JPH0577325B2 - - Google Patents

Description

[Detailed Description of the Invention] <Industrial Application Field> The present invention provides electronic components such as capacitors,
The present invention relates to a method for manufacturing electronic components that are packaged using a case made of resin, metal, or the like.

<Prior Art> Case-shaped electronic components such as those described above, such as film capacitors, have recently been in increasing demand due to their advantages in dimensional accuracy, and expectations for improvements in manufacturing technology have also increased. In the case of conventional case-type devices, the manufacturing technology is moisture-proofing only by resin sealing, and the device itself is not impregnated with resin, resulting in insufficient moisture resistance. Therefore, when performing impregnation for the purpose of further improving performance, it was common to perform the impregnation in advance in a separate process before sealing.

FIG. 12A is a block diagram showing the conventional manufacturing process including the impregnation process for a case-exterior film capacitor. First, a capacitor element having lead wires is coated with epoxy resin or the like in a vacuum atmosphere. After impregnating and heating the resin to harden it, the element is housed in a case. At this time, the element is temporarily fixed in the case with an adhesive, by bending the lead wire, or by engaging the lead wire with an uneven portion of the case. Then, after injecting and filling a sealing resin into the case containing the element using a discharger, heating and curing the case, and repeating the process of injecting the resin again and curing the case as necessary. In this way, a case-exterior film capacitor was produced by inserting the capacitor into the element, injecting and filling the resin, and curing it by heating.

<Problems to be Solved by the Invention> However, according to the conventional manufacturing method as described above, resin impregnation of the element and sealing filling are performed in separate steps as described above, and the case When sealing, resin was injected into each case one by one, resulting in poor work efficiency and difficulty in mass production.
Therefore, there was a problem of high costs.

The present invention has been made in view of the above-mentioned conventional problems, and provides a method for manufacturing case-exposed electronic components that simplifies the manufacturing process as described below and that is easy to mass-produce. It is something to do.

<Means for Solving the Problems> In order to achieve the above object, the present invention provides a method for manufacturing an electronic component in which a lead-type or chip-shaped electronic component element is enclosed in a case made of plastic or metal. The component elements are temporarily fixed in the case using an appropriate fixing means such as adhesive, and the electronic component elements are immersed and filled in a low-viscosity thermosetting resin together with the case in air or a reduced pressure atmosphere. The method is characterized in that impregnation and sealing are performed at the same time by pulling up the resin from the resin, removing unnecessary resin adhering to the outer surface of the case, and then heating and curing the case.

<Function> When manufacturing electronic parts such as capacitors according to the above structure and method, the method shown in the block diagram of FIG. 1 can be applied to both lead type and chip type. First, to explain the drawer lead type, the element body can be temporarily fixed in a case, and the element can be impregnated and filled by immersing the case together in a resin bath (not shown) in a reduced pressure atmosphere. After that, the semi-finished product pulled out of the resin tank will have resin dripping if left as it is, so either wipe it or heat it (approximately 80 degrees Celsius) to a degree that does not accelerate the hardening of the resin. Reduces the viscosity of the adhered resin, collects it at the bottom of the case, and sucks up the resin with a vacuum nozzle. In this case, there is also a method of applying a mold release agent to the case surface in advance to prevent unnecessary resin from adhering to the outer surface of the case. Thereafter, by curing in an oven or the like, the element is impregnated and sealed at the same time, and a beautiful case-shaped electronic component is completed without any problems in appearance. In this case, the lead wire can also be bent from the lead-out portion of the case, flattened, and used as a chip-shaped component.

On the other hand, in the case of a chip type, as long as an element with electrodes that can be surface-mounted is properly housed in a case, a case-exposed chip type electronic component can be created through a simple process similar to the above-mentioned lead type. .

<Example> Hereinafter, an example of the present invention will be described based on FIGS. 2 to 11.

Example 1 FIGS. 2 to 8 show a method of manufacturing a lead-type capacitor using a multilayer film capacitor element (hereinafter simply referred to as an element).

In the figure, 1 is an element, 2 is a lead wire, 3 is a case, and 4 is a resin.

The element 1 is a base element (not shown) in which a metallicon layer 5 is formed by laminating strip-shaped metallized films in multiple layers by winding or the like, and spraying metal (metallicon) on both ends of the film. ) were cut into individual pieces as shown in FIG. and,
In this element 1, as shown in FIG. 3, lead wires 2 are welded to the metallic layer 5, respectively.

Case 3 is made of plastic such as PP (polypropylene), PC (polycarbonate), or PBT (polybutylene terephthalate), or metal such as aluminum, and is formed into a rectangular shape with a bottom, as shown in Figures 4a and 5. The size is set such that one element 1 can fit therein.

The resin 4 is an epoxy resin with low viscosity and good permeability, and is stored in a resin tank of a size appropriate to the actual level of mass production.

Next, the procedure for manufacturing the film capacitor of the present invention will be explained.

First, the required number of elements 1 are fixed in a series of arrangements to a tape mount or the like. Case 3
They are also prepared in the same number and in the same arrangement according to the number of elements 1.

Then, a hot melt 6 is applied to the bottom of the case 3 using a hot melt applicator (not shown).
is discharged as shown in FIG. 5, and as shown in FIG. 4a, the element 1 is housed in the case 3 and temporarily fixed with the hot melt 6. Next, as shown in Fig. 4b, the case 3 containing these elements 1 is attached to a jig bar 8 with adhesive tape 9, placed in a frame as one unit of production, and placed in a resin tank. Soak.
At this time, the process is carried out in a reduced pressure atmosphere so that the resin 4 sufficiently permeates into the element 1. FIG. 6 shows the state in which one case is immersed. The immersion time for impregnating the element and filling the case 3 depends on the size of the element 1 and the resin 4.
The viscosity varies depending on the viscosity conditions, and should be set to the optimum condition.

After a predetermined period of time has elapsed, the case 3 is pulled up from the resin tank, and the resin drippings are sufficiently cut off or the resin 4 that has gathered at the bottom of the periphery is wiped off.
A large number of case-shaped film capacitors can be obtained at one time by placing the whole frame in an oven at about 120° C. for about 2 hours and curing it. Figures 7a and 7b show individual case-exterior film capacitors C manufactured in this manner.

Generally, the film capacitor C formed by such a method does not require forming the lead wire 2, and can be attached to a printed wiring board as it is straight.

Further, by bending the above-mentioned lead wire and processing it into a flat shape as shown in FIG. 8, it can also be applied as a chip shape, thus making surface mounting possible.

Embodiment 2 FIGS. 9 and 10 show an example of manufacturing a chip capacitor as a second embodiment. In this case, the element 1 is as shown in FIG.
It is bent and fixed in accordance with the position of the following external electrode (electrode plate) 7 provided on the case side in advance, and then stored in the case 3. That is, an electrode plate 7 made of copper or the like is previously provided on one side of the case 3, and is set so as to be connected to the lead wire 2 of the element 1 inside. Alternatively, the metallic layer (terminal) 5 of the element 1 and the external electrode 7 may be directly welded without attaching a lead wire. Note that the electrode plate 7 is desirably masked in advance with adhesive tape or the like so that the resin does not adhere when the case 3 is immersed in the resin. A chip-shaped case-exposed film capacitor C as shown in FIG. 11 is obtained by using each member constructed in this way and performing the same steps as in the case of the lead-out type described above.

In each of the above embodiments, a laminated type film capacitor element is used, but it may also be a wound type, and is not limited to a metallized film.
It may be a foil type combined with a dielectric film, a drawer lead type, or a chip type. Furthermore, electronic components are not limited to capacitors, but may also include resistors, coils, etc., and various composite components, and various design changes may be made within the scope of the technical idea described in the claims. is possible.

<Effects of the Invention> As described above, according to the method for manufacturing a case-clad electronic component of the present invention, unlike the conventional method, the separate steps of impregnating an element before housing it in a case and filling it with resin after housing the element are eliminated. In addition, since the entire case is immersed in the resin, it is possible to form many pieces at once, greatly increasing work efficiency compared to the conventional method of injecting resin with one individual dispenser. This is a very effective method for mass production. Therefore,
It has the practical benefit of dramatically reducing costs.

[Brief explanation of drawings]

FIG. 1 is a block diagram showing the basic steps of the present invention, FIGS. 2 to 4 a are perspective views showing the element and case in the first embodiment, and FIG. 4 b shows a large number of semi-finished products on a jig. Front view showing the installed state, No. 5
The figure is a sectional view of the first embodiment, FIG. 6 is a perspective view of the first embodiment with the entire case immersed in resin, and FIGS. 7a and b are perspective views of the completed state. FIG. 8 is a perspective view showing a case in which the lead wire is transformed into a chip in the first embodiment, and FIGS. 9 and 10 respectively show an element and a case in the second embodiment. FIG. 11 is a perspective view showing the completed state of the second embodiment, and FIG. 12 is a block diagram showing a comparison of the steps of the prior art and the present invention. In the figure, 1 is an element, 2 is a lead wire,
3 is a case, 4 is a resin, 5 is a metallicon layer, 6 is a hot melt, 7 is an electrode plate, 8 is a jig bar, 9 is an adhesive tape, and C is a capacitor.

Claims (1)

[Claims] 1. In a method of manufacturing an electronic component in which a lead-type or chip-shaped electronic component element is enclosed in a case made of plastic or metal, the electronic component element is placed in the case using an appropriate fixing means such as adhesive. After temporarily fixing the electronic components, the entire case is immersed and filled in a low-viscosity thermosetting resin in the air or in a reduced pressure atmosphere, and these are pulled out of the resin and unnecessary resin attached to the outer surface of the case is removed. A method for producing a case-exterior electronic component, characterized in that impregnation and sealing are performed at the same time by heating and curing.