JPH0579939U - Substrate cleaning tool - Google Patents

Abstract

(57) [Summary] [Object] To provide a substrate cleaning tool capable of cleaning and removing the coating liquid adhering to not only the end face of the substrate but also the back face near the end face. [Structure] A large-diameter brim portion 25 is integrally provided on a rotating body 24, and one surface of the brim portion 25 is provided with a sliding contact portion 2 for the back surface of the substrate.
6 is provided, and the sliding contact portion 2 for the back surface of the substrate of the rotating body 24 is provided.
6, a substrate end surface sliding contact portion 27 is provided on the outer surface, a substrate back surface sliding contact portion 26 is provided on the back surface near the end surface of the rectangular substrate W, and a substrate end surface sliding contact portion is provided on the end surface of the rectangular substrate W. 27 are brought into sliding contact with each other, and the coating liquid adhering to the end face of the rectangular substrate W and the back face close thereto is washed and removed all at once.

Description

[Detailed description of the device]

[0001]

[Industrial applications]

 The present invention is applicable to a rectangular substrate such as a glass substrate for a photomask, a glass substrate for a liquid crystal display device, a circular substrate such as an optical disc substrate, or a substantially circular substrate such as a semiconductor wafer having an orientation flat. On the other hand, the present invention relates to a substrate cleaning tool used for cleaning and removing a coating liquid such as a photoresist, a polyimide resin, or a color filter material attached to the end surface side.

[0002]

[Prior Art]

 When applying various coating liquids such as photoresist, polyimide resin, and color filter material on the surface of the substrate as described above while rotating the substrate, the excess coating liquid is shaken off from the peripheral edge by the rotation of the substrate. However, there was a problem that the coating solution remained in the state of being attached to the end surface.

Therefore, it has been conventionally considered to wash and remove the coating liquid adhering to the end surface of the substrate.

For example, in Japanese Patent Publication No. 58-19350, a solvent is applied to a back surface of a rectangular substrate from below an edge of the rectangular substrate while rotating the rectangular substrate after spin coating at a low speed. When ejected, it flows to the edge side of the rectangular substrate due to centrifugal force, and due to the action of wrapping around the edge surface due to surface tension, the device configured to dissolve and remove the excess coating liquid adhering to the back surface and edge surface of the rectangular substrate is described. Has been done.

Further, Japanese Patent Publication No. 29474/1993 discloses a first conveyance path for conveying a rectangular substrate in a so-called upright state, that is, in a state in which the surface direction of the rectangular substrate is vertical. And a second transport path that is orthogonal to the transport direction of the first transport path and that transports in a direction parallel to the surface direction of the rectangular substrate, and is arranged so as to be along both sides of each of the transport paths. An apparatus configured to provide a cylindrical brush for cleaning the end surface of the substrate, and to clean the end surfaces of the four sides of the rectangular substrate as it is transported, and to clean both the front and back surfaces of the substrate by sandwiching the front and back surfaces of the substrate with a brush. Is listed.

[0006]

[Problems to be solved by the device]

 However, in the former device disclosed in Japanese Patent Publication No. 58-19350, there is a phenomenon that the solvent also wraps around the substrate surface, and the film of the coating solution swells with the solvent near the edge of the substrate surface, The film quality may be impaired. When applied to a rectangular substrate, the amount of solvent reaching the corners of the rectangular substrate is smaller than that at the other edge, especially when the rectangular substrate has a large aspect ratio. However, there is a drawback that it is difficult to get around to the end face and the excess coating liquid cannot be sufficiently dissolved and removed at the corner portion.

Further, the latter device described in Japanese Patent Publication No. 3-29474 is a device used for cleaning the substrate as a finishing step of the polishing process, and therefore the substrate is brushed to clean the entire surface of the substrate. Since it is configured so as to be sandwiched from both sides, it was difficult to remove the excess coating liquid attached to the back surface without sliding the substrate surface like a substrate having a thin film of coating liquid formed on the surface. ..

The present invention has been made in view of the above circumstances, and it is possible to clean and remove the coating liquid adhering not only to the end face of the rectangular substrate but also to the rear face near the edge close to the end face. It is an object of the present invention to provide a substrate cleaning tool that can perform all at once.

[0009]

[Means for Solving the Problems]

 In order to achieve the above-mentioned object, the present invention forms a thin film of a coating liquid on the surface of a substrate and supports the edge of the substrate by rotating and slidingly contacting the edge of the substrate. In the substrate cleaning tool for cleaning, the large-diameter brim portion is integrally rotatable on the rotating body, the substrate back surface sliding contact portion is provided on one surface of the brim portion, and the rotating body substrate back surface sliding contact portion is provided. It is a substrate cleaning tool configured by providing a sliding contact portion for a substrate end face on a near outer surface.

[0010]

[Action]

 According to the configuration of the substrate cleaning tool of the present invention, the sliding contact portion for the substrate end surface is slidably contacted with the end surface of the substrate, and the sliding contact portion for the back surface of the substrate is slidably contacted with the back surface near the edge close to the end surface. By rotating the rotating body in this state, the coating liquid attached to each of the end surface and the back surface of the substrate can be washed and removed all at once.

[0011]

【Example】

 Next, an embodiment of the present invention will be described in detail with reference to the drawings.

FIG. 1 is a partially cutaway side view showing a rectangular substrate cleaning apparatus using a substrate cleaning tool according to a first embodiment of the present invention, and FIG. 2 is a perspective view of a main part. In these drawings, Reference numeral 1 denotes a substrate holding means that can move up and down. It holds a rectangular substrate W in a horizontal posture and holds it by vacuum suction, and a first substrate mounting plate 1a in the vertical direction. The first electric motor 1b is driven and rotated around the axis P1.

A support base 2 provided on the lower side of the rectangular substrate W is movably movably in a direction toward and away from the first axis P1 via a pair of guides 3 and 3 and an air cylinder 4. A table 5 is provided, and along the outer peripheral end surface of the rectangular substrate W, a movable table 5 is provided with one guide 6 and a belt 8 driven by a second electric motor 7 capable of rotating in the forward and reverse directions. A support base 9 is provided so as to be movable linearly in the direction.

As shown in the cross-sectional view of the main part of FIG. 3, a hollow cylindrical support 10 is erected on the support base 9, and the support 10 has a first support member 11 a on which a second vertical support member 11 a extends. The second support member 11b is integrally rotatably fitted around the axis P2 and is integrally connected to the upper end of the first support member 11a so as to project in the horizontal direction, and the tip end of the second support member 11b. On the side, a drive shaft 13 of the substrate cleaning tool 12 is provided so as to be rotatable around a vertical third axis P3 that is deviated from the second axis P2.

A rotary shaft 14 is rotatably provided in the first support member 11a, and transmission pulleys 15a and 15b are integrally attached to the upper and lower sides of the rotation shaft 14, respectively. A first transmission belt via first tension pulleys 19 and 19 for applying tension across a main pulley 17 driven by a third electric motor 16 provided on the table 5 and a driven pulley 18. 20 is wound, and on the other hand, the second transmission pulley 15a and the transmission pulley 21 attached to the drive shaft 13 so as to be integrally rotatable are provided with a second tension pulley 22 for applying tension to the second transmission pulley 15a. The transmission belt 23 is wound around and configured to drive and rotate the substrate cleaning tool 12 by the power transmission of the second electric motor 16.

As shown in FIG. 3, the substrate cleaning tool 12 is provided with a large-diameter flange portion 25 rotatably integrally attached to a rotating body 24 attached to a drive shaft 13 so as to rotate integrally. The sliding contact portion 26 for the back surface of the substrate is provided on the upper surface, and the sliding contact portion 27 for the end surface of the substrate is provided on the outer surface of the rotating body 24 at a position close to the sliding contact portion 26 for the back surface of the substrate of the brim portion 25. .. Solvent-resistant felts are attached to the surfaces of the board back surface sliding contact portion 26 and the board end surface sliding contact portion 27, respectively. As shown in the plan view of the main part, the slide contact portion 27 for the substrate end surface is slid on the end surface of the square substrate W, and the slide contact portion 26 for the back surface of the substrate is slid on the rear surface near the end edge of the square substrate W. By making contact with each other, the coating liquid attached to the end surface of the rectangular substrate W and the back surface near the end surface can be cleaned and removed at once.

An arm member 28 is integrally attached to the lower end side of the first support member 11 a, as shown in the enlarged cross-sectional views of the main parts of FIG. 3 and FIG. Support pins 29 are attached, while second support pins 31 are attached to two positions of a support bracket 30 that is integrally attached to the support base 9, and the first support pin 29 and the second support pin 31 are attached. , 31 respectively, a tension spring 32 as an urging means is attached, and the substrate cleaning tool 12 is linearly moved along the end surface of the rectangular substrate W while driving and rotating the substrate cleaning tool 12 around the third rotation axis P3. When the substrate end surface sliding contact portion 27 is not slidingly contacting the end surface of the rectangular substrate W when moving, as shown in the schematic plan view of FIG. While the second support member 11b is in the posture orthogonal to the moving direction, as the substrate end surface sliding contact portion 27 slides in contact with the end surface of the rectangular substrate W, as shown by a two-dot chain line in the schematic plan view of FIG. In addition, the rotation of the first supporting member 11a causes the second supporting member 11b to swing rearward in the moving direction of the substrate cleaning tool 12, so that the sliding contact portion 27 for the substrate end face is pulled and the biasing force of one pulling ring 32 is applied. While pressing the end face of the rectangular substrate W by the sliding contact, the substrate end face sliding contact portion 27 slides on the end face of the rectangular substrate W behind the swing axis P2 in the moving direction of the second support member 11b. A mechanism is imitated. When moving in the reverse direction, the second support member 11b makes sliding contact while swinging in the direction opposite to that shown in the figure.

In the figure, reference numeral 33 denotes an adhering matter recovery container provided below the moving area of the substrate cleaning tool 12, and reference numeral 34 denotes a cleaning container for cleaning the substrate cleaning tool 12 and allowing a new solvent to soak into the cleaning container. Shows.

With the above configuration, after the square substrate W is loaded and held in the substrate holding means 1 in a predetermined posture, the substrate cleaning tool 12 is placed along one end face of the square substrate W and the substrate cleaning tool 12 is rotated (rotated) while linearly reciprocating, and the sliding contact portion 27 for the substrate end surface is slidably contacted with the end surface of the rectangular substrate W, and the sliding contact portion 26 for the back surface of the substrate is slidably contacted with the rear surface near the edge. Then, the adhered substances on one end face of the rectangular substrate W and the back face close to the one end face are cleaned and removed.

After that, the substrate holding means 1 is rotated by 90 °, and the air cylinder 4 is operated to adjust the relative distance between the substrate cleaning tool 12 and the end surface of the rectangular substrate W. The deposits on the other end face of W and the back face close to it are washed away. By repeating these operations, the adhered substances on the end faces of all four sides of the rectangular substrate W and the back face close thereto are cleaned and removed.

FIG. 7 is a partially cutaway side view showing a second embodiment of the substrate cleaning tool according to the present invention, in which a recess 35 is formed on the upper surface of the collar 25, and the recess 35 has a lower end on the small diameter side. The slide contact portion 27 for the substrate end surface is provided on the outer surface of the rotating body 24, while the slide contact portion 26 for the substrate back surface is provided on the upper end surface outward from the large-diameter side end portion of the recess 35 to provide a substrate cleaning tool. It is configured . Felts are attached to the respective surfaces of the substrate back surface sliding contact portion 26 and the substrate end surface sliding contact portion 27 in the same manner as in the first embodiment described above, and the substrate end surface sliding contact is applied to the end surface of the rectangular substrate W. The coating liquid adhered to the end surface of the rectangular substrate W and the back surface close to the end surface of the rectangular substrate W are washed all at once by sliding the portion 27 and the back surface of the rectangular substrate W on the back surface on the end surface side. It can be removed.

FIG. 8 is a partially cutaway side view showing a third embodiment of the substrate cleaning tool of the present invention. The difference from the first embodiment is as follows. That is, in order to form each of the substrate back surface sliding contact portion 26 and the substrate end surface sliding contact portion 27, hair 36 made of nylon, mohair or the like is planted instead of felt. The other structure is the same as that of the first embodiment, and the description is omitted by giving the same drawing numbers.

In place of the planting construction of the felt of the first and second embodiments and the bristles 36 of the third embodiment, for example, a porous sponge or a cloth wrapped cloth may be used.

In the above-described embodiment, the substrate cleaning tool 12 is configured to be movable in the direction approaching the first axis P1 that rotates the rectangular substrate W, and the rectangular substrate W of a different size or the rectangular prism Although it is configured so that it can cope well with the substrate W or even when the holding position by the substrate holding means 1 is displaced, for example, a square square substrate W of a constant size is always targeted. In such a case, the substrate cleaning tool 12 may not be moved in the direction approaching the first axis P1 for rotating the rectangular substrate W.

In addition, in the above-described embodiment, the rectangular substrate cleaning device to which the substrate cleaning tool according to the present invention is assembled is configured separately from the spin coating device for coating liquid such as photoresist, and is rotated first. While cleaning the rectangular substrate that has finished the coating process, the next rectangular substrate can be spin-coated to improve the throughput. Alternatively, the substrate holding means of the spin coater may be combined with the substrate holding means 1 of the rectangular substrate cleaning apparatus.

Further, in the above-described embodiment, as the apparatus using the substrate cleaning tool according to the present invention, the substrate cleaning apparatus configured to move the substrate cleaning tool straight along the edge of the rectangular substrate is used. However, the substrate cleaning tool according to the present invention may be used in a substrate cleaning apparatus having a different structure. For example, a substrate cleaning tool according to the present invention is rotatably attached to the tip of an arm that supports a rectangular substrate so that it can rotate horizontally and swings in a horizontal plane about an axis parallel to the rotation axis of the substrate. As the substrate is rotated, the substrate cleaning tool traces the edge of the substrate so that it may be used in a substrate cleaning device in which the substrate end face and the substrate back face near the substrate edge are in sliding contact. The substrate cleaning device according to the present invention may be used in a substrate cleaning device that cleans the edge of a substrate by rotating and slidingly contacting the edge of a substrate on which a thin film of liquid is formed and supported horizontally. The device using the tool is the same as the substrate cleaning device of the above-described embodiment as long as a thin film of the coating solution is formed on the surface of the substrate to horizontally support the substrate and the substrate cleaning tool slides on the substrate edge while rotating. Not limited.

The present invention can be applied not only to the rectangular rectangular substrate W but also to a substrate cleaning tool of a rectangular substrate cleaning device for cleaning a square rectangular substrate.

Further, the substrate cleaning tool according to the present invention is not limited to the rectangular substrate as in the above-described embodiment, but is a circular substrate such as an optical disc substrate, or a substantially circular substrate such as a semiconductor wafer having an orientation flat. It can also be used for cleaning the substrate end face and the back face of the substrate from the edge.

[0029]

[Effect of the device]

 As described above, according to the substrate cleaning tool of the present invention, the coating liquid adhering to the end face of the substrate and the back face near the edge can be cleaned and removed all at once. You can do it and you can improve your productivity.

[Submission date] May 11, 1992

[Procedure Amendment 1]

[Document name to be amended] Statement

[Correction target item name] 0008

[Correction method] Change

[Correction content]

The present invention has been made in view of such circumstances, and the cleaning and removal of the coating liquid adhering not only to the end surface of the substrate but also to the rear surface near the edge close to the end surface is performed. It is an object of the present invention to provide a substrate cleaning tool that can be used for other purposes.

[Brief description of drawings]

FIG. 1 is a partially cutaway side view showing a rectangular substrate cleaning apparatus using a substrate cleaning tool according to a first embodiment of the present invention.

FIG. 2 is a perspective view of a main part.

FIG. 3 is a sectional view of a main part.

FIG. 4 is a plan view of a main part.

FIG. 5 is an enlarged cross-sectional view of a main part.

FIG. 6 is a schematic plan view of a main part.

FIG. 7 is a partially cutaway side view of the second embodiment.

FIG. 8 is a partially cutaway side view of the third embodiment.

[Explanation of symbols]

 24 ... Rotating body 25 ... Collar part 26 ... Substrate back surface sliding contact portion 27 ... Substrate end surface sliding contact portion W ... Substrate

Claims (1)

[Scope of utility model registration request] 1. A substrate cleaning tool for cleaning an edge of a substrate, which is formed by coating a thin film of a coating solution on a surface of the substrate and slidingly contacts the edge of the substrate supported horizontally while rotating.
A large-diameter brim portion is provided on the rotating body so as to be integrally rotatable, a substrate back surface sliding contact portion is provided on one surface of the brim portion, and a substrate is provided on an outer surface of the rotating body near the substrate back surface sliding contact portion. A substrate cleaning tool provided with a sliding contact portion for an end surface.