JPH0580828B2 - - Google Patents

Info

Publication number
JPH0580828B2
JPH0580828B2 JP59040544A JP4054484A JPH0580828B2 JP H0580828 B2 JPH0580828 B2 JP H0580828B2 JP 59040544 A JP59040544 A JP 59040544A JP 4054484 A JP4054484 A JP 4054484A JP H0580828 B2 JPH0580828 B2 JP H0580828B2
Authority
JP
Japan
Prior art keywords
substrate
insulating film
semiconductor
polycrystalline
metal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP59040544A
Other languages
English (en)
Japanese (ja)
Other versions
JPS60186036A (ja
Inventor
Tetsutada Sakurai
Katsutoshi Izumi
Mamoru Obara
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NTT Inc
Original Assignee
Nippon Telegraph and Telephone Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Telegraph and Telephone Corp filed Critical Nippon Telegraph and Telephone Corp
Priority to JP59040544A priority Critical patent/JPS60186036A/ja
Publication of JPS60186036A publication Critical patent/JPS60186036A/ja
Publication of JPH0580828B2 publication Critical patent/JPH0580828B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W10/00—Isolation regions in semiconductor bodies between components of integrated devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W10/00—Isolation regions in semiconductor bodies between components of integrated devices
    • H10W10/01—Manufacture or treatment

Landscapes

  • Element Separation (AREA)
JP59040544A 1984-03-05 1984-03-05 半導体基板の製造方法 Granted JPS60186036A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP59040544A JPS60186036A (ja) 1984-03-05 1984-03-05 半導体基板の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP59040544A JPS60186036A (ja) 1984-03-05 1984-03-05 半導体基板の製造方法

Publications (2)

Publication Number Publication Date
JPS60186036A JPS60186036A (ja) 1985-09-21
JPH0580828B2 true JPH0580828B2 (de) 1993-11-10

Family

ID=12583388

Family Applications (1)

Application Number Title Priority Date Filing Date
JP59040544A Granted JPS60186036A (ja) 1984-03-05 1984-03-05 半導体基板の製造方法

Country Status (1)

Country Link
JP (1) JPS60186036A (de)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2757872B2 (ja) * 1989-01-31 1998-05-25 三菱電機株式会社 半導体装置及びその製造方法
JP2775848B2 (ja) * 1989-05-18 1998-07-16 富士通株式会社 半導体装置の製造方法
JP2662684B2 (ja) * 1993-06-21 1997-10-15 住友金属鉱山株式会社 電解用アノードの搬送装置
JP2007514321A (ja) * 2003-12-10 2007-05-31 ザ、リージェンツ、オブ、ザ、ユニバーシティ、オブ、カリフォルニア ミックスド・シグナル集積回路のための低クロストーク回路基板

Also Published As

Publication number Publication date
JPS60186036A (ja) 1985-09-21

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Legal Events

Date Code Title Description
EXPY Cancellation because of completion of term