference to examples. Figure 1
Shows an etching tank 8 for etching the metal-clad laminate 3, (a) is a top sectional view, (b) is a front sectional view, and (c) is a side sectional view. In the etching tank 8, a plurality of etching solution injection holes 1 are provided at a plurality of longitudinal positions.
FIG. 1 shows a plurality of etching liquid spray tubes 2 provided with
As shown in (a) and (b), the metal-clad laminate 3 is arranged substantially parallel to the passage direction, and the plurality of etching solution spray tubes 2 are passed through the metal-clad laminate 3 as shown in FIG. 1 (b). On the upper side of the portion 4, the etching solution injection hole 1 faces downward,
On the lower side, the etching solution injection holes 1 are arranged vertically so as to face upward, and individual etching solution spray tubes 2 are provided.
The pressure adjusting valve 5 is provided to form an etching device. As shown in FIGS. 1B and 1C, a roller conveyer 6 is provided between the upper and lower etching solution spray pipes 2 from the inlet 9 to the outlet 10 of the etching tank 8 of the metal-clad laminate 3, and the passage portion 4 is provided. In addition to the above, the excretion portion 11 is formed at the bottom of the etching tank 8 so as to collect and collect the used etching solution. The etching solution 7 is an etching solution supply pipe 12
Is guided to each etching liquid spray tube 2 through a branch pipe 13. Each branch pipe 13 is provided with a pressure adjusting valve 5 and a pressure gauge 14.
By adjusting the supply pressure of the etching solution 7 with each pressure adjusting valve 5, the flow rate of the etching solution 7 is adjusted and is sent to each etching solution spray pipe 2 and sprayed from the etching solution injection hole 1 to the metal-clad laminate 3. The amount of spray of the etching liquid 7 can be adjusted. ..

When the metal-clad laminate 3 is introduced into the etching tank 8 after the previous process, the metal-clad laminated board 3 is sandwiched between the upper and lower roller conveyors 6 at the inlet 9 of the etching tank 8 and is exited by the roller conveyor 6 rotated by the motor. It is transported to 10. During this transportation, the etching liquid 7 is sprayed from the upper and lower etching liquid spray tubes 2 onto the metal-clad laminate 3, and the metal foil such as the copper foil on the front and back of the metal-clad laminate 3 is etched to form a circuit. Is something that can be done. The used etching liquid 7 thus sprayed is collected and collected in the excretion portion 11 at the bottom of the etching tank 8.

When the etching solution 7 is sprayed from the etching solution spray tube 2 as described above, each pressure adjusting valve 5 is adjusted to adjust the supply pressure of the etching solution spray tube 2 located at the central portion of the metal-clad laminate 3. When the pressure is higher than the supply pressure at the end portions, the amount of the etching liquid 7 sprayed on the metal-clad laminate 3 increases toward the central portion and decreases toward the end portions. Will be larger than. However, the etching liquid 7 sprayed on the central part flows from the central part of the metal-clad laminate 3 to the end part of the metal-clad laminate 3, so that the etching processing level of the end part becomes large, and the etching of the central part and the end part is performed. The processing level can be almost the same. In this way, the difference in the in-plane balance of the etching treatment level of the metal-clad laminate 3 can be suppressed to 15 μm or less. Further, since the etching liquid 7 sprayed on the upper surface of the metal-clad laminate 3 stays, but the etching liquid 7 sprayed on the lower surface does not stay, the contact time of the etching liquid 7 on the upper surface becomes longer, and the etching treatment level on the front and back sides becomes higher. The difference in the difference between the two becomes large. Therefore, when the supply pressure of the etching liquid spray tube 2 spraying on the upper surface of the metal-clad laminate 3 is low and the supply pressure of the etching liquid spray tube 2 spraying on the lower surface is high, the amount of the etching solution 7 sprayed on the upper surface is small and Since the amount of the etching liquid 7 to be sprayed is large, the residence time of the etching liquid 7 retained on both surfaces of the metal-clad laminate 3 can be made substantially the same. In this way, the difference in balance between the front and back of the etching treatment level of the metal-clad laminate 3 can be set to 10 μm or less.
As described above, the difference between the front and back surfaces of the metal-clad laminate 3 in terms of the etching treatment level can be set to 10 μm or less. Even when the metal-clad laminate 3 is thin, it remains on the upper surface and remains on the circuit forming portion and the lower surface. The layer structure of the circuit forming portion can be made almost symmetrical, and the metal-clad laminate 3 is warped like a convex downward, and the etching liquid 7 can be accumulated on the upper surface of the metal-clad laminate 3. Will be resolved.

[0010]

As described above, according to the present invention, a plurality of etching solution spray pipes having etching solution injection holes at a plurality of longitudinal positions are arranged substantially parallel to the passing direction of the metal-clad laminate, and The etching liquid spray tube of the book is arranged vertically so that the etching liquid injection hole faces downward on the upper side of the passage portion of the metal-clad laminate and the etching liquid spray hole faces downward on the lower side. Since pressure control valves were provided for all individual etching solution spray pipes, the pressure of each spray pipe was adjusted by each pressure control valve to increase the pressure of the spray pipe located at the center of the metal-clad laminate. It is possible to suppress the difference in the etching finish level between the end part and the center part, to suppress the in-plane variation, and to suppress the reaction that occurs due to the asymmetrical layer structure of the metal-clad laminate, and to suppress the metal-clad laminate. In which it is possible to suppress the variation of the front and back of the etching processing level of the plate.

[Brief description of drawings]

FIG. 1 shows an embodiment of the present invention, in which (a) is a top sectional view, (b) is a front sectional view, and (c) is a side sectional view.

2A and 2B show a conventional example, in which FIG. 2A is a top sectional view, FIG. 2B is a front sectional view, and FIG. 2C is a side sectional view.

[Explanation of symbols]

 1 Etching solution injection hole 2 Etching solution spray tube 3 Metal-clad laminate 4 Passing section 5 Pressure adjustment valve

Claims (1)

[Claims] 1. A plurality of etching solution spray pipes having etching solution injection holes provided at a plurality of longitudinal positions are arranged substantially parallel to the passage direction of a metal-clad laminate, and the plurality of etching solution spray pipes are made of metal. It is arranged vertically so that the etching solution injection hole faces downward on the upper side of the passing part of the laminated laminate, and the etching solution injection hole faces downward on the lower side. An etching device for a metal-clad laminate, comprising a pressure control valve.