JPH0579970U - Structure of hybrid integrated circuit - Google Patents

Structure of hybrid integrated circuit

Info

Publication number
JPH0579970U
JPH0579970U JP2704892U JP2704892U JPH0579970U JP H0579970 U JPH0579970 U JP H0579970U JP 2704892 U JP2704892 U JP 2704892U JP 2704892 U JP2704892 U JP 2704892U JP H0579970 U JPH0579970 U JP H0579970U
Authority
JP
Japan
Prior art keywords
circuit board
case
hybrid integrated
integrated circuit
present
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2704892U
Other languages
Japanese (ja)
Inventor
正彦 我妻
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nippon Chemi Con Corp
Original Assignee
Nippon Chemi Con Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Chemi Con Corp filed Critical Nippon Chemi Con Corp
Priority to JP2704892U priority Critical patent/JPH0579970U/en
Publication of JPH0579970U publication Critical patent/JPH0579970U/en
Pending legal-status Critical Current

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  • Structure Of Printed Boards (AREA)
  • Mounting Of Printed Circuit Boards And The Like (AREA)

Abstract

(57)【要約】 【目的】 回路基板をケースに逆向きに配置してしまう
こと無く収納でき、しかも、不要な電極にはリード端子
が取り付けられないようにして無駄にリード端子が使用
しないようにした混成集積回路の構造を提供する。 【構成】 回路基板11の対向する側面の各々に切り欠
き8を非対称に設け、ケース10の側壁に前記各切り欠き
8に嵌まり込む凸部9を設け、前記ケース10の前記各切
り欠き8に前記凸部9が嵌まり込むように前記回路基板
11を配置して混成集積回路を形成した。
(57) [Abstract] [Purpose] The circuit board can be stored without arranging it in the case in the opposite direction, and the lead terminals are not attached to unnecessary electrodes so that the lead terminals are not uselessly used. And a hybrid integrated circuit structure. [Structure] Notches 8 are provided asymmetrically on each of opposite side surfaces of a circuit board 11, and projections 9 that fit into the notches 8 are provided on side walls of a case 10, and the notches 8 of the case 10 are provided. The circuit board so that the convex portion 9 fits in the
11 were placed to form a hybrid integrated circuit.

Description

【考案の詳細な説明】[Detailed description of the device]

【0001】[0001]

【産業上の利用分野】[Industrial applications]

この考案は、混成集積回路の構造に関するものである。 This invention relates to the structure of a hybrid integrated circuit.

【0002】[0002]

【従来の技術】[Prior Art]

図4は従来の混成集積回路の構造を示す横断面図で、1は、表面実装部品5を搭 載する回路基板を示し、この回路基板1の斜視図を図3の(a)に示す。回路基 板1の側面には複数の電極2が形成されており、各電極2には各々リード端子3 の先端の接続部4が電極2を挟んだ状態で半田により接続されている。こうして リード端子3の取り付けられた回路基板1は樹脂性のケース6に収容されて樹脂 等の封止剤7により被覆されている。ケース6の斜視図を図3の(b)に示す。 FIG. 4 is a transverse cross-sectional view showing the structure of a conventional hybrid integrated circuit. Reference numeral 1 shows a circuit board on which surface mount components 5 are mounted, and a perspective view of the circuit board 1 is shown in FIG. A plurality of electrodes 2 are formed on the side surface of the circuit board 1, and a connecting portion 4 at the tip of a lead terminal 3 is connected to each electrode 2 by solder while sandwiching the electrode 2. In this way, the circuit board 1 to which the lead terminals 3 are attached is housed in a resin case 6 and covered with a sealant 7 such as resin. A perspective view of the case 6 is shown in FIG.

【0003】[0003]

【考案が解決しようとする課題】[Problems to be solved by the device]

しかしながら従来の混成集積回路の構造では、回路基板をケースに収納すると きに逆向きに配置してしまうことがあり、この場合にケースの表面に部品表示の 捺印がしてあると、組み立てた混成集積回路が不良品となってしまったり、また 、不要な電極にもリード端子が取り付けられる構造であるため、不要なリード端 子を無駄に使用してしまう等、改善が望まれていた。 However, in the structure of the conventional hybrid integrated circuit, the circuit board may be placed in the opposite direction when it is housed in the case. In this case, if the marking of parts is printed on the surface of the case, the assembled hybrid Improvements have been desired, such as the integrated circuit becoming a defective product, and the structure in which lead terminals are attached to unnecessary electrodes, and unnecessary lead terminals are wasted.

【0004】 そこで、この考案は回路基板をケースに逆向きに配置してしまうこと無く収納 でき、しかも、不要な電極にはリード端子が取り付けられないようにして無駄に リード端子が使用しないようにした混成集積回路の構造を提供することを目的と する。Therefore, the present invention can store the circuit board without arranging the circuit board in the reverse direction in the case, and prevent unnecessary use of the lead terminals by preventing the lead terminals from being attached to unnecessary electrodes. It is an object of the present invention to provide a structure of such a hybrid integrated circuit.

【0005】[0005]

【課題を解決するための手段】[Means for Solving the Problems]

本考案では、回路基板の対向する側面の各々に切り欠きを非対称に設け、ケー スの側壁に前記各切り欠きに嵌まり込む凸部を設け、前記ケースの前記各切り欠 きに前記凸部が嵌まり込むように前記回路基板を配置して形成したことを特徴と する。 In the present invention, the notches are provided asymmetrically on each of the opposite side surfaces of the circuit board, and the side wall of the case is provided with a protrusion that fits into each of the notches, and the notch of each of the cases is provided with the protrusion. It is characterized in that the circuit board is formed so as to fit in.

【0006】[0006]

【作用】[Action]

本考案では、回路基板をケースに逆向きに配置してしまうことが無く、しかも 、不要な電極が無いので無駄にリード端子が取り付けられることはない。 In the present invention, the circuit board is not arranged in the case in the opposite direction, and since there are no unnecessary electrodes, the lead terminals are not attached unnecessarily.

【0007】[0007]

【実施例】【Example】

以下本考案の実施例を図面に従って説明する。図1(a)は、本考案の回路基 板の斜視図、図1(b)は、本考案のケースの斜視図である。 Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 (a) is a perspective view of a circuit board of the present invention, and FIG. 1 (b) is a perspective view of a case of the present invention.

【0008】 図1の(a)、(b)において、回路基板11には電極12が対向する側面に沿っ て略等間隔で複数配置されているが、回路基板11の対向する側面の各々には非対 称に切り欠き8が形成されており、使用されない不要な電極は存在しないように 形成されている。10は回路基板11を収納する樹脂ケースで、樹脂ケース10の側壁 には各切り欠き8に嵌まり込む凸部9が形成されている。以下、図2の横断面図 に示すように、回路基板11には表面実装部品5が搭載され、また、電極12にはリ ード端子3が取り付けられる。こうして、表面実装部品5が搭載され、電極12に リード端子3が取り付けられた回路基板11は、樹脂ケース10の凸部9に切り欠き 8を嵌合して樹脂ケース10内に配置され、樹脂等の封止剤7により被覆されて混 成集積回路が構成される。In FIGS. 1A and 1B, a plurality of electrodes 12 are arranged on the circuit board 11 along the opposite side surfaces at substantially equal intervals, but on each of the opposite side surfaces of the circuit board 11. Has a notch 8 formed asymmetrically, so that there is no unnecessary electrode that is not used. Reference numeral 10 is a resin case for housing the circuit board 11. The side wall of the resin case 10 is formed with a projection 9 that fits into each notch 8. The surface mount component 5 is mounted on the circuit board 11 and the lead terminal 3 is mounted on the electrode 12, as shown in the transverse sectional view of FIG. In this way, the circuit board 11 on which the surface mount component 5 is mounted and the lead terminals 3 are attached to the electrodes 12 is arranged in the resin case 10 by fitting the notches 8 into the protrusions 9 of the resin case 10. A hybrid integrated circuit is formed by being covered with a sealing agent 7 such as.

【0009】[0009]

【考案の効果】[Effect of the device]

以上説明したように、本考案の混成集積回路の構造によれば、回路基板をケー スに逆向きに配置してしまうこと無く収納でき、しかも、不要な電極が無いので 、無駄にリード端子が使用されることがなく経済的であり、混成集積回路の組み 立てに伴う不良が解消される等実用的効果は大きいものである。 As described above, according to the structure of the hybrid integrated circuit of the present invention, the circuit board can be housed without arranging the circuit board in the opposite direction, and since there are no unnecessary electrodes, the lead terminals are useless. It is economical because it is not used, and it has great practical effects, such as elimination of defects associated with the assembly of hybrid integrated circuits.

【図面の簡単な説明】[Brief description of drawings]

【図1】本考案の一実施例を示し、図1(a)は本考案
に係わる回路基板の斜視図、図1(b)は本考案に係わ
るケースの斜視図である。
1 shows an embodiment of the present invention, FIG. 1 (a) is a perspective view of a circuit board according to the present invention, and FIG. 1 (b) is a perspective view of a case according to the present invention.

【図2】本考案の一実施例を示す混成集積回路の横断面
図である。
FIG. 2 is a cross-sectional view of a hybrid integrated circuit showing an embodiment of the present invention.

【図3】本考案の従来例を示し、図2(a)は従来の回
路基板の斜視図、図2(b)は従来のケースの斜視図で
ある。
FIG. 3 shows a conventional example of the present invention, FIG. 2 (a) is a perspective view of a conventional circuit board, and FIG. 2 (b) is a perspective view of a conventional case.

【図4】本考案の従来例を示す混成集積回路の横断面図
である。
FIG. 4 is a cross-sectional view of a hybrid integrated circuit showing a conventional example of the present invention.

【符号の説明】[Explanation of symbols]

3 リード端子 8 切り欠き 9 凸部 10 ケース 11 回路基板 12 電極 3 Lead terminal 8 Notch 9 Protrusion 10 Case 11 Circuit board 12 Electrode

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 【請求項1】 回路基板の対向する側面の各々に切り欠
きを非対称に設け、ケースの側壁に前記各切り欠きに嵌
まり込む凸部を設け、前記ケースの前記各切り欠きに前
記凸部が嵌まり込むように前記回路基板を配置して形成
したことを特徴とする混成集積回路の構造。
1. A notch is provided asymmetrically on each of the opposite side surfaces of a circuit board, a convex portion that fits into each notch is provided on a side wall of a case, and the notch is provided at each notch of the case. A structure of a hybrid integrated circuit, wherein the circuit board is arranged so as to be fitted therein.
JP2704892U 1992-03-31 1992-03-31 Structure of hybrid integrated circuit Pending JPH0579970U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2704892U JPH0579970U (en) 1992-03-31 1992-03-31 Structure of hybrid integrated circuit

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2704892U JPH0579970U (en) 1992-03-31 1992-03-31 Structure of hybrid integrated circuit

Publications (1)

Publication Number Publication Date
JPH0579970U true JPH0579970U (en) 1993-10-29

Family

ID=12210192

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2704892U Pending JPH0579970U (en) 1992-03-31 1992-03-31 Structure of hybrid integrated circuit

Country Status (1)

Country Link
JP (1) JPH0579970U (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105691003A (en) * 2014-12-11 2016-06-22 精工爱普生株式会社 Seal member, liquid discharge head having the same, and liquid discharge apparatus
JP2022173625A (en) * 2021-05-10 2022-11-22 日東工業株式会社 Mounting structure of detection substrate

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105691003A (en) * 2014-12-11 2016-06-22 精工爱普生株式会社 Seal member, liquid discharge head having the same, and liquid discharge apparatus
JP2016112708A (en) * 2014-12-11 2016-06-23 セイコーエプソン株式会社 Seal member, liquid discharge head provided with the same and liquid discharge device
CN105691003B (en) * 2014-12-11 2019-05-28 精工爱普生株式会社 Seal member, the liquid discharging head and liquid discharge device for having the seal member
JP2022173625A (en) * 2021-05-10 2022-11-22 日東工業株式会社 Mounting structure of detection substrate

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