JPH0578454A - Curing agent for epoxy resin - Google Patents
Curing agent for epoxy resinInfo
- Publication number
- JPH0578454A JPH0578454A JP24548991A JP24548991A JPH0578454A JP H0578454 A JPH0578454 A JP H0578454A JP 24548991 A JP24548991 A JP 24548991A JP 24548991 A JP24548991 A JP 24548991A JP H0578454 A JPH0578454 A JP H0578454A
- Authority
- JP
- Japan
- Prior art keywords
- dicyandiamide
- curing agent
- epoxy resin
- urea
- urea derivative
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Epoxy Resins (AREA)
Abstract
(57)【要約】
【目的】ジシアンジアミドを液体化することで塗膜の特
性の改善を図ったエポキシ樹脂用硬化剤を提供する。
【構成】ジシアンジアミドと分子中に活性水素を含む尿
素誘導体とモノエポキシ化合物とを反応させることによ
り得られる化合物および有機溶剤からなる。(57) [Summary] [Object] To provide a curing agent for an epoxy resin in which the characteristics of a coating film are improved by liquefying dicyandiamide. [Structure] A compound obtained by reacting a dicyandiamide, a urea derivative containing active hydrogen in the molecule, and a monoepoxy compound, and an organic solvent.
Description
【０００１】[0001]
【産業上の利用分野】本発明は、エポキシ樹脂用硬化剤
に係り、特に、ジシアンジアミドと尿素誘導体とモノエ
ポキシ化合物とを反応することにより得られる化合物か
らなるエポキシ樹脂用硬化剤に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a curing agent for epoxy resin, and more particularly to a curing agent for epoxy resin comprising a compound obtained by reacting dicyandiamide, a urea derivative and a monoepoxy compound.
【０００２】[0002]
【従来の技術】従来より、ジシアンジアミドはエポキシ
樹脂硬化剤として広く用いられ、硬化物は電気特性、耐
熱性、耐湿性などの特性に優れていることはよく知られ
ている。しかし、ジシアンジアミドは常温で固形で、通
常は粒径５〜１００μｍ程度の粉末であり、エポキシ樹
脂中に均一に分散することは三本ロールミル用いて混練
しても困難である。硬化剤にジシアンジアミドを使用し
たエポキシ樹脂塗料、例えば、プリント基板用のソルダ
レジストでは、基板の導体回路銅箔上のレジスト厚は１
０μｍ程度でレジスト組成の不均一性は、致命的な欠陥
となる。また別の方法として、ジシアンジアミドを極性
溶剤であるジメチルホルムアミド等に溶解し、エポキシ
樹脂中に分散させ使用すると、塗膜形成の乾燥工程で溶
剤を除去するとジシアンジアミドがエポキシ樹脂中で再
結晶するためやはり均一な組成の塗膜は得られない。一
方、特開昭５９−１２６４２８号公報には、ジシアンジ
アミドにモノエポキシ化合物を反応させて液状化する方
法が開示されている。発明者らの追試の結果では、実施
例が下記の点で再現出来なかった。ジシアンジアミドと
モノエポキシ化合物の反応が記載条件では起こらなかっ
た。また、反応促進剤を添加した系でも記載条件では起
こらなかった。しかし反応温度を高めることにより、上
記の反応は進行したが、常温で再結晶化するため実用に
供し得なかった。この他に、特開昭６３−２０５３１３
号公報には、シジアンジアミドとジアミノトリアジン誘
導体とモノエポキシ化合物とを反応させて液状化する方
法が開示されている。これは実用に供し得る硬化剤では
あるが、この他にもジシアンジアミドとの反応物を含む
有効な液状硬化剤が存在するのではないかと考え、種々
検討し本発明に至った。2. Description of the Related Art Conventionally, dicyandiamide has been widely used as an epoxy resin curing agent, and it is well known that the cured product has excellent properties such as electrical properties, heat resistance and moisture resistance. However, dicyandiamide is a solid at room temperature and is usually a powder having a particle size of about 5 to 100 μm, and it is difficult to uniformly disperse it in the epoxy resin even when kneading it using a three-roll mill. Epoxy resin paint using dicyandiamide as a curing agent, for example, in solder resist for printed circuit boards, the resist thickness on the conductor circuit copper foil of the board is 1
At about 0 μm, the nonuniformity of the resist composition becomes a fatal defect. As another method, when dicyandiamide is dissolved in a polar solvent such as dimethylformamide and dispersed in an epoxy resin and used, when the solvent is removed in the drying step for forming a coating film, dicyandiamide recrystallizes in the epoxy resin. A coating film having a uniform composition cannot be obtained. On the other hand, JP-A-59-126428 discloses a method of liquefying dicyandiamide by reacting a monoepoxy compound. As a result of the supplementary tests by the inventors, the example could not be reproduced in the following points. The reaction between dicyandiamide and the monoepoxy compound did not occur under the described conditions. Further, even in the system to which the reaction accelerator was added, the phenomenon did not occur under the described conditions. However, although the above reaction proceeded by raising the reaction temperature, it could not be put to practical use because it recrystallized at room temperature. In addition to this, JP-A-63-205313
The publication discloses a method of liquefying by reacting cydiandiamide, a diaminotriazine derivative and a monoepoxy compound. Although this is a curing agent that can be put to practical use, it was thought that there may be an effective liquid curing agent containing a reaction product with dicyandiamide, and various studies were conducted to arrive at the present invention.
【０００３】[0003]
【発明が解決しようとする課題】ジシアンジアミドはエ
ポキシ樹脂硬化剤として広く用いられ、硬化物は優れた
電気的、機械的等の性質をもっていることはよく知られ
ている。しかしジシアンジアミドは常温で固形（粉末）
であり、エポキシ樹脂中に均一に分散することは困難で
ある。特に、硬化物が薄い膜を形成する塗料、例えば、
プリント基板用のソルダレジストやコーティング剤で
は、組成の不均一が致命的な欠陥となる。具体的には、
ソルダレジストとして使用した場合、めっき液中へのジ
シアンジアミドの溶出によるめっき膜の伸び率や引っ張
り強度を低下させる。また、接着や塗膜自身の機械的性
質が不均一となり、ひいては最終製品の信頼性を低下さ
せる。そこで、ジシアンジアミドを液体化することで塗
膜の特性改善を図った。Dicyandiamide is widely used as a curing agent for epoxy resins, and it is well known that the cured product has excellent electrical and mechanical properties. However, dicyandiamide is solid (powder) at room temperature
Therefore, it is difficult to disperse the epoxy resin uniformly in the epoxy resin. In particular, the cured product forms a thin film, for example,
Non-uniform composition is a fatal defect in solder resists and coating agents for printed circuit boards. In particular,
When it is used as a solder resist, it elongates the dicyandiamide into the plating solution to reduce the elongation and tensile strength of the plated film. In addition, the adhesion and the mechanical properties of the coating film itself become non-uniform, which in turn reduces the reliability of the final product. Therefore, the characteristics of the coating film were improved by liquefying dicyandiamide.
【０００４】[0004]
【課題を解決するための手段】上記目的はジシアンジア
ミドと分子中に活性水素を含む尿素誘導体とモノエポキ
シ化合物とを有機溶剤中で反応させて得られることを特
徴とする化合物で達成される。The above object is achieved by a compound characterized by being obtained by reacting dicyandiamide, a urea derivative containing active hydrogen in the molecule and a monoepoxy compound in an organic solvent.
【０００５】即ち、本発明はジシアンジアミド１モルに
対して、分子中に一個以上の活性水素をもつ尿素誘導体
０.１〜３.０モル、とモノエポキシ化合物０.５〜３.０
モルとを有機溶剤中で８０〜１６０℃で反応させて得ら
れることを特徴とする化合物で達成される。有機溶剤の
量は、ジシアンジアミドと尿素誘導体とモノエポキシ化
合物との合計に対して２０〜８０重量％、好ましくは２
５〜４０重量％である。That is, the present invention relates to 1 mol of dicyandiamide, and 0.1 to 3.0 mol of a urea derivative having at least one active hydrogen in the molecule, and 0.5 to 3.0 of a monoepoxy compound.
It is achieved with a compound characterized by being obtained by reacting mol with an organic solvent at 80 to 160 ° C. The amount of the organic solvent is 20 to 80% by weight, preferably 2% by weight based on the total amount of the dicyandiamide, the urea derivative and the monoepoxy compound.
It is 5 to 40% by weight.
【０００６】[0006]
【作用】上記の反応によりジシアンジアミド、並びに分
子中に１個以上の活性水素を有する尿素誘導体にモノエ
ポキシ化合物がそれぞれに付加重合する。そしてジシア
ンジアミドとモノエポキシ化合物との付加重合生成物な
らびに尿素誘導体とモノエポキシ化合物との付加重合生
成物が共存することにより硬化剤の液化が達成される。By the above reaction, the monoepoxy compound undergoes addition polymerization to dicyandiamide and the urea derivative having at least one active hydrogen in the molecule. The coexistence of the addition polymerization product of dicyandiamide and the monoepoxy compound and the addition polymerization product of the urea derivative and the monoepoxy compound achieves liquefaction of the curing agent.
【０００７】[0007]
【実施例】本発明で用いるジシアンジアミドは融点が２
０７℃で活性水素当量が２１.０ｇ／ｅｑのものが挙げ
られている。EXAMPLE The dicyandiamide used in the present invention has a melting point of 2
Those having an active hydrogen equivalent of 21.0 g / eq at 07 ° C are listed.
【０００８】また、本発明で用いる分子中に一個以上の
活性水素分子を含む尿素誘導体は、尿素、チオ尿素、エ
チレンチオ尿素、モノメチロール尿素、ジメチロール尿
素、２メチロール尿素−２メチルエーテルや２メチロー
ル尿素−２ブチルエーテルなどのアルキル化メチロール
尿素、３フェニル１１−ジメチル尿素、３フェニルメト
キシ１−モノエチル尿素などのフェニル基をもつアルキ
ル化尿素などがある。配合量はジシアンジアミド１モル
に対して０.１〜３.０が好ましい。一個以上の活性水素
をもつ尿素誘導体が０.１モルより少ないか、３.０モル
より多くなると未反応物などの析出が見られ、常温で均
一な液状硬化剤が得られない。The urea derivative containing one or more active hydrogen molecules in the molecule used in the present invention is urea, thiourea, ethylenethiourea, monomethylol urea, dimethylol urea, 2 methylol urea-2 methyl ether or 2 methylol urea. -Alkylated methylol urea such as -2 butyl ether, 3 phenyl 11-dimethyl urea, and alkylated urea having a phenyl group such as 3 phenylmethoxy 1-monoethyl urea. The compounding amount is preferably 0.1 to 3.0 with respect to 1 mol of dicyandiamide. When the amount of the urea derivative having one or more active hydrogen is less than 0.1 mol or more than 3.0 mol, precipitation of unreacted substances and the like is observed and a uniform liquid curing agent cannot be obtained at room temperature.
【０００９】本発明に用いるモノエポキシ化合物は、ア
リルグリシジルエーテル、ブチルグリシジルエーテル、
フェニルグリシジルエーテル、オクチレンオキサイド、
ドデセンオキサイド、オレフィンオキサイド（好ましく
はＣ16〜Ｃ18のオレフィンオキサイド）、スチレンオキ
サイド、Ｐ−ブチルフェノールグリシジルエーテル、ク
レジルグリシジルエーテル、グリシジルメタクリレー
ト、シクロヘキセンビニルモノオキサイドなどである。
配合量は用いるジシアンジアミドならびに分子中に一個
以上の活性水素分子をもつ尿素誘導体それぞれ１モルに
対して０.５〜３．０モルが好ましい。モノエポキシ化
合物が０．５モルより少ない未反応物などの析出が見ら
れ、常温で均一な液状硬化剤が得られない。一方、３.
０モルより多いと、エポキシ樹脂硬化剤として必須な残
存する活性水素が減少するため、最終のエポキシ樹脂硬
化物の物性が低下し、正常な硬化剤の役目を果たさな
い。The monoepoxy compound used in the present invention includes allyl glycidyl ether, butyl glycidyl ether,
Phenyl glycidyl ether, octylene oxide,
Dodecene oxide, olefin oxide (preferably C 16 -C 18 olefin oxide), styrene oxide, P-butylphenol glycidyl ether, cresyl glycidyl ether, glycidyl methacrylate, cyclohexene vinyl monooxide and the like.
The compounding amount is preferably 0.5 to 3.0 mol per 1 mol of each of dicyandiamide used and a urea derivative having one or more active hydrogen molecules in the molecule. Precipitation of unreacted substances etc. with less than 0.5 mol of the monoepoxy compound is observed, and a uniform liquid curing agent cannot be obtained at room temperature. Meanwhile, 3.
When it is more than 0 mol, the residual active hydrogen, which is essential as an epoxy resin curing agent, decreases, so that the physical properties of the final epoxy resin cured product deteriorate, and it does not serve as a normal curing agent.
【００１０】本発明に用いる有機溶剤は、硬化剤をソル
ダレジストインクに適用しスクリーン印刷で塗布するこ
とを考慮すれば、常温での揮発性の小さな沸点が１０ビ
トール、シクロヘキサノール、ｎ−プロピルアセテー
ト、ｎ−ブチルアセテート、ｉ−ブチルアセテート、ア
ミルアセテート、メチルアミルアセテート、エチルラク
テート、ブチルラクテート、メチルオキシトールアセテ
ート、ブチルオキシトールアセテート、メチルジオキシ
トール、ブチルジオキシトール、メチル−ｎ−プロピル
ケトン、メチル−ｉ−ブチルケトン、シクロヘキサノ
ン、イソフォロン、ジアセテートアルコール、ニトロメ
タン、ニトロエタン、エチレングリコールモノブチルエ
ーテル、エチレングリコールモノエチルエーテル、エチ
レングリコールモノメチルエーテル、酢酸エチレングリ
コールモノエチルエーテルなどがある。またソルダレジ
ストインク以外の用途に使用する場合には、アセトン、
メチルエチルケトンなどの低沸点溶剤も用いられる。有
機溶剤の配合割合はジシアンジアミドと尿素誘導体とモ
ノエポキシ化合物との合計に対して２０〜８０重量％が
液体化及び取扱い上好ましい。Considering that the curing agent is applied to the solder resist ink and screen-printed, the organic solvent used in the present invention has a small boiling point of 10 volatile at room temperature, cyclohexanol, and n-propyl acetate. , N-butyl acetate, i-butyl acetate, amyl acetate, methyl amyl acetate, ethyl lactate, butyl lactate, methyl oxitol acetate, butyl oxytol acetate, methyl dioxitol, butyl dioxitol, methyl-n-propyl ketone , Methyl-i-butyl ketone, cyclohexanone, isophorone, diacetate alcohol, nitromethane, nitroethane, ethylene glycol monobutyl ether, ethylene glycol monoethyl ether, ethylene glycol monomer Ethers, and the like acetic ethylene glycol monoethyl ether. In addition, when using for applications other than solder resist ink, acetone,
A low boiling solvent such as methyl ethyl ketone may also be used. The mixing ratio of the organic solvent is preferably 20 to 80% by weight based on the total amount of the dicyandiamide, the urea derivative and the monoepoxy compound in terms of liquefaction and handling.
【００１１】本発明のエポキシ樹脂硬化用化剤は、その
使用にあたっては、硬化剤中に残存する活性水素の当量
と用いるエポキシ樹脂のエポキシ当量を考慮して、エポ
キシ樹脂に対する添加量を具体的に決めることが望まし
い。When the epoxy resin curing agent of the present invention is used, the addition amount to the epoxy resin is specifically specified in consideration of the equivalent of active hydrogen remaining in the curing agent and the epoxy equivalent of the epoxy resin used. It is desirable to decide.
【００１２】以下、本発明を具体的に実施例を挙げて説
明する。Hereinafter, the present invention will be specifically described with reference to examples.
【００１３】〈実施例１〜１２〉撹拌機、温度計、冷却
管を備えた１Ｌのセパラブルフラスコ中に、ジシアンジ
アミド、尿素誘導体、モノエポキシ化合物、有機溶剤を
全量で１００〜１５０ｇ仕込み、１２０〜１５０℃のオ
イルバス上で３０〜１２０分間加熱して、ジシアンジア
ミド並びに尿素誘導体とモノエポキシ化合物とを反応さ
せ液化させた。<Examples 1 to 12> In a 1 L separable flask equipped with a stirrer, a thermometer and a cooling tube, 100-150 g of dicyandiamide, a urea derivative, a monoepoxy compound and an organic solvent were charged in total, and 120- By heating on an oil bath at 150 ° C. for 30 to 120 minutes, the dicyandiamide and the urea derivative were reacted with the monoepoxy compound to liquefy.
【００１４】ジシアンジアミドと尿素誘導体との配合割
合、ジシアンジアミドと尿素誘導体に対するモノエポキ
シ化合物の配合割合および有機溶剤の種類を表１に示
す。Table 1 shows the mixing ratio of the dicyandiamide and the urea derivative, the mixing ratio of the monoepoxy compound to the dicyandiamide and the urea derivative, and the kind of the organic solvent.
【００１５】[0015]
【表１】 [Table 1]
【００１６】使用した尿素誘導体は、尿素ａ、チオ尿素
ｂ、モノメチロール尿素ｃ、３フェニル１メチル尿素ｄ
である。また使用したモノエポキシ化合物は、フェニル
グリシジルエーテルｅ、ブチルグリシジルエーテルｆ、
Ｐ−ブチルフェノールグリシジルエーテルｇ、一方、有
機溶剤の配合量は、原料主成分（ジシアンジアミドと分
子中に一個以上の活性水素をもつ尿素誘導体とモノエポ
キシ化合物）に対して２５〜４０重量％である。実施例
１〜１２に示した反応生成物はいずれも常温で透明な液
体であり、常温で９０日放置しても結晶等の析出は見ら
れず、極めて保存安定性が良い（表２）。The urea derivative used is urea a, thiourea b, monomethylol urea c, 3 phenyl 1-methyl urea d.
Is. The monoepoxy compound used was phenyl glycidyl ether e, butyl glycidyl ether f,
P-butylphenol glycidyl ether g, on the other hand, the compounding amount of the organic solvent is 25 to 40% by weight based on the raw material main components (dicyandiamide, urea derivative having one or more active hydrogens in the molecule, and monoepoxy compound). The reaction products shown in Examples 1 to 12 are all transparent liquids at room temperature, and no precipitation of crystals or the like is observed even after standing at room temperature for 90 days, and the storage stability is extremely good (Table 2).
【００１７】[0017]
【表２】 [Table 2]
【００１８】実施例１〜１２で得られた反応生成物を用
いてソルダレジストインクを作り、エポキシ用硬化剤と
しての特性評価をした。ソルダレジストインクの組成は
次の通りである。エポキシ樹脂（油化シェルエポキシ社
製：エピコート１５２）１００重量部、石英微粉末（龍
森製：５Ｘ）２０重量部、石英超微粉末（日本アエロジ
ル社製：ＲＹ−２００）３重量部、シリコーンオイル
（トーレシリコーン社製：ＳＨ−２０３）３重量部、フ
タロシアニングリーン２重量部、ブチルセルソルブアセ
テート２〜５重量部を混練し、これを基本組成として、
さらに実施例１〜１２で得られたエポキシ用硬化剤を適
量添加して１２種類のソルダレジストインクを得た。Solder resist inks were prepared using the reaction products obtained in Examples 1 to 12, and their properties as epoxy curing agents were evaluated. The composition of the solder resist ink is as follows. Epoxy resin (Okaka Shell Epoxy Co., Ltd .: Epicoat 152) 100 parts by weight, quartz fine powder (Tatsumori: 5X) 20 parts by weight, quartz ultrafine powder (Nippon Aerosil Co., Ltd .: RY-200) 3 parts by weight, silicone 3 parts by weight of oil (SH-203 manufactured by Toray Silicone Co., Ltd.), 2 parts by weight of phthalocyanine green, and 2 to 5 parts by weight of butyl cellosolve acetate were kneaded, and this was used as a basic composition.
Further, an appropriate amount of the epoxy curing agent obtained in Examples 1 to 12 was added to obtain 12 types of solder resist ink.
【００１９】ガラスエポキシ銅張り積層板上にこれらの
ソルダレジストインクをスクリーン印刷法により約１０
〜１５μｍの厚みに塗布する。スクリーン版の目づまり
等の異常は何れも生じなかった。次にこれらを１４０℃
４５分間加熱し硬化させる。ソルダレジスト硬化膜の特
性を評価し表３に示した。About 10 of these solder resist inks were screen-printed on a glass epoxy copper-clad laminate.
Apply to a thickness of ~ 15 μm. No abnormalities such as clogging of the screen plate occurred. Next, these are 140 ℃
Heat for 45 minutes to cure. The characteristics of the solder resist cured film were evaluated and are shown in Table 3.
【００２０】[0020]
【表３】 [Table 3]
【００２１】なお、耐めっき性評価に用いた化学銅めっ
き液はｐＨ１２.３、７０℃でその主成分は、次の通り
である。The chemical copper plating solution used for the plating resistance evaluation has a pH of 12.3 and 70 ° C., and its main components are as follows.
【００２２】ＣｕＳＯ4・５Ｈ2Ｏ：１２ｇ／ＥＤＴＡ・
２Ｎａ：４２ｇ／ＮａＯＨ：１２ｇ／ポリエチレングリ
コールステアリルアミン：０.１ｇ／αα’−ジピリジ
ル：５ｍＬ／蒸留水：全量を１ｌとする量。CuSO 4 .5H 2 O: 12 g / EDTA
2Na: 42 g / NaOH: 12 g / polyethylene glycol stearylamine: 0.1 g / αα′-dipyridyl: 5 mL / distilled water: an amount to make the total amount 1 l.
【００２３】実施例１〜１２の硬化剤を用いてソルダレ
ジスト硬化膜は、いずれも絶縁抵抗、銅箔との密着性、
耐めっき性、半田耐熱性が良好であった。また、めっき
液に対するレジスト負荷量２ｄｍ／Ｌでの硬化剤成分の
溶出による銅めっき膜の物性（伸び率、引っ張り強度）
の低下は見られず良好であった。The solder resist cured films prepared by using the curing agents of Examples 1 to 12 all had insulation resistance, adhesion to copper foil,
The plating resistance and solder heat resistance were good. Also, the physical properties of the copper plating film (elongation rate, tensile strength) due to the elution of the curing agent component at a resist load of 2 dm / L with respect to the plating solution.
Was not observed and was good.
【００２４】〈比較例１〜８〉比較のため、尿素誘導体
およびジシアンジアミドを含まない場合（比較例１，
２）、ならびにジシアンジアミドとモノエポキシ化合物
との組み合わせ、尿素誘導体とモノエポキシ化合物との
組み合わせ、およびジシアンジアミドと尿素誘導体とモ
ノエポキシ化合物との組み合わせにおいて、前二者のモ
ル比が１／０.０３、１／４の場合、前２者とモノエポ
キシ化合物との比が１／０.４の場合について、実施例
１〜１４に示したものと同じ手法を用いて、ジシアンジ
アミドおよび尿素誘導体の液化を試みた（比較例３〜
８）。１２０〜１６０℃の反応温度では完全に溶解する
ものも一部あるが、常温に戻すと表４に示すように多量
の粒子（結晶）が析出し、均一な液状硬化剤が得られな
かった。<Comparative Examples 1 to 8> For comparison, when the urea derivative and dicyandiamide were not included (Comparative Example 1,
2), and in the combination of dicyandiamide and monoepoxy compound, the combination of urea derivative and monoepoxy compound, and the combination of dicyandiamide, urea derivative and monoepoxy compound, the molar ratio of the former two is 1 / 0.03, In the case of 1/4, in the case of the ratio of the former two and the monoepoxy compound being 1 / 0.4, an attempt was made to liquefy the dicyandiamide and the urea derivative by using the same method as shown in Examples 1 to 14. (Comparative Example 3 ~
8). Some of them were completely dissolved at a reaction temperature of 120 to 160 ° C., but when returned to room temperature, a large amount of particles (crystals) were precipitated as shown in Table 4, and a uniform liquid curing agent could not be obtained.
【００２５】[0025]
【表４】 [Table 4]
【００２６】[0026]
【発明の効果】本発明によれば、固体粉末状のジシアン
ジアミドと尿素誘導体を常温状態で液状化することが可
能となり、これをエポキシ樹脂系ソルダレジストの硬化
剤に用いると、スクリーン印刷による塗布工程でのスク
リーン版の目づまりが起こらず、粉末状の硬化剤が存在
しない均一な塗膜が形成でき、さらに硬化膜の特性も優
れており、塗料等の被覆用のエポキシ樹脂用硬化剤に有
用である。According to the present invention, it becomes possible to liquefy solid powdery dicyandiamide and a urea derivative at room temperature, and when this is used as a curing agent for an epoxy resin solder resist, a coating process by screen printing can be performed. It does not cause clogging of the screen plate in, and can form a uniform coating film that does not have a powdery curing agent.It also has excellent cured film properties, making it useful as a curing agent for epoxy resins for coating paints, etc. is there.
───────────────────────────────────────────────────── フロントページの続き (72)発明者 菊地 廣 神奈川県横浜市戸塚区吉田町292番地株式 会社日立製作所生産技術研究所内 (72)発明者 矢野 玲子 神奈川県横浜市戸塚区吉田町292番地株式 会社日立製作所生産技術研究所内 (72)発明者 岡 齊 神奈川県横浜市戸塚区吉田町292番地株式 会社日立製作所生産技術研究所内 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Hiro Kikuchi 292 Yoshida-cho, Totsuka-ku, Yokohama-shi, Kanagawa Stock Production Institute, Institute of Industrial Science, Hitachi, Ltd. (72) Reiko Yano 292 Yoshida-cho, Totsuka-ku, Yokohama, Kanagawa Production Engineering Laboratory, Hitachi, Ltd. (72) Inventor, Osamu Oka, 292 Yoshida-cho, Totsuka-ku, Yokohama, Kanagawa Prefecture, Ltd.
Claims (1)
む尿素誘導体とモノエポキシ化合物とを反応することに
より得られる化合物および有機溶剤からなることを特徴
とするエポキシ樹脂用硬化剤。1. A curing agent for an epoxy resin, comprising a compound obtained by reacting dicyandiamide with a urea derivative containing active hydrogen in the molecule and a monoepoxy compound, and an organic solvent.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP24548991A JPH0578454A (en) | 1991-09-25 | 1991-09-25 | Curing agent for epoxy resin |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP24548991A JPH0578454A (en) | 1991-09-25 | 1991-09-25 | Curing agent for epoxy resin |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0578454A true JPH0578454A (en) | 1993-03-30 |
Family
ID=17134423
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP24548991A Pending JPH0578454A (en) | 1991-09-25 | 1991-09-25 | Curing agent for epoxy resin |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0578454A (en) |
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-
1991
- 1991-09-25 JP JP24548991A patent/JPH0578454A/en active Pending
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|---|---|---|---|---|
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