JPH0580562U - Parts adhesion processing equipment - Google Patents

Abstract

(57) [Summary] [Purpose] When forming an adhesive layer on the surface of a part such as a ring, the purpose is to improve the quality of the part on which the adhesive layer is formed and to save labor for the treatment. [Constitution] Pretreatment chambers E, F, G for pretreatment of components 31 to be bonded, and a pretreatment basket C for performing the pretreatment process of the components housed inside the pretreatment chambers -1, C-2, C-3, a pretreatment carrier D for moving the pretreatment basket, and a main treatment chamber J for forming an adhesive layer on a component which has undergone the pretreatment process. , K, and a basket for main processing C-in which the pre-processed parts are housed inside and placed in the main processing chamber
4, C-5 and parts 3 housed in the pretreatment basket
The delivery means 50 for transferring 1 to the main processing basket and the main processing basket containing the parts are
The main processing carrier I for moving the main processing basket so that the main processing chamber is moved in and out of the main processing chamber, and the parts for which the main processing is completed in the main processing chamber K are discharged from the main processing basket, and the post-processing apparatus is provided. Means 4 for transporting to
6 and.

Description

[Detailed description of the device]

[0001]

[Industrial applications]

 The present invention relates to a component adhesion processing device for forming an adhesive layer on the surface of a component such as an oil seal.

[0002]

[Prior Art]

 A ring that reinforces the oil seal, etc. is manufactured by a remanufacturing press, and in a later process step, a rubber lip is attached to one end of the ring, based on a certain manufacturing plan, a predetermined number of rings are prepared in advance. It has been practiced to apply an adhesive to the ring, form an adhesive layer on the surface of the ring, and store the layer. In such a ring-bonding process, the ring surface produced by press molding or the like is subjected to pretreatment such as cleaning or chemical conversion treatment, and then an adhesive layer is formed on the pretreated ring surface. This processing is performed for this purpose. Conventionally, parts before treatment are manually put in or ejected from each machine for pretreatment of press-formed rings, and then adhesive is applied to those pretreated rings. After all, I had to manually put in and take it out of the machine that does this processing.

[0003]

[Problems to be solved by the device]

 However, if the above adhesive treatment is performed manually, the product quality may deteriorate due to the inclusion and adhesion of dust, etc., and the adhesive layer may deteriorate due to instability of the treatment speed. This may result in quality deterioration. Furthermore, there is a problem that labor saving cannot be achieved because it is done manually.

An object of the present invention is to improve the quality of a part on which an adhesive layer is formed and to save labor for processing the part when the adhesive layer is formed on the surface of a part such as a ring.

[0005]

[Means for Solving the Problems]

 In order to achieve the above-mentioned object, the device for adhering components according to the present invention includes at least one pretreatment chamber for pretreating the components to be subjected to the adhesion treatment, and is housed inside the pretreatment chamber. The pretreatment basket that performs the pretreatment process for the parts, the pretreatment carrier that moves this pretreatment basket so that this pretreatment basket moves between the pretreatment chambers, and the pretreatment process are completed. At least one main processing chamber for forming an adhesive layer on the parts, a main processing basket in which the pre-processed parts are housed and placed in the main processing chamber, and a pre-processing chamber A delivery means for transferring the pre-processed parts stored in the basket into the main processing basket and the main processing basket containing the parts are put in and taken out from the main processing chamber. A discharging means for discharging the main processing carrier for moving the main processing basket and the parts for which the main processing for forming the adhesive layer in the main processing chamber is completed, from the main processing basket, and transporting the parts to the subsequent processing device. Have and. The pretreatment basket and the main treatment basket each include a pair of end plates and a porous side plate that is interposed between the end plates and has an opening in the outer periphery and is bent in a spiral shape. It is desirable to be done.

[0006]

[Action]

 In the component adhesion treatment device of the present invention, for pretreatment in which components to be pretreated are accommodated between at least one pretreatment chamber composed of, for example, a degreasing chamber, a surface conditioning chamber, a chemical conversion chamber and a drying chamber. The basket is moved by the pretreatment carrier, and the pretreatment of the parts is automatically performed. The parts for which the pretreatment has been completed are automatically transferred from the pretreatment basket to the main treatment basket by the delivery means. The processing basket containing the parts is placed in at least one or more main processing chambers including a bonding chamber for forming an adhesive layer, and the surfaces of the parts in the processing basket are automatically An adhesive layer is formed. The part having the adhesive layer formed on the surface after the main processing step is taken out from the main processing basket by the discharging means and sent to the subsequent step.

[0007]

【Example】

 Hereinafter, the present invention will be described in more detail with reference to the embodiments shown in the accompanying drawings. 1 is an overall perspective view of a system including a component bonding processing apparatus according to an embodiment of the present invention, FIG. 2 is a front view of the ring-making press shown in FIG. 1, and FIG. 3 is a side view of the ring-making press shown in FIG. 4, FIG. 4 is a plan view of the feeder shown in FIG. 1, FIG. 5 is a side view of the feeder shown in FIG. 1, FIG. 6 is a front view of the basket shown in FIG. 1, and FIG. 7 is an arrow VII-VII of FIG. 8 is a side view of the component adhesion processing device shown in FIG. 1, FIG. 9 is a plan view of the discharging device and the carrying rack shown in FIG. 1, and FIG. 10 is the discharging device and the carrying rack shown in FIG. 11 is a side view of FIG. 11, FIG. 11 is a view showing a ring forming process by the ring forming press shown in FIG. 2, FIG. 12 is a flow chart of processing in a component bonding processing apparatus according to an embodiment of the present invention, and FIG. FIG. 6 is a cross-sectional view of an oil seal component such as a stem member using a ring manufactured by a ring press.

First, an outline of an apparatus according to an embodiment of the present invention will be described with reference to FIG. As shown in FIG. 1, a supply device B is installed between the ring-making press A and the adhesion processing device P, and the ring as a component manufactured by the ring-making press A is bonded by the supply device B. It is adapted to be conveyed to the processing device P. A transport shelf N is installed on the right side of the adhesion processing device P, and the ring as a component that has been subjected to the adhesion processing by the adhesion processing device P is transferred to the transportation shelf N by the discharging device M as discharging means. It is like this.

Next, details of each device will be described. As shown in FIGS. 2 and 3, the ring-making press A is a device for producing the ring 31 (FIGS. 12 and 14) as a component to be subjected to the adhesion treatment. The ring-making press A is operated by an operation unit 6 having a manual switch for displaying the number of revolutions of the press, the load current, and the like, and performing an operation such as setup. When the metal hoop material 10 is sequentially supplied from the hoop material supply device 9, the press working part 5 is driven by the driving part 7 to manufacture the ring 31 by press press punching. The details of the ring-making work of the ring 31 by the ring-making press A are shown in FIG. First, as shown in FIG. 11 (A), a molding plate 10 ′ having an appropriate size is punched from the hoop material 10. Next, press working is performed in the order shown in FIGS. 3B to 3G to form the ring 31 as a component. The manufactured ring 31 is supplied to the supply box 2 made of punching metal or the like placed on the supply device B by the conveyor 1 shown in FIG. In FIG. 3, reference numeral 8 is a safety cover for the press working part 5.

When a certain number of rings 31 are accumulated in the supply box 2, as shown in FIG. 1, the rings are sent in the direction of the adhesion processing device P while being kept in the supply box 2. The supply box 2 sent near the adhesion processing device P is lifted upward by the lifter 48. The feeding timing of the feeding device B is a time point when a certain number of rings 31 are accumulated in the feeding box 2 in consideration of the ring-making ability of the ring-making press and the bonding processing ability of the bonding processing device P.

Referring to FIGS. 4 and 5, the plurality of rings 31 supplied to the punching metal supply box 2 are operated by the supply device operation unit 11 having a manual switch for performing operations such as setup. It is conveyed in the direction of the lifter 48 by the upper conveyor 12 of the supply device B and is placed on the elevating part 15 of the lifter 48. After that, the supply box 2 with the ring is lifted on the lifter 48 while being placed on the elevating part 15, and is inverted at the upper limit position. Therefore, the ring 31 in the supply box 2 is put into the pretreatment basket C-1 via the delivery section 16.

After that, the empty supply box 2 descends the lifter 48 while being placed on the elevating part 15, and is sent to the elevating part 14 near the transport conveyor 1 by the lower conveyor 13 of the supply device B, As a result, it is returned to the area of the upper conveyor 12.

Next, the adhesion processing device P will be described. The adhesion processing device P has a plurality of baskets C-1 to C-5 and the like (hereinafter, C is used as a representative name of these) in which the ring 31 to be processed is housed. The basket C included in the adhesion processing device P is roughly divided into pretreatment baskets C-1 to C-3 and main treatment baskets C-4 and C-5. The pretreatment baskets C-1 to C-3 are conveyed so as to be sequentially circulated between the degreasing chamber E as the pretreatment chamber, the surface conditioning / chemical conversion chamber F, and the drying chamber G using the pretreatment carrier D. It is movable. Further, one main processing basket C-4 of the main processing baskets is configured such that the main processing carrier D is used so that the inside of the bonding chamber J as the main processing chamber can be freely taken in and out, and the other main processing basket C-4 can be moved. The processing basket C-5 is always placed in the printing chamber K. The movement of these baskets C will be described later.

All of these carriers C have the same structure, and as shown in FIGS. 6 and 7, disk-shaped end plates C3 and C3 and a spiral interposed between these end plates C3 and C3. And a side plate C2. An opening C1 is formed at the outermost periphery of the side plate C2, and the ring 31 as a component is supplied from the opening C1 or, conversely, the ring 31 is discharged. The spiral side wall 2 is composed of a punching metal plate or the like, and is a mesh-shaped perforated plate. Various liquids and air can flow in and out through this side wall. With such a porous plate, the inner ring 31 can be immersed in the treatment liquid by dipping the carrier C into the treatment liquid. The end plate C3 may also be a porous plate. A rotation axis C4 is attached to the end plate C3 and can rotate about its central axis CL. The rotation direction AA shown in FIG. 7 is a positive rotation direction, and BB is a negative rotation direction. When the carrier C is rotated in the positive rotation direction AA, the ring 31 accommodated inside does not go out from the opening C1 and the carrier C is rotated in the negative rotation direction BB. The ring 31 is discharged to the outside through the opening C1. By rotating the ring 31 in the positive rotation direction, the inner ring 31 is agitated moderately, and the various treatment liquids are uniformly applied to the surface of each ring 31.

The pretreatment step in the adhesion treatment includes, for example, a degreasing treatment of the ring 31, a treatment such as surface adjustment, and a treatment of drying the ring 31 after the surface adjustment. In order to perform those treatments, the adhesion treatment device P is provided with a degreasing chamber E, a surface conditioning / chemical conversion chamber F, and a drying chamber G in this order, as shown in FIGS. Below the pretreatment chambers E, F, and G, a degreasing liquid storage tank 17, a chemical conversion liquid storage tank 18, a surface conditioning liquid storage tank 19, and a warm water tank 20 are arranged. In the post-treatment step in the adhesion treatment step, the main treatment in which the ring 31 is contained in the liquid of the adhesive in order to form an adhesive layer on the surface of the ring 31 that has been dried in the drying chamber G. There is a process of soaking the work basket and so-called dipping, and a process of drying it and baking it. In order to perform such main processing, the bonding processing apparatus P is provided with a bonding chamber J and a baking chamber K in order.

Next, movements of various baskets in the bonding processing apparatus P will be described mainly with reference to FIG. The pretreatment baskets C-1, C-2, C-3 are arranged in the pretreatment chambers E, F, G before the control is started. When the control for moving the basket C is started, the pretreatment basket C-1 is grasped by the chuck 23 of the vertical movement unit 22 of the pretreatment carrier D and stopped at the upper position, and the delivery unit 16 is moved. The supply of the ring 31 is received from the supply device B via. Next, the basket C-1 is lowered into the degreasing chamber E, and the degreasing liquid is sprayed from the two liquid nozzles while rotating the pretreatment basket C-1 in the positive rotation direction AA shown in FIG. Then, the ring 31 in the basket C-1 is degreased. Subsequently, the pretreatment basket C-3 in the drying chamber G is set at the delivery position CC1 located above the delivery unit 50 using the pretreatment carrier D. Subsequently, the pretreatment carrier D is used to move the pretreatment basket C-2 in the surface conditioning / chemical conversion chamber F to the drying chamber G.

After that, the pretreatment carrier D is used to move the basket C-1 to the empty surface conditioning / forming chamber F, and while rotating the basket C-1 in the positive rotation direction AA, A predetermined liquid is jetted from the liquid nozzle to adjust each surface of the ring 31. Subsequently, the pretreatment carrier D is used to return the empty pretreatment basket at the delivery position CC1 to the degreasing chamber E. Then, the basket in the drying chamber G is moved to the delivery section CC1 in the same manner as described above.

Next, using the pretreatment carrier D, the basket whose surface has been adjusted is moved to the empty drying chamber G, and the warm air nozzle is rotated while rotating in the positive rotation direction AA. To dry the ring 31 in the basket.

The basket containing the ring 31 that has been pretreated in this way is rotated by the pretreatment carrier D in the negative rotation direction BB at the position CC 1 of the delivery section 50. Then, the ring in the basket is discharged, guided by the delivery unit 50, and transferred to the main processing basket C-4 at the upper position of the bonding chamber J. The basket C-4 is held by the chuck 26 of the main processing carrier I.

The main processing basket C-4 containing the ring 31 is lowered into the lower bonding chamber J by the action of the vertical moving portion 24 of the main processing carrier I, and is positive in the adhesive liquid. The adhesive is uniformly applied to each ring 31 in the basket C-4 while rotating in the rotation direction AA.

After that, the basket C-4 is lifted again by the operation of the vertical moving unit 24, the main processing carrier I is moved in the horizontal moving unit 25, and the transfer unit 52 disposed above the baking chamber K is placed at the true position. Stop on At that position, the basket C-4 is rotated in the negative rotation direction BB, the inner ring 31 is discharged, and the ring 31 is transferred to the main processing basket C-5 thereunder via the transfer section 52. The main processing basket C-5 performs the baking process of each ring 31 inside while rotating in the positive rotation direction A A in the baking chamber K having a heater. The movements of the baskets C-1 to C-5 as described above are repeated.

FIG. 12 shows details of the bonding process for the ring 31 which is performed in synchronization with the movement of the basket C as described above. As shown in FIG. 12, first, in the degreasing chamber E, in step 80, the surface of the ring 31 is degreased, in step 81 the degreasing liquid is drained, in step 82 water washing is performed, and then in step 83. Drain the water at.

Next, in the surface conditioning / chemical conversion chamber F, in step 84, the surface of the ring 31 is surface-treated with the liquid of the surface treatment, in step 85 the liquid is drained, and in step 86, the liquid of the chemical conversion treatment is used. The chemical conversion treatment is performed, the liquid is drained in step 87, the water washing treatment is performed in step 88, and the water drainage is performed in step 89. Next, in the drying chamber G, the ring 31 is dried as shown in step 90. In the next bonding chamber J, in step 91, the ring 31 is dipped in the adhesive liquid to apply the adhesive to the surface of the ring 31, the liquid is drained in step 92, and the drying process is performed in step 93. In the printing chamber K, the printing process shown in step 94 is performed.

When the printing process is completed, the shutter below the printing chamber K shown in FIG. 8 is opened, and while the basket C-5 is rotating in the negative rotation direction BB, the printing chamber K is passed through the transfer section 46. The ring 31 which has been baked and completely processed is transferred to a transport box 34 arranged below.

Next, the discharging device M and the carrying rack N shown in FIG. 1 will be described. The discharging device M has a chuck 35, and by using the chuck 35, the ring 31 in the transport box 34 is temporarily stored in the rack of the transport rack N together with the transport box 34. Since the transport box 34 in which the ring 31 is stored must be stored in the rack of the transport rack N at a predetermined position, the discharging device M has the vertical moving unit 27 and the horizontal moving unit 28. The ejector operation unit 30 controls the movement of the transport box 34 along each moving unit.

The transport rack N, which is filled with the transport box 34 containing the ring 31 that has been subjected to the bonding process, is supplied to the subsequent process. It can be moved to any position.

The ring 31 that has been subjected to the adhesive treatment and then carried to the transport rack N by the discharge device M and temporarily stored therein is vulcanized and bonded to the rubber material 31A in the subsequent step, for example, as shown in FIG. Then, the oil seal member 31 'and the like are manufactured.

It should be noted that the present invention is not limited to the above-described embodiments, but can be variously modified within the scope of the present invention. For example, the main processing baskets C-4 and C-5 used in the bonding chamber J and the baking chamber K in which the main processing step in the bonding processing is performed are the dedicated baskets in the respective chambers, but the pre-processing step Similarly, the baskets C-4 and C-5 may be sequentially circulated and used.

[0029]

[Effect of the device]

 According to the present invention, when an adhesive layer is formed on the surface of a component such as a ring, the components are housed in a basket, and an adhesive treatment process for forming the adhesive layer is performed between the chambers. Since it is moved by using, it is possible to uniformly form the adhesive layer on the components in the basket. Moreover, the work can be automated and mass production is possible. Further, since the pretreatment basket and the main treatment basket are separately provided and parts are transferred between the baskets by the delivery means, the treatment liquid used in the pretreatment is The quality of the adhesive layer is improved without mixing with the treatment liquid used in. Moreover, since all of these operations can be automated, it is possible to prevent dust and the like from entering the adhesive layer. In particular, when the basket is composed of a pair of end plates and a porous side plate that is interposed between these end plates and has an opening in the outer periphery and is bent in a spiral shape, this By rotating in the forward and reverse directions, it becomes easy to automate the discharge of the parts housed inside, and at the same time, it becomes possible to perform uniform processing or uniform drying of various processing liquids by stirring the parts.

[Brief description of drawings]

FIG. 1 is an overall perspective view of a system including a component adhesion processing device according to the present invention.

FIG. 2 is a front view of the ring-making press shown in FIG.

FIG. 3 is a side view of the ring-making press shown in FIG. 1.

FIG. 4 is a plan view of the supply device shown in FIG.

FIG. 5 is a side view of the supply device shown in FIG. 1.

FIG. 6 is a front view of the basket shown in FIG. 1.

7 is a cross-sectional view taken along the line VII-VII in FIG.

FIG. 8 is a side view of the component adhesion processing device shown in FIG.

9 is a plan view of the discharging device and the carrying rack shown in FIG. 1. FIG.

FIG. 10 is a side view of the discharging device and the carrying rack shown in FIG. 1.

11 is a diagram showing a ring forming process by the ring forming press shown in FIG. 2;

FIG. 12 is a flow chart of processing in the component bonding processing apparatus according to the present invention.

13 is a cross-sectional view of an oil seal component such as a stem member using a ring manufactured by the ring manufacturing press shown in FIG.

[Explanation of symbols]

 1 ... Conveyor 2 ... Supply box 5 ... Pressing section 6 ... Operating section 7 ... Drive section 8 ... Safety cover 9 ... Hoop supply Device 10 ... Hoop material 11 ... Operation part 12 ... Upper stage conveyor 13 ... Lower stage conveyor 14 ... Elevating part 15 ... Elevating table 16 ... Delivery part 17 ... Degreasing liquid storage Tank 18 ... Chemical conversion liquid storage tank 19 ... Surface conditioning liquid storage tank 20 ... Hot water tank 21 ... Horizontal moving part 22 ... Vertical moving part 23 ... Chuck 24 ... Vertical moving part 25 ... Horizontal moving part 26 ... Chuck 27 ... Vertical moving part 28 ... Horizontal moving part 29 ... Control device 30 ... Ejection device operating part 31 ... Ring 31 '... Oil Seal member 31A ... Rubber material 34 ... Transport box 35 ... Chuck 36 ... Up part 46 ... Delivery part 48 ... Lifter 50 ... Delivery part 52 ... Delivery part 80-94 ... Processing step A ... Ring making press B ... Supply device C・ ・ ・ ・ Basket D ・ ・ ・ ・ Pre-treatment carrier E ・ ・ ・ ・ Degreasing chamber F ・ ・ ・ ・ Surface adjustment / chemical conversion chamber G ・ ・ ・ ・ Drying chamber I ・ ・ ・ ・ Post-treatment carrier J ・ ・..Adhesion chamber K .... Baking chamber M .... Discharging device N ...

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[Procedure amendment]

[Submission date] June 21, 1993

[Procedure Amendment 1]

[Document name to be amended] Statement

[Item name to be amended] Scope of utility model registration request

[Correction method] Change

[Correction content]

[Scope of utility model registration request]

Claims (2)

[Scope of utility model registration request] 1. A component adhesion treatment device for forming an adhesive layer on a surface of a component, wherein at least one pretreatment chamber for pretreatment of a component to be subjected to an adhesion treatment, and a pretreatment chamber placed in the pretreatment chamber, A pretreatment basket that performs a pretreatment process for the parts housed inside, a pretreatment carrier that moves the pretreatment basket so that the pretreatment basket moves between pretreatment chambers, and a pretreatment At least one main processing chamber for forming an adhesive layer on the processed parts, and a main processing basket in which the preprocessed parts are housed and placed in the main processing chamber , The delivery means for transferring the pre-processed parts stored in the pre-processing basket into the main processing basket, and the main processing basket containing the parts from the main processing chamber. The main processing carrier that moves the main processing basket as if to put it in, and the parts that have undergone the main processing for forming the adhesive layer in the main processing chamber are ejected from the main processing basket, and are transferred to the post-processing device. A component adhesion processing device having a discharging means for carrying. 2. The pretreatment basket and the main treatment basket are a pair of end plates and a porous side plate which is interposed between the end plates and has an opening at an outer peripheral portion and is bent in a spiral shape. The component adhesion processing device according to claim 1, further comprising: