JPH0576799B2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION [Industrial Application Field] The present invention relates to a component mounting device that can mount a plurality of types of electronic components having different shapes, sizes, etc.

[Background technology and its problems]

Conventional component mounting devices include one type of suction nozzle unit for suctioning electronic components;
There are some devices that can be equipped with many types of suction nozzle units.

In the former case, attachable electronic components (e.g.
There is a problem in that the types of chips (chip-shaped ICs, tantalum capacitors, etc.) are limited to those that can be picked up by one suction nozzle unit.

Furthermore, even in the latter case, since a plurality of prepared suction nozzle units are selected and replaced, there is a problem in that it takes an extremely long time to replace the suction nozzle units.

Furthermore, with conventional systems, electronic components are picked up by suction with a suction nozzle unit, and the electronic components are transported from the pick-up position to the installation position using only the suction force. There were problems such as misalignment.

[Purpose of the invention]

The present invention has been made in view of the above points, and provides a component mounting device that can mount a plurality of types of electronic components having different shapes, sizes, etc., without shifting their center positions.

[Summary of the invention]

In order to achieve the above object, the present invention picks up an electronic component supplied to a predetermined position with a pick-up suction nozzle unit corresponding to the electronic component, holds it with a holding claw unit, and uses this holding claw unit to pick up the electronic component. The electronic parts are transported from the pick-up position to the mounting position and mounted using a mounting suction nozzle unit compatible with electronic components, so that multiple types of electronic components of different shapes and sizes can be mounted without shifting their center positions. This is what I did.

〔Example〕

Fig. 1 is a plan view schematically showing the main parts of the present invention, Fig. 2 is a partially omitted side view showing an embodiment of the invention, and Figs. 3 a, b, and c are explanations of the operation of the holding claw unit. It is a diagram. The holding claw unit in FIG. 2 is shown as viewed from the side in FIG. 3.
In FIG. 1, reference numerals 1 ₁ to 5 ₅ are component supply devices, which supply a plurality of electronic components E ₁ to E ₅ of different shapes, sizes, etc.
It is composed of component supply units 2 ₁ to 2 ₅ that supply electronic components E 1 to E 5 , and tables 3 ₁ to 3 ₅ shown in FIG. 2 that position the transported electronic components E ₁ to E ₅ at predetermined positions in the forward and backward directions.

Reference numeral 11 denotes a plurality of pick-up suction nozzle units (hereinafter simply referred to as suction nozzle units) corresponding to the sizes and shapes of the electronic components _E1 to _E5 .
12 ₁ to 12 ₅ are provided, and the suction nozzle units 12 ₁ to 12 ₅ are attached to tables 3 ₁ to 3 _{2 .}
Correspondingly, the suction nozzles 13 ₁ to 1 as shown in FIG.
3 ₅ and support rods 14 ₁ to 14 ₅ that support the suction nozzles 13 ₁ to 13 ₅ are urged upward in FIG. 2 by a spring (not shown).

Reference numerals 21 ₁ to 21 ₈ are holding claw units that position and hold the electronic components E ₁ to E ₅ of different sizes picked up by the suction nozzles 13 ₁ to 13 ₅ in the front, back, right, and left directions, and are shown in FIGS. 2 and 3. As shown, the operating rod 22, the holding pieces 23, 23 which expand the holding claws 24, 24 at the tips which are bent at right angles when the operating rod 22 is pushed down, and the holding claws 24, 24 which are always closed. Spring 2 that urges the holding pieces 23, 23 to
Consists of 5. In addition, the holding claw unit 21 ₁ ~
21 ₅ shows electronic components of different sizes when expanded.
All types from E ₁ to E ₅ can be held.
Further, the operating rod 22 is connected to a second spring by a spring (not shown).
It is urged upward in the figure. Reference numeral 31 designates a first index table in which the holding claw units 21 ₁ to 21 ₈ are arranged concentrically at equal intervals, and the electronic components E ₁ to
Holding claw unit 2 at pick-up position holding _E5
11 to ₂₁₅ are rotated and conveyed to the mounting position (the position of the holding claw unit ₂₁₇ ).

41 ₁ to 41 ₅ are the suction nozzle units 12 ₁
-12 As in ₅ , a plurality of mounting suction nozzle units (hereinafter simply referred to as suction nozzle units) provided corresponding to the size of electronic components collect the electronic parts transferred by the first index table. parts
E ₁ to _{E 5} are sucked from the holding claws 24, held in that position, and mounted on the substrate P shown _in FIG. _2. As shown in FIG. Support rods 43 ₁ to 43 ₅ that support ₁ to 42 ₅
It is composed of The support rods 43 ₁ to 43 ₅ are biased upward in FIG. 2 by springs (not shown). 51 is the suction nozzle unit 41 ₁ to 41 ₅
The position of the suction nozzle unit 41 ₁ facing the holding claw unit 21 ₇ on the second index table arranged concentrically at equal intervals is the mounting position.
In addition, the holding claw and suction nozzle unit 27 ₇ , 41 ₁
As can be seen from FIG. 2, the mounting positions for mounting the electronic components E ₁ to _{E 5} coincide with the mounting position for the suction nozzle unit 41 ₁ .

In FIG. 2, 61 is an electronic component of the board P.
This is an XY table device that positions the mounting positions of E ₁ to _{E 5} at the position of the suction nozzle unit ₄₁₁ shown in FIG.

Reference numerals 71 refer to the component supply devices 1 ₁ to 1 ₅ , the pick-up device 11 , the holding claw units 21 ₁ to 21 ₈ , the first and second index tables 31 and 51 , the suction nozzle units 41 ₁ to 45 ₅ and the XY table device 61 The control device that drives the cam 73 and the first,
transmitted to the second index table 31, 51,
The operating rods 74 ₁ to 74 ₄ and the first and second index tables 31 and 51 are operated and rotated.

In FIG. 2, suffixes are omitted from the symbols as necessary, and suffixes will be omitted in the following description unless necessary.

Next, the operation of the parts supply device of the present invention will be explained.

When the motor 72 is rotated by the control device 71 and the electronic component E is supplied from one of the component supply devices 1, for example, the component supply section 2 ₁ of the component supply device 1 ₁ , the electronic component E is supplied with compressed air. etc., and is positioned on the table 3 in the front-rear direction. This positioned electronic component E operates the cam 73 by operating one of the clutches that transmits the driving force of the motor 72, and connects all the suction nozzle units 12 of the pick-up device 11 with the operating rods 74 ₁ and 74 ₂ .
If the holding claw unit 21 facing this is all pushed down and then raised by the biasing force of the spring,
It is picked up by the suction nozzle 13 that has started suction and raised, and the left and right sides are positioned by the holding claw unit 21.
In other words, it is held in a state in which the front, rear, left, and right sides are positioned. Then, when the holding claw unit 21 holds the electronic component E, the suction of the suction nozzle 13 is released.

To explain in detail the suction and holding of the electronic component E, the suction nozzle 13 starts suction, and the holding claw unit 21 before the suction nozzle unit 12 descends.
is the state shown in FIG. 3a, but when the suction nozzle unit 12 starts to descend, the operating rod 74 ₂ moves to the operating rod 22.
is pushed down, so the holding pieces 23, 23 are held at point A.
It rotates in the direction of the arrow around , and enters the state shown in FIG. 3b, in which the supplied electronic component E can be held. In this state, when the suction nozzle unit 12 suctions the electronic component E to the position indicated by the dotted line and rises, the pressing force of the operating rod 22 is released and the holding pieces 23, 23 are moved by the spring 2.
It rotates in the direction of the arrow with the biasing force of 5, so as shown in Fig. 3c.
The electronic component E is held by the holding claws 24, 24 with the electronic component E positioned front, back, left and right as shown in FIG.

Then, in this state, the clutches for rotating the first and second index tables 31 and 51 are operated, and the holding claw unit 21 and the suction nozzle unit 41 corresponding to the electronic component E are moved to the mounting position while detecting the position. Rotate. At the same time as this
The XY table device 61 operates to determine the mounting position of the board P. Note that when the suction nozzle unit 41 corresponding to the electronic component E is in the mounting position, the second index table 51 does not rotate. As shown above, attach the holding claw and suction nozzle unit 2.
1 and 41 are in the mounting position, the aforementioned clutch operates again to actuate the cam 73, and the actuating rod 7
4 ₃ , 74 ₄ is the holding claw, suction nozzle unit 21 ,
The electronic component E can be mounted on the cream solder or the mounting agent on the board P by pushing down 41 and then lifting it up by the biasing force of the spring. Incidentally, the mounting operation of the electronic component E can be performed by operating each part in the opposite manner to the explanation in FIG. 3.

Thereafter, electronic components E can be sequentially mounted on the board P in the same manner. Therefore, the electronic component E is moved from the pick-up position to the mounting position by the holding claw unit 21.
Since the electronic component E is held and transported, the electronic component E can be mounted on the board P with high precision without shifting its center position. Furthermore, since a plurality of suction nozzle units 12, 41 are provided corresponding to a plurality of electronic components E having different sizes and shapes, it is possible to select any suction nozzle unit 12, 41 according to the size of the electronic component. All electronic parts E can be quickly installed.

In the above explanation, the electronic components E are mounted one by one, but the cam 73 operates all the operating rods 74 to hold the electronic component E on one side and mount the electronic component E on the other. Various controls such as driving by the control device 71 can be performed. Further, even if there is only one holding claw unit 21, the electronic component E can be mounted by operating in the same manner. Furthermore, the cam 73 operates the operating rod 74.
Activate the suction nozzle, holding claw unit 12,
Although 21 and 41 are operated, mechanisms other than the cam 73 and the operating rod 74 may be used as long as they can be operated as described above. Further, the first and second index tables 31 and 51 may be rotated by respective dedicated motors.

〔Effect of the invention〕

As explained above, the component mounting device of the present invention picks up the electronic component with a pick-up suction nozzle unit corresponding to the size and shape of the electronic component, holds it with the holding claw unit, and transports the electronic component in this state to the mounting position. Since the electronic component is mounted using a mounting suction nozzle unit compatible with the electronic component, the electronic component can be mounted with high precision without shifting its center position. In addition, by selecting a mounting suction nozzle unit that is compatible with the electronic component at the mounting position, it is now possible to mount multiple electronic components of different sizes, which has the advantage of being able to quickly mount a wide variety of electronic components. be.

[Brief explanation of drawings]

Fig. 1 is a plan view schematically showing the main parts of the present invention, Fig. 2 is a partially omitted side view showing an embodiment of the invention, and Figs. 3 a, b, and c are explanations of the operation of the holding claw unit. It is a diagram. In the figure, 1 ₁ to 1 ₅ are component supply devices, 11 is a pickup device, 21 ₁ to 21 ₈ are holding claw units, and 3
1 is a first index table, 41 ₁ to 41 ₅ are attachment suction nozzle units, 51 is a second index table, 61 is an XY table device, 71 is a control device, 72 is a motor, 73 is a cam, and 74 ₁ to 41 are
74 ₄ is an operating rod, E ₁ to E ₅ are electronic components, and P is a board.

Claims (1)

[Scope of Claims] 1. A plurality of component supply devices that supply chip-shaped electronic components having different sizes and shapes to predetermined positions, respectively; a plurality of pick-up suction nozzle units that can be selected and picked up according to size; a plurality of holding claw units that hold electronic components picked up by the pick-up suction nozzle units at the picked up positions; a first index table whose rotation is controlled for transporting the electronic component picked up by the holding claw unit to a mounting position; and a first index table for sucking the electronic component from the holding claw unit at the mounting position and mounting it on the board. a second index table that concentrically arranges a plurality of mounting adsorption noise units corresponding to the size of the electronic component and transports the same to a component mounting position; an XY table that positions the board; and an XY table that positions the board; a supply device, the pick-up device, the holding claw unit, the first index table, the attachment suction nozzle unit, and the second
1. A component mounting device comprising: an index table; and a control device for controlling the XY table device, and mounting the electronic component at a predetermined position on the board.