JPH0582004U - Thermistor element - Google Patents

Abstract

(57) [Abstract] [Purpose] The present invention relates to a thermistor element, and particularly to a temperature element such as a temperature sensor, anemometer, and liquid level gauge, which are widely used in the fields of home appliances, automobiles, and industrial equipment. [Structure] The thermistor chip is connected with a heat resistant conductive paint to a lead wire whose one end is formed with a flat surface by coining, etc., and a part of the end surface of the melf type lead is left to be baked on the heat resistant conductive paint with glass. At the same time, it is sealed with glass. [Effect] Since the thermal time constant is reduced to 1/4 as compared with the conventional example, it responds well to the thermal change of the test object with good responsiveness. Further, since it is composed of heat-resistant parts, it has excellent heat resistance and durability.

Description

[Detailed description of the device]

[0001]

[Industrial applications]

 The present invention relates to a thermistor element, and more particularly to a temperature element such as a temperature sensor, anemometer, and liquid level gauge which are widely used in the fields of home appliances, automobiles, and industrial equipment.

[0002]

[Prior Art]

 As a conventional technique, for example, Japanese Patent Publication No. 52-7352 discloses a thermistor element shown in FIG. In FIG. 5, electrodes 12 and 13 having a heat-resistant conductive coating baked on both sides of a disk-shaped thermistor body 11 having a diameter of about 1 mm or less are formed. Also, the bases of lead wires 14 and 15, which can be hermetically sealed to glass such as dumet wire or platinum wire, are connected to the electrodes 12 and 13 by baking a heat resistant conductive paint, and the main body 11 and the electrode 12 are connected. , 13 and the bases of the lead wires 14, 15 are embedded in the glass 16. Further, for example, Japanese Utility Model Laid-Open No. 62-116507 discloses the temperature sensor element of FIG. In FIG. 6, 24 is a melf type lead, and 25 is a slag type lead. A thermistor tip 26 is sandwiched between the two, and the whole is hermetically sealed with a glass tube (or resin tube) 27. It has a structure that allows continuity.

[0003]

[Problems to be solved by the device]

 However, in the above-mentioned conventional thermistor element disclosed in Japanese Patent Publication No. 52-7352, there is a glass having very poor thermal conductivity between the thermistor body 11 as a temperature detecting portion and the temperature-measuring object, and the thermistor is present. It deteriorates the responsiveness of the device. Further, in the temperature sensor element disclosed in Japanese Utility Model Laid-Open No. 62-116507, the connection between the thermistor chip and the lead portion depends on the compressive stress due to the difference in the thermal expansion coefficient of the glass tube (or resin tube). Therefore, the conductivity at high temperature and the thermal shock resistance are poor.

The present invention focuses on the above-mentioned conventional problems, and relates to a thermistor element, and in particular, relates to an improvement of a thermistor element that responds to a thermal change of a body to be tested with good responsiveness and has good impact resistance. .

[0005]

[Means for Solving the Problems]

 In order to achieve the above-mentioned object, in the present invention, a lead wire having a flat portion formed on one side of the thermistor chip by pressure-bonding or the like is connected with a heat-resistant conductive paint, and one end surface of the melf type lead is connected. The glass is sealed at the same time as the heat resistant conductive paint is baked on the glass while leaving the part.

[0006]

[Action]

 According to the above configuration, the melf-type lead (made of Fe-Ni alloy) facilitates heat transfer between the thermistor chip and the body to be measured, and the opposite surface is a flat surface whose end face is expanded by coining or the like. The lead wire is formed so that the angle is about 90 ° with respect to the axial direction of the lead wire, and both are connected with heat resistant conductive paint. Both are connected with a heat resistant conductive paint and coated with glass to suppress heat dissipation and improve responsiveness and durability.

[0007]

【Example】

 Hereinafter, embodiments of the thermistor element according to the present invention will be described in detail with reference to the drawings. FIG. 1 is an overall configuration diagram showing an embodiment of the thermistor element of the present invention. In Fig. 1, on one side (W) of the thermistor chip (330 μm square × 220 μm thickness) 1, the Dumet wire (47% Ni material, wire diameter 0.15 mm) was applied by coining or the like to the axial direction of the lead wire. The flat surface 2a of the lead wire 2 is connected by a heat resistant conductive paint (Au paste) 3 so as to be about 90 °. A melf type lead (47% Ni material) 4 is arranged on the surface (U) opposite to the surface (W), and glass (lead glass, Nippon Electric Glass LG- 6) Heat-resistant electroconductivity in step 5 The glass is sealed at the same time as the paint is baked.

In the above embodiment, the chip size was set to (330 μm square × 220 μm thickness), and the Dumet wire was also a lead wire (47% Ni material and wire diameter 0.15 mm), and as shown in FIG. The spread flat surface 2a of the lead wire 2 was connected to the heat resistant conductive paint 3 and the external shape was set to the dimensions shown in FIG. 1 of the present invention, and the thermal time constant was measured when the conventional example is shown in FIG. The measurement was carried out by moving the element temperature from 25 ° C. to a gas tank at 80 ° C., and measuring the time until the resistance value R of the element became R = R25-ΔR × 0.632. At this time, ΔR is the difference between R2 5 and R8 0. As a result, as shown in FIG. 3, the thermal time constant is reduced to 1/4. In addition, as a result of comparing the high temperature characteristics of the resistance value R between the conventional type (dotted line display) and the present invention (solid line display), as shown in FIG. 4, the resistance sharply increases even at high temperature as in the conventional type (dotted line display). It was found that the present invention changed in a straight line (indicated by a solid line).

[0009]

[Effect of the device]

 As described above, according to the present invention, the thermal time constant is reduced to 1/4 as compared with the conventional example, so that it responds to the thermal change of the object to be detected with good responsiveness. Also, because it is composed of heat-resistant parts, it has excellent heat resistance and durability.

[Brief description of drawings]

FIG. 1 is an overall configuration diagram showing one embodiment of a thermistor element of the present invention,

FIG. 2 is a partially enlarged view of the lead wire of the present invention,

FIG. 3 is a diagram showing a change time of a device resistance value of the present invention and a conventional device,

FIG. 4 is a diagram showing a change time of a device resistance value with respect to temperature of the present invention and a conventional one;

FIG. 5 is an overall configuration diagram showing an embodiment of a conventional thermistor element,

FIG. 6 is an overall configuration diagram showing another embodiment of a conventional thermistor element,

[Explanation of symbols]

 1 thermistor chip, 2 lead wire, 3 heat resistant conductive paint, 4 melf type lead, 5 glass,

Claims (1)

[Scope of utility model registration request] 1. A thermistor chip, one end of which has a flat surface formed by coining or the like to connect a lead wire with a heat-resistant conductive paint, and a part of the end surface of the melf type lead is left to be heat-resistant conductive paint with glass. A thermistor element characterized by being sealed with glass simultaneously with baking.